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Ken GoodsonRobert Bosch Department Chair
Stanford Mechanical Engineering
Thermal Managementat the Extremes
SF Bay Area Nanotechnology CouncilSeptember 17, 2013
ABC News October 2011
“Hot” electronics are in the news…
NY Daily News 2010March 2012
MacWorld June 2012
transportation defense
energy efficiency
hotspot mitigation
materials integration
appliances
informationHeat & Energy Challenges
Faculty & StaffProf. Goodson (Stanford), PIProf. Nolas (USF)Dr. Boris Kozinsky (Bosch)Dr. Winnie Wong-Ng, NIST Functional Properties GroupDr. Yongkwan Dong, USF Department of PhysicsStudents:Michael Barako, Saniya Leblanc, Yuan Gao, Amy Marconnet
Bosch
Stanford
DOE-NSF Thermoelectrics Partnership
Vehicle Waste Heat Recovery
Stanford
LogicMemoryMemory
Chip Carrier
3D StackingInterfaces
IBM‐3M Press ReleaseSeptember 2011
Nanostructured materials targeting unique combinations of electrical, thermal, mechanical properties• Mechanically Compliant Thermal & Electrical
Conductors.• Phase Change Energy Storage to Reduce Case
Temperature.• Controllable Anisotropic Electrical and Thermal
Properties.
Underfill Filler
Nano Packaging Materials:From 3D to Portables
400 nm
3D Routing of Liquid and Vapor
100m
Spreading by Etched Diamond Channels
DARPA Convection Limits (ICECool 1 + 2)
Convection Cooling LimitsPhase Separation
by Nanostructured Capping Film
Faculty & StaffProf. Goodson (Stanford), PIProf. Martin Fisher (Stanford)Students:Marc Dunham, Michael Barako, Saniya Leblanc
Analog Devices – Bosch – DOE - NSF
Energy Scavenging Sensorsfor Smart Buildings
Optimization Countours
• Smart Buildings bring multitudes of sensors and wiring.
• TE energy scavenging from heat sources (HVAC, water, windows) allows “truly wireless” sensor networks.
• Low power, low temperature TE conversion demands revolutionary new materials and design.
Lifelink.com
Selected AlumniProf. Dan Fletcher UC Berkeley Dr. Jeremy Rowlette Daylight SolnsProf. Evelyn Wang MIT Dr. Patricia Gharagozloo Sandia LabsProf. Katsuo Kurabayashi U. Michigan Dr. Per Sverdrup IntelProf. Sungtaek Ju UCLA Dr. Chen Fang Exxon-MobileProf. Amy Marconnet Purdue Dr. Milnes David IBMProf. Bill King UIUC Dr. Saniya Leblanc Alphabet En.Prof. Eric Pop UIUC (Stanford) Dr. Roger Flynn IntelProf. Sanjiv Sinha UIUC Dr. Julie Steinbrenner Xerox ParcProf. Xeujiao Hu Wuhan Univ. Dr. John Reifenberg Alphabet En.Prof. Carlos Hidrovo UT Austin Dr. David Fogg CreareProf. Kaustav Banerjee UCSB (EE) Dr. Matthew Panzer KLA-TencorProf. Ankur Jain UT Arlington Dr. Yuan Gao OracleProf. Sarah Parikh Foothill College Dr. Joe Miler ARPA-E
Current Group Ken GoodsonWoosung Park Elah Bozorg-Grayeli Ken LopezMichael Barako Tom Dessault Matt HoffmanShilpi Roy (EE) Sri Lingamneni Dr. Saniya LeBlancJoe Katz (EE) Aditya Sood (MSE) Dr. Takashi KodamaJungwan Cho Marc Dunham Dr. Yoonjin WonJena Barnes Maneeshika Madduri Dr. Damena Agonafer
Consulting Prof. Mehdi Asheghi
Restrict the transport lengthscale using nanofabrication
Restrict the transport lengthscale using high speed optics
Nano Thermal Metrology
Sample Complexity
Rig
Com
plex
ity
How do we “see” nano
thermal transport?
Sample Complexity
Rig
Com
plex
ityNano Thermal Metrology
Students: Yoneoka, Li, KodamaNano Letters (2012b)
Kodama, Jain, Goodson,Nano Letters 9 (2009)
Students: Yoneoka, Li, KodamaNano Letters (2012b)
Electrons in Metal NanofilmsYoneoka, Lee, et al., 2012b, "Electrical and Thermal Conduction in ALD
Nanobridges Down to 7-nm Thickness," Nano Letters, 12, 683-686.
Sample Complexity
Rig
Com
plex
ityNano Thermal Metrology
Students: Li, Lee, KodamaNano Letters (2012a)
Students: Yoneoka, Li, KodamaNano Letters (2012b)
Kodama, Jain, Goodson,Nano Letters 9 (2009)
10 0
10 1
10 2
10 3
20 40 60 80 100
Ther
mal
con
duct
ivity
(Wm
-1K
-1)
300
ds=1.6 m
100 nm
20 nm
0.42 m
0.8 m
Bulk
Temperature (K)Asheghi, Goodson, et al., Applied Physics Letters 71 (1997)Asheghi, Goodson, et al., J. Heat Transfer 120 (1998)Liu and Asheghi, J. Heat Transfer 120 (2006)
ThermalConductivity
(W m-1 K-1)
Marconnet, Asheghi, Goodson, “From the Casimir Limit to Phononic Crystals: 20 Years of Phonon Transport Studies using SOI Technology,” J. Heat Transfer (2013)
Phonons in Silicon Nanofilms
defect
lattice wave
phonon
dphonon
es
bulk dECvkmod
2
31
,dFbulkfilm
Spectral Fuchs-Sondheimer Model
Spectral Fuchs SondheimerModel
Electrons & Phonons in FinFETS
Intel (2012)
VOL. 94 (2006)
Phonon
tSi
Boundary Scattering
BranchNonequilibrium
Phonon Emission
Intel (2012)
T eff
(K)
finFET position (nm)
g-LO
diffusionall LO
Electrons & Phonons in FinFETS
IEEE TRANS. ELECTRON DEVICES (55) 2008
Coupled Electron Monte Carlo &Phonon BTE in 20 nm finFET
SRC e-Workshop 2013 – Task 2308
<http://www2.imec.be><http://www.intel.com>
SRC Task 2308: Thermal Properties Beyond the 11nm Node
<Device> <Interconnect>
Non‐planarTop/Bottom SideWall
<www.realworldtech.com>
Sample Complexity
Rig
Com
plex
ityNano Thermal Metrology
Students: Li, Lee, KodamaNano Letters (2012a)
Students: Yoneoka, Li, KodamaNano Letters (2012b)
Student: Marconnet, BarakoACS Nano (2011)
SiC / Diamond
GaN
12 ps pumpdelayed probe
Students: Cho, Bozorg-Grayeli, Rowlette, ReifenbergPhysical Review B (2009)Electron Device Letters (2010,2011,2012)
CNT Forest
Metal
Metal CNT Catalyst
TransparentSubstrate
Nanotube FilmsStudents: Panzer,
Gao, Marconnet
Rev. Modern Physics (2013)ACS Nano (2011)
Nanoletters (2010)
Thermal Pump-Probe Sample Design
Electron-Phonon Interfaces
NanoPhotonicCrystals
Students: Rowlette, Kekatpure,Marconnet
Physical Review B (2009)diamond
Si
Dual-SidedTDTR
Diamond FilmsStudents: Bozorg-Grayeli, Sood, Cho
Applied Physics Letters (2013) J. Applied Physics (1996)
With Brongersma Group, MSE
Students: Lee,Chen,Jeyasingh,
Bozorg-Grayeli, Li, Reifenberg
Electron Device Letters (2008, 2010, 2011)
Proc. IEEE (2010)
Diamonds: 150 nm Ge2Sb2Te5
Triangles: 30 nmfcc
0.00 50 100 150 200 250 300 350
0
50
100
150
200
250
300
Boundary Resistance [m2K/G
W]
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Thermal Con
ductivity
[W/m
K]
Annealed Temperature [°C]
amorphous
kmin
kelectrons(WFL)
Electrons & Phonons in GeSbTeLee, Wong, Goodson, et al., Applied Physics Letters 2013
hcp
Electrons, Phonons, and Neurons:Conversion with Chalcogenides
Thermoelectric conversion in a phase change cell1,2,5
Phase distributions in a phase change memory cell2,3
1Lee, Asheghi, Goodson NANOTECHNOLOGY (2012)2Li, Wong, Goodson, et al., TRANS. ELECTRON DEVICES (2012)3Kuzum, Jeyasingh, Wong, et al. NANO LETTERS (2012)4Kuzum, Jeyasingh, Wong, et al. TRANS. ELECTRON DEVICES (2012)5Wong, Asheghi, Goodson, et al. PROCEEDINGS OF THE IEEE (2010)6Acharya et al., MECHANICAL ENGINEERING (2013)
NanoThermal Synapse3-4
Philip Wong, Stanford EE
0.01
0.1
1
10
100
1,000
1,000 10,000
Mass Density (kg m-3)
diamond
silicon
amorphoussilicon dioxide
polyimideporousxerogel
Crystalline
Disordered
copperSiC
Thermal Conductivity
(W m-1 K-1)
available materials
Layered 2DWSe2 Crystals [2]
multilayeramorphous [1]
1. Costescu et al., Science 303 (2004)2. Chiritescu et al., Science 315 (2007)
Extreme Property CombinationsGoodson, Science 315 (2007)
??
Thermal Properties of Aligned Carbon Nanotube Films
Thermal Conductivity
1 W/mK
100 W/mK
Volume fraction
Marconnet, Panzer, Goodson, Reviews of Modern Physics (2013)
Amy Marconnet
Molecular Simulation,with Prof. Wei Cai,Student: Yoonjin Won, Stanford ME
In Search of “Radically NewProperty Combinations” Goodson, Science 315 (2007)
Mechanical & Thermal Properties of Aligned CNT Films
750 µm
50 µm
Thermal MechanicalPump Laser Doppler
Vibrometer (LDV)
Piezoelectric Shaker
Probe
Si substratePolysiliconOxideAl2O3FeCNT
Students: Yoonjin Won, Yuan Gao, Matt Panzer, Amy Marconnet,PIs: Profs. Kenny & Goodson, Carbon (2012)
MEMS Resonator
Substrate
Drain
Gate
Source
Towards 30kW/cm2 for GaN HEMT Radar
Special Thanks to Avi Bar-Cohen and Joe Maurer,
DARPA MTO
What are the extreme limits
of thermal management?
INDIUM-PHOSPHATE EPITAXIAL
LIFT-OFF THIN FILM
100 µm
1.5 µm
100 µm
100 - 600 µm
ACTIVE REGION
CVD DIAMOND MICROCHANNEL
HEAT SINK
GaInAsP/InP LASER DIODE ARRAY
4 mm2 µm 100 µm
100 µm
= 2 = 2
=
=
AW XL
2d
1d
= cH
= cw = ww
THIN METALLIC BACK CONTACT
Stanford Compact Heat Exchanger History
Fabian Pease
Goodson, Kurabayashi, and Pease,Trans. Components Packaging,
Manufacturing Technology B20 (1997)
Lou London
Bill Kays
David Tuckerman
400 nm
3D Routing of Liquid and Vapor
100m
Spreading by Etched Diamond Channels
DARPA Convection Limits (ICECool 1 + 2)
Nanostructured Heat SinksPhase Separation
by Nanostructured Capping Film
2000 2002 2004
DARPA fundingIntel
AppleAMD
Research Background
Trajectory of a Startup (Cooligy)
Zhou et al., Proc. SEMITHERM 2004, Proc. ITHERM 2004
Si chip
Fluidinlet
Outlet Thermalattach3D
CooligyStartup(VC funding)
Apple G5 Production run100K+ Units
MicroCoolers for Computers
AcquisitionBy Emerson
2006 2008
~600W total~ 1kW/cm2
LiquidCoolingChallenge
Vapor Escape Microfluidic HXPrototype
Vapor-transmitting membrane reduces pressure drop and instabilities along two-phase micro HX.
Latest data show 60% pressure drop and nearly 50% drop in excess temperature over inlet saturation.
2 ml/min, G = 103 kg/s/m2
0
5
10
15
20
25
0 10 20 30 40 50 60 70Eff. Heat Flux [W/cm2]
Ptot / P lo
ControlVentSIM ControlSIM Vent
International Journal of Heat and Mass Transfer (2011)
International Journal of Multiphase Flow (2011)
Students: Milnes David, Roger Flynn, Julie Steinbrenner, Chen Fang, Joe Miler
Video slowed 2000XAir injectionV = 1.78 m/s
LiquidV = 0.63 m/s
0
0.10.2
0.30.4
0.5
0.60.7
0.80.9
1
0 2 4 6 8 10
V liq[m
/s]
Vair [m/s]
Annular
Stratified
Slug‐Annular
Bubbly& Wavy
Wavy‐Stratified
Vapor Escape I (2001-2010): Challenges .David, Miler, Steinbrenner, Goodson, et al., "Hydraulic and Thermal Characteristics of a Vapor Venting Two-phase
Microchannel Heat Exchanger," International Journal of Heat and Mass Transfer (2011)
Vapor Escape II 2012 – Strict, Nanostructured Phase Separation
vapor escape
Micro Porous Copper Liquid
Delivery
diamond wall
NanoporousLiquid Burst
Cap
400nm
Langmuir‐Blodgett Spheres
Outreach to K‐12 and Undergraduates
Jena BarnesMaterials Science & Engineering ‘13Synthesis and Characterization of ZnO Nanowire Films• Presented at national materials
science conference• Accepted fellowship to pursue
PhD in materials science at Duke University
Maneeshika MadduriElectrical Engineering ‘13Thermal Characterization of ZnONanowire Films• Accepted into Sandia National
Laboratory Master’s Fellowship Program
Undergraduates: K‐12 students & teachers:
Partnering with public highschool to provide materials and mentors for design lab.
Last-Minute VC Demo, 2001Microchannel Chip
Electroosmotic Pump
Heat Rejecter Coil & Plate
Sony VAIO Laptop Demo
Shulin Zeng with help from Evelyn Wang, Linan Jiang, and Abdullahel Bari (Stanford)
Selected AlumniProf. Dan Fletcher UC Berkeley Dr. Jeremy Rowlette Daylight SolnsProf. Evelyn Wang MIT Dr. Patricia Gharagozloo Sandia LabsProf. Katsuo Kurabayashi U. Michigan Dr. Per Sverdrup IntelProf. Sungtaek Ju UCLA Dr. Chen Fang Exxon-MobileProf. Amy Marconnet Purdue Dr. Milnes David IBMProf. Bill King UIUC Dr. Saniya Leblanc Alphabet En.Prof. Eric Pop UIUC (Stanford) Dr. Roger Flynn IntelProf. Sanjiv Sinha UIUC Dr. Julie Steinbrenner Xerox ParcProf. Xeujiao Hu Wuhan Univ. Dr. John Reifenberg Alphabet En.Prof. Carlos Hidrovo UT Austin Dr. David Fogg CreareProf. Kaustav Banerjee UCSB (EE) Dr. Matthew Panzer KLA-TencorProf. Ankur Jain UT Arlington Dr. Yuan Gao OracleProf. Sarah Parikh Foothill College Dr. Joe Miler ARPA-E
Current Group Ken GoodsonWoosung Park Elah Bozorg-Grayeli Ken LopezMichael Barako Tom Dessault Matt HoffmanShilpi Roy (EE) Sri Lingamneni Dr. Saniya LeBlancJoe Katz (EE) Aditya Sood (MSE) Dr. Takashi KodamaJungwan Cho Marc Dunham Dr. Yoonjin WonJena Barnes Maneeshika Madduri Dr. Damena Agonafer
Consulting Prof. Mehdi Asheghi