Appendix B / Properties of Selected Engineering Materials ● 455

Silicon nitride• Hot pressed 4.1–6.0 3.7–5.5 700–1000• Reaction bonded 3.6 3.3 250–345• Sintered 5.3 4.8 414–650

Zirconia, 3 mol% Y2O3 7.0–12.0 6.4–10.9 800–1500

POLYMERSEpoxy 0.6 0.55 —Nylon 6,6 2.5–3.0 2.3–2.7 44.8–58.6Polycarbonate (PC) 2.2 2.0 62.1Polyester (thermoset) 0.6 0.55 —Polyethylene terephthalate (PET) 5.0 4.6 59.3Polymethyl methacrylate (PMMA) 0.7–1.6 0.6–1.5 53.8–73.1Polypropylene (PP) 3.0–4.5 2.7–4.1 31.0–37.2Polystyrene (PS) 0.7–1.1 0.6–1.0 —Polyvinyl chloride (PVC) 2.0–4.0 1.8–3.6 40.7–44.8

a For metal alloys and polymers, strength is taken as yield strength; for ce-ramic materials, flexural strength is used.Sources: ASM Handbooks, Volumes 1 and 19, Engineered Materials Hand-books, Volumes 2 and 4, and Advanced Materials & Processes, Vol. 137, No.6, ASM International, Materials Park, OH.

Table B.6 Room-Temperature Linear Coefficient of ThermalExpansion Values for Various Engineering Materials

Coefficient ofThermal Expansion

Material 10�6 (�C )�1 10�6 (�F )�1

METALS AND METAL ALLOYSPlain Carbon and Low Alloy Steels

Steel alloy A36 11.7 6.5Steel alloy 1020 11.7 6.5Steel alloy 1040 11.3 6.3Steel alloy 4140 12.3 6.8Steel alloy 4340 12.3 6.8

Stainless SteelsStainless alloy 304 17.2 9.6Stainless alloy 316 15.9 8.8Stainless alloy 405 10.8 6.0Stainless alloy 440A 10.2 5.7Stainless alloy 17-7PH 11.0 6.1

Cast IronsGray irons

• Grade G1800 11.4 6.3• Grade G3000 11.4 6.3• Grade G4000 11.4 6.3

Table B.5 (Continued)

Fracture Toughness Strengtha

Material MPa�m ksi�in. (MPa)

Ductile irons• Grade 60-40-18 11.2 6.2• Grade 80-55-06 10.6 5.9

Aluminum AlloysAlloy 1100 23.6 13.1Alloy 2024 22.9 12.7Alloy 6061 23.6 13.1Alloy 7075 23.4 13.0Alloy 356.0 21.5 11.9

Copper AlloysC11000 (electrolytic tough pitch) 17.0 9.4C17200 (beryllium–copper) 16.7 9.3C26000 (cartridge brass) 19.9 11.1C36000 (free-cutting brass) 20.5 11.4C71500 (copper–nickel, 30%) 16.2 9.0C93200 (bearing bronze) 18.0 10.0

Magnesium AlloysAlloy AZ31B 26.0 14.4Alloy AZ91D 26.0 14.4

Titanium AlloysCommercially pure (ASTM grade 1) 8.6 4.8Alloy Ti-5Al-2.5Sn 9.4 5.2Alloy Ti-6Al-4V 8.6 4.8

Precious MetalsGold (commerically pure) 14.2 7.9Platinum (commercially pure) 9.1 5.1Silver (commercially pure) 19.7 10.9

Refractory MetalsMolybdenum (commercially pure) 4.9 2.7Tantalum (commercially pure) 6.5 3.6Tungsten (commercially pure) 4.5 2.5

Miscellaneous Nonferrous AlloysNickel 200 13.3 7.4Inconel 625 12.8 7.1Monel 400 13.9 7.7Haynes alloy 25 12.3 6.8Invar 1.6 0.9Super invar 0.72 0.40Kovar 5.1 2.8Chemical lead 29.3 16.3Antimonial lead (6%) 27.2 15.1Tin (commercially pure) 23.8 13.2Lead–Tin solder (60Sn-40Pb) 24.0 13.3Zinc (commercially pure) 23.0–32.5 12.7–18.1Zirconium, reactor grade 702 5.9 3.3

456 ● Appendix B / Properties of Selected Engineering Materials

Table B.6 (Continued)

Coefficient ofThermal Expansion

Material 10�6 (�C )�1 10�6 (�F )�1

Appendix B / Properties of Selected Engineering Materials ● 457

GRAPHITE, CERAMICS, AND SEMICONDUCTING MATERIALSAluminum oxide

• 99.9% pure 7.4 4.1• 96% 7.4 4.1• 90% 7.0 3.9

Concrete 10.0–13.6 5.6–7.6Diamond (natural) 0.11–1.23 0.06–0.68Gallium arsenide 5.9 3.3Glass, borosilicate (Pyrex) 3.3 1.8Glass, soda–lime 9.0 5.0Glass ceramic (Pyroceram) 6.5 3.6Graphite

• Extruded 2.0–2.7 1.1–1.5• Isostatically molded 2.2–6.0 1.2–3.3

Silica, fused 0.4 0.22Silicon 2.5 1.4Silicon carbide

• Hot pressed 4.6 2.6• Sintered 4.1 2.3

Silicon nitride• Hot pressed 2.7 1.5• Reaction bonded 3.1 1.7• Sintered 3.1 1.7

Zirconia, 3 mol% Y2O3 9.6 5.3

POLYMERSElastomers

• Butadiene-acrylonitrile (nitrile) 235 130• Styrene-butadiene (SBR) 220 125• Silicone 270 150

Epoxy 81–117 45–65Nylon 6,6 144 80Phenolic 122 68Polybutylene terephthalate (PBT) 108–171 60–95Polycarbonate (PC) 122 68Polyester (thermoset) 100–180 55–100Polyetheretherketone (PEEK) 72–85 40–47Polyethylene

• Low density (LDPE) 180–400 100–220• High density (HDPE) 106–198 59–110• Ultrahigh molecular weight 234–360 130–200

(UHMWPE)Polyethylene terephthalate (PET) 117 65Polymethyl methacrylate (PMMA) 90–162 50–90Polypropylene (PP) 146–180 81–100Polystyrene (PS) 90–150 50–83Polytetrafluoroethylene (PTFE) 126–216 70–120Polyvinyl chloride (PVC) 90–180 50–100

Table B.6 (Continued)

Coefficient ofThermal Expansion

Material 10�6 (�C )�1 10�6 (�F )�1

FIBER MATERIALSAramid (Kevlar 49)

• Longitudinal direction �2.0 �1.1• Transverse direction 60 33

Carbon (PAN precursor)• Standard modulus

Longitudinal direction �0.6 �0.3Transverse direction 10.0 5.6

• Intermediate modulusLongitudinal direction �0.6 �0.3

• High modulusLongitudinal direction �0.5 �0.28Transverse direction 7.0 3.9

E Glass 5.0 2.8

COMPOSITE MATERIALSAramid fibers-epoxy matrix (Vf � 0.6)

• Longitudinal direction �4.0 �2.2• Transverse direction 70 40

High modulus carbon fibers-epoxymatrix (Vf � 0.6)• Longitudinal direction �0.5 �0.3• Transverse direction 32 18

E glass fibers-epoxy matrix (Vf � 0.6)• Longitudinal direction 6.6 3.7• Transverse direction 30 16.7

Wood• Douglas fir (12% moisture)

Parallel to grain 3.8–5.1 2.2–2.8Perpendicular to grain 25.4–33.8 14.1–18.8

• Red oak (12% moisture)Parallel to grain 4.6–5.9 2.6–3.3Perpendicular to grain 30.6–39.1 17.0–21.7

Sources: ASM Handbooks, Volumes 1 and 2, Engineered Materials Handbooks, Vol-umes 1 and 4, Metals Handbook: Properties and Selection: Nonferrous Alloys andPure Metals, Vol. 2, 9th edition, and Advanced Materials & Processes, Vol. 146, No.4, ASM International, Materials Park, OH; Modern Plastics Encyclopedia ’96, TheMcGraw-Hill Companies, New York, NY; R. F. Floral and S. T. Peters, ‘‘Compos-ite Structures and Technologies,’’ tutorial notes, 1989; and manufacturers’ technicaldata sheets.

458 ● Appendix B / Properties of Selected Engineering Materials

Table B.6 (Continued)

Coefficient ofThermal Expansion

Material 10�6 (�C )�1 10�6 (�F )�1