THE POSSIBILITIES ARE INFINITE - Fujitsu › downloads › MICRO › fme › news › Summer_2002_web.pdfTHE POSSIBILITIES ARE INFINITE MirrorFlashTM Doubles Storage Capacity without

T H E P O S S I B I L I T I E S A R E I N F I N I T E

MirrorFlashTM Doubles Storage Capacity without Compromising Performance or Reliability

World’s First Eight-Stacked Device Confirms Fujitsu’s Leadership in Multi-Chip Package Technology

Summer 2002 Brings Signs of Recovery

BluetoothTM Modules Available for The Year of Growth

Single-Chip Solution for Digital Satellite Broadcasting Combines Tuner and QPSK Demodulator

Smallest Fingerprint Sensor is Ideal for Mobile Applications

FME Gears up for Electronica in Time for the Upturn

Second Generation of Balanced SAW Filters features Low InsertionLoss

Enhanced High-Resolution PDPs give Increased Brightness and Contrast

FME Celebrates 20-Year Partnership with EBV

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Summer 2002 MIRRORFLASHTM DOUBLES STORAGE CAPACITYWITHOUT COMPROMISING PERFORMANCE OR RELIABILTY

MirrorFlashTM

http://www.fme.fujitsu.com

http://www.fme.fujitsu.com/products/index.html












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Fujitsu is now supplying samples of its highly innovative new flash memory product,MirrorFlashTM, which represents a true breakthrough in flash technology.

MirrorFlashTM doubles the storage capability of the basic flash memory cell, anddoes so without compromising device endurance, performance or reliability. This is insharp contrast to other techniques of increasing flash cell storage such as multi-levelcell (MLC) technologies.

Data retention for the Fujitsu MirrorFlashTM memories is put at 20 years, anddevices are capable of 100,000 program and erase operations.

MirrorFlashTM offers a series of major benefits. While retaining the same reliabilityas current NOR architecture, it is a simpler process since there are fewer poly andmetal layers involved, which results in fewer defects.

Compared with conventional NOR flash, the size of the address area is cut by 50percent, resulting in a reduction in the overall die size of between 30 and 35 percent.As a result, costs are reduced so MirrorFlashTM devices will be significantly lessexpensive than NOR flash parts made using the same process technology and withthe same storage capacity.

This makes MirrorFlashTM ideally suited to flash memory applications where largestorage capacities are required but where price is also critical. Examples includehandheld devices,set-top boxes and navigation systems, which are the key target applications fortoday’s first-generation MirrorFlashTM.

When the second generation of MirrorFlashTM emerges, around the end of 2003,Fujitsu’s aim is that most of its flash memory production will be MirrorFlashTM, whichwill be far superior to conventional flash for high capacity devices providing256/512Mbit of storage.

MirrorFlashTM represents such an important breakthrough in flash technologybecause it offers a series of major benefits without any drawbacks. For example, itsupports page mode functioning so is able to offer

Data = 00

Source/ Drain

Drain/ Source

Gate

The basic architecture of the MirrorFlashTM

device.














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high-speed access times, down to 25ns. Random access times are also good, at90ns, faster than any of the MLC technologies, all of which are still over 100ns. Powerconsumption of MirrorFlashTM is also lower than MLCs, and the same operatingtemperature as Fujitsu’s conventional NOR flash devices, -40 to +85°C is guaranteed.

Samples of the first Fujitsu MirrorFlashTM devices, 64Mbit chips in 0.23 micronprocess technology, are now available, with volume production set for September.Three other capacities are in the pipeline, 32, 128 and 256Mbit. The secondgeneration of MirrorFlashTM will use 0.13 micron process technology and will have

features such as a 1.8V supply, dual operation and burst mode functions,and high-speed programming.

Fujitsu will provide MirrorFlashTM in two packaging formats,TSOP56 and FBGA, which will be retained across the whole family ofMirrorFlashTM products, right up to devices offering 1Gbit of storage.

Other features of MirrorFlashTM include an OTP area of 256Bytes,where an electronic serial number can be stored for greater security, and

to improve programming times a write buffer of 16 words (256bits) isprovided, as well as an acceleration pin, which helps reduce device programming inproduction by 50-60 percent.

The bus width of the first generation MirrorFlashTM parts can be selected to be x8 or x16, and for the next generation, x16/x32 is being considered. Also, to makemanaging production of the MirrorFlashTM chips easier for customers, all sectors areuniform.

MirrorFlashTM architecture

The MirrorFlashTM architecture doubles device density while eliminating the limitationsof MLC techniques. The breakthrough stems from fundamental changes in devicearchitecture and process technology, which enable the MirrorFlashTM memory cell to














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store electrons in two distinct, independent locations within a single cell.In the MirrorFlashTM cell, the basic unit of charge storage, the memory cell

transistor, differs from conventional floating gate memory transistors. Unlikeconventional flash memory cells, which use an asymmetric transistor with adifferently doped source and drain, the MirrorFlashTM cell uses a symmetric transistorwith similar source and drain. The floating gate or charge storage element is thereforefundamentally changed, so that electrons can be stored on either side of the cell.Once they are, they remain trapped there.As a result, read, program and erase operations can be performed at full speed andpower irrespective of whether one is using the left or right bit. Both bits within theMirrorFlashTM cell have full operating margin so the memory cell behaves just as if itwere two independent conventional memory cells.

Since the threshold voltage margins of MirrorFlashTM are about the same as that ofsingle-bit flash, performance and reliability is comparable to that of today’sconventional single bit NOR flash memory, users can continue to expect the samehigh levels of performance and reliability that they have currently.

This contrasts with MLC technology, in which multi-level cells store fractionallevels of charge within a cell to offer increased data storage capability.The threshold voltage of a transistor depends on the number of electrons in thefloating gate, so it is possible to store different units of data by varying the number ofelectrons stored in the cell. As a result, MLCs can store more than the basic 0 and 1,and to store n bits per cell, the device must have 2n different states. Each staterequires a different number of electrons to be stored in the floating gate, so eachstate has its own threshold voltage.

However, there are drawbacks to the MLC approach. For example, the readoperation for MLCs is inherently slow since the cell needs to distinguish betweenthese multiple possible threshold voltages. In order to program an MLC, electronsmust be precisely metered into the floating gate. If too many or too few electrons are














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allowed into the floating gate, the data stored in the cell is corrupted, so the programoperation must be performed very carefully and is therefore slow.

The reliability of MLCs is even more of a problem than the reduced program, eraseand read performance. Since MLCs depend on differences between small numbers ofelectrons in the floating gate, the loss of a few electrons could cause data corruptionand device failure. MLC devices therefore use higher operating voltages to ensure thebasic cell has a sufficiently wide Vt window. However, the associated electric fieldscause oxide breakdown and other stresses and thus limit the endurance of the [email protected]














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WORLD’S FIRST EIGHT-STACKED DEVICECONFIRMS FUJITSU’S LEADERSHIP IN MULTI-CHIP PACKAGE TECHNOLOGYFujitsu’s world leadership position in multi-chip package (MCP) technology has beenunderlined with a series of announcements, including the volume production of four-stack devices, as well as the development of eight-stack units, the highestcapacity MCPs yet produced.

Also, Fujitsu has formed an agreement with NEC and Toshiba that will providecustomers with a common user interface in relation to MCPs, making elements suchas driver software usable across devices from all three companies.

Fujitsu is the only company now in volume production of MCPs with two, three,and four chip stacks, which are proving increasingly popular in the handheld markets,especially mobile phones and other devices such as PDAs. Two-stack and three-stackMCPs are already being widely implemented in mobile phone designs, especially thenew generation of GSM, GPRS and CDMA telephones.

The triple stack MCPs are particularly useful for the most advanced phones thathave a multimedia capability, for instance the Japanese i-Mode system (now beingintroduced in parts of Europe such as Germany). In this application, a triple stack MCPcan provide NOR flash for storing text characters and images, FCRAM for workingmemory, and SRAM as backup memory.

The latest Fujitsu MCP to go into volume production is the MB84VZ064A, a four-stack device that features a pair of 64Mbit NOR dual-operation flash memories,32Mbit of mobile FCRAM with an asynchronous SRAM interface, and 8Mbit of SRAM,giving it the largest memory capacity of any MCP currently being mass produced.

Fujitsu is the only company now in volumeproduction of MCPs with two, three, and fourchip stacks.














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The new MCP combines the memory of two existing MCPs in a single device with a103-ball (10.0 x 9.0 x 1.4mm) plastic BGA package. This reduces the total mountedsurface area to about 63% of the previous combination of packages. The developmentof mobile phones offering enhanced functionality and higher transmission speeds hascreated a strong demand for MCP memory that is both more compact and uses lesspower, but offers greater capacity and speed.

The NOR flash memory in the MB84VZ064A is fabricated using Fujitsu’s 0.17micron process technology and runs faster than previous NOR flash products,performing sector erase operations in 0.2 seconds compared with one second withprevious-generation devices, and has an access time of 70ns, compared with 85nspreviously. This is an important advance because the latest chipsets for GSMtelephones require a 70ns access time, so these MCPs can be used in their design,allowing ultra small phones to be produced, or more features built into the same space.

The new four-stack MCP also features the latest, second-generation mobile FCRAM,which uses only 25mA of operating current, compared with 30mA for first-generationFCRAM used in previous MCPs, and like the flash memory has an enhanced accesstime of 70ns.

Encapsulate

Substrate

LSI

Solder Balls

Fujitsu is in the process of developing eight-stack MCPs, the highest capacity devices yet produced.














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Pushing the technology of MCPs even further, Fujitsu has announced the developmentof an ultra-high density MCP that can support up to eight chips, an achievement madepossible by advances in thin-chip processing and MCP technology. Typically, themounted surface area on a circuit board allows for packages 1.2-1.6mm thick. Thethickness allowed for one chip depends on the number of stacked chips per package.Thus, three-stacked packages require each chip to be 0.15mm thick, while in four-stack MCPs, the chips must be 0.1mm, and for five or more, 0.08mm or less. However,to create chips less than 0.1mm thick requires a chemical process beyondconventional polishing techniques, entailing longer chip processing times, higherequipment costs and problems associated with environmental emissions.

The new MCP is the result of improvements in both ultra-thin wafer processing andadvanced MCP technology. This slimming process makes possible the production ofwafers as thin as 0.080mm without the use of chemicals, resulting in reducedmanufacturing cycles, equipment costs and impact on the environment.

While Fujitsu’s existing MCPs can house a maximum of four chips within a 1.6mmpackage height, the new wafer-slimming process alone makes it possible to produceMCPs with up to six stacked chips. Combined with the company’s advanced newpackaging technology, a maximum of eight chips (in a package height of 2.0mm) cannow be mounted onto a single MCP. The slimming process is being further developed,with the target of reducing wafer thickness to just 0.025mm. Ultimately, Fujitsu aims touse its technology to combine different kinds of chips – for example memory, logic,and an MPEG decoder – in a single MCP for use in a range of powerful,feature-rich handheld devices.

Another benefit of these technological advances is that IC cards and compact harddisk drives, which previously could hold only two-chip packages, are now able tosupport three-chip combinations (in an LGA package height of 0.5mm). The newpackaging technology is an ideal mounting technique for ultra-high density packages.Until now, each circuit board was limited in the size of chip that could be mounted onto














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it, and complications arose in configuring outside electrical connections when layeringchips of identical sizes, as electrical connectors could not be stacked to reach upperlayers. With the advanced packaging technique, chips are attached to one or bothsides of the circuit board using lead-free solder balls to bond packages to the board.This makes it possible to stack a number of chips of all shapes and sizes, includingthose of the same size.

A further development in the world of MCPs is the agreement formed betweenFujitsu and two other major players in the market, NEC and Toshiba, to create astandardised user interface for MCPs. This will mean, for example, that once acustomer has developed driver software, they will be able to use MCPs from any ofthe three companies, so they are not locked into a single supplier.

This does not mean that the MCPs from the companies will be identical – thestandardisation relates just to the user interface and the pinouts of the MCPs. Otheraspects, such as the voltage range and the kind of ‘pseudo RAM’ used, for instance,will be specific to each supplier. Nevertheless, the agreement will encouragecustomers to take advantage of the benefits of pseudo RAM (in Fujitsu’s case, this isFCRAM) because they will be able to use different versions but retain the sameinterface. The first MCPs featuring the new interface will be available at the beginningof [email protected]














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SUMMER 2002 BRINGS SIGNS OF RECOVERYThere is no doubt that 2001 was one of the worst years the semiconductor industry hasexperienced, and Fujitsu was affected, like everyone else. But it’s now early Summer 2002, andthere are signs of renewal in the air and real reasons for optimism about the future.

It is not just that book-to-bill ratios are on the increase. Perhaps even more important isthe fact that there are lots of new design activities taking place at FME’s customers, suggestingthe electronics industry is back on track.

Consumer applications that have long been talked about, like BluetoothTM and set-topboxes, are now being realised. More established applications, like mobile phones, are havinginteresting new features added to them, such as location-based services.

What is more, Europe is the base for many of these activities, and offers excellentopportunities in a range of sectors, including telecoms and automotive.

There is no question, the upturn will bring challenges. The on-line marketplace and adrastically altered supply chain will speed up the pace of new developments still further, and,with many European OEMs giving up production, Europe could become an ‘innovation only’area, resulting in a major change to society as a whole. Like many others, FME will need tomanage these changes carefully, working closely with our customers.

But at Fujitsu, we know we are well placed to deal with the recovery that we will see in2002 and beyond, with world-leading process technologies – our 90nm prototype productionline started operating early this year – and a range of innovative, feature-packed products, asthis issue of Infinity shows.

Dirk WeinsziehrSenior Director, Marketing














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BLUETOOTHTM MODULES AVAILABLE FOR THEYEAR OF GROWTHAs the wireless standard BluetoothTM looks set to undergo dramatic growth over thenext few years, Fujitsu is developing a comprehensive portfolio of hardware andsoftware products, tools and services, to enable customers to implement BluetoothTM

interfaces into their end equipment.Market projections suggest 2002 will be the year when BluetoothTM really takes

off. For example, Frost & Sullivan estimates that this year will see some 96millionBluetoothTM units shipped, compared with just 1.2million in 2001. And by 2007, thiswill have grown to more than one billion units, generating a turnover for BluetoothTM-enabled devices of $318billion.

Initially Europe is expected to lead the way, with currently around a 60 percentshare of the market, although in the last year, interest in BluetoothTM in the USA hasbeen growing rapidly.The evolution of BluetoothTM is typically divided into three phases. The first, happeningnow, centres on high end products such as mobile phones, wireless headsets, andexpansion cards for notebook PCs and PDAs. The second phase, set to start aroundthe third quarter of this year, will add BluetoothTM interfaces to products such as PCsand their peripherals like printers and scanners. Chipset pricing will be reduced by asmuch as half that of Phase 1.

Finally, Phase 3 will be the period when market demand will be so great, that allappropriate products will have to feature BluetoothTM – as today’s PCs must now havea USB interface, for instance. By then, chipsets will be half the price of Phase 2.To help customers move as quickly and easily as possible into the BluetoothTM era,FME is supplying purpose-built modules that incorporate everything needed todevelop and implement BluetoothTM solutions, including both the baseband and RFelements, as well as the Host Controller Interface (HCI) and a range of commonhardware interfaces.

The Class 1 BluetoothTM Module, theMBH7BT04, complies with BluetoothTM

specification Version 1.1














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Available now, the modules support two of the different distance ranges that theBluetoothTM standard caters for, Class 1 being 100 metres and Class 2, 20 metres. TheClass 1 Module, the MBH7BT04, complies with BluetoothTM specification Version 1.1,with a maximum output of +20dBm. Hardware interfaces provided are USB, UART andPCM, the software interface is HCI, and the unit measures 32 x 15 x 2.65mm.

The Class 2 Module, the MBH7BT02A, features a similar specification but with alower power rating of +4dBm, and dimensions of 18 x 13 x 2.3mm. A third modulecurrently under development is the MBH7BT05, which will also be Class 2, and as itssoftware interface, will feature the upper protocol stack incorporated in flash ROM.

Fujitsu is targeting these modules at particular vertical markets, where BluetoothTM

is expected to have the most immediate and useful impact.They include in particular all kinds of industrial applications; peripherals for

notebook PCs, such as printers, scanners and keyboards; BluetoothTM-enablingdevices for mobile equipment like cellular phones and PDAs, using the CompactFlashcard format, for instance; and consumer products, such as remote controls for TVs,where BluetoothTM can offer superior performance to conventional infrared units, sinceit does not require line-of-sight access.

To further support BluetoothTM customers, a range of Prodigy HCI-based protocol analysers is now available. These enable users to see exactlywhat is happening between the controller and the software, and unlike many otherdevices, do not influence the air traffic in any way, thanks to the use of a wire-basedconnection. This also makes for a very stable development environment.

The Prodigy analysers are a low cost, portable solution weighing only 80g andrequire no external power supply, connecting to a notebook PC via a USB interface,with Prodigy Manager software also supplied. The Prodigy conforms to the keyprotocol standards (HCI, L2CAP, SDP, RFCOMM and OBEX on an HCI link). Threeversions are available: for HCI-UART plus BCSP (MST2301), HCI-UART (MST2302),and BCSP (MST2303).

[email protected]

The Prodigy HCI-based protocol analysers arelow cost and portable, weighing only 80g.














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FME has introduced one of the most advanced, highly integrated single-chip solutionsfor digital satellite broadcasting, which combines a tuner and a QPSK demodulatorinto a state of the art network interface module (NIM).

For set-top box manufacturers the new chip, the MB86A15, offers a series ofbenefits over previous-generation discrete QPSK NIMs, including much smaller size,significantly reduced power consumption, and lower cost.

The chip integrates a Zero IF Tuner, a QPSK Demodulator and Forward ErrorCorrection (FEC) circuitry, making it ideal for DVB-S and DSS transmissions, as well astuning-diodes, capacitance and inductive elements.

This means that the only external components needed to design and build acomplete working front-end for a set-top box are the F-connector, a 4MHz crystal,and some resistors and capacitors.

In addition, the MB86A15 internally generates the control signal for DiSEqC 1.x,the standard for interfacing between the satellite dish and receiver, which makes itpossible to switch between an array of dishes. The DiSEqC 1.x standard requires aprotocol involving very strict timing, and this is supported by the new chip directly inhardware, optimising performance and reducing the amount of software needed.

Much lower power consumption is an attractive feature of the MB86A15, whichoperates from supply voltages of just 2.5V, 3.3V and 5V. This contrasts with previous-generation designs, in which the tuning diode required a 30V supply. Maximum powerdissipation of the new device is 1.5W (at 45Mbaud), and thanks to this it is availablein a compact LQFP 120-pin package. The low power consumption will help to furtherreduce costs and make design and implementation easier.

SINGLE-CHIP SOLUTION FOR DIGITALSATELLITE BROADCASTING COMBINESTUNER AND QPSK DEMODULATOR

The MB86A15 provides a drastic reduction insize over previous-generation discrete QPSKnetwork interface modules (NIMs).














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The development of the MB86A15 single-chip solution means that set-top boxmanufacturers can now source from Fujitsu all three central elements needed to buildtheir products – the tuner and QPSK demodulator, the CPU and MPEG controllercomplete with RAM and DACs (the MB87P2130), and the required flash memory (theMBM29LVxxx). No other manufacturer can provide this comprehensive offering.Having to deal with just a single component supplier can help manufacturers invarious ways, for example by giving them a single source for all the support theyneed, such as software drivers. The evaluation kit for the MB86A15 includes the LNBsupply and also 22kHz modulation circuitry. Fujitsu provides end users with theapplication programming interface software in source code, free of charge.

Parameter Value

Transmission standards DVB-S, DSS

Input frequency range 950 - 2150MHz

Symbol rate range 1 - 45MS/s

Input signal level -75dBm to -10dBm

FEC automatic detection or fixed to 1/2, 2/3, 3/4, 5/6, 7/8

IQ detection automatic detection or fixed to normal/inverted

LNB control supports 22kHz + Tone Burst + DiSEqC 1.x

Transport stream output parallel or serial

Signal monitoring Input level, C/N and carrier frequency offset

Supply voltages 2.5V, 3.3V and 5V

Power consumption max. 1.5W

Package LQFP-120

The tuner/QPSK demodulator chip features impressive specifications.














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F-connector

Power Supply

MB86A15(Tuner + QPSKdemodulator)

MB87P2130(CPU + MPEG +RAM + DACs)

MBM29LVxxx(Flash)

SCAR

T

Set-top box manufacturers can now build their products using just three key components, sourced from Fujitsu.

Do you need more to build a Set-Top Box?

Through the use of Windows-based monitoring software, the evaluation anddevelopment processes are significantly simplified. For example, the Windowssoftware offers the user a graphical bit error rate display, bar graphs for signalstrength and quality, and transponder administration using the DiSEqC [email protected]














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SMALLEST FINGERPRINT SENSOR ISIDEAL FOR MOBILE APPLICATIONSIn a further addition to its range of biometric products, Fujitsu has introduced theworld’s smallest capacitive based, solid-state fingerprint sensor. The MBF300Fingerprint SweepSensorTM features advanced FBGA packaging technology to achievea sensor size of only 4.3 x 14mm, with a height of just 1.2mm.

The new device is the first fingerprint sensor from Fujitsu to be activated byswiping the finger across a thin sensor strip, as opposed to the other products in therange, where the finger is placed on a single-touch sensor and held stationary for it tobe read.

The smaller size of the new sensor makes it ideal for integration into mobileapplications such as cellular phones, personal digital assistants (PDAs) and keylessaccess devices. The MBF300 is manufactured in standard CMOS technology, and itssize will also make it suitable for price-sensitive applications.

Another potential high-volume application that the MBF300 is well suited to istransaction security for e-commerce. In many situations, fingerprint authenticationcan supplant the more cumbersome PINs and passwords that are used today.

The MBF300 sensor consists of a 256 x 32 column and row configuration of tinymetal electrodes, with each column linked to a pair of sample-and-hold circuits. Thefingerprint image is recorded in sequence row by row. Each metal electrode acts asone capacitor plate and the contacting finger acts as the second plate. A passivationlayer on the surface of the device forms the dielectric between these two plates.Applying the finger to the sensor creates varying capacitor values across the arrays,which are then converted into an image of the fingerprint. The values of the array aredetermined by the contour (ridges and valleys) of the fingerprint.

Fujitsu’s proprietary SweepSensorTM software technology interfaces with theMBF300 to provide high resolution, 500DPI images of fingerprints swept over the

The new MBF300 fingerprint sensor will bevaluable in many applications ranging frommobile telephones to the automotive industry.














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sensor. Once the fingerprint has been scanned, it is verified against the storedtemplate of the individual fingerprint.

Each MBF300 chip supports three different industry-standard bus interfaces, thefirst fingerprint sensor device to do this. The USB core circuitry is integrated into thechip and supports an image rate of 100 frames/sec, while the enhanced 8 bitMicroprocessor Bus supports over 1000 frames/sec. The MBF300 Serial PeripheralInterface (SPI) sustains an image rate of 100 frames/sec and requires only six wiresfor connection to a microprocessor supporting the SPI [email protected]

Finger Scan48.8%

Middleware11.9%

Hand Scan10.4%

Facial Scan15.4%

Keystroke Scan0.4%Iris Scan

6.2%Signature Scan

2.7%

Voice Scan4.3%

Finger scanning accounted for nearly half the world’s total biometric interface market in 2001, according toFujitsu’s International Biometric Group.

2001 Comparative Market Share by Technology(Does not include AFIS Revenues)














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FME GEARS UP FOR ELECTRONICA IN TIME FOR THE UPTURN

FME’s plans for this autumn’s major exhibition event, Electronica, are alreadyunderway, as signs of a possible upturn in the global semiconductor industry suggestthat the timing for the world’s largest electronic components show could be spot on.

Held once every two years at Munich’s Messe München International venue,Electronica has for decades been the key event in the European electronic industry’scalendar. The last Electronica, in 2000, featured 160,000 square metres of exhibitionspace, and attracted more than 83,000 visitors and 3,050 exhibitors.

FME’s presence at the show, which runs from November 12-15, will include a 90square metre stand and a VIP lounge, and it will also stage a special evening event forcustomers.

FME’s stand at this year’s Electronica will stage a series of interactive product demonstrations for visitors to the show.

12th to 15th Nov. 2002Fujitsu – Hall A5, Stand A5.261

electronica 02


http://fair.electronica.de/













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The location of FME’s stand at Electronica, sited at the crossover point between thedisplays and ICs sections of the show, reflects the portfolio of products that it will beexhibiting.Many of these products lend themselves perfectly to being demonstrated at a show,because to see what they offer involves actually physically interacting with them,rather than merely reading a list of specifications.

The most obvious example is FME’s range of high quality displays, all of whichwill be featured at Electronica. These include four models of TFT-LCDs, which featurewhat is widely acknowledged to be the best TFT-LCD technology yet developed,called Multi-domain Vertical Alignment (MVA). This provides benefits such as anextremely wide angle of view, and fast response times, making MVA-based displaysparticularly suitable for reproducing moving images. The Fujitsu MVA TFT-LCD modelsspan from 17-inch XGA models to 23-inch UXGA units.

The full range of Fujitsu plasma display panels (PDPs) will be shown on the standat Electronica, with the latest products featuring significant enhancements in terms ofresolution, brightness and contrast. The PDPs, produced by the joint venture companyFujitsu Hitachi Plasma Display (FHP), are market leaders and are available in the sizesthat represent the fastest growing sector of the PDP market, 32, 37 and 42 inches.

FME also has an increasing number of IC-based products that lend themselves tobeing shown at an exhibition like Electronica. For example, its fingerprint sensors, foruse in biometric-based authentication systems, provide fascinating demonstrationsfor show visitors who can see the units actually working – with their own fingers! Thelatest introduction to the range, the MBF300 Fingerprint SweepSensorTM, is the world’ssmallest capacitive based, solid-state fingerprint sensor yet developed.

Another technology that needs to be experienced to see what it can offer is thewireless standard, BluetoothTM, for which FME is developing a comprehensive portfolioof products, including wireless access points, PCMCIA and CompactFlash cards, andalready available, modules with host controller interfaces (HCIs) that incorporate acomplete BluetoothTM system with both baseband and RF elements. These aretargeted at a range of specific markets including industrial, mobile, and consumer.














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Also on show at Electronica will be Coral, Fujitsu’s 32 bit graphics display controller(GDC), one of the most powerful GDCs of its kind yet developed. Designed principallyfor use with in-car instrumentation, Coral has the necessary processing performanceand multimedia capabilities to support functions such as MPEG streaming and DVDapplications, set to play key roles in new and future automotive models.

Finally, FME will be demonstrating some of its most advanced memory productsat Electronica, in particular FRAM, which represents a true breakthrough in memorytechnology, combining the low voltage/power consumption and high-speed operationtypical of DRAM and SRAM, with the non-volatility of flash memory and EEPROM. Italso offers exceptional performance – more than one trillion high-speed (100ns)rewrite operations, for example. FRAM is already being used in applications such aselectronic train and bus tickets, civilian registration cards, and products related toentertainment and personal authentication.

So, make sure Electronica is in your diary – from November 12 to 15, at theMesse München International – and for more information, see the Electronicawebsite: http://fair.electronica.de/


http://fair.electronica.de/













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SECOND GENERATION OF BALANCED SAW FILTERS FEATURES LOW INSERTION LOSS

Fujitsu has announced the development of a new member of its FR-V processor coreplatform, the MB93401, also called ‘Robin’, which will be available from the firstquarter of next year.

The FR-V (Fujitsu RISC-VLIW) has been developed to support the rapidly growingnumber of demanding embedded applications in the digital consumer electronics,communications and automotive markets. It features a Very Long Instruction Word(VLIW) architecture, which is complemented by a capability for instruction-levelparallelism that enables simultaneous processing of multiple instructions.

A further feature is the range of specialised instruction sets available for use withthe FR-V core, plus the ability to incorporate further custom instruction sets. This

The new series of balanced SAW filters catersfor all the major cellular telephone formats.

Balanced SAW FiltersF5/F6 CQ series (B25Å/B26Å) Balanced terminal impedance ( Ω )

50 100 150 200EGSM-Tx F5CQ–897M50–**** – B25J – B25KEGSM-Rx F5CQ–942M50–**** B25A B25B B25C B25DDCS-Rx F6CQ–1G8425–**** B26A B26B B26C B26DAMPS-Tx F5CQ–836M50–**** – B25L – B25MAMPS-Rx F5CQ–881M50–**** – B25R B25P B25QPCS-Rx F6CQ–1G9600–**** B26J B26K B26L B26MJCDMA-Tx F5CQ–906M00–**** B25W – – –WCDMA-Tx F6CQ–1G9500–**** – – – B26PWCDMA-Rx F6CQ–2G1400–**** B26Q – – B26SB25*, B26*: ES Now B25*, B26*: Under development














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makes the FR-V well suited to the development of System-on-Chip devices. Also, tomeet the needs of its target markets, the FR-V has exceptionally low powerconsumption, as little as 0.05mW per MOPS.

The new component complements the top of the range unit that is alreadyavailable, the MB93501, called ‘Tiger’. The new processor core offers slightly lowerperformance than the Tiger, but is a highly integrated system on a single chip. TheTiger provides the highest level of performance available in the FR-V series in a two-chip solution.

The MB93401 features not only the FR-V core, but also on-chip resources such asDMA, two UARTs, and a timer, which means no second chip is required. The FR-V coreof the new device features two integer slots, plus the same for media, which meansthat a VLIW element in the MB93401 could comprise two integer and two mediainstructions.This design makes the MB93401 well suited to tasks in which media instructions are

The F5/F6 CQ Series of single SAW filters come in a 2.5 x 2.0mm, six-pin package.

Balanced Output

Unbalanced Input

2.5 ± 0.2

2.0

± 0.

2

1.0 max

(C 0.30)index

0.63 ± 0.1

0.5 ± 0.1

Pin Configuration (F5CQ/F6CQ Series)














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-35

-30

-25

-20

-15

-10

-5

0

dB (S

(2,1

))

1.55 1.65 1.75 1.85 1.95 2.15

fre q, GHz

-10

-9

-8

-7

-6

-5

-4

-3

-2

-1

0

dB (S

(2,1

))

-1.78 -1.80 -1.82 -1.84 -1.86 -1.88 -1.90 -1.92

fre q, GHz

2.05

-40

m1

m2m3

m4

m7m8

m7fre q=1.805GHzdB(S(2,1))=-1.362

m8fre q=1.880GHzdB(S(2,1))=-1.841

Low Insertion Loss

m1fre q=1.705GHzdB(S(2,1))=-29.083m2fre q=1.785GHzdB(S(2,1))=-16.887m3fre q=1.902GHzdB(S(2,1))=-14.139m4fre q=1.980GHzdB(S(2,1))=-28.564

Low insertion loss is one of the enhanced features of the new SAW filter range.

SAW Balanced FilterDCX-RX (150ohm output)

heavily used, for example in image pre-processing. Typical end products that wouldbenefit from this would be photocopiers, or combined fax-scanner-printer-copiermachines. Other possible applications could include in-car navigation systems.

Development environments of the FR-V processor cores are based on anadvanced version of a vector compiler used in Fujitsu supercomputers. Instead of theawkward assembly languages used for developing DSP and media-relatedapplications, the FR-V development environment enables users to write applicationswith high-level languages, reducing design cycle times.

Fujitsu is continually refining its CMOS expertise with the development of sub-0.1micron process technology, leading to increased operating speeds and powerconsumption levels below 0.05mW/MOPS. Fujitsu is also planning to expand itsapplication-specific functions by increasing the number of simultaneous operationsand their combinations in VLIW.www.fme.fujitsu.com/products/micro/techform.html














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ENHANCED HIGH-RESOLUTION PDPs GIVEINCREASED BRIGHTNESS AND CONTRAST

A new range of plasma display panels (PDPs) now under development at FujitsuHitachi Plasma Display (FHP) will offer significant enhancements in terms of picturequality.The last year has seen impressive growth in the demand for PDPs, as consumers areincreasingly attracted to the quality they offer, and the space saving that results froma flat screen, wall-hanging TV.

In 2001, sales of PDPs across Europe were around 78,000, compared with 51,000in 2000. For this year, sales are expected to nearly double to 150,000, according tomarket research company DTC.

Similarly, in Japan rapid growth is taking place, with TV manufacturers frequentlyintroducing new high resolution models. These are ideal receivers for the highdefinition TV (HDTV) broadcasts that are gaining popularity in both Japan and the USA.FHP’s PDPs are already renowned for providing some of the highest quality pictures ofany PDPs, and the new range, called H2, will enhance these quality levels still further.

42 inch 37 inch 32 inch














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All the H2 models will be suitable for high definition TV viewing, offering the highestavailable resolution of 1024 x 1024 and using FHP’s unique ALIS (Alternate Lighting ofSurfaces) technique, which alternately displays odd and even lines at high speeds.

One important development of the new H2 series will be significantly higher levelsof brightness. The current target is to achieve 900cd/m2 for the 32 and 37 inchmodels, compared with 650cd/m2 for the current units, and for the 42 inch PDPs,1000cd/m2, compared with 750cd/m2 currently. Also seeing a major improvement iscontrast, with all three models aiming to offer double the contrast of the currentgeneration, going from 500:1 to 1000:1.To make life as easy as possible for the end equipment manufacturers, the H2 PDPswill all be backward compatible with the H1 devices, in terms of their mechanicalcharacteristics and interfacing.Now under development, the H2 PDPs will go into volume production by the end of2002.

[email protected]














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FME CELEBRATES 20-YEAR PARTNERSHIP WITH EBV FME recently celebrated one of its longest-standing business relationships, with itslargest distributor in Europe, German company EBV, based in Poing, near Munich.

At a ceremony held to mark the partnership, that has so far lasted 20 years, thePresident of FME, Yukata ‘Yul’ Suzuki, thanked EBV’s President, Patrick Zannit, for thesuccess of the relationship between the two companies, which had beencharacterised by trust, fairness and mutual success, he said.

“20 years is a long time and in an industry as young and dynamic as electronics,it’s almost like a dynasty!” When FME and EBV first came together, both companieshad different names – respectively, FMG and Micro Halbleiter.“As our product mix has changed from the old days of EPROMs, through to SRAMs,on to DRAMs, now flash and of course MCUs, with designs done here in Europe, soEBV has adapted its sales strategy and expanded its sales coverage, especiallygeographically. Your expansion and success in Eastern Europe alone has been quitephenomenal, and we have profited from many of the initiatives you have undertaken.”

Suzuki said FME was looking forward to tackling, with EBV, the new markets andchallenges that lie ahead.

“No one can rule out the possibility that 20 years from today a successor of minewill stand here and comment on our 40th anniversary. I hope so. Between EBV andFME the possibilities are infinite.”[email protected]














European Distributors & Representatives

European Sales Offices

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EUROPEAN DISTRIBUTORS & REPRESENTATIVESAustriaEBV Elektronik GmbHDiefenbachgasse 35/1, A-1150 WienTel: (01) 8 91 52-0Fax: (01) 8 91 52-30

BelgiumEBV Elektronik GmbHExcelsiorlaan 35 /, Av. Excelsior 35B-1930 ZaventemTel: (02) 7 16 00 10Fax: (02) 7 20 81 52

Czech RepublicEBV Elektronik GmbHV Holesovièkách 29CZ-182 00 Praha Tel: (02) 66 31 30 31Fax: (02) 68 89 07 8

DenmarkEBV Elektronik GmbHVed Lunden 9, DK-8230 ÅbyhøjTel: 86 25 04 66Fax: 86 25 06 60

EBV Elektronik GmbHRosenkæret 11 C, DK-2860 SøborgTel: 39 69 05 11Fax: 39 69 05 04

FinlandEBV Elektronik GmbHPihatörmä 1 a, FIN-02240 EspooTel: (09) 27 05 27 90 Fax: (09) 27 09 54 98

PN Electronics142-176 avenue de StalingradParc Technologique des Corvettes BP 5392703 Colombes CedexTel: (01) 47 80 67 85Fax: (01) 47 85 95 12

PN ElectronicsRue Jean Bart Immeuble Calliope31317 LabegeTel: (05) 62 88 23 23Fax: (05) 62 88 23 29

PN Electronics334 Rue des vingt toises-Le Magistere II38950 Saint Martin le VinouxTel: (04) 38 02 02 03Fax: (04) 38 02 21 00GermanyEBV Elektronik GmbHKitzingstraße 15-19D-12277 Berlin-MariendorfTel: (0 30) 74 70 05-0Fax: (0 30) 74 70 05-55

EBV Elektronik GmbHIn der Meineworth 21D-30938 BurgwedelTel: (0 51 39) 80 87-0Fax: (0 51 39) 80 87-70

EBV Elektronik GmbHAn der Gümpgesbrücke 7D-41564 KaarstTel: (0 21 31) 96 77-0Fax: (0 21 31) 96 77-30

EBV Elektronik GmbHNahkatehtaankatu 2, FIN-90100 OuluTel: (08) 5 62 49 10 Fax: (08) 5 62 49 15

FranceEBV Elektronik GmbHImmeuble Hemiris, Bâtiment A115 Rue Nicolas LedouxF-13854 Aix-en-ProvenceTel: (04) 42 39 65 40Fax: (04) 42 39 65 50

EBV Elektronik GmbH3, rue de la RenaissanceF-92184 Antony CedexTel: (01) 40 96 30 00Fax: (01) 40 96 30 30

EBV Elektronik GmbH29, ave des PeupliersF-35510 Cesson SévignéTel: (02) 99 83 00 50Fax: (02) 99 83 00 60

EBV Elektronik GmbHActys Bâtiment 2, voie 3, BP 348F-31313 Labège CedexTel: (05) 61 00 84 61Fax: (05) 61 00 84 74

EBV Elektronik GmbHParc Club du Moulin à Vent33, Av. du Dr. Georges LévyF-69693 VenissieuxTel: (04) 72 78 02 78Fax: (04) 78 00 80 81

ˆ
















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EBV Elektronik GmbHIm Technologiepark 2-8 D-85586 PoingTel: (0 81 21) 77 4-0Fax: (0 81 21) 77 4-4 22

EBV Elektronik GmbHNeue Ramtelstraße 4D-71229 LeonbergTel: (0 71 52) 30 09-0Fax: (0 71 52) 75 95-8

EBV Elektronik GmbHBorsigstraße 7 D-65205 WiesbadenTel: (0 61 22) 80 88-0Fax: (0 61 22) 80 88-99

EBV Elektronik GmbHZum Mühlenberg 9D-07806 Neustadt/OrlaTel: (03 64 81) 24 4-0Fax: (03 64 81) 24 4-99

Glyn GmbH & Co. KGAm Wörtzgarten 8 D-65510 Idstein/Ts.Tel: (0 61 26) 59 02 22Fax: (0 61 26) 59 01 11

GreeceEBV Elektronik GmbH1, Anaxagora Str.GR-17778 Tavros / AthensTel: (01) 03 41 43 00Fax: (01) 03 41 43 04

EBV Elektronik s.r.l. (Firenze)Via Panciatichi, 40Palazzo 11, I-50127 FirenzeTel: (0 55) 4 36 93 07 Fax: (0 55) 4 26 52 40

EBV Elektronik s.r.l. (Modena)Via Campagna, 12I-41010 Cognento (MO)Tel: (0 59) 29 24 / 21 1Fax: (0 59) 29 29 / 48 6

EBV Elektronik s.r.l. (Napoli)Via Paolo della Valle, 32Quartiere Soccavo I-80126 NapoliTel: (0 81) 7 28 16 58Fax: (0 81) 7 67 22 67

EBV Elektronik s.r.l. (Padova)Via IX Strada, 23/C int.2 Zona Industriale I-35100 PadovaTel: (0 49) 7 92 36 20Fax: (0 49) 8 07 48 74

EBV Elektronik s.r.l. (Roma)Viale Palmiro Togliatti 1639I-00155 RomaTel: (06) 4 06 36 65 / 789Fax: (06) 4 06 37 77

EBV Elektronik s.r.l. (Torino)Corso Vercelli 348I-10156 TorinoTel: (011) 2 62 56 90Fax: (011) 2 62 56 91

HungaryEBV Elektronik GmbHH-1107 Budapest, Ceglédi út 1-3Tel: (01) 4 31 34 95/6Fax: (01) 4 31 34 97

IrelandEBV Elektronik GmbHBallymount Trading Estate Ballymount Road, WalkinstownDublin 12Tel: (01) 4 56 40 34Fax: (01) 4 56 40 35

IsraelEBV ElektronikAvnet Building Commercial Centre Dror SouthP.O. Box 149, 40650 Tel MondTel: (09) 7 96 69 90Fax: (09) 7 96 68 80

Toyo Ram Electronics Ltd1 Hamasger StP.O. Box 2334Ind.ZoneRaanana 43653Tel: (09) 7 60 36 50Fax: (09) 7 44 30 50

ItalyEBV Elektronik s.r.l. (Milano)Via C. Frova, 34I-20092 Cinisello Balsamo (Mi)Tel: 02 66 09 61Fax: 02 66 01 70 20
















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Malpassi s.r.l.Via Baravelli 1I-40012 Calderara di Reno BolognaTel: (0 51) 72 72 52Fax: (0 51) 72 73 78

Melchioni Electronica S.p.A.Divisione IndustriaVia Pietro Colletta 37 I-20135 MilanoTel: 02 5 79 41Fax: 02 5 41 34 001

NetherlandsEBV Elektronik GmbHPlanetenbaan 116NL-3606 AK MaarssenbroekTel: (03 46) 58 30 10Fax: (03 46) 58 30 25

NorwayEBV Elektronik GmbHRyensvingen 3B P.B 101 Manglerud, N-0612 OsloTel: (0 22) 67 17 80Fax: (0 22) 67 17 89

PolandEBV Elektronik GmbHPl. Solny 16, PL-50062 WroclawTel: (0) 71 3 42 29 44 Fax: (0) 71 3 42 29 10

SpainEBV Elektronik GmbHAntón Fortuny 14-16 4° 1a Esc. CE-08950 Esplugues de LlobregatBarcelonaTel: (0 93) 4 73 32 00Fax: (0 93) 4 73 63 89

EBV Elektronik GmbHCentro Empresarial EuronovaC/Ronda de Poniente, 4 1a planta, Oficina A.E-28760 Tres Cantos, MadridTel: (0 91) 8 04 32 56Fax: (0 91) 8 04 41 03

SwedenEBV Elektronik GmbHDerbyvägen 20S-21 235 MalmöTel: (0 40) 59 21 00Fax: (0 40) 59 21 01

EBV Elektronik GmbHSjöängsvägen 7S-19 272 SollentunaTel: (08) 59 47 02 30Fax: (08) 59 47 02 31

SwitzerlandEBV Elektronik GmbHBernstrasse 394CH-8953 DietikonTel: (01) 7 45 61 61Fax: (01) 7 45 61 00

RussiaEBV Elektronik GmbH Korovinskoye Shausse 10Build 2, off. 28RUS-127486 MoscowTel: (0 95) 9 37 87 07Fax: (0 95) 9 37 87 06

SloveniaEBV ElektronikDunajska 22 SLO-1511 LjubljanaTel: (01) 3 00 03 73Fax: (01) 4 33 04 57

South AfricaEBV Electrolink236 Queen Mary AvenueGlenmore, Durban 4001Tel: (0 31) 2 05 12 05Fax: (0 31) 2 05 22 65

EBV Electrolink5th Floor, Fleetway HouseMartin Hammerschlag WayForeshore, Cape Town 8001 Tel: (0 21) 4 21 53 50Fax: (0 21) 4 19 62 56

EBV ElectrolinkBuilding 14, 2nd Floor141 Western Service RoadWoodlands Office ParkWoomead, Johannesburg 2157Tel: (0 11) 2 36 19 00Fax: (0 11) 2 36 19 13
















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EBV Elektronik GmbHAv. des Boveresses 52, CH-1010 LausanneTel: (0 21) 6 54 01 01Fax: (0 21) 6 54 01 00

TurkeyEBV Elektronik GmbHBayar Cad. Gülbahar Sok. No. 17 / Perdemsaç Plaza D: 56 Kozyatagi TR-81090 / IstanbulTel: (02 16) 4 63 13 52Fax: (02 16) 4 63 13 55

United KingdomEBV ElektronikEBV House, 7 Frascati WayMaidenhead, Berkshire SL6 4UYTel: (01628) 78 36 88Fax: (01628) 78 38 11

EBV Elektronik144 West George StreetGlasgow G2 2HGTel: (0141) 3 52 20 50Fax: (0141) 3 52 20 59

EBV ElektronikManchester International Office CentreSuite 5B, Styal Road Manchester M22 5WBTel: (0161) 4 99 34 34Fax: (0161) 4 99 34 74

EBV Elektronik12 Interface Business ParkBincknoll Lane Wootton Bassett Wiltshire SN4 8SYTel: (01793) 84 99 33Fax: (01793) 85 95 55

Glyn Ltd172 Norsey Road, BillericayEssex CM11 1BUTel: (01277) 63 42 00Fax: (01277) 63 14 39

Glyn Ltd35 Wansdyke, Lancaster Park, MorpethNorthumberland NE61 3RATel: (01670) 51 46 16Fax: (01670) 51 69 36

EUROPEAN REPRESENTATIVES

DenmarkTeam TechBygstubben 3, DK-2950 VedbaekTel: 45 66 25 00 Fax: 45 66 02 44

IsraelToyo Ram Electronics Ltd.1 Hamasger Street, P.O.BOX 2334 Ind.Zone, Raanana 43653 Tel.: (08) 78 03 65 0Fax: (09) 74 43 05 0

NetherlandsA-top electronics b.v.Baltesakker 1a, 5625 TC EindhovenTel. (0 40) 292 73 83Fax: (0 40) 292 70 25

SpainEuroinger, s.l.C/ Almendralejos, 428140 Fuente el Saz del JarmaMadridTel: (0 91) 62 01 42 5Fax: (0 91) 62 00 61 2

World Wide Web SitesEBV Elektronik GmbH:

www.ebv.comEuroinger, s.l.

www.euroinger.comGlyn GmbH & Co. KG:

www.glyn.deGlyn Ltd:

www.glyn.comMalpassi srl:

www.malpassi.itMelchioni Electronica SpA:

www.melchioni.itPN Electronics:

www.pne.frTeam Tech:

www.teamtech.dkToyo Ram Electronics Ltd:

www.toyoram.co.il



http://www.ebv.com

http://www.euroinger.com

http://www.glyn.de

http://www.glyn.com

http://www.malpassi.it

http://www.melchioni.it

http://www.pne.fr

http://www.teamtech.dk

http://www.toyoram.co.il














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GermanyFujitsu Microelectronics Europe GmbHAm Siebenstein 6-10D-63303 Dreieich-BuchschlagTel: (0 61 03) 69 00 Fax: (0 61 03) 69 01 22

Fujitsu Microelectronics Europe GmbHCarl-Zeiss-Ring 11 D-85737 Ismaning/MunichTel: (0 89) 96 09 44 0 Fax: (0 89) 96 09 44 22

FranceFujitsu Microelectronics Europe GmbH127, Chemin des BassinsF-94035 Créteil CedexTel: (01) 45 13 12 12 Fax: (01) 45 13 12 13

ItalyFujitsu Microelectronics Europe GmbHPalazzo Pitagora - Milano 3 CityVia Ludovico il Moro 4BI-20080 Basiglio, Milano Tel: 02 90 45 02 1 Fax: 02 90 75 00 87

United KingdomFujitsu Microelectronics Europe GmbHNetwork House, Norreys DriveMaidenhead, Berkshire SL6 4FJTel: (01628) 50 46 00 Fax: (01628) 50 46 66

EUROPEAN SALES OFFICES



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THE POSSIBILITIES ARE INFINITE - Fujitsu › downloads › MICRO › fme › news › Summer_2002_web.pdfTHE POSSIBILITIES ARE INFINITE MirrorFlashTM Doubles Storage Capacity without