The First Entrepreneurial and Practice-Oriented Masters Program

in Microelectronics Systems Packaging

Leyla ConradAssociate Director, Education

Packaging Research Center

Georgia Institute of Technology

Evolution and Expectations in Packaging Industry

1999 2006Electronics $993B > $2.0TMicroelectronics & Packaging $250B $500BElectronics Packaging $109B* > $200B

To Support the Industry Growth:• Next-Generation System Technologies• Skilled Human Resources

• Globally-Competitive, System-Level Engineers with Complete Product Dev. Education

*Input from Tech Search International

U.S. Industry NeedsU.S. Industry Needs• 58,000 scientists, engineers, and technicians are currently employed in U.S.

in electronic packaging

• PRC projects this number will reach 89,000 by 2008

• Total U.S. annual demand for new human resources =3,800 in 2002; current total degree recipients at all levels from all U.S. universities < 300 per year.

• Estimated distribution in educational backgrounds:

#1 Priority #2 Priority #3 Priority #4 Priority

Industry M.S.

(53%)

B.S.

(20%)

Ph.D.

(10%)

Technicians

(10%)

Academia Ph.D.

(2%)

National &

Corporate Labs

Ph.D.

(5%)

Annual Human Resource Needs in U.S.Annual Human Resource Needs in U.S.

Ph.D.Ph.D. 600600 5050

M.S.M.S. 20002000 7070

B.S.B.S. 800800 5050

ProfessionalProfessionalEngineersEngineers

LevelLevel Need/YearNeed/Year Prod./Yr.Prod./Yr. Provided ByProvided By PRC Production/10 yearsPRC Production/10 years

• Graduate Education, Graduate Education, 228 in 10 years (PRC)228 in 10 years (PRC)• Certificate in MicroelectronicCertificate in Microelectronic

• Undergraduate EducationUndergraduate Education 465 in 10 years465 in 10 years

• Industry EducationIndustry Education

PackagingPackaging 267 in 10 years267 in 10 years

• 20 Universities20 Universities

• 20 Universities20 Universities

•IEEE-CPMTIEEE-CPMT•IMAPSIMAPS

•5-10 Universities5-10 Universities•CompaniesCompanies

• 3 UniversitiesUniversities

What is PRC?What is PRC?

Georgia Tech12 Collaborating Universities

•GlobalElectronics

Industry

Global PRC•50 Companies•280 Students

•35 Professors, 7 Departments•$20M Annual

Budget

• Next-generation of Microelectronic Systems Packaging Technologies Based on SOP

• New Breed of Globally-Competitive Engineers• Partnership and Technology Transfer to Global Industry

•NSF-ERC•Georgia State•(GRA)

•15 Research Eng.

•IMAPS, IEEE Programs

•Web-based Courses•International Internships

•Academic Conference

• Internships/Co-Ops• Manufacturing

Education• Distinguished Seminars• Mentoring by Industry

Professionals• Industry Engineers on

Campus• Entrepreneurial

Education

Integrated Vision forEducation

•Labs for Hands-on DBO Courses

•Prototype Research Projects

•Operation of Manufacturing Equipment

Research

Industry

GlobalRelations

Infrastructure

EDUCATION:• Product Dev. Cycle• System-level• Global

• Prototype Research• Curriculum Development• Books• Short Courses• Workshops• Student Monthly Seminars• Systems Research

Desired Educational OutcomesDesired Educational OutcomesResults of IAB Needs Assessment:

• Rigorous, broad exposure to fundamentals

• Deep level knowledge of issues relevant to electronics packaging

• Interdisciplinary and cross-functional skills

• Economics and management education

• Hands-on work experience

• Interpersonal skills

• Exposure to foreign cultures

• Diversity

Practice Oriented Masters Program

• Objective: Implement a microelectronic packaging certificate program in engineering.

• Goals:

- Deep level knowledge of packaging,

- Interdisciplinary and cross-functional skills,

- Hands-on work experience,

- Economics and management education,

- Industry experience,

- Exposure to foreign cultures.

STRATEGY3 primary components

1) Engineering Component - 4 courses,12 hrs

2) Management Component - 2 courses, 6 hrs

3) Internship Component - 3 to 6 months

Certificate Program

Major: ECE, ME or MSE

Minor: Management

Practice Oriented Masters Practice Oriented Masters ProgramProgram

Practice-Oriented MastersPackaging Certificate 12 sem. hoursEngineering

Component Degree Requirements 12 sem. hoursMGT6753 – Managementfor Engineers

3 sem. hoursManagementComponent Management elective 3 sem hours

InternshipComponent

3 months for domestic and 6 monthsfor international

Engineering ComponentEngineering Component

Microelectronics Packaging Certificate

System-levelECE/ME/MSE8803 – MicroelectronicsSystems Packaging TechnologiesChE/ECE4803 – Electronic PackagingSubstrate Fabrication

ORHands-on

ME/ECE/MSE4803 – Electronics Packaging:Assembly, Reliability, Thermal Managementand Test

Two Microelectronics Packaging Electives from the list

Microelectronics Packaging Microelectronics Packaging CoursesCourses

Elective Courses (Graduate)ChE6609 – Polymers in MicroelectronicsECE6140 – Digital Systems TestECE6361 –Microwave Design LaboratoryECE6430 – Digital MOS Integrated CircuitsECE6455 – Semiconductor Process ControlECE6458 – Gigascale IntegrationECE6520 – Integrated OpticsECE6542 – OptoelectronicsECE6556 – Intelligent ControlECE7141 – Advanced Digital Systems TestME6224 – Semiconductor Manufacturing and AssemblyME8103 – Finite Element MethodME8403 – Thermo-mechanical Reliability in PackagingMSE6510 – Polymers for Electronics and Photonics IMSE7510 – Polymers for Electronics and Photonics II

Design-Build-Operate (DBO) CoursesDesign-Build-Operate (DBO) Courses

• Objective: Augment PRC curriculum with hands-on instructional laboratories.

• Goal: Ensure that all PRC students have the opportunity to receive training in the hands-on aspects of electronics packaging.

• Strategy: 2 hands-on laboratory courses Substrate Fabrication (design, fabricate, test)

Module Assembly (assemble, test, thermal management)

Complete Product Development CycleComplete Product Development Cycle

DBO1 Facilities

Next Generation Substrate Facility

• Introduction to Packaging• Laboratory Safety• Interconnect Design• Dielectric/Polymer

Deposition• Formation of interconnect

vias• Copper Metallization• Substrate Testing

Course TopicsCourse Topics

Process FlowProcess FlowSubstrate Fabrication

1.ORIGINAL SUBSTRATE

2. COAT AND PRE-BAKE

3. PHOTO-EXPOSE, DEVELOP, CURE

4. SUB-ETCH COPPER LAYER

5. STRIP PHOTORESIST

6. APPLY PHOTO-POLYMER

7. EXPOSE, DEVELOP, FINAL CURE

8. METALLIZATION PROCESS WITH ELECTROLESS

PLATING

InfrastructureInfrastructure

Design Meniscus Coater

Spin Coater

UV Exposure

Wet stations

DBO2 Facilities

Next Generation Module Facility

• Introduction to next generation packaging

• Thermo-mechanical modeling and reliability

• Assembly processes and materials

• Functional testing• Thermal management• Reliability testing

Course TopicsCourse Topics

Print No Clean SolderPaste on SMT Sites

Print No Clean SolderPaste on SMT Sites

SimultaneousSolder Reflow

and Underfill Cure

SimultaneousSolder Reflow

and Underfill Cure

Second Side AssemblySecond Side Assembly

Pick and PlaceSMT Components

Pick and PlaceSMT Components

Pick and PlaceFlip Chip Components

Pick and PlaceFlip Chip Components

Post PlacementInspection (Optional)

Post PlacementInspection (Optional)

Low Cost Next Generation Process

Functional TestFunctional Test

Burn-InBurn-In

Final AssemblyFinal Assembly

Print Underfill onFlip Chip Bond Sites

Print Underfill onFlip Chip Bond Sites

Print No Clean SolderPaste on Flip Chip BondPads (Very Fine Pitch)

and SMT Pads

Print No Clean SolderPaste on Flip Chip BondPads (Very Fine Pitch)

and SMT Pads

Cure UnderfillCure Underfill

Solder ReflowSolder Reflow

Dispense UnderfillDispense Underfill

Second Side AssemblySecond Side Assembly

Pick and PlaceSMT Components

Pick and PlaceSMT Components

Pick and PlaceFlip Chip Components

Pick and PlaceFlip Chip Components

Post PlacementInspection (Optional)

Post PlacementInspection (Optional)

Process Using Solder Paste Printing

Functional TestFunctional Test

Burn-InBurn-In

Final AssemblyFinal Assembly

Assembly Process FlowAssembly Process Flow

Management ComponentManagement ComponentMGT6753 - Management for Engineers

Leadership for Creativity and Innovation (Instructor: Christina Shalley Financial Reporting and Analysis of Tech Firms (Instructor: C.Mulford) Managerial Accounting (Instructor: Deborah Turner) Negotiation (Instructor: Christina Shalley) Teams (Instructor: Dennis Nagao) Operations I (Instructor: Cheryl Gaimon) Operations II (Instructor: Cheryl Gaimon) Focus on Capacity and Process Planning (Instructor: Cheryl Gaimon) The Value of Quality (Instructor: Vinod Singhal) Supply Chain Management (Instructor: Soumen Ghosh) Finance (Instructor: Narayan Jayaraman) Entrepreneurial Finance--Valuation, Financing (Instructor: Narayan Jayaraman) New Product Development (NPD) Process (Instructor: Kenneth Kahn) From Development to Commercialization Mkting (Instructor: Kenneth Kahn) E-Commerce (Instructor: Fred Riggins) Strategy (Instructor: Lloyd Byars)

Management ComponentManagement ComponentManagement Elective Courses

• MGT 6051 Database Development and Applications

• MGT 6052 System Analysis and Design

• MGT 6055 Decision Support and Expert Systems

• MGT 6056 Electronic Commerce and Marketing

• MGT 6060 Financial Management

• MGT 6198 Corporate Entrepreneurship for Global Competitiveness

• MGT 6306 Business to Business Marketing

• MGT 6350 Operations Management

• MGT 6351 Operations Planning and Control

• MGT 6360 Global Operations and Logistics

• MGT 6772 Managing Resources of the Technological Firm

• MGT 6773 Strategic Management of Technology Based Ventures

• MGT 6789 Technology Transfer

• MGT 6814 Law, Management, and Economics

Tool Companies

Semiconductor Companies

Internship ComponentInternship Component

Material Companies

Packaging Companies

System CompaniesAerospace Automotive Communications Medical Computer

CIRCUIT TECHNOLOGIES

Lambda Technologies

Corporate FellowshipsCorporate Fellowships

• Goal: to produce substantial number of microelectronics systems packaging engineers

- fellowship grant of $25,000 (US)

Company Benefits

• Summer intern

• Access to PRC graduates

• Attend one annual IAB meeting

POM StudentsPOM Students

• Himanshu Agarwal (MSE)

• Ankur Agrawal (ChE)

• Charles Butterfield (ECE)

• Anil K. Chinthakindi (ChE)

• Pranav Patel (ECE)

• Melinda Woods (ECE)

POM Organizational StructurePOM Organizational Structure

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E ngineeringG ary M ay

M anagem entN arayan an Jayaram an

In te rnshipC arl R u s t

Projec t C oordina torL eyla C on rad

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Microelectronic Systems Packaging Technology Curriculum at GTMicroelectronic Systems Packaging Technology Curriculum at GT

Fundamental Science/Math Courses

ECEElectromagnetics

MEHeat Transfer

MSEMaterials

ChEElectrochem.

FUNDAMENTAL ENGINEERING COURSESFundamental/Thrust Courses (8)

Hands-on CoursesDBO2DBO1

System-level course

UG

Res

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UG

Res

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System-level courseHands-on Courses

DBO2DBO1

Fundamental/Thrust courses (14 )

Sys

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Inte

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Res

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Focused Program of Study

Packaging Certificate Entrepreneurial andPractice Oriented MS

ManagementCourses

System-level course

Sys

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Inte

grat

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Res

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Professional Communications course

Future ChallengesFuture ChallengesEnhancing electronic packaging education

• Planning human resource needs

• Enhanced M.S. degrees

• Technology-enhanced educational delivery

• Focus on manufacturing, business, management

• SOP technology

• Environmentally benign processing

• Assessment of education programs

Forming partnerships• Universities, industry, and professional societies must form partnerships to

promote electronics packaging education