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The Effect of Process Equipment on Fine-Line Uniformity March 25, 2003

The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

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Page 1: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 1

The Effect of Process Equipment on

Fine-Line Uniformity

March 25, 2003

Page 2: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 2

Preface

Test patternsUniformity issuesPhotoplotter resolutionLaser direct imagingEtching uniformity

Page 3: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 3

Conductor/Space Panels

Page 4: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 4

Conductor/Space Modules

Design1 inch by 1 inch4 conductors and 3 spacesSelectable conductor and space sizes

AnalysisYields and defect densitiesPredicted product yieldsConductor width and height uniformityProcess capability (Cp, Cpk)

Page 5: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 5

Conductor Width and Height

Average conductor width over its lengthAverage conductor height over the module

width

height

Page 6: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 6

Uniformity Issues

Types of non-uniformities

Feature orientationPanel surfaceSide-to-sidePanel-to-panelLot-to-lot

Sources of non-uniformities

ArtworkImagingDevelopingEtching

Page 7: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 7

Photoplotter Test

18 x 24 inch panels1-oz copperPrint and etch[3] 4 [4] 5 [5] 6 [6] [conductor] spaceConstant process conditions

Page 8: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 8

Photo-Plotter Resolution

8,000

8,000

20,000

Resolution (DPI)

0.1561.031.69B

0.0950.661.61A

0.0860.491.76A

Std. Dev. (mils)

Range (mils)

Mean (mils)Plotter

Page 9: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 9

Plotter A at 20,000 DPI

Surface Std. Dev. = 0.086 milsSurface Range = 0.41 mils

Page 10: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 10

Plotter A at 8,000 DPI

Surface Std. Dev. = 0.091 milsSurface Range = 0.51 mils

Page 11: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 11

Plotter B at 8,000 DPI

Surface Std. Dev. = 0.148 milsSurface Range = 0.856 mils

Page 12: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 12

Laser Direct Imaging Test

18 x 24 inch panels0.5-oz copperPrint and etch[2] 2 [3] 3 [4] 4 [5] [conductor] spaceSingle-sided exposure

Page 13: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 13

LDI Top Side

Page 14: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 14

LDI Bottom Side

Page 15: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 15

Etching Non-Uniformities

PuddlingStripingDirectional dependenceEdge dependenceCombinations

Page 16: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 16

Puddling

Page 17: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 17

Striping

Page 18: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 18

Directional Dependence

Page 19: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 19

Edge Dependence

Page 20: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 20

Puddling and Striping

Page 21: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 21

Puddling and Directional

Page 22: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 22

Directional and Edge

Page 23: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 23

Etching Uniformity

Improvements are possibleCooperation between equipment manufacturer and PCB fabricator is critical

Page 24: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 24

Top Side - Initial

Surface Std. Dev. = 0.110 milsSurface Range = 0.57 mils

Page 25: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 25

Top Side - Final

Surface Std. Dev. = 0.079 milsSurface Range = 0.46 mils

Page 26: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 26

Bottom Side - Initial

Surface Std. Dev. = 0.160 milsSurface Range = 0.74 mils

Page 27: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 27

Bottom Side - Final

Surface Std. Dev. = 0.071 milsSurface Range = 0.40 mils

Page 28: The Effect of Process Equipment on Fine-Line Uniformity Effect of Process... · 2014. 4. 12. · Process capability (Cp, Cpk) Page 5 Conductor Width and Height Average conductor width

Page 28

Final Thoughts

Uniformity improvements are essential forcontrolled impedance productshigh-density products

Etching is not the only source of non-uniformitiesProcess non-uniformities can cause opens and shortswww.cat-test.info