9
The Development of Tin Whiskers in Lead-free Solder Joseph Garvey and Rachel Lindbergh – Co-Principal Investigators Gabriel Voigt – Co-Investigator Palmetto Scholars Academy North Charleston, SC

The Development of Tin Whiskers in Lead-free Solder Joseph Garvey and Rachel Lindbergh – Co-Principal Investigators Gabriel Voigt – Co-Investigator Palmetto

Embed Size (px)

Citation preview

Page 1: The Development of Tin Whiskers in Lead-free Solder Joseph Garvey and Rachel Lindbergh – Co-Principal Investigators Gabriel Voigt – Co-Investigator Palmetto

The Development of Tin Whiskers in Lead-free

SolderJoseph Garvey and Rachel Lindbergh – Co-Principal Investigators

Gabriel Voigt – Co-Investigator

Palmetto Scholars AcademyNorth Charleston, SC

Rachel Lindbergh
Mrs. Voigt, When you go through, try it on present view first.
Page 2: The Development of Tin Whiskers in Lead-free Solder Joseph Garvey and Rachel Lindbergh – Co-Principal Investigators Gabriel Voigt – Co-Investigator Palmetto

Tin Whiskers● Small, crystalline structures● 0.006 to 10 micrometers thick

and up to 10 millimeters long● Have been known to cause

short circuits ● Causes are unknown--

theories say they could be caused by compression

Page 3: The Development of Tin Whiskers in Lead-free Solder Joseph Garvey and Rachel Lindbergh – Co-Principal Investigators Gabriel Voigt – Co-Investigator Palmetto

Tin whiskers have degraded or destroyed…

● Galaxy IIIR● Galaxy VII ● Solidaridad 1● OPTUS B1● DBS-1● PAS-4● DirecTV 3

● Pacemakers● Patriot and Phoenix

missiles● Cellphones● Computers

Rachel Lindbergh
I put satellites on one side, and other items on the right
Rachel Lindbergh
_Marked as resolved_
Rachel Lindbergh
_Re-opened_
Page 4: The Development of Tin Whiskers in Lead-free Solder Joseph Garvey and Rachel Lindbergh – Co-Principal Investigators Gabriel Voigt – Co-Investigator Palmetto

Experiment Design

▪ 120 mm x 5 mm x 2 mm (99.3% tin, 0.7% copper) rectangular piece of tin made from tin solder (quantity of 4)

▪ 120 mm x 5 mm x 2 mm fiberglass, copper clad circuit board (quantity of 4) with a maximum of 4 mL of copper cladding; fiberglass is 0.1 cm in height, copper cladding is .06 cm in height

▪ Max of 3g of tin solder (percentage by weight): maximum of 97% tin; maximum of 4.2% silver; maximum of 3% hydrogenated rosin; maximum of 0.9% copper

▪ Polyethylene foam packing cylinders for securing test bed and PCBs in tube (10 cylinders -- 0.5 cm in diameter, 1.27 cm in depth)

Page 5: The Development of Tin Whiskers in Lead-free Solder Joseph Garvey and Rachel Lindbergh – Co-Principal Investigators Gabriel Voigt – Co-Investigator Palmetto

Our FME

Key for test tubeThis is a depiction of what our type 1 FME will look like.Red= electroplated tin testbed 120 mm x 5 mm x 2mmOrange= printed circuit board 120 mm x 5 mm x 2 mmBlue= Polyethylene foam packing 0.5 cm in diameter, 1.27 cm in depthBlack= plugs to seal the test tubeWhite= test tube

Page 6: The Development of Tin Whiskers in Lead-free Solder Joseph Garvey and Rachel Lindbergh – Co-Principal Investigators Gabriel Voigt – Co-Investigator Palmetto

Experiment Design

• 4 Type 1 FME’s will be constructed in the same manner according to the instructions above.

• 1 Type 1 FME will be randomly selected for spaceflight.

• The ground truth FME’s will be static but oriented in a different position:

• One ground truth FME will be oriented vertically

• One ground truth FME will be oriented upwards

• One ground truth FME will be oriented downwards

Page 7: The Development of Tin Whiskers in Lead-free Solder Joseph Garvey and Rachel Lindbergh – Co-Principal Investigators Gabriel Voigt – Co-Investigator Palmetto

Our Goal

We want to determine whether spaceflight affects the development of tin whiskers

We expect that the FME that goes to the ISS will develop more tin whiskers than the ground truths.

Page 8: The Development of Tin Whiskers in Lead-free Solder Joseph Garvey and Rachel Lindbergh – Co-Principal Investigators Gabriel Voigt – Co-Investigator Palmetto

Data Analysis

● Mass will be measured with a microscale from College of Charleston

● Solder will be analyzed with a scanning electron microscope from National Oceanic and Atmospheric Administration

Page 9: The Development of Tin Whiskers in Lead-free Solder Joseph Garvey and Rachel Lindbergh – Co-Principal Investigators Gabriel Voigt – Co-Investigator Palmetto

AcknowledgementsPartners• Space and Naval Warfare Systems

Command (SPAWAR)• Center for the Advancement of

Science in Space (CASIS)• National Center for Earth and

Space Science Education• College of Charleston• Citadel University• Medical University of South

Carolina (MUSC)• National Oceanic and Atmospheric

Administration (NOAA)

Sponsors• ISHPI• Google• South Carolina Space Grant

Consortium• Center for the Advancement of

Science in Space (CASIS)