The DatasheetArchive - Datasheet Search Engine Phone, Camera, PDA, Notebook Coupling into Light Guide Panel AV Systems SEOUL SEMICONDUCTOR CO., LTD. SSC-QP-7-03-44 갑

SPECIFICATION

ITEM WHITE SIDE VIEW LED

MODEL SWAF07

CUSTOMER

Customer

Approved by Approved by Approved by

/ / /

Supplier

Drawn by Checked by Approved by

/ / / SEOUL SEMICONDUCTOR CO., LTD.

Rev. 1.00 SWAF07

Contents

1. Features

2. Applications

3. Absolute Maximum Ratings

4. Electro-Optical Characteristics

5. CIE Chromaticity Diagram

6. Characteristic Diagram

7. Reliability

8. Precautions

9. Soldering Profile

10. Outline Dimension

11. Packing

12. Reel Packing Structure

13. History

02 02 03 03 04 06 08 09 10 11 12 13 14

SEOUL SEMICONDUCTOR CO., LTD.

1 SSC-QP-7-03-44(갑)

Rev. 1.00 SWAF07

1. Features Package: SMT Solderability

Dimension : 3.8 × 1.05 × 0.6 (mm)

Low Thermal Resistance

RoHS Compliant, Lead Free

Suitable for Small Applications

Own Patent Reserved

SWAF07 is Very Useful Side View LED in Back Light Unit Application

2. Applications Flat Backlighting (LCD, Display)

Mobile Phone, Camera, PDA, Notebook

Coupling into Light Guide Panel

AV Systems


2 SSC-QP-7-03-44(갑)

Rev. 1.00 SWAF07

3. Absolute Maximum Ratings (Ta = 25°C)

Parameter Symbol Value Unit

Power Dissipation Pd*1 120 mW

Forward Current IF 30 mA

Peak Forward Current IFM*2 100 mA

Reverse Voltage VR 5 V

Operating Temperature Topr -30 ~ +85 °C

Storage Temperature Tstg -40 ~ +100 °C

Junction Temperature Tj 125 °C

*1 Care is to be taken that Power Dissipation does not exceed the Absolute Maximum Rating of the product. *2 IFM conditions : Pulse width TW ≤ 0.1ms, Duty ratio ≤ 1/10

4. Electro-Optical Characteristics (Ta = 25°C)

Item Symbol Condition Min Typ Max Unit

Rank Y 2.7 - 3.0 Rank Z 3.0 - 3.3 Forward Voltage*

Rank A

VF IF = 20 mA

3.3 - 3.7

V

Reverse Current IR VR = 5 V - - 50 µA Rank J1 1100 - 1200 Rank J2 1200 - 1300 Rank J3 1300 - 1400 Rank J4 1400 - 1500 Rank J5 1500 - 1600 Rank J6 1600 - 1700 Rank J7 1700 - 1800 Rank J8 1800 - 1900

Luminous Intensity*1

Rank J9

IV IF = 20 mA

1900 - 2000

mcd

Viewing Angle *2 2θ1/2 IF = 20 mA 120 ˚ x 0.264 - 0.296 Rank b y 0.248 - 0.295 x 0.287 - 0.311

Rank e y 0.276 - 0.315 x 0.307 - 0.330

Color Coordinates *3

Rank f y

IF = 20 mA

0.294 - 0.339

-

*1 luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED

package. Luminous Intensity Measurement allowance is ±10%. *2 θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. *3 Measurement Uncertainty of the Color Coordinates is ±0.01 * Note : All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at

20mA within the maximum ratings shown above. All measurements were made under the standardized environment of Seoul Semiconductor.


3 SSC-QP-7-03-44(갑)

Rev. 1.00 SWAF07

5. CIE Chromaticity Diagram

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.80.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

460470

475480

485

490

495

500

505

510

515520525

530535

540545

550555

560565

570575

580585

590595

600610

620630830

y C

oord

.

x C o o r d .0.24 0.26 0.28 0.30 0.32 0.34 0.36

0.22

0.24

0.26

0.28

0.30

0.32

0.34

0.36

e

f

b

y C

oord

.

x C o o r d .

Luminous Intensity

Ranking by Color Coordinates Ranking by Luminous Intensity

RANK Min Max Unit

b e f

J1 1100 1200 √ J2 1200 1300 √ √ J3 1300 1400 √ √ √ J4 1400 1500 √ √ √ J5 1500 1600 √ √ √ J6 1600 1700 √ √ √ J7 1700 1800 √ √ √ J8 1800 1900 √ √ J9 1900 2000

mcd

√ * The Checked ranks are available

Color Rank (IF = 20 mA, Ta = 25°C)

B e f x y x y x y

0.264 0.267 0.296 0.276 0.311 0.294 0.280 0.248 0.311 0.294 0.330 0.318 0.296 0.276 0.307 0.315 0.330 0.339 0.287 0.295 0.287 0.295 0.307 0.315


4 SSC-QP-7-03-44(갑)

Rev. 1.00 SWAF07

6. Characteristic Diagram

Forward Current vs. Forward Voltage Intensity vs. Forward Current

2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3

1

10

Ta = 25OC

Forw

ard

Cu

rren

t [m

A]

Forward Voltage [V]

0 5 10 15 20 25 30 350

200400600800

100012001400160018002000220024002600

Ta = 25OC

Inte

nsi

ty [

mcd

]

Forward Current [mA]

Forward Current vs. Ambient Temperature Radiation Diagram

-30 -15 0 15 30 45 60 75 900

5

10

15

20

25

30

Forw

ard

curr

ent

[mA

]

Ambient temperature [oC]

-100 -80 -60 -40 -20 0 20 40 60 80 1000.0

0.5

1.0 Ta = 25OC x axis y axis

Inte

nsi

ty

Theta [o]

y x


5 SSC-QP-7-03-44(갑)

Rev. 1.00 SWAF07

Color Coordinate vs. Forward Current Spectrum

0.288 0.290 0.292 0.2940.283

0.284

0.285

0.286

Ta = 25OC

1 mA

30 mA

y C

oord

.

x Coord.

400 500 600 700 800

Ta = 25OC IF = 20 mA

Inte

nsi

ty [

%]

Wavelength [nm]

Forward Voltage vs. Ambient Temperature Color Coordinate vs. Ambient Temperature

-45 -30 -15 0 15 30 45 60 75 900.94

0.96

0.98

1.00

1.02

1.04

1.06 IF = 20 mA

V F

/ V F

[2

5OC

]

Ambient Temperature [oC]

0.296 0.298 0.300 0.302 0.3040.282

0.284

0.286

0.288

0.290

0.292

IF = 20 mA

y C

oord

.

x Coord.

25oC

85oC

-30oC


6 SSC-QP-7-03-44(갑)

Rev. 1.00 SWAF07

Relative Luminosity vs. Ambient Temperature Allowable Forward Current vs. Duty Ratio

-30 -15 0 15 30 45 60 75 900.7

0.8

0.9

1.0

1.1

1.2

I v /

I v

[25o C

]

Ambient Temperature [oC]

1 10 100

20

40

60

80

100

120

Ta = 25OC

Allo

wab

le F

orw

ard

Cu

rren

t [

mA

]

Duty Ratio [%]


7 SSC-QP-7-03-44(갑)

Rev. 1.00 SWAF07

7. Reliability

(1) TEST ITEMS AND RESULTS

TEST ITEM Test conditions Note Number of Damaged Reference

Life Test 1 Ta = 25°C; IF = 20 mA 1000 hr 0/20 EIAJ ED-4701 100 101

Life Test 2 Ta = 25°C; IF = 30 mA 500 hr 0/20 EIAJ ED-4701 100 101

Thermal Shock -30°C ~ 85°C (30 min) (30 min)

20 cycle 0/50 EIAJ ED-4701 300 307

High Temperature Life Test Ta = 85°C; IF = 5 mA 1000 hr 0/20 -

Low Temperature Life Test Ta = - 30°C; IF = 20 mA 1000 hr 0/20 -

High Temperature Storage Ta = 100°C 1000 hr 0/50 EIAJ ED-4701 200 201

Low Temperature Storage Ta = - 40°C 1000 hr 0/50 EIAJ ED-4701 200 202

High Humidity Heat Life Test Ta = 60°C; RH = 90%, IF = 20 mA 500 hr 0/20 EIAJ ED-4701 100 102

Humidity Heat Load Ta = 85°C; RH = 85% 1000 hr 0/50 EIAJ ED-4701 100 103

Resistance to Soldering Heat Tsld = 260°C, 10 sec Pre treatment; 30°C, 70%, 168 hr 2 time 0/50 EIAJ ED-4701

301 302

Solder ability (Reflow Soldering)Tsld = 215±5°C, 3 sec (Lead Solder)

1 time over 95% 0/50 EIAJ ED-4701

303

Temperature Cycle - 40°C ~ 25°C ~ 100°C ~ 25°C (30 min) (5 min) (30 min) (5 min)

100 cycle 0/50 EIAJ ED-4701 100 105

Moisture Resistance Cycle 25°C ~ 65°C ~ - 10°C RH = 90%, 24 hr / 1 cycle 10 cycle 0/50 EIAJ ED-4701

200 203

(2) CRITERIA FOR JUDGING THE DAMAGE

Criteria for Judgment Item Symbol Test Condition

Min. Max.

Forward Voltage VF IF = 20 mA - U.S.L × 1.2

Reverse Current IR VR = 5 V - U.S.L × 2.0

Luminous Intensity IV IF = 20 mA L.S.L × 0.5 -

U.S.L. : Upper Standard Level, L.S.L. : Lower Standard Level


8 SSC-QP-7-03-44(갑)

Rev. 1.00 SWAF07

8. Precautions

(1) Storage conditions

Keep the product in a dry box or a desiccator with a desiccant in order to prevent moisture absorption.

a. Keep it at a temperature in the range from 5°C to 30°C and at a humidity of less than 60% RH.

In case of being stored for more than 3 months, the product should be sealed with Nitrogen gas.

(2) After opening the package

When soldering, this could result in a decrease of the photoelectric effect or light intensity.

a. Soldering should be done right after mounting the product.

b. Keep the temperature in the range from 5°C to 40°C and the humidity at less than 30%.

Soldering should be done within 7 days after opening the desiccant package.

If the product has been exposed for more than 7 days after opening the package or the indicating color

of the desiccator changes, the product must be baked at a temperature between 60°C and 65°C for 10 to

12 hours.

An unused and unsealed product should be repacked in a desiccant package and kept sealed in a dry

atmosphere.

(3) Precautions for use

Any external mechanical force or excessive vibration should not be applied to the product during cooling

after soldering, and it is preferable to avoid rapid cooling.

The product should not be mounted on a distorted part of PCB.

Gloves or wrist bands for ESD(Electric Static Discharge) should be wore in order to prevent ESD and

surge damage, and all devices and equipments must be grounded to the earth.

(4) Miscellaneous

Radiation resistance is not considered.

When cleaning the product, any kind of fluid such as water, oil and organic solvent must not be used

and IPA(Isopropyl Alcohol) must be used.

When using the product, operating current should be settled in consideration of the maximum ambient

temperature.

Its appearance or specification for improvement is subject to change without notice.


9 SSC-QP-7-03-44(갑)

-7-03-44(갑)

Rev. 1.00 SWAF07

9. Soldering Profile

The LED can be soldered in place using the reflow soldering method.

(1) Lead solder

Preliminary heating to be at maximum 210°C for maximum 2 minutes.

Soldering heat to be at maximum 240°C for maximum 10 seconds.

0 15 30 45 60 75 90 105 120 135 150 165 180 1950

40

80

120

160

200

240

280

Soldering Times [sec]

Dev

ice

Surf

ace

Tem

pera

ture

[o C]

(2) Lead-free solder

Preliminary heating to be at maximum 220°C for maximum 2 minutes.

Soldering heat to be at maximum 260°C for maximum 10 seconds.

0 15 30 45 60 75 90 105 120 135 150 165 180 1950

40

80

120

160

200

240

280

Dev

ice

Surf

ace

Tem

pera

ture

[o C]

Soldering Times [sec]

(3) Hand Soldering conditions

Not more than 5 seconds @MAX 300°C, under Soldering iron.


10 SSC-QP

Rev. 1.00 SWAF07

10. Outline Dimension ( Tolerance : ±0.2, Unit : mm )

[Bottom View]

<Recommended solder Pattern>

Cathode

Cathode Mark

Anode

Mold Gate


11 SSC-QP-7-03-44(갑)

Rev. 1.00 SWAF07

11. Packing ( Tolerance : ±0.2, Unit : mm )

Label

180

13 ±0.3

60

22

2 ±0.2

+1

-0

15.4

13+0-3

-0+0.2

±1.0

12.0

±0.0

2

4.0±0.1

Anode

Cathode

+0.1-0 2.0±0.05

4.0±0.1

SECTION B-B'

(1) Quantity: 3500 pcs / Reel

(2) Cumulative Tolerance: Cumulative Tolerance / 10 pitches to be ±0.2 mm

(3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1 - 0.7 N when the cover tape is turned off from

the carrier tape at 10° angle to be the carrier tape

(4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package


12 SSC-QP-7-03-44(갑)

Rev. 1.00 SWAF07

12. Reel Packing Structure

LOT NUMBER : XXXXXXXX

SWAF07 X

SSC PART NUMBER : XXXXXXXX

Material : Paper(SW3B(B))

SEOUL Semiconductor EcoLight

245 (mm)

AcricheRoHS

TUV

220 (mm)

MADE IN KOREA

TYPE

7inch

142 (mm)

SIZE (mm)

245 220245 220

a b14280

c

Reel

Barcode Label

QUANTITY : XXXX

RANK :

Outer Box Structure

XXX

Humidity indicator

Desiccant

Aluminum Vinyl Bag

Lot Number

The lot number is composed of the following characters;

SWAF07 ○□□◎◎ ◇◇◇

Symbol Meaning Example

○ Year 8 for 2008, 9 for 2009 ‥‥

□□ Month 01 for Jan., 02 for Feb., ‥‥ 12 for Dec.

◎◎ Day 01, 02, 03, 04, 05, ‥‥ 27, 28, 29, 30, 31

◇◇◇ Number 001, 002, 003, 004, 005, 006, 007 ‥‥


13 SSC-QP-7-03-44(갑)

Rev. 1.00 SWAF07

13. History

Rev. No. Contents Date

1.00 - The institution of New Spec. 2008. 06. 03

Published by SEOUL SEMICONDUCTOR CO., LTD. http://www.seoulsemicon.com 148-29, Gasan-Dong, Geumcheon-Gu, Seoul, 153-801. South Korea © All Right Reserved.


14 SSC-QP-7-03-44(갑)

http://www.seoulsemicon.com/

Documents

The DatasheetArchive - Datasheet Search Engine Phone, Camera, PDA, Notebook Coupling into Light Guide Panel AV Systems SEOUL SEMICONDUCTOR CO., LTD. SSC-QP-7-03-44 갑