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The CMS Modular Track Finder (MTF7) Trigger Board. D. Acosta , G. Brown , A. Carnes, M . Carver, D. Curry , G.P. Di Giovanni, I. Furic , A. Kropivnitskaya , A . Madorsky , D. Rank, C. Reeves, B. Scurlock , S. Wang University of Florida/Physics, Gainesville , FL, USA - PowerPoint PPT Presentation
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The CMS Modular Track Finder (MTF7) Trigger Board
D. Acosta, G. Brown, A. Carnes, M. Carver, D. Curry, G.P. Di Giovanni, I. Furic, A. Kropivnitskaya, A. Madorsky, D. Rank, C. Reeves,
B. Scurlock, S. Wang
University of Florida/Physics, Gainesville, FL, USA
M. Matveev, P. Padley
Rice University, Houston, TX, USA
CMS Endcap Muon System
TWEPP 2013 A. Madorsky 2
φ
θ, η
η coverage: 1.2 to 2.4
Muon Trigger structure rework
TWEPP 2013 A. Madorsky 3
Endcap TF
Overlap TFBarrel TF
- Overlap TF is now separated from Endcap and Barrel
CMS Endcap Muon Trigger
Each of two Endcaps is split into 6 sectors, 60° each
Each sector is served by one Sector Processor (SP)
Total 12 SPs in the entire system
CMS trigger requires us to identify distinct muons
Each SP can build up to 3 muon tracks per BX
4
Trigger sector 60˚
TWEPP 2013 A. Madorsky
Endcap Muon Trigger upgrade
5
Trigger information Wiregroup
patterns Strip hits
Muon EndcapTrigger sector (60°)
UpgradedPort Cards One per station
1/6 filtering
Trigger primitives 2 per chamber18 per station90 total
18 primitives per station90 total
Fibers(~100 m)
UpgradedSector Processor Complete 3-D tracks
assembled from primitives Up to 3 tracks per BX
TWEPP 2013 A. Madorsky
Motivations for upgrade Current Endcap Trigger is adequate for LHC luminosity before the upgrade The following improvements are needed for the upgrade:
Transverse Momentum (Pt) assignment Final Pt assignment is currently done with 2MB LUT Address space is already over-saturated Need bigger Pt assignment memory
Trigger primitives bandwidth With luminosity upgrade, we expect ~7 Trigger primitives per Sector
per BX (average). Current system selects only 3 best primitives in each sector
Inadequate for the upgrade Need to import preferably all primitives on each BX
18 per sector Also need to import other data (Resistive Plate Chambers) The above means:
Higher input bandwidth Bigger FPGA
TWEPP 2013 A. Madorsky 6
7
Block diagram
Optical plant(fanouts and splitters)
From MPCs60 12-core fibers, 8 cores used in each.90 trig. primitives per 60° sector3.2 Gbps
From RPCUp to 216 fibers at 1.6 Gbps (may be concentrated to higher bandwidth and fewer fibers)
Sector Processors12 units60° sector each
Muon Sorter 8 Best Muons
to Global Muon Trigger
To Overlap Track Finder
Best 3 Muons in each sector
TWEPP 2013 A. Madorsky
8
uTCA chassis
SPSP SP SP SP
SPSP SP SP SP
SP SPMS
Sector Processor (SP) occupies 2 uTCA slots12 units in system
Muon Sorter (MS) hardware identical to SP1 unit in system
All chassis use AMC13 (designed by Boston University)
clocking and DAQ3 units
Plan to control boards via PCI-express Will make compatible with IPbus as well
Chassis #1
Chassis #2
Chassis #3
TWEPP 2013 A. Madorsky
Hardware prototype
2012 prototype based on Virtex-6 FPGA Modular design
Makes future partial upgrades easier
TWEPP 2013 A. Madorsky 9
Optical module
Custom backplaneCore logic module
Optical module
Core logic module
Pt LUT module
Custom backplane
Virtex-6 Core logic module
TWEPP 2013 A. Madorsky 10
Custom backplane connector
Core logic FPGA
Control FPGA
uTCA connector
Control FPGA JTAG
PT LUT module connector
FMM connector
SD card connector
MMC USB console
MMC JTAG
MMC CPU
Estimated power consumption: ~50 W (assuming FPGAs nearly full)PT LUT mezzanine not included
1Gb FLASHMain FPGA firmware storage
MMC = Module Management Controller
Virtex-6 Core logic module:Features
Serial I/O:53 GTX receivers (up to 4.8 Gbps)8 GTH receivers (10 Gbps)12 GTX transmitters (up to 4.8 Gbps)2 GTH transmitters (10 Gbps)
MMC – Wisconsin designSee this link for details
Configuration memory for Core FPGA:PC28F00AP30EFA
1 Gb parallel FLASH Can be used to store any other information (in addition to firmware)
Permanent configuration settings Multiple firmware versions
SD card slotCan also be used to store Core FPGA firmware and settings
Fast Monitoring (FMM) connectorCompatible with the current FMM system
Control interfaces:PCI express IPbus
TWEPP 2013 A. Madorsky 11
Optical module
TWEPP 2013 A. Madorsky 12
uTCA connector
Custom backplane connector
Backplane redrivers
Optical receivers(2 out of 7 installed)
MMC
Optical transmitters (2 out of 3 installed)
Optical module Receivers:
7 12-channel RX Avago’s AFBR-820BEZ 84 RX channels
Transmitters: 3 12-channel TX
Avago’s AFBR-810BEZ 28 TX channels (12+12+4)
All of them 10 Gbps parts Not enough space on front panel to accommodate all TX parts located inside
connect with short fibers to MPO fiber couplers on front panel Tight but enough space to fit couplers on top of AFBR-820 parts.
Receivers are on front panel to minimize count of fiber-to-fiber transitions for inputs
Control: Wisconsin MMC design, no FPGA
Compatible with future Virtex-7 design of Core logic board
TWEPP 2013 A. Madorsky 13
Glue logic FPGA(Spartan-6)
Base boardconnector
RLDRAM3 memory16 chips, 8 on each side(clamshell topology)Total size: 512M x 18 bits ≈ 1GBUpgrade possible to2 GB with bigger RLDRAM3 chips(no board redesign)
DC-DC converters
Clock synthesisand distribution
PT LUT module
14TWEPP 2013 A. Madorsky
Optical communication [email protected] Gbps
47 input channels Transmission from:
LoopbackMuon Port CardEarlier VME prototype (2010)
For MPC and VME prototype clock was synchronized with VME crate
Twisted pair LVDS connection to uTCA backplane@10 Gbps
6 input channels Asynchronous clock Transmission from:
LoopbackEarlier 10Gbps
prototype (2006)Results
Zero errors for hours
TWEPP 2013 A. Madorsky 15
Eye pattern @10 Gbps.GTH receiver input.
PT LUT testsParameters:
RLDRAM clock : 200 MHz Address & control: 200 Mbps each bit Data: 400 Mbps each bit RLDRAM can tolerate up to ~1GHz clock. However:
Hard to implement in FPGANeeded for burst-oriented applications mostlyDoes not change latency for random address accessLower clk F lower power consumption
Tests performed (random data, full 1GB space): Writing into consecutive addresses Reading from consecutive addresses Reading from random addresses
No errors detected Except soldering defects in one RLDRAM chip
TWEPP 2013 A. Madorsky 16
PCI Express tests: Setup
TWEPP 2013 A. Madorsky 17
PC adapter
Motherboard AMC113 (uTCA PCIE adapter)
2012Prototype
Fiber (up to 50 m)
Multiple PC adapters testedBest results: HIB35-x4Also least expensive
Vendor CardVadatech PCI113
Samtec PCIEA
OneStopSystems HIB35-x4
PCI express performance Theoretical PCIe performance (generation 2, single lane):
Link bitrate: 5 Gbps
After 8b/10b encoding: 4 GbpsAfter PCIe packet overhead: ~3.56 Gbps
On top of that: SoftwareHardware overhead of a particular chipset on host systemHardware overhead of your device
Our test design has very small overhead Results of performance tests at UF:
Sustained performance, all overheads included5 meter fiber:
Reading: 2.4 Gbps Writing: 2.88 Gbps
50 meter fiber: Reading: 2.3 Gbps Writing: 2.88 Gbps
TWEPP 2013 A. Madorsky 18
Plans for Virtex-7 designCore logic moduleFPGAs:
Core logic: XC7VX690T-FFG1927 or XC7VX550T-FFG1927 Control: XC7K70-FB676
Inputs: 80 Virtex-7 GTH links (10 Gbps) directly to Core FPGA
Minimal latency All available receivers are designated for trigger data
Maximum flexibility 4 additional Kintex GTX links (6.4 Gbps) to Control FPGA
Delivered to Core FPGA via parallel channel Longer latency
Outputs: 28 Virtex-7 GTH links (10 Gbps)
Control: PCI express Gen 2, 2 lanes Ipbus
Status: PCB layout nearly doneTWEPP 2013 A. Madorsky 19
Core logic module FPGA interconnections
TWEPP 2013 A. Madorsky 20
XC7VX690T orXC7VX550T
XC7K70
PT L
UT
conn
ecto
r
28 outputs10 Gbps
80 inputs10 Gbps
4 inputs6.4 Gbps
IPbus
PCI express2 lanes
Parallel data exchange channel(control, DAQ control, 4 extra links)
Cus
tom
bac
kpla
ne c
onne
ctor
uTC
A b
ackp
lane
con
nect
or
DAQ control (RX)
4 TX to
AMC13
DAQ TX
Conclusions
Virtex-6 based prototype built and tested53 inputs up to 4.8 Gbps8 inputs at 10 Gbps RLDRAM3-based Pt LUT (1GB)PCI expressIPbus
Virtex-7 base board prototype is in its final design phase
TWEPP 2013 A. Madorsky 21
Backup
TWEPP 2013 A. Madorsky 22
1 2 3
4 5 6
7 8 9
1 2 3
4 5 6
78 9
TWEPP 2013 A. Madorsky 23
CSC trigger data sharing Endcap and Overlap processorsME1
ME2,3,4
1 2 3
45 6 7 8 9
Subsector 1 Subsector 2
Overlap TF
Endcap TFMultiple chambers have to beshared between Endcap and Overlap TFs (shown in yellow)
TWEPP 2013 A. Madorsky 24
CSC trigger data sharingNeighbor sector
ME1ME2,3,4
1 2 3
4 5 6
7 8 9
1 2 3
45 6 7 8 9
1 23
4 5 6
7 8 9
Subsector 1 Subsector 2
Neighborsector TF
Neighborsector TF
Several chambers shared with neighbor Sector Processor for better sector overlap coverage(shown in pink)Most of the chambers shared between 2 SPsSome chambers shared between 4 SPs
Optical components
TWEPP 2013 A. Madorsky 25
MPO Fanout
2-way splitter
4-way splitter
Components from Fibertronics
Optical plant (one sector)
TWEPP 2013 A. Madorsky 26
MTP connectors (inputs)
LC-LC adapters
MTP connectors (outputs)
Splitters
MTP fanouts
Slack spool
Slack spool 19” 1U
Rack-mountEnclosure
* Componentsshown not in full quantities