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Testability: Lecture 23Design for Testability (DFT)
Sh hi H biSh hi H biShaahin HessabiShaahin Hessabi
Department of Computer EngineeringDepartment of Computer Engineering
Sharif University of TechnologySharif University of Technology
Adapted, with modifications, from lecture notes prepared by the Adapted, with modifications, from lecture notes prepared by the p , , p p yp , , p p y
book authors book authors
Slide 1 of 43
Outline
Iterative Logic ArraysIterative Logic Arrays
AdAd--hoc DFT methodshoc DFT methods
Scan designScan designggDesign rulesDesign rules
Scan registerScan registerScan registerScan register
Scan flipScan flip--flopsflops
Scan test sequencesScan test sequences
OverheadsOverheads
Scan design systemScan design system
Slide 2 of 43Sharif University of Technology Testability: Lecture 23
Iterative Logic Arrays (ILAs)Some circuits are easy to test, for example, ILAsDefinition: An ILA is a k-dimensional array-like circuit composed e o s a d e s o a a ay e c cu co posedof identical cells with uniform interconnectionsArray circuits can be tested for powerful fault models using relatively few testsrelatively few testsExamples:
Arithmetic circuitsArithmetic circuits
Ripple-carry adders
Array multipliersArray multipliers
Bit-sliced processors
Random-access memories: RAMs, ROMsRandom access memories: RAMs, ROMs
ILA models of sequential circuits
Slide 3 of 43Sharif University of Technology Testability: Lecture 23
Example 1: Ripple-Carry Adder
1D array composed of full-adder cells
Slide 4 of 43Sharif University of Technology Testability: Lecture 23
Example 1: Ripple-Carry Adder (cont’d)
Assume the cell fault (CF) model, which implies that all i l l i f lt i ll li ti ill b d t t d
We must apply eight
single logic faults in all realizations will be detected.
patterns to every cell and observe the responses.
Six of the 8 patterns can be applied simultaneously to all cells; e.g., AiBiCi = 000
Faults in FAi can be observed via Si or Ci+1i i i+1
Two of the 8 patterns cannot be applied simultaneously to all cells, namely AiBiCi = 001 and 110, because Cin ≠ Cout
Slide 5 of 43Sharif University of Technology Testability: Lecture 23
y i i i in out
Example 1: Ripple-Carry Adder (cont’d)p pp y ( )
The patterns AiBiCi = 001 and 110 b li d i l lcan be applied simultaneously to
alternating cellsAll CF f lt i bit RC ddAll CF faults in an n-bit RC adder can be detected by 8 tests, independent of the array size n.
The property of an n-cell ILA that all (cell) faults can be d d b b f i ll d
independent of the array size n.
detected by a constant number test patterns for any n is called C-testability
Slide 6 of 43Sharif University of Technology Testability: Lecture 23
Example 2: Gate Array
This is an ILA realization of a kThis is an ILA realization of a k--input AND function, input AND function,
k k = = 11,,22,,33,,……
Question 1: Is an AND array C: Is an AND array C--testable?testable?
QuestionQuestion22: What if the AND function is replaced by : What if the AND function is replaced by XOR?XOR?
Slide 7 of 43Sharif University of Technology Testability: Lecture 23
Design for Testability (DFT)Test generation algorithms for logic circuits are complex Test generation algorithms for logic circuits are complex (NP complete)(NP complete)(NP complete)(NP complete)
Circuits containing, say, Circuits containing, say, 101066 gates or gates or 101022 flipflip--flops, may flops, may be too large for ATPG toolsbe too large for ATPG toolsbe too large for ATPG toolsbe too large for ATPG tools
Heuristic methods are used for testing complex circuits Heuristic methods are used for testing complex circuits such as microprocessors RAMs etcsuch as microprocessors RAMs etcsuch as microprocessors, RAMs, etc.such as microprocessors, RAMs, etc.
Fault coverage of such methods can be low and hard to Fault coverage of such methods can be low and hard to dete minedete minedeterminedetermine
To ensure high levels of testability, design for testability To ensure high levels of testability, design for testability (DFT) i ft ti l(DFT) i ft ti l(DFT) is often essential(DFT) is often essential
Slide 8 of 43Sharif University of Technology Testability: Lecture 23
Testability Goals1.1. Maximize fault coverageMaximize fault coverage
22 Minimize test application timeMinimize test application time2.2. Minimize test application timeMinimize test application time
3.3. Minimize test data sizeMinimize test data size
4.4. Minimize test generation effortMinimize test generation effort
Slide 9 of 43Sharif University of Technology Testability: Lecture 23
DefinitionDesign for testabilityDesign for testability (DFT) refers to those design (DFT) refers to those design techniques that make test generation and testtechniques that make test generation and testtechniques that make test generation and test techniques that make test generation and test application costapplication cost--effective.effective.
DFT methods for digital circuits:DFT methods for digital circuits:DFT methods for digital circuits:DFT methods for digital circuits:
AdAd--hoc methodshoc methods
Structured methods:Structured methods:
ScanScanP i l SP i l SPartial ScanPartial ScanBuiltBuilt--in selfin self--testtest (BIST)(BIST)Boundary scanBoundary scanBoundary scanBoundary scan
Slide 10 of 43Sharif University of Technology Testability: Lecture 23
DFTIn general, DFT deals with ways for improving In general, DFT deals with ways for improving controllability and observabilitycontrollability and observabilitycontrollability and observabilitycontrollability and observability
Costs associated with DFT:Costs associated with DFT:
Pins
Area/YieldArea/Yield
Performance
Design time
Slide 11 of 43Sharif University of Technology Testability: Lecture 23
Objections to DFTj
Short-sighted view of management (schedule and costs)g g ( )
Life-cycle cost ignored by development management/contractors/buyersg / / y
Area/functionality/performance myths
Lack of knowledge by design engineersLack of knowledge by design engineers
Testing is someone else’s problem
L k f t l t t DFT (thi i i i )Lack of tools to support DFT (this is improving….)
Slide 12 of 43Sharif University of Technology Testability: Lecture 23
Ad-Hoc DFT MethodsGood design practices learnt through experience are Good design practices learnt through experience are used as guidelines:used as guidelines:used as guidelines:used as guidelines:
Avoid asynchronous (Avoid asynchronous (unclockedunclocked) feedback. ) feedback. ((⇒⇒oscillation)oscillation)
Make flipMake flip--flops flops initializableinitializable. (. (clearclear or or presetpreset))
Avoid redundant gates. Avoid large fanAvoid redundant gates. Avoid large fan--in gates. in gates.
(controllability, observability)(controllability, observability)
Provide test control for difficultProvide test control for difficult--toto--control signals.control signals.Provide test control for difficultProvide test control for difficult toto control signals.control signals.
Avoid gated clocks.Avoid gated clocks.
C id ATE i t (C id ATE i t (t i t tt i t t t )t )Consider ATE requirements (Consider ATE requirements (tristatestristates, etc.), etc.)
Design reviews conducted by experts or design Design reviews conducted by experts or design diti t lditi t l
Slide 13 of 43Sharif University of Technology Testability: Lecture 23
auditing tools.auditing tools.
Disadvantages of Ad-Hoc DFT Methods
Circuits are too large for manual inspection.Circuits are too large for manual inspection.
Experts and tools not always available.Experts and tools not always available.
Test generation is often manual with no guarantee of Test generation is often manual with no guarantee of g a o o a ua o gua a og a o o a ua o gua a ohigh fault coverage.high fault coverage.
Design iterations may be necessary.Design iterations may be necessary.Design iterations may be necessary.Design iterations may be necessary.
UUse of adse of ad--hoc DFT is usually discouraged for large hoc DFT is usually discouraged for large circuits.circuits.circuits.circuits.
Slide 14 of 43Sharif University of Technology Testability: Lecture 23
Ad Hoc Design RulesPartitioningPartitioning
Insert control/observation points (Insert control/observation points (test pointstest points), e.g., a ), e.g., a reset line for initializationreset line for initialization
Avoid redundancyAvoid redundancy
Improve circuit structure, e.g., break global feedback Improve circuit structure, e.g., break global feedback during testingduring testing
Provide clock access during testingProvide clock access during testing
Slide 15 of 43Sharif University of Technology Testability: Lecture 23
Partitioning (Divide and Conquer)
Physically divide the system into multiple chips or boards.Physically divide the system into multiple chips or boards.y y y p py y y p p
On boardOn board--level systems, use jumper wires to divide level systems, use jumper wires to divide subunits.subunits.subunits.subunits.
Has major performance penalties.Has major performance penalties.
Slide 16 of 43Sharif University of Technology Testability: Lecture 23
Partitioning using Degating
Degating: another technique for separating modules on Degating: another technique for separating modules on ffchip/board with lower performance penalties.chip/board with lower performance penalties.
clock degating module partitioning
Slide 17 of 43Sharif University of Technology Testability: Lecture 23
Test Point InsertionMake hardMake hard--toto--control internal signals controllable via extra control internal signals controllable via extra primary inputs and logic (CP = control points)primary inputs and logic (CP = control points)primary inputs and logic (CP = control points)primary inputs and logic (CP = control points)
Make hardMake hard--toto--observe internal signals observable via extra observe internal signals observable via extra primary outputs and logic (OP = observation points)primary outputs and logic (OP = observation points)primary outputs and logic (OP = observation points)primary outputs and logic (OP = observation points)
Slide 18 of 43Sharif University of Technology Testability: Lecture 23
Test Point Insertion (cont’d)ControlControl--Point SitesPoint Sites
Clock linesClock linesClock linesClock linesGlobal reset linesGlobal reset linesInputs of stateInputs of state--control devicescontrol devicesLines of high fanLines of high fan--out (fanout (fan--out stems)out stems)Control (especially Control (especially tristatetristate control) lines of busescontrol) lines of busesAll bus lines in busAll bus lines in bus structured designsstructured designsAll bus lines in busAll bus lines in bus--structured designsstructured designsControl inputs to (embedded) RAMS and ROMsControl inputs to (embedded) RAMS and ROMsSome enable/hold/select control linesSome enable/hold/select control linesLines identified by testability measuring programs as having low Lines identified by testability measuring programs as having low controllabilitycontrollability
Slide 19 of 43Sharif University of Technology Testability: Lecture 23
Test Point Insertion (cont’d)ObservationObservation--Point SitesPoint Sites
““BuriedBuried”” (not directly accessible) control/status lines(not directly accessible) control/status linesO t t f t tO t t f t t t l d it l d iOutputs of stateOutputs of state--control devicescontrol devicesLines of high fanLines of high fan--out (fanout (fan--out stems)out stems)Outputs of Outputs of high fanhigh fan--inin circuits, e.g. parity generatorscircuits, e.g. parity generatorspp gg , g p y g, g p y gLogically redundant nodesLogically redundant nodesGlobal feedback pathsGlobal feedback pathsOutput lines in busOutput lines in bus--structured designsstructured designsOutput lines in busOutput lines in bus--structured designsstructured designsLines identified by testability measuring programs as having low Lines identified by testability measuring programs as having low observabilityobservability
M i Li it tiM i Li it tiMain LimitationMain LimitationAvailability of (spare) input/output terminalsAvailability of (spare) input/output terminals
Add MUX’s to reduce number of I/O pinsAdd MUX s to reduce number of I/O pinsSerially shifts control point values
• Long testing time
Slide 20 of 43Sharif University of Technology Testability: Lecture 23
Test Point Insertion (cont’d)Memory Control/ObservationMemory Control/Observation
Slide 21 of 43Sharif University of Technology Testability: Lecture 23
DFT: Circuit Restructuring
Example: Counter DesignExample: Counter Design
Slide 22 of 43Sharif University of Technology Testability: Lecture 23
DFT: Timing Control
Avoid asynchronous timingAvoid asynchronous timing
Make clocks observable and controllable during testingMake clocks observable and controllable during testing
Slide 23 of 43Sharif University of Technology Testability: Lecture 23
Design Rule SummaryPartition large hardPartition large hard--toto--test circuits into small testable test circuits into small testable componentscomponentsDesign controllable (e.g. Design controllable (e.g. initializableinitializable) and observable units ) and observable units with careful selection of control/test pointswith careful selection of control/test pointsAllow global feedback paths to be opened/closedAllow global feedback paths to be opened/closedAllow global feedback paths to be opened/closedAllow global feedback paths to be opened/closedAvoid redundancy, or allow it to be overridden during Avoid redundancy, or allow it to be overridden during testingtestingggAvoid asynchronous circuits, provide access to clock signalsAvoid asynchronous circuits, provide access to clock signals
ConclusionsConclusionsOften ad hoc design modification is too late to significantly Often ad hoc design modification is too late to significantly improve a circuit's testabilityimprove a circuit's testabilityD l i l h f h d iD l i l h f h d iDevelop a systematic test plan at the start of the design Develop a systematic test plan at the start of the design processprocess
Slide 24 of 43Sharif University of Technology Testability: Lecture 23
Scan DesignCircuit is designed using preCircuit is designed using pre--specified design rules.specified design rules.
Test structure (hardware) is added to the verified design:Test structure (hardware) is added to the verified design:
Add a Add a test controltest control (TC) primary input.(TC) primary input.
Replace flipReplace flip--flops by flops by scan flipscan flip--flopsflops (SFF) and connect to form one or (SFF) and connect to form one or
more shift registers in the test mode.more shift registers in the test mode.gg
Make input/output of each scan shift register controllable/observable Make input/output of each scan shift register controllable/observable
from PI/POfrom PI/POfrom PI/PO.from PI/PO.
Use combinational ATPG to obtain tests for all testable Use combinational ATPG to obtain tests for all testable faults in the combinational logicfaults in the combinational logicfaults in the combinational logic.faults in the combinational logic.
Add shift register tests and convert ATPG tests into scan Add shift register tests and convert ATPG tests into scan sequences for use in manufacturing testsequences for use in manufacturing test
Slide 25 of 43Sharif University of Technology Testability: Lecture 23
sequences for use in manufacturing test. sequences for use in manufacturing test.
Scan Design Rules1.1. Use only clocked DUse only clocked D--type of fliptype of flip--flops for all state variables.flops for all state variables.
At l t PI i (t t t l) t b il bl fAt l t PI i (t t t l) t b il bl f2.2. At least one PI pin (test control) must be available for At least one PI pin (test control) must be available for test; more pins, if available, can be used.test; more pins, if available, can be used.
All l k t b t ll d f PIAll l k t b t ll d f PI3.3. All clocks must be controlled from PIs.All clocks must be controlled from PIs.
4.4. Clocks must not feed data inputs of flipClocks must not feed data inputs of flip--flops.flops.
Slide 26 of 43Sharif University of Technology Testability: Lecture 23
Correcting a Rule ViolationCorrecting a Rule ViolationAll clocks must be controlled from PIs.All clocks must be controlled from PIs.
Comb.logic
Comb.logic
D1
D2
Q
FFlogic
CK
Q
Comb.logic
Comb.logic
D1D2
CK
Q
FF
Slide 27 of 43Sharif University of Technology Testability: Lecture 23
C
The Scan Concept
Slide 28 of 43Sharif University of Technology Testability: Lecture 23
Scan Flip-Flop (SFF)
D Master latch Slave latch
TCQLogic
overhead
SD QMUX
CK D flip-flop
CK Master open Slave opent
TC (Test Control) Normal mode, D selected Scan mode, SD selectedt
Slide 29 of 43Sharif University of Technology Testability: Lecture 23
Level-Sensitive Scan-Design Flip-Flop (LSSD-SFF)
Master latch Slave latch
DQ
Master latch Slave latch
MCK Q
SD
D flip-flopSCK
l
MCK
TCK
No
rma
lm
od
e
Logic
overhead
TCK MCK
TCK Sc
an
mo
de
Slide 30 of 43Sharif University of Technology Testability: Lecture 23tSCK
Adding Scan Structure
PI PO
SFF
SFF
Combinational
logic
SCANOUT
SFF
SFF
logic
SCANINTC or TCK Not shown: CK or
MCK/SCK feed all
Slide 31 of 43Sharif University of Technology Testability: Lecture 23
SCANIN MCK/SCK feed allSFFs.
Tests for Full-Scan CircuitsTest generation for combinational logic only
Separate the test vectors and response data, based on PI, PO and state (F) variables: ti = tiI, tiF i = 1, 2, n
ri = riO, ri
F
Test application:1. Scan-in tiF by setting the circuit in test modei y g2. Apply tiI3. Observe ri
O
4. Set the circuit in functional mode and capture the response riF
into scan register5 Scan-out ri
F while scanning-in ti+1F by setting the circuit in test5. Scan out ri while scanning in ti+1 by setting the circuit in test
mode6. i i + 1. Go to 2
Slide 32 of 43Sharif University of Technology Testability: Lecture 23
Combinational Test Vectors
I2I1 O1 O2PI PO
Combinational
logic
SCANINTC
SCANOUT
S2S1 N2N1Presentstate
Nextstate
Slide 33 of 43Sharif University of Technology Testability: Lecture 23
Combinational Test Vectors (cont’d)Don’t careor random
I2I1PI bits
SCANIN S1 S2
0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0TC
O1 O2PO
SCANOUT N1 N2
Sequence length = (ncomb + 1) nsff + ncomb clock periods
ncomb = number of combinational vectors
Slide 34 of 43Sharif University of Technology Testability: Lecture 23
nsff = number of scan flip-flops
Testing StepsScan register must be tested prior to application of scan Scan register must be tested prior to application of scan test sequencestest sequencestest sequences.test sequences.
A shift sequence A shift sequence 00110011 00110011 . . . of length . . . of length nnsffsff++44 in scan mode in scan mode
(TC(TC 00) d) d 0000 0101 1111 dd 1010 i i i ll flii i i ll fli fl dfl d(TC=(TC=00) produces ) produces 0000, , 0101, , 11 11 and and 10 10 transitions in all fliptransitions in all flip--flops and flops and
observes the result at SCANOUT output.observes the result at SCANOUT output.
Covers most, if not all, single stuckCovers most, if not all, single stuck--at faults in FFs, andat faults in FFs, andverifies the correctness of the shift operation of the scan register.verifies the correctness of the shift operation of the scan register.
AddAdd nn ++44 to sequence length obtained in previous slide;to sequence length obtained in previous slide;Add Add nnsffsff++4 4 to sequence length obtained in previous slide;to sequence length obtained in previous slide;
Total scan test length: Total scan test length: ((nncombcomb + + 22) ) nnsffsff + + nncombcomb + + 4 4 clock periodsclock periods..
Example: Example: 22,,000 000 scan flipscan flip--flops, flops, 500 500 comb. vectors, total comb. vectors, total scan test length ~ scan test length ~ 101066 clocks.clocks.
Slide 35 of 43Sharif University of Technology Testability: Lecture 23
Multiple scan registers reduce test length.Multiple scan registers reduce test length.
Multiple Scan RegistersMultiple scan registers reduce test length.Multiple scan registers reduce test length.
Scan flipScan flip--flops can be distributed among any number of shiftflops can be distributed among any number of shiftScan flipScan flip flops can be distributed among any number of shift flops can be distributed among any number of shift registers, each having a separate registers, each having a separate scaninscanin and and scanoutscanout pin.pin.
Sequence length is determined by the longest scan shiftSequence length is determined by the longest scan shiftSequence length is determined by the longest scan shift Sequence length is determined by the longest scan shift register.register.
OneOne test controltest control (TC) pin is essential (scanin and scanout for(TC) pin is essential (scanin and scanout forOne One test controltest control (TC) pin is essential (scanin and scanout for (TC) pin is essential (scanin and scanout for each chain can share PI and PO pins, respectively).each chain can share PI and PO pins, respectively).
SFF
Combinationallogic
PI/SCANIN PO/SCANOUT
MUX
SFFSFF
TC
Slide 36 of 43Sharif University of Technology Testability: Lecture 23CK
Scan Design Advantages/DisadvantagesAdvantages:Advantages:
1.1. By adding controllability/By adding controllability/observabilityobservability to the state variables, scan to the state variables, scan
design also eases functional testing.design also eases functional testing.
2.2. The testing problem is transformed from one of sequential circuit The testing problem is transformed from one of sequential circuit
testing to one of combinational circuit testing.testing to one of combinational circuit testing.
Disadvantages:Disadvantages:1.1. IO pins: One pin necessary.IO pins: One pin necessary.
2.2. Additional area for latches/FFs (Additional area for latches/FFs (area overheadarea overhead))
Gate overheadGate overhead = [= [4 4 nnsffsff/(/(nngg++1010nnffff)] x )] x 100100%%, where , where nngg = = comb. comb.
gatesgates; ; nnffff = = flipflip--flopsflops;;ffff
Example: Example: nngg = = 100100k gatesk gates, , nnffff = = 22k k flipflip--flopsflops, overhead = , overhead = 66..77%.%.
More accurate estimate must consider scan wiring and layout area.More accurate estimate must consider scan wiring and layout area.
Slide 37 of 43Sharif University of Technology Testability: Lecture 23
o e accu ate est ate ust co s de sca g a d ayout a eao e accu ate est ate ust co s de sca g a d ayout a ea
Scan Design Advantages/Disadvantages
3.3. Additional time required to latch the next state into the Additional time required to latch the next state into the
i (i ( d h dd h d))resisters (resisters (speed overheadspeed overhead))
Multiplexer delay added in combinational path; approx. two Multiplexer delay added in combinational path; approx. two
gategate--delays.delays.
FlipFlip--flop output loading due to one additional fanflop output loading due to one additional fan--out; out;
approx. approx. 55--66%.%.
44 Additional time required to scan in/out test vectors andAdditional time required to scan in/out test vectors and4.4. Additional time required to scan in/out test vectors and Additional time required to scan in/out test vectors and
responses (responses (testing overhead)testing overhead)
Cl k ti d di t ib ti i diffi ltCl k ti d di t ib ti i diffi lt5.5. Clock generation and distribution is more difficult.Clock generation and distribution is more difficult.
Slide 38 of 43Sharif University of Technology Testability: Lecture 23
ATPG Example: S5378
Original
2 781
Full-scan
2 781Number of combinational gates 2,781179
00 0%
2,7810
17915 66%
Number of combinational gatesNumber of non-scan flip-flops (10 gates each)Number of scan flip-flops (14 gates each)Gate overhead 0.0%
4,60335/49
70 0%
15.66%4,603
214/22899 1%
Gate overheadNumber of faultsPI/PO for ATPGFault coverage 70.0%
70.9%5,533 s
414
99.1%100.0%
5 s585
Fault coverageFault efficiencyCPU time on SUN Ultra II, 200MHz processorNumber of ATPG vectors 414
414585
105,662Scan sequence length
Slide 39 of 43Sharif University of Technology Testability: Lecture 23
Automated Scan Design
Behavior, RTL, and logicBehavior, RTL, and logicDesign and verification
Scan designrule audits
Ruleviolations
Gate-levelnetlist
rule audits
Combinational Scan hard areCombinationalATPG
Scan hardwareinsertion
Scannetlist
Combinationalvectors
Chip layout: Scan-chain optimization,timing verification
Scan sequenceand test program
generation
netlistvectors
Scan chain order
timing verificationgeneration
Design and testdata for
manufacturing Mask dataTest program
Slide 40 of 43Sharif University of Technology Testability: Lecture 23
manufacturing Mask dataTest program
Timing and Power
Small delays in scan path and clock skew can cause race Small delays in scan path and clock skew can cause race condition.condition.
Large delays in scan path require slower scan clock.Large delays in scan path require slower scan clock.
Dynamic multiplexers: Skew between TC and TC signals Dynamic multiplexers: Skew between TC and TC signals can cause momentary shorting of D and SD inputs.can cause momentary shorting of D and SD inputs.
Random signal activity in combinational circuit during Random signal activity in combinational circuit during scan can cause excessive power dissipation.scan can cause excessive power dissipation.
Slide 41 of 43Sharif University of Technology Testability: Lecture 23
Summary
Scan is the most popular DFT technique:Scan is the most popular DFT technique:
RuleRule--based designbased design
Automated DFT hardware insertionAutomated DFT hardware insertion
Combinational ATPGCombinational ATPG
Advantages:Advantages:Advantages:Advantages:
Design automationDesign automation
h f l h l f l dh f l h l f l dHigh fault coverage; helpful in diagnosisHigh fault coverage; helpful in diagnosis
Hierarchical: scanHierarchical: scan--testable modules are easily combined into testable modules are easily combined into
large scanlarge scan--testable systemstestable systems
Moderate area (~Moderate area (~1010%) and speed (~%) and speed (~55%) overheads%) overheads
Slide 42 of 43Sharif University of Technology Testability: Lecture 23
SummaryDisadvantages:Disadvantages:
Area overhead
Due to larger flip-flopsDue to extra routing
Possible performance degradation
Extra gate delay due to the multiplexerE i i l di d l d i i h fli flExtra capacitive loading delay due to scan wiring at the flip-flop output
Large test data volume and long test timeLarge test data volume and long test time
Basically a slow speed (DC) testBasically a slow speed (DC) test
Not applicable to all designs (e.g. asynchronous designs, designs
violating scan design rules)
High power dissipation during testing
Slide 43 of 43Sharif University of Technology Testability: Lecture 23
High power dissipation during testing