Telefono Inalambrico Panasonic Tg4021me

© Panasonic System Networks Co., Ltd. 2010 Unauthorized copying and distribution is a violation of law.

ORDER NO. KM41006127CE

Telephone EquipmentModel No. KX-TG4021MET

KX-TG4022METKX-TG4023METKX-TGA403MET

Expandable Digital Cordless Answering SystemT: Black Metallic Version(for Mexico)

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KX-TG4021MET/KX-TG4022MET/KX-TG4023MET/KX-TGA403MET

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TABLE OF CONTENTSPAGE PAGE

1 Safety Precautions----------------------------------------------- 41.1. For Service Technicians --------------------------------- 4

2 Warning -------------------------------------------------------------- 42.1. Battery Caution--------------------------------------------- 42.2. About Lead Free Solder (PbF: Pb free)-------------- 42.3. Discarding of P. C. Board-------------------------------- 5

3 Specifications ----------------------------------------------------- 64 Technical Descriptions ----------------------------------------- 7

4.1. US-DECT Description ------------------------------------ 74.2. Block Diagram (Base Unit_Main)---------------------- 94.3. Block Diagram (Base Unit_RF Part) -----------------104.4. Circuit Operation (Base Unit) --------------------------114.5. Block Diagram (Handset)-------------------------------184.6. Block Diagram (Handset_RF Part)-------------------194.7. Circuit Operation (Handset)----------------------------204.8. Circuit Operation (Charger Unit) ----------------------224.9. Signal Route -----------------------------------------------23

5 Location of Controls and Components ------------------256 Installation Instructions ---------------------------------------257 Operating Instructions-----------------------------------------258 Test Mode ----------------------------------------------------------26

8.1. Engineering Mode----------------------------------------269 Service Mode -----------------------------------------------------30

9.1. How to Clear User Setting (Handset Only)---------3010 Troubleshooting Guide ----------------------------------------31

10.1. Troubleshooting Flowchart -----------------------------3111 Disassembly and Assembly Instructions ---------------43

11.1. Disassembly Instructions -------------------------------4311.2. How to Replace the Handset LCD -------------------47

12 Measurements and Adjustments---------------------------4812.1. Equipment Required-------------------------------------4812.2. The Setting Method of JIG -----------------------------4812.3. Adjustment Standard (Base Unit)---------------------5112.4. Adjustment Standard (Charger Unit)-----------------5212.5. Adjustment Standard (Handset) ----------------------5312.6. Things to Do after Replacing IC or X'tal ------------5412.7. Frequency Table ------------------------------------------56

13 Miscellaneous ----------------------------------------------------5713.1. How to Replace the Flat Package IC----------------5713.2. How to Replace the Shield Case ---------------------5913.3. How to Replace the LLP (Leadless Leadframe

Package) IC------------------------------------------------6113.4. Terminal Guide of the ICs, Transistors and

Diodes-------------------------------------------------------6314 Schematic Diagram ---------------------------------------------64

14.1. For Schematic Diagram---------------------------------6414.2. Schematic Diagram (Base Unit_Main) --------------6614.3. Schematic Diagram (Base Unit_Operation) -------6814.4. Schematic Diagram (Handset_Main) ----------------7014.5. Schematic Diagram (Charger Unit) -----------------72

15 Printed Circuit Board-------------------------------------------7315.1. Circuit Board (Base Unit_Main)-----------------------7315.2. Circuit Board (Base Unit_Operation) ----------------7515.3. Circuit Board (Handset_Main)-------------------------7715.4. Circuit Board (Charger Unit) ---------------------------79

16 Exploded View and Replacement Parts List -----------8016.1. Cabinet and Electrical Parts (Base Unit) -----------8016.2. Cabinet and Electrical Parts (Handset) -------------81

16.3. Cabinet and Electrical Parts (Charger Unit) ------- 8216.4. Accessories------------------------------------------------ 8316.5. Replacement Parts List--------------------------------- 84

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1 Safety Precautions1.1. For Service Technicians

• Repair service shall be provided in accordance with repair technology information such as service manual so as toprevent fires, injury or electric shock, which can be caused by improper repair work.1. When repair services are provided, neither the products nor their parts or members shall be remodeled. 2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced. 3. FASTON terminals shall be plugged straight in and unplugged straight out.

• ICs and LSIs are vulnerable to static electricity.When repairing, the following precautions will help prevent recurring malfunctions.1. Cover plastic parts boxes with aluminum foil.2. Ground the soldering irons.3. Use a conductive mat on worktable.4. Do not grasp IC or LSI pins with bare fingers.

2 Warning2.1. Battery Caution

1. Danger of explosion if battery is incorrectly replaced.2. Replace only with the same or equivalent type recommended by the manufacturer.3. Dispose of used batteries according to the manufacturer’s Instructions.

2.2. About Lead Free Solder (PbF: Pb free)Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder thatcontains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repairwork we suggest using the same type of solder.

Caution• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with

temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).• Exercise care while using higher temperature soldering irons.:

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).

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2.2.1. Suggested PbF SolderThere are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check themanufacturer's specific instructions for the melting points of their products and any precautions for using their product with othermaterials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

2.3. Discarding of P. C. BoardWhen discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

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3 Specifications

Note:• Design and specifications are subject to change without notice.

Note for Service:• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.• Analog telephone connection: Telephone Line

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4 Technical Descriptions4.1. US-DECT DescriptionThe frequency range of 1.91 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is samefrequency. Refer to Frequency Table (P.56).

4.1.1. TDD Frame Format

4.1.2. TDMA systemThis system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummybearer use.In 1 slot 417 µs, the 10 ms of voice data is transmitted.

• 2 - Handsets Link

Traffic BearerA link is established between base unit and handset.The state where duplex communication is performed.Handset doesn't make up duplex in no free RF channels because of interference. (*1)

Dummy BearerBase unit sends Dummy-data to the all stand-by state handsets.Handsets receive that data for synchronization and monitoring request from the base unit.Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)

Note:(*1) It is a feature under FCC 15 regulation and for interference avoidance.In the case of checking RF parts, it is better in least interference condition.

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4.1.3. Signal Flowchart in the Radio PartsReception

A voice signal from TEL line is encoded to digital data "TXDATA" by BBIC (IC501) in a base unit.Then TXDATA goes to RF PART and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.

As for a handset RF, RF signal is received in one antenna.BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.

TransmissionA voice signal from microphone is encoded to digital data "TXDATA" by BBIC (IC1) in a handset.Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a antenna.

As for a base unit RF, RF signal is received in two antennas. BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signalfrom RX signal in the selected antenna, and demodulates it to digital data "RXDATA".BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.

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4.2. Block Diagram (Base Unit_Main)

KX

-TG

4021

/402

2/40

23 B

LOC

K D

IAG

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AC

T

+ -

SP

X50

113

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MH

z

AN

T2

AN

T1

TE

L JA

CK

L1T

L1R

DC

P

DC

M

DC

JA

CK

RLY

SID

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ON

EC

IRC

UIT

Q16

1

Q14

1

BE

LLD

ET

EC

TH

OO

K

BE

LL

Q11

1

LIN

LOU

T

RF

_PA

RT

HS

MIP

HS

MIN

IC50

1B

BIC

INU

SE

DE

TE

CT

2IN

US

ED

ET

EC

T 1

RE

CE

IVE

AM

P

DC

IN 1

DC

IN 2

IC30

2

VC

CP

AV

BA

T_A

PU

VB

AT

VC

C_F

EV

CC

_IF

VC

C_V

CO

PD

N D

ET

3.0V

DO

UB

OU

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SCL, SDAWP

VD

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ANS_LED

IC60

1

FLA

SH

ME

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RY

IC61

1

EE

PR

OM

ME

MO

RY

KE

YS

R15

1,R

152

R13

1, R

133

Q17

1

VB

AT

DL,CS

MSG_LED

KEY 13

KEY C, D, E

SPOUTNSPOUTP

3.0

VR

EG

ULA

TOR

IC33

1

RE

SE

T IC

CLK,DO

STM/CKM

R37

1R

372

VCCA

VC

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AN

T2

AN

T1

RX

p

RX

n

RX

ON

TX

p

TX

n

TX

ON

RE

SE

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4.3. Block Diagram (Base Unit_RF Part)

KX-TG4021/4022/4023 BLOCK DIAGRAM (Base Unit_RF Part)

DA801

ANT2

ANT1

TXON

RXON

RXp

RXn

ANT2

ANT1

TXp

TXn

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4.4. Circuit Operation (Base Unit)General Description:

(BBIC, Flash Memory, EERROM) is a digital speech/signal processing system that implements all the functions of speechcompression, record and playback, and memory management required in a digital telephone answering machine.The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functionsas follows.

4.4.1. BBIC (Base Band IC: IC501)• Voice Message Recording/Play back

The BBIC system uses a proprietary speech compression technique to record and store voice message in Flash Memory.An error correction algorithm is used to enable playback of these messages from the Flash Memory.

• DTMF GeneratorWhen the DTMF data from the handset is received, the DTMF signal is output.

• Synthesized Voice (Pre-recorded message)The BBIC implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.

• Caller ID demodulationThe BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.

• Digital SwitchingThe voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to theTelephone line, etc. They are determined by the signal path route operation of voice signal.

• Block Interface CircuitRF part, LED, Key scan, Speaker, Telephone line.

4.4.2. Flash Memory (IC601)Following information data is stored.

• Voice signalex: Pre-recorded Greeting message, Incoming message

4.4.3. EEPROM (IC611)Following information data is stored.

• Settingsex: message numbers, ID code, Flash Time, Tone/Pulse

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4.4.4. Power Supply Circuit/Reset CircuitThe power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part isinsulated from VBAT by Doubler of BBIC.Circuit Operation:

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4.4.4.1. Charge CircuitThe voltage from the AC adaptor is supplied to the charge circuits.

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4.4.5. Telephone Line InterfaceTelephone Line Interface Circuit:Function

• Bell signal detection• ON/OFF hook and pulse dial circuit• Side tone circuit

Bell signal detection and OFF HOOK circuit:In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:T → L101 → R111 → C111 → Q111 → BBIC pin 5 [BELL]When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow throughthe circuit). Following signal flow is the DC current flow.T → L101 → D101 → Q141 → Q161 → R163 → R167 → D101 → L102 → P101 → R

ON HOOK Circuit:Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-hook condition.

Pulse Dial Circuit:Pin 6 of BBIC turns Q141 ON/OFF to make the pulse dialing.

Side Tone Circuit:Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 iscanceled by the canceller circuit of BBIC.

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4.4.6. Parallel Connection Detect Circuit/Auto Disconnect CircuitFunction:

In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have acircuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephoneconnected in parallel is on hook or off hook by detecting changes in the T/R voltage.

Circuit Operation:Parallel connection detection when on hook:When on hook, the voltage is monitored at pin 17 of IC501. There is no parallel connection if the voltage is 0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.

Parallel connection detection when off hook:When off hook, the voltage is monitored at pin 18 of IC501; the presence/absence of a parallel connection is determined bydetecting the voltage changes.If the Auto disconnect function is ON and statuses are Hold, receiving ICM, OGM transmitting, BBIC disconnects the line afterdetecting parallel connection is off hook.

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4.4.7. Calling Line Identification (Caller ID)/Call Waiting Caller IDFunction:

Caller IDThe caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone companyto utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has beenentered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between thefirst and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK(Frequency Shift Keying) * format. Data "1" is a 1200 Hz sine wave, and data "0" is a 2200 Hz sine wave. There are two types ofthe message format which can be received: i.e. the single message format and plural message format. The plural messageformat allows to transmit the name and data code information in addition to the time and telephone number data.*: Also the telephone exchange service provides other formats.

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Call Waiting Caller IDCalling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call,to receive information about a calling party on a waited call. The transmission of the calling information takes place almostimmediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the newcall.

Function:The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data andMARK data pass the following route.Telephone Line → P101 → L101, L102 → C121, C122 → R121, R122 → IC501 (25, 24).If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and theinformation for the second and subsequent callers is not displayed on the portable handset display.

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4.5. Block Diagram (Handset)

IC1

IC3

MICp

AVD

LD0_CTRL

MICn

LSRpLSRn

BELL_LED

PAOUTpPAOUTnCKM//STMCKM/STM

BBIC

RESET

CHG_CTL

CHG_DET

WP

, CLK

, DA

TA

P3_

3~P

3_7

P1_

1~P

1_4

CHARGEQ4 D7

MIC

Receiver

LED

3V

Monitor SP

LCD KEYS

IC801

RF PART

ANT1X110.368 MHzEEPROM

3V

BATTERY

(BELL)

BATTERY

3V

BATTERY

3V

KX-TGA403 BLOCK DIAGRAM (Handset)

KEY_LED

Q7

LED

(KEY)

TXn

Power_adj

TXp

VDD_PADRV

PSEL

PON

TXONRXON

RF_RXnRF_RXp

CP_VOUT2

BATTERY

VDDPA

1.8V

VDD2VDD1

3V

Q2

1.8V

C144

D1

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4.6. Block Diagram (Handset_RF Part)

KX-TGA403 BLOCK DIAGRAM (Handset_RF Part)

DA801

TXON

RXON

ANT

RF_RXn

RF_RXp

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4.7. Circuit Operation (Handset)4.7.1. OutlineHandset consists of the following ICs as shown in Block Diagram (Handset) (P.18).

• DECT BBIC (Base Band IC): IC1- All data signals (forming/analyzing ACK or CMD signal)- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.)- PLL Oscillator- Detector- Compress/Expander- Reception

• RF Power Amp: IC801- Amplifier for transmission

• EEPROM: IC3- Temporary operating parameters (for RF, etc.)

4.7.2. Power Supply Circuit/Reset CircuitCircuit Operation:

When power on the Handset, the voltage is as follows;BATTERY(2.2 V ~ 2.6 V: BATT+) → F1 → Q2 (1.8 V), IC1-43pin (2.5V)The Reset signal generates IC1 (61 pin) and 1.8 V.

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4.7.3. Charge CircuitCircuit Operation:

When charging the handset on the Base Unit, the charge current is as follows;DC+(6.5 V) → F301 → R371 → R372 →CHARGE+(Base) → CHARGE+(Handset) → Q4 → D7→ F1 → BATTERY+... Battery... BATTERY- → R45 → GND → CHARGE-(Handset)→ CHARGE-(Base) → GND → DC-(GND)In this way, the BBIC on Handset detects the fact that the battery is charged.The charge current is controlled by switching Q9 of Handset.Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.12).

4.7.4. Battery Low/Power Down DetectorCircuit Operation:

“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.The detected voltage is as follows;

• Battery LowBattery voltage: V(Batt) 2.25 V ± 50 mVThe BBIC detects this level and " " starts flashing.

• Power DownBattery voltage: V(Batt) 2.0 V ± 50 mVThe BBIC detects this level and power down.

4.7.5. SpeakerphoneThe hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.

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4.8. Circuit Operation (Charger Unit)Charge control is executed at handset side so that the operation when using charger is also controlled by handset.Refer to Circuit Operation (Handset) (P.20)

The route for this is as follows: DC+pin of J1(+) → F1 → R1 → CHARGE+pad → Handset → CHARGE-pad → DC-pin of J1(-).

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4.9. Signal Route

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RF part signal route

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5 Location of Controls and ComponentsRefer to the Operating Instructions.

Note:You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

6 Installation InstructionsRefer to the Operating Instructions.


7 Operating InstructionsRefer to the Operating Instructions.


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8 Test Mode8.1. Engineering Mode8.1.1. Base Unit

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Frequently Used Items (Base Unit)ex.)

Note:(*1) When you enter the address or New Data, please refer to the table below.

Items Address Default Data New Data RemarksFrequency 00 07 / 00 08 00/01 - - Use these items in a READ-ONLY mode to

confirm the contents. Careless rewriting maycause serious damage to the computer system.

ID 00 02 ~ 00 06 Given value - -

Desired Number (hex) Input Keys Desired Number (hex) Input Keys0 0 A [Flash] + 01 1 B [Flash] + 1. . C [Flash] + 2. . D [Flash] + 3. . E [Flash] + 49 9 F [Flash] + 5

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8.1.2. Handset

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Frequently Used Items (Handset)ex.)

Note:(*1) When you enter the address or New Data, please refer to the table below.

(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to thehandset.

Items Address Default Data New Data Possible AdjustedValue MAX (hex)

Possible AdjustedValue MIN (hex)

Remarks

Battery Low 00 11 / 00 12 00 / 00 - - -(*2)Frequency 00 07 / 00 08 00 / 01 - - -

ID 00 02 ~ 00 06 Given value - - -

Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys0 0 A [Flash] + 01 1 B [Flash] + 1. . C [Flash] + 2. . D [Flash] + 3. . E [Flash] + 49 9 F [Flash] + 5

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9 Service Mode9.1. How to Clear User Setting (Handset Only)

Handset

Press , , , simultaneously until a beep sound is heard. Then single handset is initialized.(The contents of user setting are reset to factory default)*Usage time is not cleared.

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10 Troubleshooting Guide10.1. Troubleshooting Flowchart

Cross Reference:Check Power (P.32)Check Playback (P.34)Check Record (P.33)Check Battery Charge (P.34)Check Link (P.35)Check the RF part (P.37)Check Handset Transmission (P.42)Check Handset Reception (P.42)Check Caller ID (P.42)

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10.1.1. Check Power10.1.1.1. Base Unit

Cross Reference:Power Supply Circuit/Reset Circuit (P.12)

Note: BBIC is IC501.(*1) Refer to Specifications (P.6) for part number andsupply voltage of AC adaptor.(*2) Refer to Circuit Board (Base Unit_Main) (P.73).

10.1.1.2. Handset


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10.1.2. Check Record10.1.2.1. Base UnitA) Not record Incoming Message

Cross Reference:Signal Route (P.23)Telephone Line Interface (P.14)Parallel Connection Detect Circuit/Auto DisconnectCircuit (P.15)

Note: Flash Memory is IC601.BBIC is IC501.

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10.1.3. Check Playback 10.1.3.1. Base Unit


Note: Flash Memory is IC601.BBIC is IC1.(*1) Refer to Circuit Board (Base Unit_Main) (P.73).

10.1.4. Check Battery Charge10.1.4.1. Base Unit

Cross Reference:Charge Circuit (P.13)

10.1.4.2. Handset

Cross Reference:Check Power (P.32)Charge Circuit (P.21)

10.1.4.3. Charger Unit

Cross Reference:Charge Circuit (P.21)

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10.1.5. Check Link10.1.5.1. Base Unit

Cross Reference:Power Supply Circuit/Reset Circuit (P.12)Check the RF part (P.37)

Note:*1 How to adjust +3.0V:Execute the command "VDA"Refer to Things to Do after Replacing IC or X'tal (P.54) for Base Unit.*2 How to adjust the frequency of X501:To see the frequency, execute the command “SFR“, then check the TP_CKM (IC501-57pin).To adjust frequency, send command “SFR “ until the frequency counter becomes13.824 MHZ±55HZ.

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10.1.5.2. Handset

Cross Reference:Power Supply Circuit/Reset Circuit (P.20)Check the RF part (P.37)

Note:*1 How to adjust the frequency of X1:To see the frequency, execute the command “SFR“, then check the TP_CKM (IC1-46pin).To adjust frequency, send command “SFR “ until the frequency counter becomes10.368 MHz±55HZ.Refer to Things to Do after Replacing IC or X'tal (P.55) for Handset.

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10.1.6. Check the RF part10.1.6.1. Finding out the Defective part

After All the Checkings or Repairing1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.

Note:(*1) HS: Handset(*2) BU: Base Unit

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10.1.6.2. RF Check FlowchartEach item (1 ~ 6) of RF Check Flowchart corresponds to Check Table for RF part (P.39).Please refer to the each item.

Note:(*1) Refer to Check Link (P.35).

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10.1.6.3. Check Table for RF part

Note:(*1) Adjustment Standard (Base Unit) (P.51)(*2) Adjustment Standard (Handset) (P.53)

No. Item BU (Base Unit) Check HS (Handset) Check1 Link Confirmation Normal

HS, BU Mode [Normal Mode]

1. Register Regular HS to BU (to be checked).

2. Press [Talk] key of the Regular HS to establish link.

1. Register HS (to be checked) to Regular BU.

2. Press [Talk] key of the HS to establish link.

2 X'tal Frequency confirmation

HS, BU Mode: [Adjustment]

Check X'tal Frequency.(13.824000 MHz ±100 Hz)

Check X'tal Frequency.(10.368000 MHz ±100 Hz)

3 TX confirmation

Regular HS (BU) Mode:[Test RX Mode]

BU (HS) Mode:[Test TX_Burst Mode]

1. Place Regular HS 15 cm away from a checked BU.

2. Confirm "TXDATA" waveform of BU (*1) and “RXDATA“ waveform of Regular HS by Digital Oscilloscope.

1. Place Regular BU 15 cm away from a checked HS.

2. Confirm "TXDATA" waveform of HS (*2) and "RXDATA" waveform of Regular BU by Digital Oscilloscope.

4 RX confirmation

Regular HS (BU) Mode:[Test TX_Burst Mode]

BU (HS) Mode:[Test RX Mode]

1. Place Regular HS 15 cm away from a checked BU.

2. Confirm "RXDATA" waveform of BU (*1) and “TXDATA“ waveform of Regular HS by Digital Oscilloscope.

1. Place Regular BU 15 cm away from a checked HS.

2. Confirm "RXDATA" waveform of HS (*2) and "TXDATA" waveform of Regular BU by Digital Oscilloscope.

5 Range Confirmation Normal

HS, BU Mode: [Normal Mode]


2. Press [Talk] key of the Regular HS to establish link.

3. Compare the range of the BU (being checked) with that of the Regular BU.


2. Press [Talk] key of the HS to establish link.3. Compare the range of the HS (being

checked) with that of the Regular HS.

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10.1.6.4. TEST RANGE CheckCircuit block which range is defective can be found by the following check.

CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST

Note:(*1) Refer to Commands (P.50).

Item BU (Base Unit) Check HS (Handset) CheckRange Confirmation TX TEST(TX Power check)

HS, BU settingChecked unit: Low TX power (*1)Regular unit: High TX power (*1)


2. Set TX Power of the BU and the Regular HS according to CHART1.

3. At distance of about 20m between HS and BU,Link OK = TX Power of the BU is OK.No Link = TX Power of the BU is NG.


2. Set TX Power of the HS and the Regular BU according to CHART1.

3. At distance of about 20m between HS and BU,Link OK = TX Power of the HS is OK.No Link = TX Power of the HS is NG.

Range Confirmation RX TEST(RX sensitivity check)

HS, BU settingChecked unit: High TX power (*1)Regular unit: Low TX power (*1)


2. Set TX Power of the BU and the Regular HS according to CHART1.

3. At distance of about 20m between HS and BU,Link OK= RX Sensitivity of the BU is OK.No Link = RX Sensitivity of the BU is NG.


2. Set TX Power of the Checking HS and the Reg-ular BU according to CHART1.

3. At distance of about 20m between HS and BU,Link OK= RX Sensitivity of the HS is OK.No Link = RX Sensitivity of the HS is NG

BU (to be checked) Regular_HSTX Power TX Power

BU (Base Unit) TX Power Check Low HighBU (Base Unit) RX Sensitivity Check High Low

HS (to be checked) Regular_BUTX Power TX Power

HS (Handset) TX Power Check Low HighHS (Handset) RX Sensitivity Check High Low

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10.1.7. Registering a Handset to the Base Unit

10.1.8. Deregistering a Handset

10.1.9. Deregistering All Handsets by the Base Unit

42


10.1.10. Check Handset Transmission

Cross Reference:Signal Route (P.23)

10.1.11. Check Handset Reception

Cross Reference:Signal Route (P.23)

Note:When checking the RF part, Refer to Check the RF part(P.37).

10.1.12. Check Caller ID

Cross Reference:Telephone Line Interface (P.14)Calling Line Identification (Caller ID)/Call Waiting CallerID (P.16)

Note:• Make sure the format of the Caller ID service of the

Telephone company that the customer subscribes to.• It is also recommended to confirm that the customer is really

a subscriber of the service.

43


11 Disassembly and Assembly Instructions11.1. Disassembly Instructions11.1.1. Base Unit

44


45


11.1.2. Handset

46


11.1.3. Charger Unit

47


11.2. How to Replace the Handset LCDNote:

The illustrations are simplified in this page.They may differ from the actual product.

48


12 Measurements and AdjustmentsThis chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in Troubleshooting Guide (P.31)

12.1. Equipment Required• Digital multi-meter (DMM): it must be able to measure voltage and current.• Oscilloscope.• Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; ±4 ppm)

Hewlett Packard, 53131A is recommended.• DECT tester: Rohde & Schwarz, CMD 60 is recommended.

This equipment may be useful in order to precisely adjust like a mass production.

12.2. The Setting Method of JIG

<Preparation>• Serial JIG cable: PQZZ1CD300E*• PC which runs in DOS mode• Batch file CD-ROM for setting: PNZZTG4021ME

Note:*: If you have the JIG Cable for TCD500 series(PQZZ1CD505E), change the following values ofresistance. Then you can use it as a JIG Cable for bothTCD300 and TCD500 series. (It is an upper compatible JIGCable.)

12.2.1. Connections (Base Unit) Connect the AC adaptor. Connect the JIG Cable GND (black). Connect the JIG Cable RX (red) and TX (yellow).

Note:*: COM port names may vary depending on what your PC calls it.

Resistor Old value (kΩ) New value (kΩ)R2 22 3.3R3 22 3.3R4 22 4.7R7 4.7 10

49


12.2.2. Connections (Handset)Connect the DC Power or Battery to BATT+ and BATT-.Connect the JIG cable GND (black) to GND.Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.

Note:*: COM port names may vary depending on what your PC calls it.

50


12.2.3. How to install Batch file into P.C.

Note:• “*****” varies depending on the country or models.

12.2.4. CommandsSee the table below for frequently used commands.

Command name Function Examplerdeeprom Read the data of EEPROM Type “rdeeprom 00 00 FF”, and the data from address

“00 00” to “FF” is read out.readid Read ID (RFPI) Type “readid”, and the registered ID is read out.writeid Write ID (RFPI) Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E

98” is written.hookoff Off-hook mode on Base Type “hookoff”.hookon On-hook mode on Base Type “hookon”.RdEeprom Read EEPROM Type “RdEeprom 03 e2 04”, and the data from address

“03 e2”h to “03 e4”is read out*This command gets 4 byte "WW", "XX", "YY", "ZZ".*Please NEVER forget these 4 byte data!

sendchar epw Write EEPROM Type “sendchar epw 03 e2 04 FF FF FF FF”sendchar RST Reset baseset Type “sendchar RST”getchk Read checksum Type “getchk”.sendchar epw Write EEPROM Type “sendchar epw 03 e2 04 WW XX YY ZZ”

*"WW", "XX", "YY", "ZZ" is 4 byte data that already readfrom same address.

51


12.3. Adjustment Standard (Base Unit)When connecting the simulator equipment for checking, please refer to below.

12.3.1. Bottom View

Note:(*1) is referred to No.2 of Check Check Table for RF part (P.39)(*2) is referred to Power Supply Circuit/Reset Circuit (P.12)

CL2

C47

7C

478

SP

PS

PN

C53

0

C32

1

DC

DC

_OU

T

C32

2

C47

6F

CT

RS

TN

ST

M/C

KM

/P15

C34

3

C51

1

C51

0

C16

5C

163

C35

1

CH

AR

GE

+C

HA

RG

E- C

514

C18

1

C17

1

C12

1 C12

2

C15

2

C12

5

C11

2C

352

AN

T2

CL1

R50

2

RT

CK

R32

2

R32

1

R30

2

R60

5R

606

R61

2

R33

5R

602

R60

3

R11

2

R17

8V

CC

AV

RE

F

R16

6

R16

4R

161

R13

6V

DD

C

R15

1

R15

2

R11

5

R12

1

L371

L1T

L1R

L476 L4

74

L372

L362

IC60

1IC

302

IC61

1

RA

151

RA

504

D36

1

D47

3D

472

D15

3D13

3

D36

3

Q16

1

Q60

1

C142

C513

C167

C512

C186

C184

C601C479

C307

C301

C332

C521

C133

C123C472

C473

C475

C120C124

C151C525

C524

C611

C115

C168

C126

C66

1

R165

F301DC

PD

CM

R512

R507

R307

R607

R601

R304R305R301

R505

R506

R334

R604

R181

R162

R503

R167

R163

R122

L361

RA502

D142

D143

CH

G+

2C

HG

-2

B

+6.

5V

RT

CK

E4

4

3

58 1

+3.

0V

VB

AT

TM

S

TC

K

TD

I

TD

O

VB

G

GN

DU

TX

UR

X

3.0A

AN

T1

PN

LB17

12Z

PbF

CH

G

SP

DC

RE

DR

ED

RE

D

WH

TB

LK

BLK

YLW

GR

N

Spe

ctru

m A

naly

zer

Fre

quen

cy C

ount

er (

*1)

Osc

illos

cope

8Vol

tM

eter

DC

6.5V

Osc

illos

cope

(*2

)

* S

end

com

man

d "S

FR

", th

en th

e fr

eque

ncy

outp

ut o

n th

is T

P.

* S

tart

Mon

itor

52


12.4. Adjustment Standard (Charger Unit)When connecting the simulator equipment for checking, please refer to below.

12.4.1. Bottom View

TP

4

TP

3

1

2

J1

A

F1Pb

FP

NLP

1029YA

PQ

UP

11532Y

Charge-

Charge+

12 /2 W

DigitalVolt Meter

DC POWERDC 6.5 V

TP

3

TP

4 (GN

D)

53


12.5. Adjustment Standard (Handset)When connecting the simulator equipment for checking, please refer to below.

12.5.1. Component View

Note:(*1) is referred to No.2 of Check Check Table for RF part (P.39)(*2) is referred to Power Supply Circuit/Reset Circuit (P.20)

A

PbF

C44

C880

C811

C813

C72

C203

C105

C206

C201

C175 C70C152

C71

C200

C107

C106

C103

C104

C73

C864C863C814

C834

C802

C804

C43

C837

C48 C40C54

C52C53

C51

C55

C39 C30

C10

C400

C340

C341

C342

C332

C331

C147

C113C5

JTAGSTM

URXUTX

CHG(+)

MIC+ MIC-

CHG(-)

BATT-BATT+

BAT

MIC-

RCV-

E

1 4

8 5

MIC+

RCV+

R578

R50R53R236

R54

R231

R801

R802

R805 R880

R808

R66R63

R225

R405

R203

R807

R27R400R402

R248

R249

21

1

R23R37R36

R20CLK

1.8V

R7R30

F1

R2

R332

R331

R330

R3R8

R4

L802

IC3

TP_ANT1

RA800

RA4

RA40CP3.0V

CP4.0V

D22D21

D13

RED

BLK

RED

BLK

D14

D400

D7

D3 D4

Q401

POWER

Q400

Q11

Q12

GND

C580

C187

C186

C204

C827

C881

C819

C45

C46

C825

C809

C810 C

861

C808

C812

C806

C138

C139

C803

C805

C47

C822

C826

C820

C860

C182

C49

C50

C188

C12

C13

C11

C96C

18

C17

C97

C38

C35

C121

C150

C1

C2

C172

C75

C74

C3

X1

MIC

R232

R55

SP

EA

KE

R

R233

R806

R64

R28

R403R

404

R406

R407

R401

R215

R45

R74

R31

R6

R73

L801

L803

L46L47

IC801

IC1

RA

32

RA

1

RA

61

RA

31R

A30

DA

801

D1

Q880

Q2

Q10

Q7

Q4

Q9

RECEIVER

PNLB1734YKX-TGA650XXKX-TGA651XXKX-TGA250XXKX-TGA251XXKX-TGA403XX

TGA250XXTGA251XXTGA403XX

TGA650XXTGA651XX

AF

Gen

erat

or

DC

6.5

V

DC

Pow

er2.

30~

2.60

V

DC

PO

WE

R2.

00~

2.25

V

GN

DG

ND

Dig

ital

Vol

t Met

er

CLK

Fre

quen

cyC

ount

er (

*1)

2.7

VZ

ener

+

+

PC

UR

XTXRX

GND

100

GN

D

GN

D

AN

TDE

CT

Tes

ter

CM

D60

(at b

atte

ry lo

w)

Pow

er K

ey

56

1

56

8 1 F

22pF

Cur

rent

Pro

beO

scill

osco

pe (

*2)

1.8V

CP 3.0V

CP 4.0V

AF

Vol

t Met

er

Osc

illos

cope15

0

54


12.6. Things to Do after Replacing IC or X'talIf repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustmentdata, etc. in memory.The set doesn't operate if it is not executed.

12.6.1. How to download the data12.6.1.1. Base UnitFirst, operate the PC setting according to The Setting Method of JIG(P.48).Then download the appropriate data according to the following procedures.

Note:(*1) XXX_YYY: revision number“XXX”, “YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The SettingMethod of JIG (P.48).

Items How to download/Required adjustmentEEPROM (IC611) Adjusted parameter data is stored in memory.

(country version batch file, default batch file,etc.)

1) Change the address “0001” of EEPROM to “55” to downloadthe data.2) Default batch file: Execute the command “default.bat”.3) Country version batch file: Execute the command“TG4021USMErevXXX_YYY.bat”. (*1)4) Clock adjustment

X'tal (X1) System clock Clock adjustment data is in EEPROM, adjust the data againafter replacing it.1) Apply 6.5V between DCP ad DCM with DC power.2) Input Command "sendchar sfr", then you can confirm thecurrent value.3) Check X'tal Frequency.(13.824 MHz ± 100 Hz).4) If the frequency is not 13.824 MHz ± 100 Hz, adjust thefrequency of CLK executing the command "sendchar sfr xx xx(where xx is the value)" so that the reading of the frequencycounter is 13.824000 MHz ± 15 Hz.

55


12.6.1.2. HandsetFirst, operate the PC setting according to The Setting Method of JIG (P.48).Then download the appropriate data according to the following procedures.

Note:(*2) XXX_YYY: revision number“XXX” and “YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The SettingMethod of JIG (P.48).

Items How to download/Required adjustmentEEPROM (IC3) Adjusted parameter data is

stored in memory.(country version batch file,default batch file, etc.)

1) Default batch file: Execute the command “default.bat”.2) Default batch file (remaining): Execute the command “TGA402USDEFrevXXX_YYY.bat”. (*2)3) Country version batch file: Execute the command “TGA402USMErevXXX_YYY.bat”. (*2)4) Clock adjustment5) 2.35 V setting and battery low detection

Battery Monitor Check - 1) Apply 2.25 V between BATT+ and BATT-.2) Execute the command sendchar PAD sendchar LED 0 sendchar CRX 0 1 sendchar AD1 It assumes that the return value is XX. a) 6c XX 71: No need to adjust b) XX: 6A ~ 6B: Need to adjust XX: 72 ~ 74: Need to adjust Write AD value of 2.25 V to EEPROM. ex) read data: XX = 6A, write data:YY = 6A read data: XX =73, write data: YY = 73 EEPROM = 0009 (Low Voltage) write “YY“ Execute the command “wreeprom 00 09 01 YY“. EEPROM = 000A (No Voltage) write “YY - 1D“ Execute the command “xwreeprom 00 0A 01 ZZ“. Note: No Voltage writing data limit is “00“. c) XX: 00 ~ 69: Reject XX: 75 ~ FF: Reject

Battery Low Confirmation - 1) Apply 2.40 V between BATT+ and BATT-.2) Confirm that there is no flashing of Battery lcon.3) Apply 2.25 V ± 0.08 V between BATT+ and BATT-.4) Confirm that there is flashing of Battery lcon.

Battery Clock Adjustment (X1)

CLK 1) Apply 2.6 V between BATT+ and BATT- with DC power.2) Input Command “sendchar sfr“, then you can confirm the current value.3) Check X’tal Frequency. (10.368 MHz ± 100 Hz).4) If the frequency is not 10.368 MHz ± 100 Hz, adjust the frequency of CLK exe-cute in the command “sendchar sfr xx xx (where xx is the value)“ so that the readingof the frequency counter is 10.368000 MHz ± 5 Hz.

56


12.7. Frequency Table

Ch. (hex) TX/RX Frequency (MHz)Channel 0 00 1928.448Channel 1 01 1926.720 Channel 2 02 1924.992 Channel 3 03 1923.264 Channel 4 04 1921.536

57


13 Miscellaneous13.1. How to Replace the Flat Package IC

Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), asoldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

13.1.1. Preparation• PbF (: Pb free) Solder• Soldering Iron

Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone withless experience could overheat and damage the PCB foil.

• FluxRecommended Flux: Specific Gravity → 0.82.Type → RMA (lower residue, non-cleaning type)Note: See About Lead Free Solder (PbF: Pb free) (P.4)

13.1.2. How to Remove the IC1. Put plenty of solder on the IC pins so that the pins can be completely covered.

Note:If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.

2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.

3. While the solder melts, remove it together with the IC pins.

When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder isleft at the joint on the board, the new IC will not be attached properly.

58


13.1.3. How to Install the IC1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.

*Check the accuracy of the IC setting with the corresponding soldering foil.

2. Apply flux to all pins of the FLAT PACKAGE IC.

3. Solder the pins, sliding the soldering iron in the direction of the arrow.

13.1.4. How to Remove a Solder Bridge1. Lightly resolder the bridged portion.2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.

59


13.2. How to Replace the Shield Case13.2.1. Preparation

• PbF (: Pb free) Solder• Soldering Iron

Tip Temperature of 700°F ± 20°F (370°C ± 10°C)Note:We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil.

• Hot Air Desoldering ToolTemperature: 608°F ± 68°F (320°C ± 20°C)

13.2.2. Caution• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

13.2.3. How to Remove the Shield CaseNote:

If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.

1. Cut the case along perforation.

2. Remove the cut part.

3. Cut the four corners along perforation.

4. Remove the reminds by melting solder.

60


13.2.4. How to Install the Shield CaseNote:

• If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.• Shield case’s No. : PNMC1013Z

1. Put the shield case.

2. Solder the surroundings.

61


13.3. How to Replace the LLP (Leadless Leadframe Package) ICNote:

This description is only applied on the model with Shield case.

13.3.1. Preparation• PbF (: Pb free) Solder• Soldering Iron

Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)Note:We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil.

• Hot Air Desoldering ToolTemperature: 608 °F ± 68 °F (320 °C ± 20 °C)

13.3.2. Caution• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

13.3.3. How to Remove the IC1. Heat the IC with a hot air desoldering tool through the P.C.Board.

2. Pick up the IC with tweezers, etc. when the solder is melted completely.Note:

• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.

When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through theP.C.Board.

3. After removing the IC, clean the P.C.Board of residual solder.

62


13.3.4. How to Install the IC1. Place the solder a little on the land where the radiation GND pad on IC bottom is to be attached.

2. Place the solder a little on the land where IC pins are to be attached, then place the IC.Note:

• When placing the IC, the positioning should be done very carefully.

3. Heat the IC with a hot air desoldering tool through the P.C.Board until the solder on IC bottom is melted.Note:

• Be sure to place it precisely, controlling the air volume of the hot air desoldering tool.

4. After soldering, confirm there are no short and open circuits with visual inspection.

13.3.5. How to Remove a Solder BridgeWhen a Solder Bridge is found after soldering the bottom of the IC, remove it with a soldering iron.

63


13.4. Terminal Guide of the ICs, Transistors and Diodes13.4.1. Base Unit

13.4.2. Handset

64


14 Schematic Diagram14.1. For Schematic Diagram14.1.1. Base Unit (Schematic Diagram (Base Unit_Main))Notes:

1. DC voltage measurements are taken with voltmeter from the negative voltage line.

2. The schematic diagrams may be modified at any time with the development of new technology.

14.1.2. Handset (Schematic Diagram (Handset_Main))Notes:

1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.2. The schematic diagrams may be modified at any time with the development of new technology.

14.1.3. Charger Unit (Schematic Diagram (Charger Unit))Notes:

1. DC voltage measurements are taken with voltmeter from the negative voltage line.

2. The schematic diagrams may be modified at any time with the development of new technology.

65


Memo

66


14.2. Schematic Diagram (Base Unit_Main)

NC: No Components

KEYIN2KEYIN3

KEYS_DKEYS_E

KEYIN1

KEYS_C

MSG_LED

ANS_LED

UT

X

UR

X

JTA

G_T

DO

JTA

G_T

CK

JTA

G_T

MS

JTA

G_T

DI

JTAG_RTCK

JTA

G_R

TC

K

JTAG_TCK

JTAG_TDOJTAG_TDI

JTAG_TMS

VBAT

UT

X

UR

XGN

D

*WBX01

AP1

10pin

PARALLEL WIRE

2APVCCMSG_LEDANS_LED

NCKEYIN1KEYIN2KEYIN3

KEYS_CKEYS_DKEYS_E

*SW1

NC

12

RA501 33

1

2

3

45

6

7

8

RA50210k

1 2 3 45678

C516 0.1uC51

5

K1u

VBAT

VDDC

C517 0.1u

C518 0.1u

+3.0V

C65

1N

CC

652

NC

C65

5N

CC

656

NC

C65

8N

CC

659

NC

*C661

NC

RSTN

VBAT

DA801

1

23

TXn

RXON

RXp

RXn

GND

R806

470GND

TXON

R807470

TXp

GND

GND

GND

DA802

1

23

ANT2

ANT1

R89

2

470

GND

GND

R89

1

470

ANT2

GND

GND

ANT1

GND

GNDANT2

TXON

RXONRXn

ANT1

TXpTXn

RXp

GND

STM/CKM/P15

GNDGND

GNDGND

CL1

CL2

*Q6511

B1

2E

3B2

5C1

4C2

C893

3p

GND

GNDGNDGND

TD

I

TM

S

TC

K

TD

O

C895

1.2pC896

2.2p

C859

2.2p

C8052.7p

C8062.7p

C8201.5p

C86

3

1.5p

R50

233

RT

CK

C66

0N

C

C8102.4p

C81

3

2p

L809

7.5n

C8915p

C8925p

C81110p

C826

10p

C82210p

C82510p

C65

3N

CC

654

NC

C812

0.9p

C82710p

GNDC894

2.2p

*R651 680*R652 680

*R50

7

NC

+3.0V

*R51

2

1k

45TXp46RXp47RXn48GND_RF49TRSW_p50ANT_n51ATST_n52ATST_p53TEST54RSTN55NC56VCC_VCO57GPIO[27]58VDDUSB59DM_USB/GPI2860DP_USB/GPI2961VDDC162JTAG_TDO63JTAG_TDI64JTAG_TCK65JTAG_TMS66JTAG_RTCK

FCT

TO RF BLOCK

W 0.2mmL mm1st layer

W 0.2mmL 10.0mm1st layer

W 0.15mmL 20mm3rd layer

W 0.15mmL 20mm3rd layer

W 0.2mmL 10mm1st layer

W 0.2mmL 10mm1st layer

W 0.2mmL mm1st layer

10

1



*IC501

(1)(2)(3)(4)

(5)

(6)

* Start Monitor* When "SFR" command is executed, 13.824MHz frequency will be output.

67


KX-TG4021/4022/4023ME SCHEMATIC DIAGRAM (Base Unit_Main)

NC: No Components

EE

P_S

CL

EE

P_S

DA

EE

P_W

P

HOOK

EE

P_W

P

UTXURX

HOOK

BELL

MS

G_L

ED

AN

S_L

ED

BELLKEYS_EKEYS_DKEYS_C

KE

YIN

1K

EY

IN2

KE

YIN

3

SP

I_D

IS

PI_

DO

SP

I_C

LK

SP

I_C

S

EE

P_S

CL

EE

P_S

DA

FLA

SH

_RS

T

SP

I_D

IS

PI_

DO

SP

I_C

LK

SP

I_C

S

FLA

SH

_RS

T

PDN_DET

PDN_DET

+6.5V

C51

90.

1u

VBAT

R61

2

10k

C50

7K

2.2u

RA50468

1

23

4

C51

20.

1u

C51

40.

1u

C51

0K

1u

C51

3K

2.2u

VDDC

C506

1u

R50

110

L102

33u

C165NC

C184

K1.0u

L101

33u

R16

6N

C

C102 680pC13

2K

0.01

u

R16

727

R16

2

27k

R14

4N

C

SA

103

NC

21

C101 680p

R141

100kC163 NC

D101

4

3

1

2

C18

6

10p

Q142B

C

E

R164

2.7k

D14

2N

CA

K

Q141

BEC

L1R

R16

3

12

C16

8N

C

R13

110

M

SA

101

270V

21

R14

52.

2k

R161

100k

L1T

R16

527

k

D14

325

V

C14

2K

0.01

u

R14

2

2.7k

R13

333

0k

Q143NC

R17

81k

C18

1

NC

C18

5

NC

C133

NC

C151

10p

C5010.1u

+3.0V

C52

0

0.1u

VCCA

R121 390k C121 680p

C122 680pR122 390k

R115

27k

C115

0.22u

C120

1000pC1

72N

C

VC

CA

C50

810

p

R509 NC

+3.0VVDDC

C47

810

pSPP

SPN

*D47

35.

1VA

K

C47

710

p

*D47

2N

CA

K

C11

10.

047u

R11

3

10k

C11

20.

047u

Q111

BC

E

R11

110

0k

D11

3A

K

R11

210

0k

C11

3

K0.

68u

R11

4

47k

+3.0V

F3013.0A DCP

DCM

C30

1

NC

4VOUT2

1ADJ

3INPUT

2 VOUT1

*C30

6

100u

R32

2

F10

0

R32

1

F14

0

*D36

1

NC

A

K

CHARGE-

CHARGE+

C611 0.1u

+3.0V

RA1511k

1

2 3

4

R151

100k

470k

C15

2

R15

2

0.01

u

C12

4N

C

C12

310

p

GND

GAP

R37

1

5.6

R37

2

5.6

C34

20.

1u

R50

52.

2k

R50

6N

C

VREF

VBG

+6.5V

DCDC_IC

NC1 ON/*OFF

2VSS

3 VOUT

5

VIN

4

EXT

C30

4N

C

L301NC

Q301NC

R30

4

NC

R30

5

NC

C30

5N

C

+6.5V

JJ301 NC

C30

3

NC

VBAT

+3.0V

R30

7

NC

R605 3.3kR606 3.3k

R30

2N

C

R30

1N

C

P101 22

DCDC_OUT

64K EEPROM1

A02

A13

A24

GND5

SDA

6SCL

7WP

8VCC

R136NC

CHG+2

CHG-2*D36

3

NC

A

K

GND

C32

11u

Q161

BC

E

C50210u

C505

10u

C51

110

u

C34

133

0u

ZA1 NC

1 2

6

79

11

3 4 5

810

12

C47

2N

C

C47

5N

C

C47

3N

C

C53

010

p

C30

7

NC

C52

210

p

C34

310

p

C52

3N

C

C524 NC

C52

5N

C

R17

6

100

R172 100k

C175 1000p

R160

910

C17

80.

022u

C16

110

u

C17

610

u

C173

K0.22u

R17

7

NC

Q171BC

E

R17

1

22

C174 NC

R17

5

560 C

164

NC

R181

0

C17

1

0.02

2u

C16

710

00p

Q601NC

BE

C

*C601 0.1u

*R60

1

NC

+3.0V

*R60

4

10k

R603

NC

R602

NC

R50

3N

C

8M FLASH1

*CE2

SO6

SCK

7*HOLD

3*WP

8VDD

4VSS

5SI

C30

8N

CC

302

10p

C47

610

p

C47

910

p

C32

210

p

C12

5

NC

C12

6

10p

*C35

2

0.1u

*C35

1

1u

C50

912

p VDDC

D13

3A

K

D15

3N

CA

K

X501

13.824M

*L361

220nH

*L371

220nH

L362

NC

L372

NC

*L47

622

0nH

L474

NC

+6.5VVBAT

C50

3

10u

+3.0V

C504 1uC521 1u

C33

1

NC

C33

2N

C

2.7V2

VIN1

VOUT3

NC

4VSS

R3350

+3.0V

*R60

7

0

R33

3

NC

D33

1

NC

*R33

2

68k

*R33

1

47k

R33

4

47k

1GPIO[20]

2GPIO[21]

23M

IP

3GPIO[22]

4GPIO[23]

5GPIO[24]

6GPIO[25]

7GPIO[26]

8VDDC2

24H

SM

IN

25H

SM

IP

26M

PW

R

27H

SS

PO

UT

P

28LO

UT

29S

PO

UT

N

30V

CC

PA

81G

PIO

[13]

82G

PIO

[14]

83G

PIO

[15]

84G

PIO

[16]

85G

PIO

[17]

86V

DD

IO2

87G

PIO

[18]

88G

PIO

[19]

89

GND9

COREOUT

10VBAT

11DOUBCAPN1

12DOUBCAPN

13DOUBCAPP

14DOUBCAPP1

15DOUBOUT

16DCIN0/LIN0

17DCIN1

18DCIN2

19DCIN3/LIN1

20VREF

21VCCA

22MIN

31S

PO

UT

P

32P

WM

1

33P

WM

0

34D

CIN

S

35X

OU

T

36X

IN

37V

BA

T_A

PU

38V

DD

_AP

U

39V

CC

_IF

40V

DD

_IF

41V

CC

_FE

42A

NT

43T

RS

W_n

44T

Xn

67G

PIO

[0]/S

CL_

IIC68

GP

IO[1

]/SD

A_I

IC69

GP

IO[2

]70

GP

IO[3

]71

GP

IO[4

]72

GP

IO[5

]73

GP

IO[6

]74

GP

IO[7

]75

GP

IO[8

]76

VD

DIO

177

GP

IO[9

]78

GP

IO[1

0]79

GP

IO[1

1]80

GP

IO[1

2]

L501100n

REFERENCE

7XX : FOR DK

3XX : POWER, CHARGE

5XX : BBIC6XX : FLASH, EEPROM, KEY, LCD

4XX : MIC, SP

1XX : TEL LINE

8XX : RF

DC/DC CONVERTOR

(YELLOW)

(GREEN)

IC302

IC301

IC611

*IC601

*IC331

*IC501

(1)(2)(3)(4)

(5)

(6)

1.2V

3.0V

3.0V

Rx Tx

Caller ID

Bell

68


14.3. Schematic Diagram (Base Unit_Operation)

KX-TG4021/4022/4023 SCHEMATIC DIAGRAM (Base Unit_Operation)

NC: No Components

ANS11 2

STOP1 2

ERASE1 2

MSG21 2

MSG11 2

RPT1 2

SKIP1 2

UP1 2

DOWN1 2

LOCAT/INT1 2

LED902AKLED901AK

MEG_LED

KEYIN2

KEYS_BANS_LED

KEYS_E

KEYS_C

KEYIN1

2APVCC

KEYIN3

KEYS_D

69


Memo

70


14.4. Schematic Diagram (Handset_Main)

BATT+

BATT-

0.1R45

BATTERY

+1.8V

GND

1kR66

C45K0.1u

C121NC

+1.8V

GND

1uC4

7

GND

GND GNDGND

GND

GND

GND

GNDGND

GND

GND

C44K0.1u

GND

1.2kR7

100

R8

CP+4.0V

+1.8V

k0.1

uC

40

RF_RXp

PONPSEL

VDD_PADRV

TXpTXn

TXON

RXONRF_RXn

CP+3.0V

0R215

Q7

Q2

Q4

BATTERY

1uC50

1uC49

CP+4.0V

SO

FT

_C

12

SO

FT

_B

12

SO

FT

_A

12

SH

AR

P

12

AS

T

12

GND

8

12

TA

LK

12

4

12

7

12

3

12

9

12

1

12

6

12

2

12

0

12

5

12

S11 2

100

R63

F56

kR

203

10k

R64

BATTERY

GND

NCR2

C43

10p

C46

10p

NC

C39

GND

CP+3.0V

Q9

10R20

NCR6

*LE

D3

*LE

D2

*LE

D1

*LED12

D11MR330

1uC332

Q11

Q12

GND

GND

27kR332

BATTERY

27kR331

GND

GND

1kRA

1

1 2 3 45678

GND

K10uC53

K10uC52

D10pC54

GNDD10pC55

K1uC51

820R27

K10

u

C12

C17

D10p

K0.

1uC

11

K0.

1uC

13

3.3kRA4

VREFmC18D10p

D10

pC

96

820R28

D10

pC

97

VREFmNC

C48

GND

0R225

K2.2uC10

6.3V330u

CP2C2

GND

RE2RF-SHIELD

12

3

45

6

GND

UTXURXGND

JTAG

BAT

CP4.0VCP3.0V

POWER

CKM

1.8V

CHG(+)

CHG(-)

STM

NC

C3

NC

C15

0

220RA61

1

2 3

4

6.3V330u

C1CP1

1uC331

C18

2

3p

*R2480

GND

NCR4

GND

NC

R400

GNDGND

NCC400

NC

D400

NC

R40

5

Q400NC

GND

Q401NC

+1.8V

NCR401

NCR404

NC

R40

2

NCR403

NCR406

NC

R407

LEF

T12

DO

WN

12

RIG

HT

12

UP

12

R

12S

P

12

L47

L46

330*RA30

12345 6 7 8

1.5k

R30

1k

R3

*LE

D22

*LE

D23

1kR23

100R31C

147

NC

120*RA32

12345 6 7 8

Power_adj

330*RA31

1 234

K1u

C5

D7

NCC340

J39pC341

NCC342

GND GND GND

NC

C38

NC

*C13

8

NC

*C13

9

*LE

D5

*LE

D7

*LE

D4

*LE

D6

*LE

D8

*LE

D9

*X1

10.368M13

2

*LE

D21

NC

NC

NC

NC*R249

1V

SS

_LN

A1

2R

F_R

Xp

21CIDINp/VREFp

3R

F_R

Xn

4V

SS

_LN

A2

5R

FP

16

RF

P0

7R

EF

_RE

S8

AV

S_X

TA

L

22RINGp/P3_7

23RINGn/P3_6

24RINGOUT/RINGING/P3_5

25PARADET/P3_4

26ADC0/P3_3

27ADC1/INT0/P1_0

28NTC/ADC2

41C

P_C

2y

42C

P_V

OU

T1/

LED

1

43C

P_V

OU

T2/

LED

2

44P

ON

/P1_

6

45V

DD

1

46P

2_7/

BX

TA

L

81

GND

9X

TA

L210

XT

AL1

11A

VD

_XT

AL

12R

F_S

UP

PLY

113

LDO

_CT

RL

14A

VD

15LS

Rn

16LS

Rp

17V

RE

Fm

18M

ICh

19C

IDO

UT/

MIC

n20

CID

INn/

MIC

p

29SOCp

30SOCn

31CHARGE_CTRL

32P1_7/CHARGE

33PAOUTp/P3_1

34VDDPA

35PAOUTn/P3_0

36VBAT1

37CP_C1x

38CP_C2x

39CP_C1y

40VBAT2

47P

1_5/

INT

5/R

DI/V

DD

E

48P

1_4/

INT

4/T

DO

D

49P

1_3/

INT

3/S

IO

50P

1_2/

INT

2/S

K

51P

1_1/

INT

1/LE

52P

2_6/

WT

F_I

N

53P

0_7/

SP

I_D

I

54P

0_6/

SP

I_D

O

55P

0_5/

SP

I_C

LK

56P

0_4/

SP

I_E

N

57P

0_3/

SC

L2

58P

0_2/

SD

A2

59P

0_1/

UR

X

60P

0_0/

UT

X

61 RSTn62 JTAG63 P2_5/PCM_FSC/SF64 P2_4/SCL1/PCM_DO/DP365 P2_3/SDA1/PCM_DI/DP266 P2_2/PCM_CLK/CLK10067 P2_1/ECZ2/PWM1/LED468 P2_0/ECZ1/PWM0/LED369 VDD270 LDORF_CTRL71 RF_SUPPLY272 RFP0n73 RFP4

76 VSS_PADR1

79 VSS_PADR2

77 RF_TXp

80 RFP2

75 VDD_PADR

78 RF_TXn

74 RFP3

F1

5.6n

J56pC35

LDO

_CT

RL

COL0

CHARGE_CTRLCHARGE

UTX

COL0COL1COL2COL3COL4

RO

W3

RO

W2

RO

W1

CH

AR

GE

CH

AR

GE

_CT

RL

COL4

KE

Y_L

ED

BELL_LED_AURX

LDO

_CT

RL

LCD_RESET

LCD

_CD

LCD

_SC

LLC

D_S

DA

JTAG

SO

Cp

LCD_CSB

RO

W0

SO

Cn

BE

LL_L

ED

_A

CO

L5

COL1

COL2

COL5

RO

W0

COL3

RO

W1

RO

W3

RO

W2

SOCpSOCn

KE

Y_L

ED

CHARGETerminal

BATTERY

BELL LED(Amber)

TO RF BLOCK

[RU][EX /FX]

To PA

(MAX500mA

KEY B/L LCD B/L

*IC1

(1)(2)(3)

(4)

(6)(5)

(8)

(9)(10

(11(12)

(13(14)

(15

(7)

Charge Current

3.0V 4.0V

1.8V

0.75V

0V

250mVp-p

TX _RF

RX _RF

NC: No Components

71


BATTERY

GND

GND

GND

CP+3.0V

CP+3.0V

K1uC188

NC

C70

GND

D21

D22

NC

C71

GNDD10pC113

D3NC

GND

D4NC

GND

GND

NC

C72

GND

NC

C73

GND

3.3n

C81

4

220

R806

GND TXp

47R805GND

GND

VDD_PADRV

TXON

GND GND

100n

C80

8

GND

PON

GND

BATTERY

GND

1PSET 2VCCS 3

PI 4PIX7 PSEL

8 POX

9 PO

10 VCC

11

GND

5PRAMP6 PAON

GNDTXn

PSEL

GND

GND

GNDGNDGND

RF_RXp

RXON

GND

GNDGND

RF_RXn

220

R807

NC

C83

7GND

VS

SC

N5

10

GN

DC

N5

1

RE

SE

TB

CN

54

V0

CN

511

VD

DC

N5

8

SC

LKC

N5

6

LCD

_CS

BC

N5

3

A0

CN

55

OP

T_P

WR

CN

52

VD

DA

CN

59

SID

CN

57

GN

DC

N5

12

k1000pC152

DA8011

23

27n

L801

AP1MIC1

2

TP_ANT1

3p

C86

1

C82

0

NC

100p

*C10

33.

3k*R

53

NC

*C10

6

10k

*R54

GND

100p

*C10

5

GND

GND470

*R51

GND GNDGND GND

NC

*C187

NC

*C186

1kR55

10k

*R50

NC

*C17

5

NC

*R57

8

GND

GND

GND

3.6n

L802

3.6n

L803

3.3p

C80

6

1.6p

C81

01.

6p

C81

3

3.3p

C80

5

GND

NC

R80

8

VREFm

C74D10pC75

D10pVREFm

82R73

82R74

D13

D14

10kRA40

1 2 3 45678

K0.1uC172

RCV+

RCV-

MIC-

MIC+

1*C

200

1*C

201

1*C

203

820k

*R23

143

0k*R

232

0.1*C204

NC

*R233

1kRA800

12 3

4

NC

*R23

6

NC*C20

6

CN51

13C

AP

1+CN

5114

VS

SCN

5115

/RE

S

CN51

7V

0

CN51

9V

OU

T

CN51

4S

ICN

515

SC

L

CN51

10C

AP

2-

CN51

8V

R

CN51

3/C

S

CN51

11C

AP

2+

CN51

1G

ND

CN51

16G

ND

CN51

12C

AP

1-

CN51

2R

S

CN51

6V

DD

Q880NC

GND

GND GND

Power_adj

NC

C88

1

NC

R88

0

2p

C80

4

2p

C80

2

1.5p

C803

GNDGND

GNDGND

RECEIVER

1 +

2 -

SP-PHONE_SPEAKER

1+

2-

J33p

*C10

7

10p

C80

9

10p

C81

1

10p

C812

10p

C81

9

10p

C82

2

10p

C82

5

10p

C827

10p

C86

0N

CC

863

NC

C86

4

NC

C88

0

10p

*C10

4

NC

*C58

0

1k*R

52

Q10NC

NCR36

NCC30 NC

R37

BATTERY

GND

1.2k

*R80

1

100

*R80

2

1p*C834

1A0

2A1

3A2

4GND

5SDA

6SCL

7WP

8VCC

4p

*C826

LCD_SDALCD_SCLLCD_CDLCD_RESETLCD_CSB

LSRp

LSRn

MICp

MICn

to LCD UNIT (Monochrome 1.8inc FullDot/for TGA651)

LSRp

LSRn

LSRp

Pre-matching

W 0.15mmL 3.0mm x21st layer

W 0.15mmL 20+/-2mm3rd layer


Balun

BPF W 0.15mmL 5.0mm1st layer



W 0.125mmL 7.6mmGap 0.125mm1st layer

to LCD UNIT (Monochrome 1.4inc 3Line/for TGA250)

R801:220kR808:NC

*IC3

IC801

(1)(2)(3)

(4)

(6)(5)

(8)

(9)(10)

(11)(12)

(13)(14)

(15)

(7)

KX-TGA403 SCHEMATIC DIAGRAM (Handset_Main)

RX_RF

TX_RF

TX _AF

RX-AF (Handset)

Sp-phone RX/Beep

72


14.5. Schematic Diagram (Charger Unit)

J1

2

1

TP3

G

TP2

TP1

TP4

R1 12F1

SCHEMATIC DIAGRAM (Charger Unit)

73


15 Printed Circuit Board15.1. Circuit Board (Base Unit_Main)15.1.1. Component View

CL2

C477

C478

SP

PS

PN

C530

C321

DC

DC

_OU

T

C322

C476

FC

T

RS

TN

ST

M/C

KM

/P15

C343

C511

C510

C165

C163

C351

CH

AR

GE

+C

HA

RG

E-C

514C

181

C171

C121C

122

C152

C125

C112

C352

AN

T2

CL1

R502

RT

CK

R322

R321

R302

R605

R606

R612

R335

R602

R603

R112

R178

VC

CA

VR

EF

R166

R164

R161

R136

VD

DC

R151

R152

R115

R121

L371

L1TL1R

L476

L474

L372

L362

IC601

IC302

IC611

RA

151

RA

504

D361

D473

D472

D153 D

133

D363

Q161

Q601

C142

C513

C167

C512

C186

C184

C601C479

C307

C301

C332

C521

C133

C123C472

C473

C475

C120C124

C151C525

C524

C611

C115

C168

C126

C661

R165

F301 DC

PD

CM

R512

R507

R307

R607

R601

R304 R305R301

R505

R506

R334

R604

R181

R162

R503

R167

R163

R122

L361

RA502

D142

D143

CH

G+

2C

HG

-2

KX-TG4021/4022/4023 CIRCUIT BOARD (Base Unit_Main (Component View))

B

+6.5V

RT

CK

E4

4

35

81

+3.0V

VB

AT

TM

S

TC

K

TD

I

TD

O

VB

G

GN

DU

TX

UR

X

3.0A

AN

T1

PN

LB1712Z

PbF

CH

G

SP

DC

RE

DR

ED

RE

D

WH

TB

LK

BLK

YLW

GR

N

GND

URX

VDDC

+3.0V

for JIG UTX

STM/CKM

VBAT

74


15.1.2. Bottom View

KX-TG4021/4022/4023 CIRCUIT BOARD (Base Unit_Main (Bottom View))

KX

-TG

65X

X/7

5XX

/40X

X

CH

G

SP

AN

T1

AN

T2

1 1

WB

X01

B

TE

LD

C

RE

DR

ED

RE

D

WH

TB

LK

BLK

E

YLW

GR

N PN

LB17

12ZP

bF

C17

8C

175

C11

1

C34

1

JJ30

1

C30

8C

517

C82

6C

863

C82

7

C82

2C

892

C30

2

C89

4

C33

1

C52

3

C50

2

C50

1

C50

7C

522

C80

6

C813

C810

C50

4

C52

0

R11

4R

372

R17

2R

177

R33

2

KE

YS

_E

110

KE

YS

_D KE

YS

_CKE

YIN

3

KE

YIN

2

KE

YIN

1 NCA

NS

_LE

D

MS

G_L

ED

2AP

VC

C

ZA

1R

331

IC50

1

IC33

1S

W1

Q14

1Q

143

Q11

1Q

651

C176

C113

C174

C161

C164

C173

C509C508

C812

C306

C515

C304

C519

C305

C303

C518

C516

C805

C859

C896

C342

C503

C660

C659

C658

C656

C655

C654

C653

C652

C651

C172

C506

C505C185

X501

R160

R111

R113

R175 R176

R171

R509R806R891

R144

R142

R892

R807

R333

R652

R651

R501

R371

L102

L101

L809

L301

IC301

SA101

SA103

C893

RA501

D101

D113

D331

Q171

Q142

Q301

C10

1

C10

2

C82

5 C89

1

C13

2

C82

0

C81

1

C89

5

P10

1

HA

K_C

L1

R14

1

R13

3 R14

5

R13

1D

A80

1

DA

802

75


15.2. Circuit Board (Base Unit_Operation)

KX-TG4021/4022/4023 CIRCUIT BOARD (Base Unit_Operation (Component View))

A

PNLB1753Z

KX-TG4021/31HPbF

LED902

LED901

STOP

DOWN

RPT

MSG1

MSG3

MSG2

MSG4

LOCAT/INT

SKIP

ANS1 UPERASE

76


Memo

77


15.3. Circuit Board (Handset_Main)15.3.1. Component View

KX-TGA403 CIRCUIT BOARD (Handset_Main (Component View))

A

PbF

C44

C880

C811

C813

C72

C203

C105

C206

C201

C175 C70C152

C71

C200

C107

C106

C103

C104

C73

C864C863C814

C834

C802

C804

C43

C837

C48 C40C54

C52C53

C51

C55

C39 C30

C10

C400

C340

C341

C342

C332

C331

C147

C113C5

JTAGSTM

URXUTX

CHG(+)

MIC+ MIC-

CHG(-)

BATT-BATT+

BAT

MIC-

RCV-

E

1 4

8 5

MIC+

RCV+

R578

R50R53R236

R54

R231

R801

R802

R805 R880

R808

R66R63

R225

R405

R203

R807

R27R400R402

R248

R249

21

1

R23R37R36

R20CLK

1.8V

R7R30

F1

R2

R332

R331

R330

R3R8

R4

L802

IC3

TP_ANT1

RA800

RA4

RA40

CP3.0V

CP4.0V

D22D21

D13

RED

BLK

RED

BLK

D14

D400

D7

D3 D4

Q401

POWER

Q400

Q11

Q12

GND

C580

C187

C186

C204

C827

C881

C819

C45

C46

C825

C809

C810 C

861

C808

C812

C806

C138

C139

C803

C805

C47

C822

C826

C820

C860

C182

C49

C50

C188

C12

C13

C11

C96C

18

C17

C97

C38

C35

C121

C150

C1

C2

C172

C75

C74

C3

X1

MIC

R232

R55

SP

EA

KE

R

R233

R806

R64

R28

R403R

404

R406

R407

R401

R215

R45

R74

R31

R6

R73

L801

L803

L46L47

IC801

IC1

RA

32

RA

1

RA

61

RA

31R

A30

DA

801

D1

Q880

Q2

Q10

Q7

Q4

Q9

RECEIVER

PNLB1734YKX-TGA650XXKX-TGA651XXKX-TGA250XXKX-TGA251XXKX-TGA403XX


TGA650XXTGA651XX

RCV-

RCV+

SP+

SP-

X_CLK(10.368MHZ)

GNDBATBATT-

UTXURX

JIGBATT+

CHG (+) CHG (-)

78


15.3.2. Bottom View

KX-TGA403 CIRCUIT BOARD (Handset_Main (Bottom View))

1 2

PbF

PNLB1734Y

12 1

3

SP RDOWN

LEFT

SOFT_A SOFT_B

R52

R51


TGA650XXTGA651XX

KX-TGA650XXKX-TGA651XXKX-TGA250XXKX-TGA251XXKX-TGA403XX

CN51

CN5

SOFT_C

RIGHT

TALKUP

S1

4 5 6

7

MIC

8 9

LED

4LE

D7

LED12

LED

21

LED

22

LED

23

LED

1

LED

2

LED

3

LED8 LED6

LED

9LE

D5

0 #

A

79


15.4. Circuit Board (Charger Unit)15.4.1. Component View

15.4.2. Bottom View

J1R1

A

PQ

UP

11532YPb

F

PN

LP1029Y

ACIRCUIT BOARD (Charger unit (Component View))

TP

4

TP

3

1

2

J1

A

F1Pb

FP

NLP

1029YA

PQ

UP

11532Y

CIRCUIT BOARD (Charger unit (Bottom View))

TP4 (GND)

TP3

80


16 Exploded View and Replacement Parts List16.1. Cabinet and Electrical Parts (Base Unit)

Note:(*1) The SPACERs (No.14) are cut from the excess parts of SPACER (No.108) of Cabinet and Electrical Parts (Handset)(P.81).

A

A

A

PCB2

13

13

7

12

1

E1

14(*1)

4

5

6

2

3

14(*1)

10

11

9

8

15

Ref.No. Figure

A2.6 x 8mm

16

PCB1

81


16.2. Cabinet and Electrical Parts (Handset)

Note:(*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.47).(*2) The rechargeable Ni-MH battery HHR-4DPA or HHR-4MRT is available through sales route of Panasonic.(*3) Attach the SPACER (No. 119) to the exact location described above.

102103

104 E103

E105

E102

E101(*1)

111

115116

105106

110

113

B

(*2)

118 120

119 (*3)

101109

E104

112

E106

B

E107

MIC100

PCB100

108

B117

114

107

Spacer (No.119)

Battery cover

Put it in the center.

Stick it betweenribs.

Ref.No.

2 8 mmB

Figure

82


16.3. Cabinet and Electrical Parts (Charger Unit)

B

200

200-1

200-3

200-4

200-2

B

PCB200

Ref.No.

B

Figure

83


16.4. AccessoriesA2 A3A1

84


16.5. Replacement Parts List1. RTL (Retention Time Limited)

Note:The “RTL” marking indicates that its Retention Time isLimited.When production is discontinued, this item willcontinue to be available only for a specific period oftime.This period of time depends on the type of item, andthe local laws governing parts and product retention.At the end of this period, the item will no longer beavailable.

2. Important safety noticeComponents identified by the mark indicates special characteristics important for safety. When replacing any of these components, only use specified manufacture's parts.

3. The S mark means the part is one of some identical parts. For that reason, it may be different from the installed part.

4. ISO code (Example: ABS-94HB) of the remarks column shows quality of the material and a flame resisting grade about plastics.

5. RESISTORS & CAPACITORSUnless otherwise specified;All resistors are in ohms (Ω) k=1000Ω, M=1000kΩAll capacitors are in MICRO FARADS (µF) p=µµF*Type & Wattage of Resistor

16.5.1. Base Unit16.5.1.1. Cabinet and Electrical Parts

16.5.1.2. Main P.C. Board PartsNote:

(*1) When replacing IC611 or X501, make the adjustmentusing PNZZTG4021ME. Refer to How to download thedata (P.54) of Things to Do after Replacing IC or X'tal.

Safety Ref. No.

Part No. Part Name & Description Remarks

1 PNKM1132W3 CABINET BODY PS-HB2 K2ECYZ000001 JACK, DC 3 PQJJ1T039S JACK, MODULAR 4 L0AA02A00087 SPEAKER 5 PQHG10729Z RUBBER PARTS, SPEAKER6 PQHR11313Z GUIDE, SPEAKER ABS-HB7 PNKE1056Z1 CASE, CHARGE TERMINAL PS-HB8 PNJT1047Z CHARGE TERMINAL 9 PNBC1307Z1 BUTTON, NAVIGATOR KEY PS-HB10 PNHR1259Z GUIDE, BUTTON HOLDER PS-HB11 PNBC1308Z1 BUTTON, MESSAGE AS-HB12 PNJK1079Z KEYBOARD SWITCH

13 PNLA1030Z ANTENNA 14 PNYE1027Z SPACER, ANTENNA 15 PNKF1099Y1 CABINET COVER PS-HB16 PQHA10023Z RUBBER PARTS, FOOT

CUSHION

Safety Ref. No.


PCB1 PNWP14021MEH MAIN P.C.BOARD ASS'Y(RTL)

(ICs)IC302 C0CBAYG00016 IC SIC331 C0EBE0000124 IC IC501 C2HBCY000064 IC(BBIC) IC601 PNWI24021MEH IC(FLASH) IC611 PNWI14021MEH IC(EEPROM) (*1)

(TRANSISTORS)Q111 2SC6054JSL TRANSISTOR(SI) Q141 B1ACGP000008 TRANSISTOR(SI) Q142 PQVTBF822T7 TRANSISTOR(SI) Q161 2SD0874AS TRANSISTOR(SI) Q171 2SC6054JSL TRANSISTOR(SI) Q651 B1GFCFEN0011 TRANSISTOR(SI) S

(DIODES)D101 PQVDMD5S DIODE(SI) D113 MA111 DIODE(SI) SD133 MA111 DIODE(SI) SD143 MANV250GEL DIODE(SI) D473 MAZ805100L DIODE(SI) DA801 B0DDCD000001 DIODE(SI) DA802 B0DDCD000001 DIODE(SI)

(COILS)L101 PQLQXF330K COIL SL102 PQLQXF330K COIL SL361 G1CR22J00006 COIL L371 G1CR22J00006 COIL L476 G1CR22J00006 COIL L501 G1CR10J00010 COIL L809 G1C7N5JA0044 COIL

(RESISTOR ARRAYS) RA151 D1H410220001 RESISTOR ARRAY RA501 EXB28V330 RESISTOR ARRAY RA502 EXB28V103 RESISTOR ARRAY RA504 D1H468020001 RESISTOR ARRAY

(VARISTOR) SA101 J0LF00000048 VARISTOR (SURGE

ABSORBER)

(RESISTORS)R111 PQ4R10XJ104 100k SR112 PQ4R10XJ104 100k SR113 ERJ3GEYJ103 10k SR114 ERJ3GEYJ473 47k SR115 ERJ12YJ273U 27k R121 ERJ3GEYJ394 390k SR122 ERJ3GEYJ394 390k SR131 PQ4R18XJ106 10M SR133 ERJ3GEYJ334 330k SR141 ERJ3GEYJ104 100k SR142 PQ4R18XJ272 2.7k SR145 ERJ2GEJ222 2.2k SR151 ERJ2GEJ104 100k SR152 ERJ2GEJ474X 470k SR160 ERJ3GEYJ911 910 SR161 ERJ3GEYJ104 100k SR162 ERJ3GEYJ273 27k SR163 ERJ12YJ120 12 R164 ERJ3GEYJ272 2.7k S

Safety Ref. No.


85


16.5.1.3. Operational P.C. Board Parts

16.5.2. Handset16.5.2.1. Cabinet and Electrical Parts

R165 ERJ3GEYJ273 27k SR167 ERJ12YJ270 27 R171 ERJ2GEJ220 22 SR172 ERJ2GEJ104 100k SR175 ERJ2GEJ561 560 SR176 ERJ2GEJ101 100 SR178 ERJ2GEJ102 1k SR181 ERJ2GE0R00 0 SR321 ERJ2RKF1400 140 R322 ERJ2RKF1000 100 R331 ERJ3EKF4702 47k R332 ERJ3EKF6802 68k R334 ERJ2GEJ473 47k SR335 ERJ2GE0R00 0 SR371 ERJ1TYJ5R6U 5.6 R372 ERJ1TYJ5R6U 5.6 R501 ERJ3GEYJ100 10 SR502 ERJ2GEJ330 33 SR505 ERJ2GEJ222 2.2k SR512 ERJ2GEJ102 1k SR604 ERJ2GEJ103 10k SR605 ERJ2GEJ332 3.3k SR606 ERJ2GEJ332 3.3k SR607 ERJ2GE0R00 0 SR612 ERJ2GEJ103 10k SR651 ERJ3GEYJ681 680 SR652 ERJ3GEYJ681 680 SR806 ERJ2GEJ471 470 SR807 ERJ2GEJ471 470 SR891 ERJ2GEJ471 470 SR892 ERJ2GEJ471 470 S

(CAPACITORS)C101 F1K2H681A008 680p C102 F1K2H681A008 680p C111 F1J2A473A024 0.047 C112 F1J2A473A024 0.047 C113 PQCUV1A684KB 0.68 C115 F1L2E2240004 0.22C120 ECUE1H102KBQ 0.001 C121 F1K2H681A008 680p C122 F1K2H681A008 680p C123 ECUE1H100DCQ 10p C126 ECUE1H100DCQ 10p C132 ECUV1H103KBV 0.01 C142 ECUV1H103KBV 0.01 C151 ECUE1H100DCQ 10p C152 ECUE1C103KBQ 0.01 C161 F2G1H1000009 10 C167 ECUV1H102KBV 0.001 C171 ECUV1C223KBV 0.022 C173 ECUV1A224KBV 0.22 C175 ECUE1H102KBQ 0.001 C176 PQCUV0J106KB 10 C178 ECUE1C223KBQ 0.022 C184 ECUV1A105KBV 1 C186 ECUE1H100DCQ 10p C302 ECUE1H100DCQ 10p C306 F2A1C1010119 100 C321 ECUV1A105KBV 1 C322 ECUE1H100DCQ 10p C341 F2A1A3310040 330 C342 ECUV1C104KBV 0.1 C343 ECUE1H100DCQ 10p C351 ECUV1C105KBV 1 C352 ECUV1C104KBV 0.1 C476 ECUE1H100DCQ 10p C477 ECUE1H100DCQ 10p C478 ECUE1H100DCQ 10p C479 ECUE1H100DCQ 10p C501 ECUE1A104KBQ 0.1 C502 ECJ1VB0G106M 10 C503 ECJ1VB0G106M 10 C504 ECUE0J105KBQ 1

Safety Ref. No.


C505 ECJ1VB0G106M 10 C506 ECUV1A105KBV 1 C507 ECUV1A225KB 2.2 C508 ECUE1H100DCQ 10p C509 ECUE1H120JCQ 12p C510 ECUV1A105KBV 1 C511 ECJ1VB0G106M 10 C512 ECUE1A104KBQ 0.1 C513 ECUV1A225KB 2.2 C514 ECUE1A104KBQ 0.1 C515 ECUV1A105KBV 1 C516 ECUE1A104KBQ 0.1 C517 ECUE1A104KBQ 0.1 C518 ECUE1A104KBQ 0.1 C519 ECUE1A104KBQ 0.1 C520 ECUE1A104KBQ 0.1 C521 ECUE0J105KBQ 1 C522 ECUE1H100DCQ 10p C530 ECUE1H100DCQ 10p C601 ECUE1A104KBQ 0.1 C611 ECUE1A104KBQ 0.1 C805 F1G1H2R7A480 2.7p C806 F1G1H2R7A480 2.7p C810 F1G1H2R4A480 2.4p C811 F1G1H100A723 10p C812 F1G1HR90A480 0.9p C813 F1G1H2R0A480 2p C820 F1G1H1R5A480 1.5p C822 F1G1H100A723 10p C825 F1G1H100A723 10p C826 F1G1H100A723 10p C827 F1G1H100A723 10p C859 F1G1H2R2A480 2.2p C863 F1G1H1R5A480 1.5p C891 F1G1H5R0A480 5p C892 F1G1H5R0A480 5p C893 F1G1H3R0A480 3p C894 F1G1H2R2A480 2.2p C895 F1G1H1R2A480 1.2p C896 F1G1H2R2A480 2.2p

(OTHERS)E1 WBX10SH-3.5G LEAD WIRE, PARALLEL

WIRE

P101 D4DAY220A022 THERMISTOR (POSISTOR) SF301 K5H302Y00003 FUSE X501 H0J138500011 CRYSTAL OSCILLATOR (*1)

Safety Ref. No.


PCB2 PNWP2TG4031H OPERATIONAL P.C.BOARDASS'Y (RTL)

(DIODES)LED901 LNJ237W82RA LED SLED902 LNJ237W82RA LED S

Safety Ref. No.


101 PNGP1087Y5 PANEL, LCD PMMA-HB102 PNYE1026Z TAPE, DOUBLESIDED 103 PNKM1123Y6 CABINET BODY PS-HB104 PNHS1072Z SPACER, RECEIVER NET 105 PQHS10467Z COVER, SPEAKER NET 106 L0AD02A00043 RECEIVER 107 PQHG10729Z RUBBER PARTS, RECEIVER 108 PNYE1027Z SPACER, CUSHION LCD 109 PNBC1003Y3 BUTTON, VOLUME KEY ABS-HB

Safety Ref. No.


86


16.5.2.2. Main P.C. Board PartsNote:

(*1) Reconfirm the model No. written on the handset's nameplate when replacing PCB100. Because the model No. ofthe optional handset may differ from the included handset.(*2) When replacing IC3 or X1, make the adjustmentusing PNZZTG4021ME. Refer to Handset (P.55) of Thingsto Do after Replacing IC or X'tal.(*3) When replacing the handset LCD, See How to Replace the Handset LCD (P.47).(*4) When removing E106, use special tools (ex. Hot airdisordering tool).

110 PNJK1071V KEYBOARD SWITCH 111 PNHX1165Z COVER, LCD SHEET 112 PNJT1027Z CHARGE TERMINAL (L) 113 PNJT1026Z CHARGE TERMINAL (R) 114 PQHR11315Z GUIDE, SPEAKER ABS-HB115 L0AA02A00095 SPEAKER 116 PQHS10784Y SPACER, SPEAKER NET 117 PQJC10056W BATTERY TERMINAL 118 PNKF1093Z1 CABINET COVER ABS-HB119 PNHS1079Z SPACER, BATTERY 120 PNKK1038Y1 LID, BATTERY ABS-HB

Safety Ref. No.


PCB100 PNWPGA403MER MAIN P.C.BOARD ASS'Y(RTL) (*1)

(ICs)IC1 C1CB00003361 IC (BBIC (FLASH)) IC3 PNWIGA403MER IC (EEPROM) (*2) IC801 C1CB00001842 IC

(TRANSISTORS)Q2 B1ADGE000004 TRANSISTOR(SI) Q4 B1ADGE000004 TRANSISTOR(SI) Q7 UN9219J TRANSISTOR(SI) SQ9 2SC6054JSL TRANSISTOR(SI) Q11 B1ADCF000161 TRANSISTOR(SI) Q12 B1ADCF000161 TRANSISTOR(SI)

(DIODES)D1 MA2YD2120L DIODE(SI) D7 MA2ZD0200L DIODE(SI) D13 MA8043M DIODE(SI) SD14 MA8043M DIODE(SI) SD21 MA8043M DIODE(SI) SD22 MA8043M DIODE(SI) SDA801 B0DDCD000001 DIODE(SI)

(LEDS)LED4 B3ACB0000190 LED LED5 B3ACB0000190 LED LED6 B3ACB0000190 LED LED7 B3ACB0000190 LED LED8 B3ACB0000190 LED LED9 B3ACB0000190 LED LED21 B3ACB0000216 LED LED22 B3ACB0000216 LED LED23 B3ACB0000216 LED

(COILS)F1 PQLQR2M5N6K COIL SL801 G1C27NJ00010 COIL L802 G1C3N6ZA0063 COIL L803 G1C3N6ZA0063 COIL

(RESISTOR ARRAYS)RA1 D1H810240004 RESISTOR ARRAY SRA4 D1H433220001 RESISTOR ARRAY RA30 D1H83314A013 RESISTOR ARRAY SRA31 D1H433120001 RESISTOR ARRAY RA32 EXB28V121JX RESISTOR ARRAY RA40 EXB28V103 RESISTOR ARRAY RA61 D1H422120001 RESISTOR ARRAY

Safety Ref. No.


RA800 D1H410220001 RESISTOR ARRAY (IC FILTERS)

L46 J0JDC0000045 IC FILTER L47 J0JDC0000045 IC FILTER

(RESISTORS)R3 ERJ2GEJ102 1k SR7 ERJ2GEJ122 1.2k SR8 ERJ2GEJ101 100 SR20 ERJ2GEJ100 10 SR23 ERJ2GEJ102 1k SR27 ERJ2GEJ821 820 SR28 ERJ2GEJ821 820 SR30 ERJ3GEYJ152 1.5k SR31 ERJ2GEJ101 100 SR45 ERJ6RSJR10V 0.1 R50 ERJ2GEJ103 10k SR51 ERJ2GEJ471 470 SR52 ERJ2GEJ102 1k SR53 ERJ2GEJ332 3.3k SR54 ERJ2GEJ103 10k SR55 ERJ2GEJ102 1k SR63 ERJ2GEJ101 100 SR64 ERJ2GEJ103 10k SR66 ERJ2GEJ102 1k SR73 ERJ2GEJ820 82 SR74 ERJ2GEJ820 82 SR203 D0GA563ZA006 56k R215 ERJ2GE0R00 0 SR225 ERJ2GE0R00 0 SR231 ERJ2GEJ824 820k SR232 ERJ2GEJ434X 430k SR248 ERJ2GE0R00 0 SR330 ERJ2GEJ105X 1M SR331 ERJ2GEJ273X 27k SR332 ERJ2GEJ273X 27k SR801 ERJ2GEJ122 1.2k SR802 ERJ2GEJ101 100 SR805 ERJ2GEJ470 47 SR806 ERJ2GEJ221 220 SR807 ERJ2GEJ221 220 S

(CAPACITORS)C1 F2A0J3310067 330 C2 F2A0J3310067 330 C5 ECUV1A105KBV 1 C10 ECUV1A225KB 2.2 C11 ECUE1A104KBQ 0.1 C12 PQCUV0J106KB 10 C13 ECUE1A104KBQ 0.1 C17 ECUE1H100DCQ 10p C18 ECUE1H100DCQ 10p C35 ECUE1H560JCQ 56p C40 ECUE1A104KBQ 0.1 C43 ECUE1H100DCQ 10p C44 ECUE1A104KBQ 0.1 C45 ECUE1A104KBQ 0.1 C46 ECUE1H100DCQ 10p C47 ECUV1A105KBV 1 C49 ECUV1A105KBV 1 C50 ECUV1A105KBV 1 C51 ECUV1A105KBV 1 C52 PQCUV0J106KB 10 C53 PQCUV0J106KB 10 C54 ECUE1H100DCQ 10p C55 ECUE1H100DCQ 10p C72 ECUE1H100DCQ 10p C73 ECUE1H100DCQ 10p C74 ECUE1H100DCQ 10p C75 ECUE1H100DCQ 10p C96 ECUE1H100DCQ 10p C97 ECUE1H100DCQ 10p C103 ECUE1H101JCQ 100p C104 F1G1H100A723 10p C105 ECUE1H101JCQ 100p

Safety Ref. No.


87


16.5.3. Charger Unit16.5.3.1. Cabinet and Electrical Parts

16.5.3.2. Main P.C. Board Parts

16.5.4. AccessoriesNote:

You can download and refer to the Operating Instructions(Instruction book) on TSN Server.

16.5.5. Screws

16.5.6. Fixtures and ToolsNote:

(*1) See Equipment Required (P.48), and The SettingMethod of JIG (P.48)(*2) When replacing the Handset LCD, See How toReplace the Handset LCD (P.47)

K.TKXTG4021METKXTG4022METKXTG4023METKXTGA403MET

C107 ECUE1H330JCQ 33p SC113 ECUE1H100DCQ 10p C152 ECUE1H102KBQ 0.001 C172 ECUE1A104KBQ 0.1 C182 F1G1H3R0A480 3p C188 ECUE0J105KBQ 1 C200 ECUV1C105KBV 1 C201 ECUV1C105KBV 1 C203 ECUV1C105KBV 1 C204 ECUV1C104KBV 0.1 C331 ECUE0J105KBQ 1 C332 ECUE0J105KBQ 1 C341 ECUE1H390JCQ 39p C802 F1G1H2R0A480 2.0p C803 F1G1H1R5A480 1.5p C804 F1G1H2R0A480 2.0p C805 F1G1H3R3A480 3.3p C806 F1G1H3R3A480 3.3p C808 ECUE1A104KBQ 0.1 C809 F1G1H100A723 10p C810 F1G1H1R6A480 1.6p C811 F1G1H100A723 10p C812 F1G1H100A723 10p C813 F1G1H1R6A480 1.6p C814 ECUE1H332KBQ 0.0033 C819 F1G1H100A723 10p C822 F1G1H100A723 10p C825 F1G1H100A723 10p C826 F1G1H4R0A480 4p C827 F1G1H100A723 10p C834 F1G1H1R0A480 1p C860 F1G1H100A723 10p C861 F1G1H3R0A480 3p

(OTHERS)MIC100 L0CBAY000032 MICROPHONE E101 L5DYBYY00012 LIQUID CRYSTAL DISPLAY

(*3)

E102 PNHR1247Z TRANSPARENT PLATE, LCD PMMA-HBE103 PNHR1246Z GUIDE, LCD ABS-HBE104 PNHX1254Z COVER, LCD E105 PNLA1020Z ANTENNA E106 PNMC1013Z CASE,MAGNETIC SHIELD

(*4)

E107 PNVE1002Z BATTERY TERMINAL X1 H0J103500033 CRYSTAL OSCILLATOR (*2)

Safety Ref. No.


200 PNLC1010ZT CHARGER UNIT ASS'Ywithout NAME PLATE(RTL) (for KX-TG4022MET) (for KX-TG4023MET)

200-1 PNKM1131Y2 CABINET BODY PS-HB200-2 PNJT1010Z CHARGE TERMINAL 200-3 PNKF1098Z1 CABINET COVER PS-HB200-4 PQHA10023Z RUBBER PARTS, FOOT

CUSHION

Safety Ref. No.


PCB200 PNWPTGA641CH MAIN P.C.BOARD ASS'Y(RTL)

(JACK)J1 K2ECYB000001 JACK S

(RESISTOR)R1 ERG2SJ120 12

Safety Ref. No.


(FUSE)F1 K5H302Y00003 FUSE

Safety Ref. No.


A1 PQLV219Y AC ADAPTOR

A2 PQJA10075Z CORD, TELEPHONE A3 PNKL1010Z1 STAND, WALLMOUNT ABS-HB

Safety Ref. No.


A XTB26+8GFJ TAPPING SCREW B XTB2+8GFJ TAPPING SCREW

Safety Ref. No.


PQZZ1CD300E JIG CABLE (*1) PNZZTG4021ME BATCH FILE CD-ROM (*1) PQZZ430PIR TIP OF SOLDERING IRON

(*2)

PQZZ430PRB RUBBER OF SOLDERING IRON (*2)

Safety Ref. No.


Documents

Telefono Inalambrico Panasonic Tg4021me