Technology Presentation 0309stablcor.com/data/STABLCOR_Presentation.pdf Technology Presentation-0309. 2 Outline ... P/N: ST325-EP450

1

STABLCORSTABLCOR®® Technology for Technology for ““Printed Circuit Board and SubstratePrinted Circuit Board and Substrate””

STABLCOR Inc

www.stablcor.com Technology Presentation-0309

2

Outline

Electronics ChallengesToday’s Material and it’s limitationsNeed for High Performance Material and Test dataHow to use STABLCOR® in a PCBBenefits of STABLCOR® in a PCBSupply ChainCase StudyDesign GuidelinesConclusion


3

Challenges of the Electronics

The electronics Industry today is facing challenges such as

HOT SPOTCTE mismatch,

solder joint stress, thermal fatigue failure

shock and vibration issues, “SMALLER, FASTER, STRONGER”


4

PCB material & It’s limitations (Dielectric)

1.8-1.861.6 to 3.912 to 160.6 to 0.65Non-PTFE Ceramic(R4000)

2.1-3.00.30170.5 to 0.66PTFE Ceramic (RO3000)

1.25-1.32 to 2.19 to 120.2 to 0.3Aramid/Epoxy

1.5-1.73.5 to 4.515 to 190.2 to 0.4Polyimide/E-glass

1.6-1.83.5 to 4.516 to 200.3 to 0.4FR-4/E-glass

Density (g/cc)

Tensile Modulus

(Msi)IN-PLANE

CTE (ppm/C)

Thermal Conductivity

(W/m.K)DIELECTRIC MATERIAL


5

Current Material & It’s limitations

ELECTRICAL Property- Very Good

THERMAL Property – Poor

MECHANICAL Property – PoorRigidity

Co-efficient of Thermal Expansion (CTE)


6

Thermal & Thermo-mechanical material

STABLCOR® Material is used today in Printed Circuit Boards and Substrate to address THERMAL &

MECHANICAL issues


7

What is STABLCOR® Material?

A thermally & Electrically Conductive Composite Material

It has very good In-plane Thermal Conductivity

It has low In-plane CTE (3-6 ppm/C)

It can be used as a plane layer, Preferably GND plane

Carbon Composite core

Copper

Copper

It is a Carbon Composite Laminate

CCL


8

STABLCOR® material part number system

EP387 = EPOXY Grade STABLCOR LC909 = POLYIMIDE Grade STABLCOR

H/H, 1/10.009” (229um)ST10-LC909

H/H, 1/10.008”(203um)ST325-EP387*

H/H, 1/10.0045”(114um),0.006”(152um), 0.009”(229um), 0.018”(457um)

ST10-EP387

Copper Thickness (oz)Core ThicknessProduct Name

Part Number System: ST325-EP387-0.008 H/H

STABLCOR type

Resin typeCore thickness

Copper thickness *ST325 Material subject to have MICROCRACKS


9

STABLCOR Material - Part Number List

240° C0.0104" (0.264)1/2 oz over 1/2 ozST10-LC909-0.009H/HST10

240° C0.0118" (0.300)1oz over 1ozST10-LC909-0.009 1/1

Polyimide STABLCOR® Products170° C0.0108" (0.274)1oz over 1ozST325-EP387-0.008 1/1

170° C0.0094" (0.239)1/2 oz over 1/2 ozST325-EP387-0.008H/HST325*

170° C0.0194" (0.493)1/2 oz over 1/2 ozST10-EP387-0.018H/H

170° C0.0118" (0.300)1oz over 1ozST10-EP387-0.009 1/1


170° C0.0088" (0.224)1oz over 1ozST10-EP387-0.006 1/1


170° C0.0073" (0.185)1oz over 1ozST10-EP387-0.0045 1/1

170° C0.0059" (0.150)1/2 oz over 1/2 ozST10-EP387-0.0045H/HST10

Epoxy STABLCOR® Products

TgOverall Thickness Inch

(mm)Copper WeightPart NumberProducts

*ST325 Material subject to have MICROCRACKS


10

STABLCOR® Material

1.5-1.73.5 to 4.515 to 190.2 to 0.4Polyimide/E-glass

1.6-1.83.5 to 4.516 to 200.3 to 0.4FR-4/E-glass

1.6 to 1.65ST10~ 9

ST325~ 24ST10~4.5to6 ST325~1to3

ST10~ 2* ST325~82*

Stablcor Laminate-Unclad (X & Y)

* Theoretical calculated In-Plane values based on volume & Thermal conductivity of the composite materials

1.65 to 1.7ST10~ 10 ST325~ 25

ST10~5to7 ST325~2to4

ST10~ 75* ST325~175*

STABLCOR® Laminate-with 1oz Cu clad (X & Y)

9.90195 to 6108CIC (Copper-Invar-Copper)

8.921217 to 20385Copper

Density (g/cc)

Tensile Modulus

(Msi)CTE

(ppm/C)

Thermal Conductivity

(W/m.K)E.CONDUCTIVE MATERIAL

Thermal, Low CTE, Stiff and Light Weight MaterialCOPPER CLAD CARBON COMPOSITE (STABLCOR®)


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CTE – STABLCOR® Material

In-Plane CTE

CTE vs TemperatureMaterial: ST325-EP450 Unclad

-4-202468

1012141618

-60 -40 -20 0 20 40 60 80 100 120 140

Temperature (C)

CTE

(ppm

/C)

X1 Direction X2 Direction Linear (X2 Direction) Linear (X1 Direction)

Composite CTE (0-3 ppm) over Temp. range of -50C to +130C

12 to 16Non-PTFE Ceramic (RO4000)

17.00PTFE Ceramic (RO3000)

9 to 12Non Woven Aramid/Epoxy

15 to 19Polyimide/E-glass

16 to 20FR-4 / E-glass

In Plane CTE (ppm/C)DIELECTRIC MATERIAL


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209.57°C145.35°C

Alpha=42.1µm/(m·°C)

254.48°CAlpha=102µm/(m·°C)

Tg

-0.002

0.000

0.002

0.004

0.006

0.008

0.010

Dim

ensi

on C

hang

e (m

m)

0 50 100 150 200 250 300Temperature (°C)

Sample: Tg and CTE test for CCLSize: 0.7159 mmMethod: Ramp TMA

File: C:\TA\Data\TMA\Stablcor substrate.008Operator: BPRun Date: 12-Sep-2005 17:38Instrument: TMA Q400 V7.1 Build 89

Universal V4.2E TA Instruments

P/N: ST325-EP450

Through Plane CTE

201.8734.82

209.5742.11

Tg (°C)Z-CTE before Tg (ppm/oC)

Run number

Z-axis CTE measurement by TMA method 50 to 55

Non-PTFE Ceramic (RO4000)

25 to 40PTFE Ceramic (RO3000)

110 to 120Non Woven Aramid/Epoxy

50 to 55Polyimide/E-glass

55 to 60FR-4/E-glass

Through Plane CTE

(ppm/C)DIELECTRIC MATERIAL


13

How is STABLCOR® used in a PCB?

FR-4

FR-4

STABLCOR®

FR-4

FR-4

L2/3

Prepreg

Prepreg

Prepreg

Prepreg

Prepreg

Prepreg

L4/5

GND

L6/7

L8/9

L1

L10

FR-4

FR-4

FR-4

L2*

Prepreg

Prepreg

Prepreg

Prepreg

L3/4

L5/6

L7/8

L9*

L1

L10

FR-4

FR-4

FR-4

Prepreg

Prepreg

L4/5

NF

L6/7

L9/10

Prepreg

Prepreg

L8*Prepreg

Prepreg

1-CORE 2-CORE 3-CORE

(<0.035”) PCB/Substrate (<0.093”) PCB (>0.093”) PCB

L3*

FR-4 L1/2Prepreg

Prepreg

STABLCOR®

STABLCOR®

STABLCOR®

STABLCOR®

STABLCOR®


14

CROSS SECTIONS


6-layer PCB 12-layer PCB3-layer PCB


15

Thermal

CTE (Co-efficient of Thermal Expansion)

Rigidity / Stiffness

Density / Weight

The Benefits Of STABLCOR® in a PCB / Substrate


16

Thermal / HEAT

CARBON IN A PCB


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PCB Thermal Path - Schematic

Heat source

Thermal Via

Ground Via Isolated via on Ground layer

Chassis

PCB Mounting Screw

PCB Mounting Screw

STABLCOR


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Thermal Via

Ground Via

Isolated via on Ground layer

Wedge Lock

Wedge Lock

Ground Pin

Thermal Via

Cu Edge Plating

Heat source

MILLING STEP

HIGH LAYER VME CARD

VME VME -- Wedge LockWedge Lock

STABLCOR®


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THERMAL PATH


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PCB acts as HEAT SPREADER

STABLCOR® PCB FR4 PCBFR4 PCBSTABLCOR® PCB


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THERMAL – PRODUCT LEVEL

*>124.9°F

*<68.0°F

70.0

80.0

90.0

100.0

110.0

120.0

STABLCOR ®PCB – 1G module

FR4 PCB – 1G module

www.stablcor.com

STABLCOR®ST325+FR4

FR4 PCB

NATURAL CONVECTION40Watt

Technology Presentation-0309

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THERMAL SIMULATION SOFTWARE

1. Ansys Inc. (TAS PCB Software)David RosatoPh: (978) [email protected], PA 15317

2. Fluent Inc. (Icepak Software)Dan ScharpfPh: (603) 643-2600 x [email protected] Hampshire 03766

3. Flomerics (Flotherm Software)Sherman IkemotoPh: (512) 420-9273 x [email protected], California 92083

STABLCOR® material is listed in these software library


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Co-efficient of Thermal Expansion

CARBON IN A PCB


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CTE Associated with Package Type

IC PACKAGE TYPE

Organic Packages (CTE: 16-19ppm/C)

Ceramic Packages (CTE: 6-8ppm/C)

Flip Chip, DDA, WLP (2-4ppm/C)


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1.60.91ST325-EP387-0.010 0/0

1.80.25ST325-EP387-0.008 0/0

6.485.85ST10-EP387-0.009 0/0

6.284.88ST10-EP387-0.006 0/0

CTE, αy(x 10-6 1/oC)

CTE, αx(x 10-6 1/oC)Sample


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CTE – STABLCOR PCB

14-Layer, 80mil Thick, FR4+Stablcor PCB

www.stablcor.com

14-Layer, 80mil Thick, FR4+Stablcor PCBTemperature Dependent Coefficient of Thermal Expansion

Temperature (oC)

-60 -40 -20 0 20 40 60 80 100 120 140 160

CTE

(ppm

/ o C

)

0

2

4

6

8

10

12

14

16

18

20

X1 direction X2 direction

Board: EP3900B-A1

αX1 = 10.96498 + 0.00834 T - 0.0000346 T2

αX2 = 12.47485 + 0.01158 T - 0.0000548 T2

xxxxxx (STABLCOR+ FR4)

10.9 to 12.4ppm/C


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RIGIDITY / STIFFNESS

CARBON IN A PCB


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Rigidity of STABLCOR® PCB v/s FR4 PCB at Room Temp

Printed Wiring Board Bend Data

0.02.04.06.08.0

10.012.014.016.018.020.022.024.026.028.030.032.0

0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0

Displacement (mm)

App

lied

forc

e (N

)

Sample 1 (FR4)

Sample 2 (FR4)

Sample 3 (FR4 +STABLCOR)





Maximum Force at 15mm Deflection

14.00

16.00

18.00

20.00

22.00

24.00

26.00

28.00

30.00

Sample 1 (FR4) Sample 2 (FR4) Sample 3 (FR4 +STABLCOR)





Sample IdentificationM

axim

um A

pplie

d Fo

rce

(N)

This result shows the STABLCOR® samples to be ~ 66.6% stiffer than the FR4 test samples


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-0.01

0.00

0.01

0.02

0.03

0.04

0.05

Dim

ensi

on C

hang

e (m

m)

0 50 100 150 200 250 300

Temperature (°C)

Sample: PCBSize: 3.0000 mmMethod: Force RampComment: Bend Test at various temperatures

TMAFile: C:\TA\Data\TMA\3 pt bend VLP FR4.003Operator: BPRun Date: 07-Sep-2005 23:19Instrument: TMA Q400 V7.1 Build 89


FR4

-0.01

0.00

0.01

0.02

0.03

0.04

0.05

Dim

ensi

on C

hang

e (m

m)

0 50 100 150 200 250 300

Temperature (°C)

Sample: PCBSize: 3.0000 mmMethod: Force RampComment: Bend Test at various temperatures

TMAFile: C:...\TMA\3 pt bend VLP Stablcor.002Operator: BPRun Date: 06-Sep-2005 19:55Instrument: TMA Q400 V7.1 Build 89


STABLCOR+FR4

Bend Test Over Temperature Range (40oC to 250oC)

Length of vertical lines represent the amount of Deflection


30


Rigidity of thick STABLCOR® PCB (0.093” – 0.125”)

Bend Data

0.0

20.0

40.0

60.0

80.0

100.0

120.0

140.0

160.0

180.0

200.0

220.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5

Displacement (mm)

App

lied

Forc

e (N

)

ST10 board 1

ST10 board 2

ST325 board 1

ST325 board 2

Polyimide board

Bend Data

0.0

20.0

40.0

60.0

80.0

100.0

120.0

140.0

160.0

180.0

200.0

220.0

240.0

ST10 board 1 ST10 board 2 ST325 board 1 ST325 board 2 Polyimideboard

Sample Identification

Max

imum

For

ce @

6m

m D

efle

ctio

n

-47.2Polyimide board5

452.1%213.4ST325 board 24

423.5%199.9ST325 board 13

265.7%125.4ST10 board 22

277.3%130.9ST10 board 11

Stiffness Improveme

nt over Sample 5

Maximum force at

6mm (N)

Sample Identification

Sample

Number

ST10 –STABLCOR® samples are ~ 275% stiffer than the Polyimide test samples

ST325- STABLCOR® samples are ~ 450% stiffer than the Polyimide test samples


31

WEIGHT

9.9Copper Invar Copper

8.92Copper

2.7Aluminum

1.65STABLCOR® (w/o Cu)

1.70Polyimide

1.80FR4

Densitygm/cm3

Material(Laminate)


32

Current Supply Chain

End User / CUSTOMEREnd User / CUSTOMER

Qualified PCB ManufacturerQualified PCB Manufacturer• Dynamic Details Inc ** ELTEK - Israel• Hunter Technologies ** CIREP Group – France• North Texas Circuit Board ** Stevenage Circuit - UK• Murrietta Circuits ** Graphic PLC - UK• Winonics ** Streamline Circuits- USA• Cosmotronic ** Photochemie -Switzerland• Cirtech ** Elvia PCB Group - France• Unicircuit• Harbor Electronics / ECT• TTM Technologies – Stafford & Chippewa Falls Plants

Lewcott / Carbon Core Laminates (STABLCOR material

manufacturer / Distributor)

54,000 sq.ft facility

Factory: Millbury, Massachusetts, USA

www.stablcor.com


33

CASE STUDY

CASE STUDY


34

CASE STUDY – Thermal at 40W, ST10

40Watt, Natural Convection, STABLCOR PCB running 11.2oC Cooler

www.stablcor.comCourtesy: CONTINENTAL Automotive France SAS, Mr. Loic Bertrand

Customer Quote:

ST10 represented a 12% to 15% temperature reduction compared to FR4

dT between ST325 and ST10 PCBs are very close to each other

FR4 PCB STABLCOR®ST10+FR4



35

CASE STUDY – Thermal at 40W, ST325

40Watt, Natural Convection, STABLCOR PCB running 16.4oC Cooler

www.stablcor.comCourtesy: CONTINENTAL Automotive France SAS, Mr. Loic Bertrand

STABLCOR®ST325+FR4

FR4 PCB


Customer Quote:

With the STABLCOR we can say that hot spots are practically eliminated

ST325 represented a 15% to 20% temperature reduction compared to FR4


36

CASE STUDY – Thermal at 40W

ST325: With the STABLCOR solution thermal resistance decreased by ~30% compared to the FR4 solution

www.stablcor.com

2.5oC/W4.5oC/WStablcor PCB (ST325)Not Tested4.8oC/WStablcor PCB (ST10)

With plateWithout plate

4.7oC/W6.7oC/WFR4 PCB

Thermal Resistance (at 40Watt), Natural Convection

Courtesy: CONTINENTAL Automotive France SAS, Mr. Loic Bertrand

ST10: With the STABLCOR solution thermal resistance decreased by ~28% compared to the FR4 solution

6-Layer PCB, 0.062” thick, ~6.0” x 6.0”, ST325 at L2 &L5


37

CASE STUDY – SBC (Single Board Computer)


38

CASE STUDY – SBC, Thermal & CTE


39

CASE STUDY - THERMALHeat Dissipation of PWB Materials with End Clamped in Vise

-20

-10

0

10

20

30

40

50

60

70

80

Resistor Pos 1 Pos 2 Pos 3

Thermocouple Position

Tem

p R

ise

Abo

ve A

mbi

ent i

n C

elsi

us

FR4STBLCoreDifference

ViseR 1 2 3

The superior thermal conductivity is evident from the reduced temperature at the resistor. The power resistor was set up to heat up to about 100°C (ambient was about 24°C during the test), which required slightly over 6W into the resistor. Keeping the resistor power constant, the STABLCOR®material lowered the resistor temperature by 12.8°C. The thermal resistivity of the resistor to ambient was 12.6°C/W with the FR-4 and 10.6°C/W with the STABLCOR® indicating a 2.0W or 19% improvement in power handling capability with this configuration.


40

CASE STUDY – Solar Panel, low CTE & Rigidity

MATCHED CTEMATCHED CTEEliminates thermal induced stress on Eliminates thermal induced stress on the triple junction solar cells. Initial the triple junction solar cells. Initial thermal cycle testing has shown no thermal cycle testing has shown no

damage to solar cells due to damage to solar cells due to matching thermal expansionmatching thermal expansion

AUTOMATED AUTOMATED PRODUCTIONPRODUCTION

Reduces costReduces cost in large volume in large volume production compared with traditional production compared with traditional

attachment methodsattachment methods

RUGGEDRUGGEDThe rigidity of the CCL substrates The rigidity of the CCL substrates

reduces costsreduces costs by eliminating need by eliminating need for additional supports to meet for additional supports to meet

shock and vibration requirementsshock and vibration requirements


41

CASE STUDY – Flip Chip RELIABILITY

For no underfill test, the For no underfill test, the chips on STABLCORchips on STABLCOR®®

substrate remain attached at substrate remain attached at 353 cycles. Most of the chips 353 cycles. Most of the chips detached from the other test detached from the other test boards at 353 cyclesboards at 353 cycles

With no underfill, the With no underfill, the characteristic (63.2%) life of characteristic (63.2%) life of the FRthe FR--4/NELCO is about 20 4/NELCO is about 20 cycles . The STABLCORcycles . The STABLCOR®®

board is about 173 cyclesboard is about 173 cycles

STABLCOR®

Liquid to Liquid Thermal Shock Reliability


42

CASE STUDY – Ceramic BGA Reliability

10.00 10000.0100.00 1000.001.00

5.00

10.00

50.00

90.00

99.00

Cycles (-40 to +125°C)

Unr

elia

bilit

y, (%

failu

re)

WC

WFC

WF

L1

L2

L4

L5

L6

L7

ST325-EP387-0.008H/H

2ply 44N106

2ply 44N106

2ply 44N106

2ply 44N106

L8

L9L10

L11

L13

L14

1ply 2313

FR4 0.005 h/h

1 ply 2313

FR4 0.005 h/h

1ply 2313

FR4 0.005 h/h

FR4 0.005 h/h

L12-STABLCOR (GND plane)

L3- STABLCOR (GND plane)

FR4 0.005 h/h

FR4 0.005 h/h

ST325-EP387-0.008H/H

0.093” Thick PCBThermal Cycle Reliability

STABLCOR PCB

FR4 PCB

The characteristic life of the CBGA on the STABLCOR PWB is roughly 2X better than on the regular PWB


43

Case Study – Thermount vs. Stablcor PCB CTE

14-Layer, 80mil Thick, 85NT Thermount PCB 14-Layer, 80mil Thick, FR4+Stablcor PCB


44

Case Study – Thermount vs. Stablcor PCB CTE

14-Layer, 80mil Thick, 85NT Thermount PCB 14-Layer, 80mil Thick, FR4+Stablcor PCBTemperature Dependent Coefficient of Thermal Expansion

Temperature (oC)

-60 -40 -20 0 20 40 60 80 100 120 140 160

CTE

(ppm

/ o C

)

0

2

4

6

8

10

12

14

16

18

20


Board: EP3900B-C1 (Thermount)

αX1 = 12.0942 + 0.015026 T - 0.000118 T2

αX2 = 10.33096 + 0.00757 T - 0.0000488 T2

xxxxxxx

Temperature Dependent Coefficient of Thermal Expansion

Temperature (oC)

-60 -40 -20 0 20 40 60 80 100 120 140 160

CTE

(ppm

/ o C

)0

2

4

6

8

10

12

14

16

18

20


Board: EP3900B-A1

αX1 = 10.96498 + 0.00834 T - 0.0000346 T2

αX2 = 12.47485 + 0.01158 T - 0.0000548 T2

xxxxxx (STABLCOR+ FR4)

10.3 to 12.1ppm/C 10.9 to 12.4ppm/C


45

CASE STUDY

Technology Presentation

JPL

Stud

y fo

r Mul

tifun

ctio

nal

Spac

ecra

ft St

ruct

ure

www.stablcor.com

46

DESIGN GUIDELINES

DESIGN GUIDELINES


47

DESIGN GUIDELINES

STABLCORSTABLCOR®® Laminate Laminate

…………is anis an…………

Electrically ConductiveElectrically Conductive MaterialMaterial


48

DESIGN GUIDELINES

Thus,Thus,……………….. ..

It is used as a PLANE layer, It is used as a PLANE layer, preferably GROUND planepreferably GROUND plane layer layer within a multilayer PCBwithin a multilayer PCB


49

BEST WAY TO USE STABLCOR?

USE AS A GROUND PLANE

USE ALL STABLCOR LAYERS AS SAME GROUND

DO NOT USE AS SPLIT GROUND PLANE

DO NOT USE AS A POWER PLANE

DO NOT USE AS A MIX PLANE LAYER


50

OPTIMIZE CLEARANCE PAD SIZES ON GND Plane

Anti-pad size “TOO BIG” Optimized Anti-pad sizes

Plated Through Hole (PTH) pattern

DESIGNER MUST OPTIMIZE ANTI-PAD SIZES ON A STABLCOR GROUND PLANE DATA

www.stablcor.com

Rule to optimize anti-pad size:PTH size + 20mil (minimum)PTH size + 28mil (maximum)** stay towards minimum side


51

STABLCOR must be symmetrical in a stack-up

FR-4

FR-4

STABLCOR®

FR-4

FR-4

L2/3

Prepreg

Prepreg

Prepreg

Prepreg

Prepreg

Prepreg

L4/5

GND

L6/7

L8/9

L1

L10


FR-4

FR-4

FR-4

L2*

Prepreg

Prepreg

Prepreg

Prepreg

L3/4

L5/6

L7/8

L9*

L1

L10

Prepreg

Prepreg

STABLCOR®

STABLCOR®

FR-4

FR-4

FR-4

Prepreg

Prepreg

L4/5

NF

L6/7

L9/10

L8*Prepreg

Prepreg

L3*

FR-4 L1/2Prepreg

PrepregSTABLCOR®

STABLCOR®

STABLCOR®

STABLCOR LAYERS MUST BE PLACED SYMMETRICALLY ALONG THE THICKNESS OF A PCB


52

Proposed stack-up to Optimize RIGIDITY Benefit

STABLCOR® along the Neutral Axis

STABLCOR® near the surface and away from the Neutral Axis

FR-4

FR-4

FR-4

FR-4

L2/3

Prepreg

Prepreg

Prepreg

Prepreg

Prepreg

Prepreg

L4/5

GND

L6/7

L8/9

L1

L10

STABLCOR® 9to18mil coreFR-4

FR-4

FR-4

L2 Gnd

Prepreg

Prepreg

Prepreg

Prepreg

L3/4

L5/6

L7/8

L9 Gnd

L1

L10

Prepreg

PrepregSTABLCOR® 4.5 to 9mil core

STABLCOR® 4.5 to 9mil core

Optimized Stack-up for RigidityNon-Optimized Stack-up for RigidityPrinciple: Use STABLCOR® layers away from Neutral Axis

Two thin STABLCOR® layers as arranged below would give higher stiffness than single thick core in a center


53

Do’s and Don’ts

Do’s & Don’ts


54

Do’s & Don’t

DISTRIBUTE THE STABLCOR MATERIAL ACROSS THE THICKNESS OF A PCB

Thick Dielectric CoreL2

Prepreg

Prepreg

Prepreg

Prepreg

Prepreg

L4 GND

L1

L8

STABLCOR®

STABLCOR®

Prepreg

STABLCOR®

Thick Dielectric Core

L5 GND

NF

L6

L3

L7

Don’t

Thick Dielectric CoreL3

Prepreg

Prepreg

Prepreg

Prepreg

Prepreg

L2 GND

L1

L8

STABLCOR®

STABLCOR®

Prepreg

STABLCOR®

Thick Dielectric Core

L7 GND

NF

L5

L4

L6

Do’s


55

Do’s & Don’t

USE THICK CORE INSTEAD OF USING TWO THIN CORE NEXT TO EACH OTHER

Don’t

Dielectric Core

L3 GND

Prepreg

Prepreg

Prepreg

Prepreg

Prepreg

L2 GND

L1

L10

8mil STABLCOR®

8mil STABLCOR®

Prepreg

8mil STABLCOR® L9 GND

L5

L7

L4

L8 GND

Dielectric Core

8mil STABLCOR®

Prepreg

L6

Do’s

Dielectric Core

L3

3ply 106 Prepreg min.


Prepreg

L2 GND

L1

L10

16mil STABLCOR®

Prepreg

L9 GND

L5

L7

L4

Dielectric Core

L6

Dielectric Core



16mil STABLCOR®

L8


56

Do’s & Don’t

SINGLE CORE, SINGLE PLY STACK-UP

Top

Bottom

NF, STABLCOR(CTE control layer)

Prepreg

Prepreg

DOUBLE PLY, UNCLAD, STABLCOR LAMINATE

Top

Bottom


Prepreg

Prepreg

DOUBLE PLY, Copper CLAD, STABLCOR LAMINATE

DO NOT USE “SINGLE PLY” STABLCOR IF THERE IS ONLY ONE CORE STACK-UP

Don’ts Do’s

Top

Bottom

0.01

0”to

0.0

50”


Prepreg

Prepreg

SINGLE PLY, UNCLAD, STABLCOR LAMINATE

“Single ply” Stablcor in a “Single Core, Thin PCB”stack-up will cause “warpage”. That is why it is recommended to use “Double ply” Stablcor in a “Single Core, thin PCB”

SINGLE CORE, DOUBLE PLY STACK-UP


57

LIMITATIONS

IT IS NOT A DIELECTRIC MATERIAL

IN SOME CASES IT CAN INCREASE FINISH PCB THICKNESS

STABLCOR “CORE” WILL BE EXPOSED AROUND THE PERIMETER OF THE FINISHED PCB

AVAILABLE FROM AUTHORIZED MANUFACTURERS ONLY

IT IS NOT RECOMMENDED TO USE HOT AIR SOLDER LEVEL (HASL) SURFACE FINISH FOR ST325 PRODUCTS


58

CONCLUSION

Operates Cooler Reduces Hot SpotPCB acts as a Heat SinkReduces Thermal Stress on Components

Matches CTEAttach Ceramic packages more reliablyAttach Flip Chip more reliably

All above benefits at almost no weight premium

StiffnessPrevents WarpageIncreased Yields for Component Placement

Benefits for lead free PCBA processing lower reflow oven temperatures


59

For more info www.stablcor.com

STABLCOR Inc


Documents

Technology Presentation 0309stablcor.com/data/STABLCOR_Presentation.pdf Technology Presentation-0309. 2 Outline ... P/N: ST325-EP450