VIA At a Glance
Year established: Fremont, California, USA (1987)
Corporate headquarters: Taipei, Taiwan (1992)
Global operations: Eight offices located in USA, Europe, China, Japan,
Korea and Taiwan
Diversity: Foremost fabless supplier of core logic chipsets, low power x86
processors, advanced connectivity, multimedia, networking and storage
silicon, and complete embedded platform solutions
x86 Platform Provider
As a leading x86 provider, VIA focuses on enabling low power, ultra mobile
system design applications, and has an expansive product portfolio making
VIA a complete platform solution leader. VIA’s diversified product portfolio
includes critical building blocks such as power efficient processors, graphics,
audio, video, networking, communication, and multimedia chipsets.
VIA integrates technology and design into system ready platforms which
are based on innovations including VIA low power and high efficiency 64-
bit x86 processors and its noted small form factors. VIA also designs highly
integrated and ultra-compact embedded boards and a range of industry-
specific x86 embedded systems featuring VIA silicon building blocks.
From VIA C3® to QuadCore Processor �
Since VIA’s first C3® processor was launched in 2001, VIA’s processors
insistently offer industry leading performance per watt, miniaturization,
low power consumption and compatibility with a complete range of
feature rich VIA digital media chipsets, VIA processors are powering
the new generation of embedded, mobile and consumer electronics
From Mini-ITX to Pico-ITX �
VIA launched two of the most used small form factors (SFF) on the
market: Mini-ITX (17cm x 17cm) and Pico-ITX (10cm x 7.2cm) in 2002
and 2007 respectively. The Mini-ITX was proved to be the catalyst for
a creative SFF and it was recognized as an industry open standard for
any embedded or x86 systems on module. The Pico-ITX, the world's
smallest commercialized form factor, was also an innovative platform
alternative for any small footprint embedded systems.
From Hardware to Applications �
VIA has developed a range of applications that provide a networked
infrastructure with optimized control and remote monitoring
capabilities. These applications make it easy to create intelligent control
systems for buildings that combine comfort and convenience, while
reducing overall energy consumption. The solutions are like digital
signage, life automation, transit system, healthcare, home media, in-
vehicle, POS & retail, self-service & interactive kiosks.
VIA’s Competitive Advantages
Superior R&D Capability �
Today VIA boasts over 2,000 employees worldwide, of which over 70%
are highly skilled and experienced engineers with 40% dedicated to
Unique Software Capability �
VIA has a complete software team that manages from the silicon driver
source code to applications/tools/BSPs. By delivering security and
multimedia software solutions based on VIA embedded platforms, VIA
helps customers to expedite the development of software to reach
One-stop-shop Service �
VIA provides one-stop-shop total solutions by leveraging VIA’s extensive
expertise in in-house software engineering and hardware system
integration. VIA facilitates the process through optimizing entire value-
added options for customers – from product design and development,
to production, sales and service.
Pin-to-pin-compatible Processor Strategy �
Pin-to-pin compatibility is set to provide a natural upgrade path from
other VIA processors. VIA’s x86 platforms are able to scale from fanless
single core up to low power quad core with the same board.
Market-leading Longevity Support �
VIA is committed to providing superior customer support and others
programs of up to 7 years of lifecycle for long-term commitment to the
VIA Green Computing
VIA has long been a leading proponent of Green Computing, with a focus
on power efficiency throughout the design and manufacturing process
since 2001. In 2011, VIA Honored with 7 First Ever "Taiwan Green Classics
Awards by Taiwan Ministry of Economic Affairs with the efforts in creating
the best green products and services.
VIA PowerSaver™ Technology �
VIA PowerSaver™ technology dynamically adjusts frequency and voltage
based on user requirements, enabling smooth transition between a
range of processor speeds to match application requirements and
saving up to 40% of power.
VIA Carbon Free Computing �
VIA Carbon Free Computing is a set of programs and products
designed to help individuals and organizations reduce their impact on
the environment. Offering the world's first Carbon Free processors, VIA
works with partners around the world to offset the amount of CO2 so as
to improve the environment and give back to the community.
TreeMark™ Tree Rating �
VIA is introducing a new benchmark, TreeMark™, intended as a useful
tool for organizations looking to balance environmental impact in their
computing purchase decisions and underscore the importance of the
environmental impact of computing.
Mini-ITX Form Factor (17 cm x 17 cm)
Launched in 2002, the VIA EPIA® Mini-ITX form factor has inspired thousands
of embedded system builders and end users around the world to create
innovative devices that take advantage of its small size and rich feature
set. The Mini-ITX form factor is designed to fit standard ATX mount points
—ensuring a wide variety of compatible chassis.
Nano-ITX Form Factor (12 cm x 12 cm)
Advancing the trend in platform miniaturization, VIA developed the 12 cm
x 12 cm EPIA® Nano-ITX embedded board as the ideal building block for a
wide variety of applications requiring even smaller dimensions.
Pico-ITX Form Factor (10 cm x 7.2 cm)
In 2007, VIA launched EPIA® Pico-ITX, the world’s smallest commercialized
form factor, measuring just 10 cm x 7.2 cm. The VIA EPIA® Pico-ITX provides
an innovative platform alternative designed to enable x86 architecture for
embedded systems where it was previously impractical for space reasons.
VIA Embedded Boards
VB Series (17 cm x 17 cm)
VIA Embedded also offers the VB series for entry-level market deployments,
based on the Mini-ITX form factor. With the VB series, customers can define
their product and application needs faster and more cost-effectively.
Em-ITX Form Factor (17 cm x 12 cm)
The Em-ITX series support dual-sided I/O coastlines and can combine
with Em-IO expansion modules — making it flexible and easy to extend
functionality and I/O ports for a specific vertical application.
COM Express Module
VIA COM Express modules are targeted at industrial PC and large OEM
customers focused on dynamic application segments and take advantage
of VIA’s advanced low power embedded platforms.
QSeven Form Factor (7 cm x 7 cm)
VIA QSeven series supports both x86 based and ARM (Cortex A-9 single
core and Cortex A-9 dual core) based modules along with starter kits that
are comprised of a module of choice and the carrier board. Various levels
of customized solutions and services are also offered to speed your time to
17 cm x 17 cm (6.7” x 6.7”)
12 cm x 12 cm (4.7” x 4.7”)
17 cm x 12 cm
(6.7” x 4.7”)
10 cm x 7.2 cm (3.9” x 2.8”)
7 cm x 7 cm
(2.75" x 2.75" )
Basic Form Factor: � 12.5 cm x 9.5 cm (4.92” x 3.73”)
Compact Form Factor: � 9.5 cm x 9.5 cm (3.73” x 3.73”)
Ultra Form Factor: � 8.4 cm x 5.5 cm (3.3” x 2.16”)
Modular Design Strategies from VIA
VIA System-on-Module Solutions
Many products in the VIA Embedded portfolio employ a modular design
strategy that allows our customers the freedom to easily customize and
modify existing designs creating new and exciting devices in much faster
design cycles, using fewer resources.
VIA COM Express are set to customize module solutions for high-level
embedded applications, and support system expansion and application
specific customization. Designed with low power consumption and
high multimedia performance, the VIA COM Express series is targeted at
industrial PCs and large OEM customers focused on dynamic application
segments, including gaming, healthcare, military, transport and industrial
automation. Customers can take advantage of a proprietary multi-I/O
baseboard for evaluation purposes, or can utilize VIA's extensive technical
support in developing a custom baseboard.
VIA QSeven is a small form factor standard that is designed for low-power
and mobility applications. It supports up to 12W of maximum delivered
power and provides legacy free interfaces for embedded applications along
with a comprehensive set of graphical interfaces such as DisplayPort, HDMI
and dual channel LVDS.
COM Express Module
Make use of its multiple I/O baseboard
and application specific customization for
modular solutions evaluation.
With advantages of its compact size,
integrated thermal solution and low cost
connectors, VIA QSeven is the ideal for
building block for various low power and
COTS designs that can be tailored to specific requirements and �
Full breadth of CPU performance range including multi-core readiness �
Availability of starter kits, embedded APIs, tools, technical �
documentation and SDKs
Optimized to address SWaP-C (S