Technology Disrupts; Supply Chains Manage - SMTA€¦ · Technology Disrupts; Supply Chains Manage ... –Enterprise resource planning (ERP) systems ... –In-Circuit Test in Cleanroom

1/25/2015

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1991 – 2015 TechLead Corporation

Technology Disrupts; Supply Chains Manage

Dr. Herbert J. Neuhaus

TechLead Corporation


Outline

• Supply Chain Management

• Disruptive Innovation

• SMT Examples

– Chip-on-Board

– Package-on-Package

• Insights & Recommendations

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Supply Chain Management


Supply Chain Management Definition

• Management of the flow of goods

• Movement & storage: origin to consumption

– Raw materials

– Work-in-process inventory

– Finished goods

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Supply Chain Management Definition II

• Systemic, strategic coordination

– Traditional business functions & tactics

– Across business functions within a company

– Across businesses within the supply chain

– Improving long-term performance

• Individual companies

• Supply chain as a whole


Supply Chain Elements

• Plan: strategy

• Source: choose suppliers of goods & services

• Make: manufacture

• Deliver: orders, warehouses, carriers, invoices, payments

• Return: defective or excess products

• Reciprocity – You are supplier’s customer

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Historical Developments

• Creation– Early industrial revolution, mass production (Henry Ford)– Re-engineering, downsizing, cost reduction programs

• Integration– Electronic data interchange (EDI) systems – Enterprise resource planning (ERP) systems

• Globalization– Integrate global sources into core business

• Specialization– Focus on "core competencies" & specialization– Outsource manufacturing & distribution


Supply Chain Disruptions

Accenture

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Disruptions

Semiconductor Industry Association- Global Billings Report


Disruptions

• Intel expects $1B less revenue: cites hard drive shortage, Thai floods

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Disruptive Innovation


Sustaining Technology

• Incremental improvements to an already established technology

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Disruptive Technology

• Lacks refinement

• Often introduces performance problems

• Appeals to a limited audience

• May not yet apply to a proven practical application


Incumbents Often Dismiss Disruptive Innovation

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Winning Disruptive Innovations

• Telephone vs telegraph

• Diesel electric vs steam locomotive

• Solid state electronics vs vacuum tubes

• Mini-mills vs integrated steel producers

• Digital cameras vs film

• Amazon vs brick and mortar bookstores

• iTunes vs compact disks vs records


Value Recognition Is Critical

• Unrecognized value

– Threat

– Lack of a response IS a response

– Typical of entrenched suppliers

• Recognized value

– Opportunity

– Rapidly reconfigure supply chain

– Integrate innovation into manufacturing

– Typical of new entrants and well managed firms

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Chip-on-Board


Chip-on-Board

• Bare chip bonded to board

• Wire-bond interconnect

• Liquid encapsulation

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Chip-on-Board

• Now mature but once a disruptive innovation

• Advantages

– Form factor reduction

– Rapid time to market

– Cost reduction?


Chip-on-Board Applications

• Portable electronics

– Watches, pagers, calculators, games

• Low end, short life cycle products

• Not suitable for high reliability or high value die

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Chip on Board Disruptive

• Contamination control– Clean room required, Class 10,000 or better

• Bare die– Procurement

– Handling

– Quality

• Wire-bond

• Rework& Yield Management– Impractical after encapsulation

– In-Circuit Test in Cleanroom


Chip-on-Board Process

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Chip Adhesive


Chip Placement

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Bare Die Quality

• Bare die testing limited

• Unknown Bad Die (UBD) a reality

• EIA/JEDEC JESD49 covers die procurement info

– Leaves details to supplier discretion

• Wafer yield data highly proprietary

• Significant Supply Chain Challenge


Wire Bonding

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Wire Bonding


Wire Bonding

• Mature, complex process

• Not a traditional SMT skill

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Glop-top Encapsulant


Rework Options

• Mounted, Wire-bonded die reworkable

– Die failure analysis possible

– Dress board pads

– Replace die

• More difficult after encapsulation

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Yield Management Example

• Yielded Cost Model shows

– COB without rework of bad chips impractical for high value chips

– One rework is sufficient to render COB cost effective regardless of chip yield or value

$1.00 chip, 0 Reworks Allowed





Cos

t of

scr

app

ed c

hip

per

100

boa

rds

Chip Yield


COB Supply Chain Learnings

• COB known, but disruptive

• Supply Chain Issues

– Upstream• Die procurement (quality)

– In-house• Cleanrooms

• Die handling

• Wire bonding

• Encapsulation

• Rework & yield management

– Downstream• Restricted field feedback

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Package-on-Package


Package on Package (PoP)

• Individual Packages Stacked On Each Other

• Bottom Package Typically Logic Device

• Top Package Typically Memory Device

Bottom Package Logic Module

PoPb

Top PackageMemory Module

PoPt

PCB

Source: Intel

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• Package on Package (PoP) growing fast!

• Products:

– Cell phones

– Digital camera

– PDA

– Tablets

– Ultra mini PC (UMPC)

Source: Intel



• Advantages:– Mix & Match Package Suppliers

– Reduce Total Cost of Ownership

– Small Board Footprint

– Test Individual Packages For Known Good Die

– High Die/Package Area Ratio

– Compatible With Standard SMT Process

• Disadvantages:– Who Owns Failures?

– Cost

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• Top Memory Packages:

– Molded package

– Usually same size as the bottom package

– Only 2 rows of balls

– Mold cap height depends on # of Si die

3 die+1Spacer

2 die+1Spacer

4 memory die

Source: Intel



• Standard PoP packages :

– Wire bond style PoP bottom package

– Flip Chip style PoP bottom package

Source: Intel

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PoP Assembly Process

Source: Intel

Bottom packageTop package

Flux applied to fixture of

known depth

Top package dipped in flux

Top package placed on

bottom package

PoP board reflowed via

standard SMT process

Bottom package

placed via standard

SMT process


Assembly Option: Pre-Stacking

• Some customers prefer not to do PoP stacking in mainline SMT process– Use subcontractor to obtain pre-stacked units

– Pre-stacked units assembled on special pallets

Source: Intel

Bottom units placed in SMT carrier

Pre-stacked PoP unit

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Assembly Option: Pre-Stacking

• Pre stacking benefits:

– No dipping process at SMT assembly

– Single step SMT placement process

• Pre stacking disadvantage:

– PoP units go through extra reflow cycle

– Testing challenges with pre-stacked units

– Failure accountability following SMT assembly

Source: Intel


PoP Package Technology

• TSOP Stacking

– Interposer with PTH connects TSOPS

– Sn plated TSOP leads

– SAC 305 soldered Stacked unit

– 0.5 mm pitch for both bottom & top parts

Source: Intel

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Board Level Underfill Options

• Common Dispense Options:– Underfill (full fill)

– Both top & bottom

– Bottom only

– Corner glue (CG)

– Dots

– L shape

Selected dispense option & materials optimized to product

use condition requirements

Corner glue L shape

Underfill full fill

Corner glue L shape

Source: Intel


Board Level Underfill Options

• No Underfill PoP – Joint failures tend to occur at bottom package joints

• Selectively Underfill One PoP Level Only – Failure location & mechanisms transfer to other levels

– Overall PoP reliability comparable to no underfill

• Fully Underfill of PoPb & PoPt packages– Maximizes reliability benefits

Fully Underfilled PoP

Source: Intel

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PoP Supply Chain Learnings

• PoP SMT based, yet disruptive

• Supply Chain Issues

– Upstream• Packaged die (pre-stacked?)

• Interposers?

– In-house• Fluxing

• Underfill

• Reflow

• Rework & yield management

– Downstream• Field repair

• Accountability


Insight #1

Distinction between manufacturing & services has blurred

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Manufacturing & Services

• Manufacturing’s Service-like activities

– R&D

– Customer support

– Test & Inspection

– Inventory management

• External production

– EMS


Value-Add

• Value added through

– Enhanced customer value

– Cost reduction

– Differentiation

• Value added basis for supply chain sourcing

• Some value-add transient

– Not apparent in final product

– Difficult to recognize, especially with disruptive innovations

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Supply Chain Impact

• Value added accounting must include transient value-add

– Service-like activities

• Test & inspection

• Customer support

• Failure to accurately account value-add services

– Poor make-or-buy decisions


Value-Add Service Example

• New yield management paradigm

– Enhanced role of supply chain management

• COB Bare die quality

– Known Good Die

– Probably Good Die

– Unknown Bad Die

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Insight #2

Supply Chain not linear; really a complex mesh


Supply Chain?

• The word “chain” implies a linear flow

• But the supply chain is a NOT linear

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Supply Mesh


Disruptive Innovation & Supply Chain

• Disruptive innovation often re-orders

– Manufacturing operations

– Upstream & Downstream Supply Chain

• Accountability becomes a source of conflict

• All participants (“links”) must manage supply chain

• Inertia breeds failure (or missed opportunity)

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Losing Sight of the Common Objective

I'm glad that the holeis not on our side!


Inertia

• Resistance to change

• Defines

– Important criteria

– Acceptable solutions

– “Correct” viewpoint

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Conclusions

• Innovation

– Sustains

– Disrupts

• Sustaining Innovation

– Powers incremental growth

– Reconfigures supply chain

• Disruptive Innovation

– Redefines value-add (harder to recognized)

– Redefines supply chain


Disruptive Innovation

• Threat or Opportunity?

• Threat when incumbents dismiss innovation outside

– Established thinking

– Established supply chain

• Opportunity

– Recognize innovative value

– Rapidly reconfigure supply chain

– Integrate innovation into manufacturing

Documents

Technology Disrupts; Supply Chains Manage - SMTA€¦ · Technology Disrupts; Supply Chains Manage ... –Enterprise resource planning (ERP) systems ... –In-Circuit Test in Cleanroom