Inaugural Conference and Exhibition on

SYSTEM IN PACKAGE

(SiP) TECHNOLOGY

Doubletree Sonoma Wine CountrySonoma, California - USAJune 27-29, 2017

Technical ProgramJune 27, 2017 June 28, 2017 June 29, 2017Market & Technology Trends SiP market overview, SiP in

cellphone teardown of latest

cellphones, SiP innovation

challenges in mobile applications,

active and passive components

trends, EMS SiP packaging

technology, SiP business

opportunities

System Integration RF Front End SiP, Connectivity SiP

(WiFi, BT, GPS…), medical and

wearable SiP, Smartwatch SiP

solution, display and display

driver integration, SiP solutions

for power, mmW 5G SiP, SiP Test

SiP Technology Embedded active and passives

technologies, Integrated Passive

Devices, NanoCoating, EMI

shielding

Panel Session - Future SiP Platforms: Challenges

and Solutions

Sip at SiPPrivate IMAPS

Experience at the Benziger Family Winery

Website & Registration: http://www.imaps.org/sip/

Thank you to the Premier Sponsors:

Packaging Solutions for Smartphones and Tablets

Wafer Level Chip Scale PackagesLaminate-Based Advanced SiPWafer-Based Advanced SiPLow-Cost Flip Chip

MEMS

CONNECTINGPeople and Technology www.amkor.com

Enabling a Smart WorldAs one of the world’s largest suppliers of outsourced semiconductor packaging, design, assembly & test services; Amkor helps make “next generation” products a reality.

IMAPS System in Package (SiP) 2017 Conference Website: www.imaps.org/sip

Early Registration & Hotel Deadline: May 31, 2017 THANK YOU TO OUR PREMIER SPONSORS!

SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs - market trends, system integration/miniaturization, and new technology innovation enablers to meet current and future SiP challenges. This conference will bring the entire SiP supply and design chain from OEM, Fabless, IDM, OSAT, EMS, EDA, silicon foundries, equipment and material suppliers together under one roof. Speakers, sponsors, exhibitors and attendees will focus on the insights of SiP technology in the relaxing Sonoma wine country, away from big city distractions. Featuring three days of technical sessions, panel discussions, exhibitors and activities, SiP 2017 will provide dynamic learning and technology updates for SiP trends and new engineering innovations from the industry’s world SiP leaders.

TUESDAY, JUNE 27

7:00am - 5:00pm Registration Open 9:00am - 6:00pm Exhibits Open (when not in session)

7:00am - 8:00am Breakfast

8:00am - 8:45am

OPENING KEYNOTE PRESENTATION: PAST, PRESENT AND FUTURE OF SiP

General Chair: Nozad Karim, Amkor Technology Abstract & BIO Soon

SESSION 1 MARKET & TECHNOLOGY TRENDS

Session Chairs: Rozalia Beica, Dow; Farhang Yazdani, BroadPak Corporation

8:45am - 9:15am Market Overview Jan Vardaman, TechSearch International

9:15am - 9:45am SiP innovation Challenge in Mobile David Lu, Huawei

9:45am - 10:30am Coffee Break in the Exhibits

10:30am - 11:00am Active & Passive Components Integration Trends

Jean-Christophe Eloy, System Plus Consulting/Yole

11:00am - 11:30am SiP Trends in Cellphones Yang Zhang, Qualcomm

11:30am – 12:00pm Management of Vertically Integrated Multi-Die, Multi-Substrate Heterogeneous Packages Kevin Rinebold, Mentor Graphics Corporation

12:00pm-2:00pm Lunch in the Exhibits

TABLETOP EXHIBITION HOURS: Tuesday, June 27: 9:00am-6:00pm (when not in session) Wednesday, June 28: 10:00am-3:00pm (when not in session) Be sure to visit these companies in the exhibit area during your time at SiP 2017:

Amkor Technology Cadence Design Systems, Inc. DOW Indium Corporation

NAMICS PacTech Samtech

IMAPS System in Package (SiP) 2017 Conference Website: www.imaps.org/sip

2:00pm - 2:45pm KEYNOTE PRESENTATION:

THE EVOLUTION OF ELECTRONIC MATERIALS AND THE INFORMATION AGE Abstract: Computing has significantly evolved over the years; it has driven the semiconductor industry to develop advanced technologies that can address the increasing needs and complexities across generations of electronics, leading to today’s information age products. The introduction of smartphone, mobility and connectivity have extended the application space and has raised the importance of innovation across the supply chain, from design to manufacturing across front and back end processes. While advancing the technology node continues, increasing demands for more functionalities, while continuing to reduce cost and form factor, will require further innovation in materials, processes and integration technologies.

James T. Fahey, Ph.D., Business President, Electronic Materials, The Dow Chemical Company Jim Fahey was named Business President for Dow Electronic Materials in February, 2015. In his previous role he was Global Business Director for Semiconductor Technologies, a division of Dow Electronic Materials and Global General Manager for Growth Technologies. Prior to this, Fahey was the Business Unit Director of Microelectronic Technologies, and a vice president of Rohm and Haas Company.

Dr. Fahey began his professional career in 1991 in the semiconductor industry as an Engineer at IBM Corporation, where he developed lithographic materials in the organization's Microelectronics Division in Fishkill, NY.

Dr. Fahey received a B.S. in Organic Chemistry in 1986 from St. Francis Xavier University in Antigonish, Nova Scotia, Canada. He earned a M.S. in Polymer Chemistry from Cornell University in 1989 and a Ph.D. in Chemistry from Cornell University in 1991.

2:45pm - 3:15pm EMS SiP Packaging Technology and Service

Dongkai Shangguan, Flextronics USA

3:15pm - 3:45pm Google SiP Applications in Wearable Electronics Nael Hannan, Google

3:45pm-4:30pm Coffee Break in the Exhibits

4:30pm - 6:00pm

STARTUP COMPANIES' SESSION Session Chair: Rozalia Beica, Dow An entrepreneurship competition focused on IoT, mobile applications and System-in-Package will be included on June 27th. Several innovators and start-up companies will have the opportunity to present and compete in front of a jury comprised of venture capitalists, angel investors and industry leaders. The start-up competition will provide a great opportunity to learn about industry challenges and new emerging technologies and business ideas to address them. The teams competing will be provided access to an international network of investors and industry leaders. Event sponsorship opportunities are available.

Thank you to our Corporate Sponsors:

additional sponsorships still available

Thank you to the Official Media Sponsor:

IMAPS System in Package (SiP) 2017 Conference Website: www.imaps.org/sip

WEDNESDAY, JUNE 28

7:00am - 3:30pm Registration Open 10:00am - 3:00pm Exhibits Open (when not in session)

7:00am - 8:00am Breakfast

8:00am - 8:45am KEYNOTE PRESENTATION:

"ALL IN ONE PACKAGE” - THE PACKAGING SOLUTION OF THE FUTURE? Abstract: What are the needs for packages in the future? How do they develop further? What is the ideal electronic package for the applications of the future? In order give an answer to these questions, we will have to start with basic considerations and establishing a holistic view. We have to focus on the functions and start to reassemble them in a new way in order to generate electronic modules and systems with at a minimum consumption of space and energy that are working at high speed. Components, substrates, PCBs and packaging technologies are able to contribute and improve the overall performance. When we are able to combine them so that they are able to work together in an ideal way we will be able to achieve the most effective and efficient electronic package – the “All in one Package”. Therefore, however, we have to dissolve existing borders of the electronic value chain and reassemble them in a new way. This keynote will give an overview on solutions that are available today and it will give an outlook on what we can expect in the up-coming years.

Hannes Voraberger, Group Manager R&D, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Dr. Hannes Voraberger studied industrial chemistry at Graz University of Technology. His professional career he began in 1999 at JOANNEUM RESEARCH in Graz (Austria) focusing on the development of chemical sensors. In 2004 he joined the AT&S. After 2 years as a project leader in the research and development department in Leoben (Austria) he joined AT&S Shanghai (China) to establish a local research and development department. After he has returned to Austria in 2008 he took over the responsibility for intellectual property and the financing of research and development projects in the AT&S. In 2010, he was promoted to his current responsibility of heading AT&S’ research and development department. In the course of his academic and professional career Hannes Voraberger could publish several scientific papers and patents.

SESSION 2 8:45am – 9:15am

SiP & SYSTEM INTEGRATION Session Chairs: David Lu, Huawei; Dongkai Shangguan, Flextronics RF-SiP Front End SiP Jack Ajoian, Broadcomm

9:15am - 9:45am Smartwatch SiP Packaging Solutions Sunny Lee, ASE

9:45am - 10:15am Low Power IoT Application Karim Arabi, Atlazo, Inc.

10:15am - 10:45am Coffee Break in the Exhibits

10:45am - 11:15am mmWave 5G SiP

Javi DeLaCruz, Invensas Corporation

11:15am - 11:45am Testing Solutions of SiP Packaging Hank Lydick, National Instrument USA

11:45am – 12:15pm Display & Display Driver SiP Speaker TBD

12:15pm-2:00pm Lunch in the Exhibits

2:00pm - 2:30pm Fan-out SiP Solution

Steffen Kroehnert, Nanium S.A.

2:30pm - 3:00pm Interconnect Scheme for SiP Devices using Micro-Coaxial Cables Caprice Gray, C. S. Draper Laboratory

3:00pm - 3:30pm Power Module SiP Steven Kummerl, Texas Instruments

IMAPS System in Package (SiP) 2017 Conference Website: www.imaps.org/sip

THURSDAY, JUNE 29

7:00am - 2:00pm Registration Open

7:00am - 8:00am Breakfast

SESSION 3 SiP TECHNOLOGY

Session Chairs: Jan Vardaman, TechSerarch; Urmi Ray, Consultant

8:00am – 8:30am Integrated Passive Devices (IPD) Vinayak Pandey, STAT ChipPAC

8:30am - 9:00am Enabling Faster Design and Performance Decisions for Advanced Package Architectures in SIP Humair Mandavia, Zuken

9:00am - 9:30am mSAP/SAP Thin Substrate Technology for SiP Application Kazuto (Jack) Tozawa, IBIDEN Co., Ltd.

9:30am – 10:00am Interconnect Material in SiP Packaging Ning-Cheng Lee, Indium USA

10:00am - 10:30am Coffee Break

10:30am - 11:00am Water Proved Products/ NanoCoating Technology

Simon McElrea, Semblant

11:00am - 11:30am EMI Shielding Jason Cheung, Henkel USA

11:30am – 12:00pm Advanced Packaging Materials for SiP Brian Schmaltz, NAMICS

12:00pm-1:00pm Lunch in the Exhibits

PANEL SESSION: FUTURE SIP PLATFORMS: CHALLENGES AND SOLUTIONS

1:00pm-2:30pm This panel discussion focuses on the challenges in the future SiP platforms with discussions about the requirements for design, inspection, test, and assembly. Experienced participants from the infrastructure required to provide the next generation SiP will join the lively discussion organized by moderators Jan Vardaman and Urmi Ray. PANELISTS & ADDITIONAL DETAILS SOON

2:30pm Closing Remarks

REGISTRATION INFORMATION: (Early Registration Deadline: May 31, 2017) | Register Online: www.imaps.org/sip Full attendee registrations (not exhibits only) includes the sessions, meals, breaks, exhibit attendance, reception, and lunches. Also includes one Download of the post-conference presentation slides, and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration. All prices and registration details can be found online: www.imaps.org/sip.

HOTEL INFORMATION – HOTEL DEADLINE – MAY 31, 2017. Reservations must be made directly with:

DoubleTree by Hilton Sonoma Wine Country 1 DoubleTree Drive | Rohnert Park, CA 94928 IMAPS Discounted Single/Double Room Rate: $170/night + taxes/fees ONLINE RESERVATIONS: http://group.doubletree.com/imapsadvancedtechnology Phone Reservations: +1-707-584-5466 (Mention IMAPS or IMAPS System in Package when booking by phone) Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

NEXT GENERATION MICROELECTRONICS

Samtec leverages industry-leading microelectronics and high-speed interconnect expertise to provide innovative solutions for next generation IC packaging and IoT demands.

Visit us at the Inaugural IMAPS System-in-Package (SiP) Conference 2017

June 27-29, 2017 | Sonoma, California USA

IMAPS-SiP 2017 Conference Ad.indd 1 4/24/17 10:08 AM

IMAPS System in Package (SiP) 2017 Conference Website: www.imaps.org/sip

Wine Country Tour & Dinner: Sip at SiP

Private IMAPS Experience at the Benziger Family Winery Wednesday, June 28th | 4:00pm-10:00pm

Join conference colleagues for a special evening experience at the Benziger Family Winery in Sonoma. Guests will enjoy a private tour, wine tasting, and dinner at one of the most popular wine estates in California’s famous wine region. The Experience Upon arrival in provided transportation from the conference hotel, Sip at SiP guests will transfer to a Benziger tram for a special behind-the-scenes look of the 80 acre biodynamic estate. Get an up-close view of the fermentation facility, crush pad, and explore the barrel caves while learning about Benziger’s unique farming practices and winemaking history. The tram tour will conclude at the tasting room for a sampling of their unique portfolio of wines, followed by an intimate three-course family-style dinner in the estate’s Wine Cave. Transportation will be provided back to the hotel upon the conclusion of dinner. Logistics Date: Wednesday, June 28th Approximate departure time: 4:15pm, following the end Wednesday’s technical program (Meet at 4pm) Tram Tour: 5:00pm-6:00pm Wine Tasting: 6:00pm-7:00pm Dinner in the Wine Cave: 7:00pm-9:00pm Approximate return time: 10:00pm Tickets $95 per person Each ticket reserves transportation, an hour-long tram tour, a wine tasting with hors d’oeuvres, and a seated family-style dinner for one person. Tickets are limited and must be purchased separately from the conference registration fee. To register, first select your conference registration type, then select the Sip at SiP ticket on the Sessions page before checking out online. If you wish to add a ticket after you have registered for the conference, please contact IMAPS HQ at 919-293-5000.