by SEMIKRON / Technical Explanation / SEMITOP / 2017-08-28

PROMGT.1026/ Rev.3/ Template Technical Explanation

Page 1/65

Revision History............................................................................................................................... 3

1 Introduction ............................................................................................................................... 4 1.1 SEMITOP key-features ......................................................................................................... 4 1.2 Customer advantages and benefits .......................................................................................... 4 1.3 SEMITOP with Press-Fit terminals for solder free assembly to the PCB ....................................... 5

2 SEMITOP Technical details ......................................................................................................... 6 2.1 Mechanical construction ......................................................................................................... 6

2.1.1 Tolerance system ............................................................................................................ 6 2.2 Product portfolio ................................................................................................................... 8 2.3 Chip technologies ................................................................................................................ 11 2.4 SEMITOP type designation system ....................................................................................... 12

3 Chip technologies and optimized operation frequency ................................................................... 13 3.1 IGBT technology characteristics ............................................................................................ 14

3.1.1 600V and 650V IGBTs .................................................................................................... 14 3.1.2 1200V IGBTs ................................................................................................................ 15

3.2 MOSFETs technology characteristic ........................................................................................ 17 3.2.1 Si MOSFETs .................................................................................................................. 17 3.2.2 SiC MOSFETs ................................................................................................................ 17

3.3 Inverse and Free-wheeling diodes ......................................................................................... 18 3.3.1 SEMIKRON CAL diodes ................................................................................................... 18 3.3.2 Fast switching diodes ..................................................................................................... 18

3.4 Chip operating areas............................................................................................................ 19 3.4.1 IGBT Safe Operating Area (SOA) for turn-on and single pulse operation ............................... 19 3.4.2 IGBT Reverse Bias Safe operating area (RBSOA) for periodic turn-off .................................. 20 3.4.3 IGBT Short Circuit Safe operating area (SCSOA) for non periodic turn-off of short circuits ...... 21 3.4.4 MOSFET Safe Operating Area (SOA) for single pulse operation ............................................ 21 3.4.5 Surge current characteristic of CAL diodes........................................................................ 22

4 SEMITOP technology ............................................................................................................... 23 4.1 Baseplate-less basic technology ............................................................................................ 24 4.2 Thermal material data ......................................................................................................... 26 4.3 Definition and measurement of Rth ....................................................................................... 27

4.3.1 Test setup .................................................................................................................... 28 4.3.2 Principle of Rth measurement .......................................................................................... 28 4.3.3 Transient thermal impedance Zth .................................................................................... 28

4.4 Specification of the integrated temperature sensor .................................................................. 30 4.4.1 Electrical characteristic (NTC) ......................................................................................... 30 4.4.2 Electrical characteristic (PTC) ......................................................................................... 31 4.4.3 Electrical isolation ......................................................................................................... 32

5 Assembly instructions ............................................................................................................... 33 5.1 Heatsink specification .......................................................................................................... 33 5.2 Mounting surface ................................................................................................................. 33 5.3 Assembling steps ................................................................................................................ 35

5.3.1 SEMITOP with soldered terminals .................................................................................. 35 5.3.2 SEMITOP with Press-Fit pins ......................................................................................... 36

Technical Explanation

SEMITOP Revision: 05

Issue date: 2017-08-28

Prepared by: Roberto Agostini

Approved by: Werner Obermaier

Keyword: SEMITOP, technical explanation, one screw mounting,

no baseplate, pins for soldering, press-fit pins, 12mm height,

flexibility, low inductance design, thermal paste, assembly,

torque, washer, screw, heatsink, datasheet, laser marking,

packaging, label, data matrix, RoHS, ESD, reliability

by SEMIKRON / Technical Explanation / SEMITOP / 2017-08-28 Page 2/65

5.3.3 Mounting process outline ............................................................................................... 37 5.4 Thermal grease application ................................................................................................... 37

5.4.1 Standard thermal grease specification ............................................................................. 37 5.4.2 Pre-applied thermal paste specification ............................................................................ 38

5.5 Assembling on heatsink ....................................................................................................... 39 5.6 Matching SEMITOP and the PCB .......................................................................................... 39

5.6.1 SEMITOP with soldered terminals .................................................................................. 39 5.6.1.1 Soldering on PCB .......................................................................................................... 40 5.6.2 Connecting the PCB via press-fit pins ............................................................................... 42 5.6.2.1 Press-in process ............................................................................................................ 43 5.6.2.2 Press-out process .......................................................................................................... 44

5.6.2.3 Reworking of the assembly module and PCB .................................................................. 44 5.6.3 PCB starter kit .............................................................................................................. 44 5.6.3.1 Demo PCB board for GD topology, SEMITOP4 soldered terminals ...................................... 44 5.6.3.2 Demo PCB board for DGDL topology, SEMITOP4 soldered terminals ................................... 45

5.7 ESD protection .................................................................................................................... 45

6 Technologies ............................................................................................................................ 46 6.1 Principle of Press-Fit technology ............................................................................................ 46 6.2 Pin current capability ........................................................................................................... 46

6.2.1 Soldered terminals current capability ............................................................................... 46 6.2.2 Press-fit pins current capability ....................................................................................... 47

6.3 Tin whisker formation .......................................................................................................... 48 6.4 Thermal interface materials .................................................................................................. 48

7 Restriction of hazardous substances in electrical and electronic equipment (RoHS) ........................... 50

8 Laser marking .......................................................................................................................... 51

9 Packaging specification...............................................................