Technical Documentation Notes

Technical Documentation （Notes）

J531-1 rev.1(2020.05)

TechDoc(Notes)e_rev.1(2020.05) 1

１． Precautions

1-1. Precautions on use of semiconductor products

Though our company makes all efforts to ensure the quality and reliability of products, by their nature,

semiconductor products can fail or malfunction. When making use of our semiconductor products,

customers are responsible for designing safe devices to ensure that no malfunction or failure of the

semiconductor product can result in loss of human life, physical injury, or property damage. In addition,

when creating designs, customers must verify the latest product specifications, only use the products

within the guaranteed ranges, and abide by all contents of this document regarding precautions and

conditions to be observed in the use of the products.

1-2. Safety precautions

This section provides important information on the correct and safe usage of devices in order to

proactively prevent any risk to users or other individuals or any property damage.

Please thoroughly familiarize yourself with the following information (indications and graphic

symbols) before reading the main content, and abide by all precautions, instructions, etc. noted herein.

1-2-1. Explanation of degree of danger indications

Indicates situations in which incorrect handling or use poses a serious a risk of the death or

severe injury of users (*1).

Indicates situations in which incorrect handling or use poses a potential risk of the death or

severe injury of users (*1).

Indicates situations in which incorrect handling or use poses a potential risk of injury of

users (*2) or property damage (*3).

*1："Severe injury" here refers to loss of vision, wounds, burns (high temperature and low temperature),

electrocution, broken bones, poisoning, and other cases where serious complications and after-effects may

arise, and/or which require hospitalization or long-term outpatient hospital treatment.

*2："Injury" here refers to wounds, burns, electrocution, and other cases where hospitalization or long-term

outpatient hospital treatment is not required.

*3："Property damage" here refers to extensive damage to equipment, devices, or other items.


1-2-2. Explanation of instructions indicated with graphic symbols

Indicates items which are prohibited (which must not be carried out, implemented, etc.).

Detailed prohibition details are indicated using graphics and text inside of or near to the

graphic symbol.

Indicates items which are required (must be carried out, implemented, etc.).

Detailed requirement details are indicated using graphics and text inside of or near to the

graphic symbol.

Indicates items requiring caution (items requiring special caution or care).

Detailed caution details are indicated using graphics and text inside of or near to the

graphic symbol.

1-2-3. General semiconductor product precautions

Do not use any part of your body to touch any components while they are powered or after

they are shut down until all electrical charge has completely dissipated.

Doing so may result in death or severe injury from electrocution.

Dissipate all electrical charge before connecting electrodes, probes, or other tools or

equipment when carrying out assessment, inspection, or testing of devices.

Attempting to connect equipment before all electrical charge is completely dissipated may result in

death or severe injury from electrocution.

Only turn on the power supply after connecting electrodes, probes, or other tools or

equipment when carrying out assessment, inspection, or testing of devices.


Connecting equipment while power is turn on may result in death or severe injury from

electrocution.

Make sure to dissipate all electrical charge after completion of work.

If electrical charge is not dissipated, the next time an operation is carried out before turning power

on, it may result in death or severe injury from electrocution.

Do not use products at values exceeding the absolute maximum ratings (current, voltage,

safe operation area, temperature, etc.).

The damage to the device causes short-circuit current, which can in turn cause explosions or

ignition which can result in fires and injury.

Use equipment which can detect short circuit current, and completely shut off all power

supply lines when a short circuit occurs.

If power supply is not completely shut off, short circuits can result in the continued flow of high

current, which can in turn cause explosions or ignition which can result in fires and injury.

Take prevention of scattering in the event of explosions or fires into account in the design

of cases.

Scattering or flying debris can cause injuries.

Use safety equipment such as covers, etc., when carrying out assessment, inspection, or

testing of devices.

When devices are damaged, overstress or arcing between electrodes and ground can cause

explosions or ignition which can result in fires and injury.


Design devices to be grounded to metallic components other than product electrodes or

terminals.

Even for products where device electrodes and metallic cases are insulated, the case electric

potential can increase as a result of electrostatic capacitance. Any degradation or damage of

insulation can result in the case becoming charged with high voltage, contact with which may result

in death or severe injury from electrocution.

For Schottky barrier diodes, use heat dissipation design and safe design which takes into

account forward and reverse dissipation.

Compared to standard rectifier elements, Schottky barrier diodes have higher reverse current, so in

severe usage environments (high temperature, high voltage, etc.) increased reverse dissipation

may damage the device or cause short-circuit current, which can in turn cause explosions or

ignition which can result in fires and injury.

Design devices so that principal circuits are reliably rendered inoperable when control

circuits are powered, except when device principal circuits are intended to operate.

Device malfunctions may result in death or severe injury from electrocution.

Absolute maximum ratings must not be exceeded even momentarily. Design devices so

that none of the absolute maximum ratings are exceeded.

If the absolute maximum ratings are exceeded, it could result in failure, damage, or degradation,

which can in turn results in injuries from explosions or ignition.

Do not connect devices backwards, incorrectly or to incorrect locations, or reverse power

supply positive and negative connections.


If the current or power consumption exceed the absolute maximum ratings, it could result in not

only failure, damage, or degradation, but also injuries from explosions or ignition. In addition, if any

devices are powered on while connected backwards or incorrectly, immediately cease use of the

device and do not attempt use again after the incorrect connection incident.

Do not touch heat dissipation fins while a device is powered or immediately after a device

has been depowered.

Heat dissipation fins will be hot, so touching them will result in burns.

Do not touch device lead ends.

The ends of some types are sharp, which can result in puncture wounds.

Connect devices to earth after verifying that there is no leakage using measurement

equipment, soldering iron, etc.

If there is any leakage (short), the device will be electrically ruptured, which can cause

electrocution.

Wear protective eyewear when cutting leads.

Flying cutting debris can cause eye injuries.

When handling devices during assessment, inspection, or testing, either wait for the device

to cool down, or wear protective gloves when handling.

The device will heat up when operating, and may remain hot even after power is shut off, which can

result in burns.


1-2-4. Use of our company's products

Please take note of the following when using our company's products.

1) If you wish to use any such product, please be sure to refer to the specifications issued by

Shindengen.

2) All products described or contained herein are designed with a quality level intended for use in

standard applications requiring an ordinary level of reliability. If these products are to be used

in equipment or devices for special or specific applications requiring an extremely high grade of

quality or reliability in which failures or malfunctions of products may directly affect human life

or health, a local Shindengen office must be contacted in advance to confirm that the intended

use of the product is appropriate. Shindengen products are grouped into the following three

applications according the quality grade.

【Standard applications】

Computers, office automation and other office equipment, communication terminals, test

and measurement equipment, audio/visual equipment, amusement equipment, consumer

electronics, machine tools, personal electronic equipment, industrial equipment, etc.

【Special applications】

Transportation equipment (vehicles, ships, etc.), trunk-line communication equipment,

traffic signal control systems, antidisaster / crime systems, safety equipment, medical

equipment, etc.

【Specific applications】

Nuclear reactor control systems, aircraft, aerospace equipment, submarine repeaters, life

support equipment and systems, etc.

3) Although Shindengen continuously endeavors to enhance the quality and reliability of its

products, customers are advised to consider and take safety measures in their design, such as

redundancy, fire containment and anti-failure, so that personal injury, fires, or societal

damages can be prevented.

4) Please note that all information described or contained herein is subject to change without

notice due to product upgrades and other reasons. When buying Shindengen products, please

contact the Company’s offices or distributors to obtain the latest information.


5) Shindengen shall not bear any responsibility with regards to damages or infringement of any

third-party patent rights and other intellectual property rights incurred due to the use of

information on this website.

6) The information and materials on this website neither warrant the use of Shindengen's or any

third party’s patent rights and other intellectual property rights, nor grant license to such

rights.

7) In the event that any product described or contained herein falls under the category of strategic

products controlled under the Foreign Exchange and Foreign Trade Control Law of Japan,

exporting of such products shall require an export license from the Japanese government in

accordance with the above law.

8) No reprinting or reproduction of the materials on this website, either in whole or in part, is

permitted without proper authorization from Shindengen.


1-3. Product Storage, Usage Conditions & Handling Precautions

1-3-1. Product storage

Follow the directions noted below when storing the product.

1) Do not store the product in a location where it will be

exposed to water, direct sunlight or corrosive gases.

Avoid exposure to condensation and store in an

environment that has constant temperature and

humidity levels. (Recommended normal temperature

and normal humidity : 5 to 30°C, 45 to 75%)

Fig.1 Example of poor storage conditions / location

2) When humidifying the environment during the dry season to maintain a constant humidity level,

rust can develop on the product lead if tap water is used due to the chlorine content. First boil

the water or use pure water to ensure that chlorine is not present in the water.

3) When there is a sudden change in temperature during storage or product transport,

condensation occurs on the product and causes a change in color or corrosion on the product.

4) When storing, make sure that there is no load being applied directly onto the product.

5) When the product will be stored for a long period of time, insert silica gel into moisture barrier

packaging or into an airtight container to ensure that it is stored in a dry environment. When

using the product after being stored for a long period of time, be sure to check the solderability

before use.

6) When stacking and temporarily storing the product in cardboard packaging, ensure that the

product is stacked in the same direction as prescribed. If the product in cardboard packaging is

stacked in a format different from what is prescribed (upside down or on its side), an

unexpected load may be applied to the product and cause the product to break or become

damaged. The number of levels that a product in cardboard packaging can be stacked varies

according to the product.

In addition to the directions noted above, please pay attention to the following for products that use

moisture barrier packaging when shipped.

7) Make sure the product is stored so that the moisture barrier package does not get broken nor

becomes damaged.


8) When opening and using a product with a moisture barrier package, be sure to use the product

within the prescribed time. Please note that the prescribed time varies according to the

product.

9) When temporarily storing any unused products after opening the packaging, insert a desiccant

into the moisture barrier packaging, reseal the package and store, or store the unused products

in an environment where a desiccator is being used to maintain low humidity. In addition, be

careful when using a desiccant because it has a limit to the amount of moisture it can hold or

absorb.

10) Do not use a product after the prescribed time has been exceeded, because the absorption of

moisture can cause poor mounting onto substrates. After the prescribed time has been

exceeded, it is possible to remove the moisture that has been absorbed in the product through

heat treatment. However, if the product undergoes heat treatment after being packaged at the

time of shipment, the packaging becomes distorted by the heat. Therefore, the product must

first be transferred to a heat resistant tray or aluminum magazine which can withstand heat

treatment.

1-3-2. Static Electricity Countermeasures

When removing the semiconductor product from the packaging and handling it by itself, pay

attention to the precautions noted below while performing working tasks. There are “Static

electricity warning” indicators that are displayed depending on the product. Pay particular

attention when handling products with these indicators.

1) To avoid building an electrical charge, keep the humidity level between 40 to 60% for the work

area.

2) Make sure the devices, workbenches, chairs, jigs and tools set up inside the work area are

grounded.

3) Place an antistatic mat on the floor of the work area and on the surface of the workbench. If the

resistance value changes because the surface of the antistatic mat becomes dirty, for example,

then clean the mat accordingly.

4) When there are places of concern where an electrical charge may build up inside the work area,


use a ground (or use an ionizer when necessary for the places where a ground is not possible)

to ensure that there is no buildup of an electrical charge.

5) When setting up a monitor inside the work area, select a monitor that is not susceptible to

building up an electrical charge or treat the monitor surface with an antistatic agent.

Fig.2 Example of countermeasures for workbenches and work area

6) When items come into contact with the product (such as the component on the mounter that

picks up the product, tweezers, or a soldering iron) only use items that have been treated with

an antistatic agent, that are grounded or that are made from a material that does not hold an

electrical charge. In addition, only use a soldering iron that has a low voltage (12 to 24 V).

Fig.3 Ground for soldering iron

7) When the product has an electrical charge and comes into contact with metal, the product may

become damaged due to a sudden electric discharge. When the product carries an electrical

charge, take steps to avoid a sudden electric discharge.

8) The worker must wear antistatic clothes and antistatic shoes, and while working, he or she

must also wear an antistatic wrist strap to safely ground his or her body. In addition, when the

worker must use gloves or finger cots to prevent contamination, use gloves or finger cots that

have been treated with an antistatic agent.

The hand soldering tool must have a tip that does not leak nor produce

any induced potential, and in certain it is desirable to be grounded.

Iron tip


Fig.4 Example of countermeasures used by worker

9) We recommend that you periodically measure the electrical charge inside the work area to

make sure that there is no electrical charge buildup.

10) When using a shelf to store the product or a cart to transport it, pay attention to the electrical

charge that builds up on the shelf or cart.

Fig.5 Example of countermeasures for parts box

Fig.6 Example of countermeasures for protective shelf


1-3-3. Prevention of Overvoltage & Overcurrent Damage

Other factors besides static electricity can cause a voltage or current to be applied that exceeds

the product’s overload capacity and damage (overvoltage and overcurrent damage) the product.

Various causes can lead to overvoltage and overcurrent damage, and identifying and

troubleshooting those causes is extremely difficult.

1) Is there anything with a high voltage that is close to the product?

2) Is there a ground fault or electrical leak from any of the surrounding devices?

3) Is there any impact from an external surge such as a lightning surge?

4) Is there an overvoltage or overcurrent when the product is operated or during product testing?

5) Is there a surge that occurred on the circuit?

6) When connecting to a probe on an oscilloscope for measuring are there any malfunctions such

as, the load capacity becoming greater or noise occurring?

7) When an electric load has built up on the circuit’s capacitor and that electric load has discharged,

is it the cause of the damage?

After, when contacting us regarding a product where this type of damage may have occurred,

please send the product and include as many details as possible concerning the surrounding

circumstances or the operating conditions at the time of the failure or damage.

1-3-4. Countermeasures Against Product Impact, Stress & Vibration

There is a risk that the product or packaging may become damaged due to impact, stress or

vibrations that exceed a certain level. Therefore, be careful when handling or transporting the

product.

1) If there is excessive impact or stress applied when the product is picked up while being

mounted on a board or during the mounting, the product may become damaged. Therefore,

manage and handle the product appropriately.

2) There is an internal chip near the center of the mold resin. Even if no problem is visible on the

exterior of the product, product stress can cause damage to the internal chip. Therefore,

handle with care.


1-3-5. Other Usage Conditions

Follow the directions noted below on the usage conditions.

1) When corrosive gases exist or are emitted, they can impact the characteristics of the product

and cause a product defect.

2) The product is not designed to account for radiation or cosmic rays. The product may not

operate properly due to the impact from radiation or cosmic rays.

3) When subjected to an intense electric or ferromagnetic field, it may impact the characteristics

of the product and cause the product to not operate properly.

4) When there is an external light (such as ultraviolet light or sunlight), it may cause the product

to not operate properly depending on the intensity or amount of light.

5) When dust, oil or other contaminants are present, it may impact the characteristics of the

product and cause the product to not operate properly.

6) The mold resin that is used in the product is designed to account for flame resistance. However

this is not a guarantee. When the product is damaged due to an overvoltage or overcurrent, or

when there is flammable material that is nearby, there is the danger of catching fire. In addition,

if the product ignites, toxic gases may also be emitted. Use the product in accordance with the

product standards and specifications. Do not use or set up any product near burning materials,

pyrogenic substances, firebombs or flammable materials.

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Technical Documentation Notes