27
1. General 1-1. Range of Applications This specification applies to tantalum chip capacitors for applications in electronic equipment. 1-2. Test Conditions Unless otherwise specified , tests are made at temperature of +5 to +35℃ with humidity of 45 to 85% and atmospheric pressure of 860 to 1060 millibar. If there is any doubt in judgement of test, tests will be made at the temperature of 20±2℃, humidity of 60% to 70%, atmospheric pressure of 860 to 1060 millibar. 1-3. Working Temperature Range -55℃ to +125℃ (For use over 85℃, derated voltage will be applied.) 1-4. SVS and SCS has no difference for product at"2. Part Number Code". "SCS" is also Pb-free product from March.2005. 2. Part Number Code TC SVS OJ 106 M A A R 1 2 3 4 5 6 7 8 2-1. The symbol shows a simplified character of the tantalum capacitor. 2-2. The symbol shows the type of the capacitor. SVS : Samsung Capacitor Small 2-3. The symbol shows Rated Voltage as follows : 2-4. The symbol shows Nominal Capacitance as following ways : SOLID TANTALUM CHIP CAPACITOR FILE NO. 10-S-CTN001 1 Symbol 0E 0G 0J 1A 1C 1D 1E 1V DC Rated Voltage 2.5 4 6.3 10 16 20 25 35 Symbol Capacitance () PicoFarad () Symbol Capacitance () PicoFarad () 105 1.0 10×10 5 684 0.68 68×10 4 106 10.0 10×10 6 475 4.7 47×10 5

TC SVS OJ 106 M A A R - p.globalsources.com file1.General 1-1.RangeofApplications Thisspecificationappliestotantalumchipcapacitorsforapplicationsinelectronic equipment. 1-2.TestConditions

  • Upload
    trananh

  • View
    214

  • Download
    0

Embed Size (px)

Citation preview

1. General

1-1. Range of Applications

This specification applies to tantalum chip capacitors for applications in electronic

equipment.

1-2. Test Conditions

Unless otherwise specified , tests are made at temperature of +5 to +35 with

humidity of 45 to 85% and atmospheric pressure of 860 to 1060 millibar.

If there is any doubt in judgement of test, tests will be made at the temperature

of 20±2, humidity of 60% to 70%, atmospheric pressure of 860 to 1060 millibar.

1-3. Working Temperature Range

-55 to +125 (For use over 85, derated voltage will be applied.)

1-4. SVS and SCS has no difference for product at"2. Part Number Code".

"SCS" is also Pb-free product from March.2005.

2. Part Number Code

TC SVS OJ 106 M A A R

1 2 3 4 5 6 7 8

2-1. The symbol shows a simplified character of the tantalum capacitor.

2-2. The symbol shows the type of the capacitor.

SVS : Samsung Capacitor Small

2-3. The symbol shows Rated Voltage as follows :

2-4. The symbol shows Nominal Capacitance as following ways :

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN0011

Symbol 0E 0G 0J 1A 1C 1D 1E 1V

DC RatedVoltage

2.5 4 6.3 10 16 20 25 35

Symbol Capacitance () PicoFarad () Symbol Capacitance () PicoFarad ()

105 1.0 10×105 684 0.68 68×10

4

106 10.0 10×106 475 4.7 47×10

5

2-5. The symbol shows Tolerance on Capacitance.

2-6. The symbol shows Case size, (P, A, B, C, D,)

2-7. The symbol shows reel size. (A : 7", C : 13")

2-8. The symbol shows Taping Process. (R, L, B)

3. Drawing and Dimension

3-1. Drawing

3-2. Dimension

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN0012

CaseCode L W1 W2 H Z

J 1.6 +0.15-0.1

0.85 +0.15-0.1 0.6 ±0.1 0.85 +0.15

-0.1 0.4 ±0.1

P 2.0 ±0.2 1.25 ±0.2 0.9 ±0.1 1.2 max 0.5 ±0.2

A 3.2 ±0.2 1.6 ±0.2 1.2 ±0.1 1.6 ±0.2 0.8 ±0.3

B 3.5 ±0.2 2.8 ±0.2 2.2 ±0.1 1.9 ±0.2 0.8 ±0.3

C 6.0 ±0.3 3.2 ±0.3 2.2 ±0.1 2.5 ±0.3 1.3 ±0.3

D 7.3 ±0.3 4.3 ±0.3 2.4 ±0.1 2.8 ±0.3 1.3 ±0.3

Symbol Tolerance(%)

K ±10

M ±20

Unit : mm

W1

W2

H

L

Z Z

Bulk BTaping and

Reel for ChipR

Directionof Feed

Tape

LTaping and

Reel for Chip

+ Polarity Mark + Polarity Mark

Directionof Feed

3-3. Case Size Matrix

SVS Series

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 3

W.VCap.()

2.5V(0E)

4V(0G)

6.3V(0J)

10V(1A)

16V(1C)

20V(1D)

25V(1E)

35V(1V)

0.15 154

0.22 224

0.33 334

0.47 474 A

0.68 684 A A

1.0 105 A A A

1.5 155 A A A A,B

2.2 225 A A A A,B B

3.3 335 A A A A,B B B

4.7 475 A A A A,B A,B B C

6.8 685 A A A,B A,B B B,C C

10 106 A A,B A,B A,B B,C C C,D

15 156 A,B A,B A,B A,B,C C C,D C,D

22 226 A,B A,B A,B,C B,C B,C,D C,D D

33 336 A,B A,B,C A,B,C B,C,D C,D D D

47 476 A,B,C A,B,C B,C,D C,D D

68 686 B,C B,C,D B,C,D C,D D

100 107 B,C,D B,C,D C,D D D

150 157 C,D C,D D D

220 227 B C,D C,D D

330 330 D D D

470 477 D D

680 687 D

[ Red : Under Development ]

VER.05.01.01

SVS-P Series

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 4

W.VCap.()

4V(0G) 6.3V(0J) 10V(1A) 16V(1C) 20V(1D) 25V(1E)

0.22 224 P P P P

0.33 334

0.47 474 P P P P P

0.68 684 P P P P P

1.0 105 P P P P

1.5 155

2.2 225 P P P P

3.3 335 P P P

4.7 475 P P P P

6.8 685 P P

10 106 P P P

15 156

22 226 P P

VER.05.01.01

[ Red : Under Development ]

4. Characteristics

4-1. Electrical Characteristics

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 5

Items Conditions Specification

1 Rated DC Voltage -55 ~ +85 2.5 ∼ 35V

2 Capacitance

Measuring frequency : 120±12Hz

Measuring voltage : 0.5Vrms + 0.5∼2V DC

Measuring circuit : Equivalent Series

Circuit

Capacitance range

0.15 ∼ 470

Tolerance on Cap.

±10%, ±20%

3Tangent of Loss

Angle (DF,tanδ)

Measurement shall be made under the same

conditions as those given for the

measurement of capacitance.

Page 11 ~ 15

Part Number

Reference

4 Leakage Current

The rated DC voltage shall be applied to

terminals across the test capacitor Cx. by

the method as shown below. The leakage

current shall then be measured after charge

for 5 min.

Measuring circuit

RS : Protective Resistor ( roughly :1 )

: DC voltmeter or electronic

voltmeter

: DC Ammeter for Leakage Current

S1 : DC Power supply Switch

S2 : Protective switch for a Ammeter

& voltmeter

CX : Test capacitor

0.01CV or 0.5

whichever is

greater

5 ESR

Measuring Frequency : 100±10kHz

tan δESR =

2πfc

f : frequency (Hz)c : capacitance (farads)

Page 11 ~ 15

Part Number

Reference

V

+

-

A

RS

S1

S2

V Cx+-

A

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 6

Items Conditions Specification

6Temperature

Stability

The capacitor shall be subjected in turn to procedures specified

below.

7 Surge Test

Test voltage : Surge voltage

Test temperature : 85

Test method :

Charge period of approx. 30±5 sec.

discharge period of approx. 6±0.5 min.

1,000 cycles.

Measuring circuit

R1 : Protective series resistor (33Ω)

R2 : Discharge resistor(33Ω)

Cx : Test capacitor

V : DC voltmeter

S : Switch

Change in apacitance :

±5% of initial value

Tangent of loss angle :

Refer to 4 -4

Leakage current:

Refer to Paragraph

4.1.4

V

+

-

R1

R2

S

Cx+

-

Rated volt 2.5V 4V 6.3V 10V 16V 20V 25V 35V

Surge volt 3.1V 5V 8V 13V 20V 26V 32V 45V

Step Temp. DurationChange in

Capacitance( ΔC )

Tangent ofLoss Angle

(D.F.)LeakageCurrent

1 25±2within

specifiedtolerance Refer to

Page 16

Paragraph4.1.4

2 2 hrs. - 10 to 0% ofinitial value N/A

3 25±2 25 min.

4 2 hrs. 0 to +10% ofinitial value

Refer toPage 16

0.1CV or 5whichever is

greater

5 2 hrs. 0 to +15% ofinitial value

0.125CV or6.25whichever isgreater

+125 +3

0

+85 +3

0

-55 0

-3

Items Conditions Specification

8DeratingVoltage

When operating at high temperature rangefrom 85 to 125, the operation shall becarried out at a derated voltage or less.Derating voltage Vt at any temperaturebetween 85 and 125 shall becalculated by the following equation.

where Vt : Derated voltage at any temp.between 85 to 125

Vr : Rated voltage at 125Vd : Derated voltage at 125

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 7

Rated volt 2.5V 4V 6.3V 10V 16V 20V 25V 35V

Derated voltat 125 1.6V 2.5V 4V 6.3V 10V 13V 16V 22V

-55 0 20 85 125

100

80

60

40

20

0

Operating tamperature

Volt-age

dera-ting%

Vt = Vr- (T - 85)Vr-Vd

40

Items Conditions Specification

1Electrode strength

(terminal strength)

Apply pressure in the direction of the

arrow at a rate of about 0.5mm/sec.

Until it reaches a bent width of 3mm and

hold for 30 sec. The test board spec

follows IEC 40(S) 541 regulation

Pessure rod

There shall be no

evidence of mechanical

damage.

Electrical

characteristics shall

satisfy the initial

requirement.

2

Adhesion strength

(Electrode peeling

strength)

A static load of 19.6N using a R0.5

scratch toll shall be applied on the

core of the component and in the

direction of the arrow and hold for 5

sec. The test board shall be IEC

40(S)541. However the base material

shall be G-10 or FR-4 (ANSI Grade)

There shall be no

evidence of mechanical

damage.

Electrical

characteristics shall

satisfy the initial

requirement.

3 Core body strength

A rod of 9.8N using a R0.5 pressure rod

shall be applied to the center in the

direction of the arrow and hold for 10

sec.

There shall be no

evidence of mechanical

damage.

Electrical

characteristics shall

satisfy the initial

requirement.

45±2mm 45±2mm

Board20

Scratch tool

R0.5

Board

ChipChip

R0.5

0.5L

ChipPressure

W

L

4-2. Mechanical Characteristics

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 8

L>W

10

Items Conditions Specification

1 Solderabilty

Solder Temperature : 245±2

Dip time : 3±0.5 sec.

Solder : Sn-3Ag-0.5Cu

Flux : Rosin (KSD 2951) + Methanol

(Rosin 25wt%)

More than 95% of the

terminal surface must be

soldered newly.

2

Resistance to

Soldering

Heat

Convection Reflow

Preheat : 150∼190 for 130 sec.

Temperature : 245±5

Repeatition : 2 Cycles

Measurement shall be made after 3~4 hours

of cooling time at room temperature

Solder bath process

Preheat : 100∼110 for 30 sec.

Temperature : 260±5

Dip time : 10 ±1 sec.

Measurement shall be made after 1∼2 hours

of cooling time at room temperature

Change in capacitance:

Reflow :±10%

Dipping : ±5%

Tangent of loss angle:

Refer to 4-4

Leakage Current :

Paragraph 4.1.4

Appearance :

There shall be no

evidence of mechanical

damage.

3Resistance to

Cleaning Test

Immersion cleaning

The capacitor shall be cleaned at room

temperature for 60sec. using isopropyl

alcohol.

There shall be no

evidence of mechanical

damage and marking shall

be legible. Electrical

characteristics shall

satisfy the initial

requirements.

4 Vibration

Frequency: 10 to 55 Hz (in 1 min.) Max

amplitude : 1.5 mm.

Direction of vibration : In directions

of X, Y and Z axes

Time : 2 hours each direction and 6 hours

in total

IEC Pub. 68-2-6.

Mounting Method

Soldering 3 ~ 5 sec at 245

Change in capacitance:

Within ±5% of the

initial value

Leakage Current :

Paragraph 4.1.4

Tangent of loss angle:

Refer to 4-4

Appearance :

There shall be no

evidence of mechanical

damage.

Solder

Aluminaboard

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 9

4-3 Reliability Test

Items Conditions Specification

5Moisture

Resistance

temperature : 40±2

relative humidity : 90% ~95% RH

time : 500±8 hours

Electrical measurements shall be made

after being stored at room temperature

for 1∼2 hours. For other procedures

refer to IEC Pub.68-2-2.

Change in capacitance:

±10% of initial value

Tangent of loss angle :

Refer to 4-4

Leakage current :

Paragraph 4.1.4

6 Load Life

Electrical measurements shall be made

after being stored at room temperature

for 1∼2 hours.

Change in capacitance :

±10% of initial value

Tangent of loss angle :

Refer to 4-4

Leakage current :

Paragraph 4.1.4

7Storage at Low

Temperature

The capacitor shall be stored at a

temperature of -55±2 for 240±8 hours

without load.

Electrical measurements shall be made

after being stored at room temperature

for 1∼2 hours.

Electrical

characteristics shall

satisfy the initial

requirement.

8 Thermal Shock The capacitor shall be subjected to each

specified temperature for each specified

time in the table above. These 4 steps

constitutes one cycle, 5 cycles shall be

performed continuously.

Electrical measurements shall be made

after being stored at room temperature

for 1∼2 hours.

Change in capacitance:

±5% of initial value

Tangent of loss angle :

Refer to 4-4

Leakage current :

Paragraph 4.1.4

Temperature Voltage Time

85 Rated Voltage 2,000 hours

125DeratedVoltage

2,000 hours

Step Temperature Time

1 -55 30 ±3 min.

2 25 ± 5 15 ±2 min.

3 125 30 ±3 min.

4 25 ± 5 15 ±2 min.

0-3

0-3

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 10

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 11

TANTALUM CHIP CAPACITORS (SVS SERIES)SVS Rating & Part Number Reference

PART NUMBER CASE SIZECAPACITANCE

()

DC Leakage( )

@+25 Max

DF (%) @+25

120 Max

ESR( Ω)

@+25 Max

2.5 Volt Rating @+85 (1.6Volt Rating @+125)

TCSVS0E227*BAR B 220 5.5 18 1.2

4 Volt Rating @+85 (2.5Volt Rating @+125)

TCSVS0G475*AAR A 4.7 0.5 8 8.0

TCSVS0G685*AAR A 6.8 0.5 8 6.0

TCSVS0G106*AAR A 10 0.5 8 6.0

TCSVS0G156*AAR A 15 0.6 8 4.0

TCSVS0G156*BAR B 15 0.6 8 3.5

TCSVS0G226*AAR A 22 0.9 8 4.0

TCSVS0G226*BAR B 22 0.9 8 3.5

TCSVS0G336*AAR A 33 1.3 8 4.0

TCSVS0G336*BAR B 33 1.3 8 3.5

TCSVS0G476*AAR A 47 1.9 8 3.5

TCSVS0G476*BAR B 47 1.9 8 3.5

TCSVS0G476*CAR C 47 1.9 8 1.8

TCSVS0G686*BAR B 68 2.7 8 1.8

TCSVS0G686*CAR C 68 2.7 8 1.6

TCSVS0G107*BAR B 100 4.0 8 3.5

TCSVS0G107*CAR C 100 4.0 8 1.6

TCSVS0G107*DAR D 100 4.0 8 0.8

TCSVS0G157*CAR C 150 6.0 8 1.2

TCSVS0G157*DAR D 150 6.0 8 0.8

TCSVS0G227*CAR C 220 8.8 8 1.2

TCSVS0G227*DAR D 220 8.8 8 0.9

TCSVS0G337*DAR D 330 13.2 8 0.8

TCSVS0G477*DAR D 470 18.8 10 0.6

6.3 Volt Rating @+85 (4Volt Rating @+125)

TCSVS0J335*AAR A 3.3 0.5 8 8.0

TCSVS0J475*AAR A 4.7 0.5 8 6.0

TCSVS0J685*AAR A 6.8 0.5 8 6.0

TCSVS0J106*AAR A 10 0.6 8 4.0

TCSVS0J106*BAR B 10 0.6 8 3.5

TCSVS0J156*AAR A 15 1.0 8 4.0

TCSVS0J156*BAR B 15 1.0 8 3.5

TCSVS0J226*AAR A 22 1.4 8 3.5

TCSVS0J226*BAR B 22 1.4 8 3.5

TCSVS0J336*AAR A 33 2.1 6 2.5

TCSVS0J336*BAR B 33 2.1 8 3.0

TCSVS0J336*CAR C 33 2.1 8 1.8

TCSVS0J476*AAR A 47 3.0 12 2.0

* Insert K for ±10% tolerance and M for ±20%

4-4 Part No. List

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 12

PART NUMBER CASE SIZECAPACITANCE

()

DC Leakage( )

@+25 Max

DF (%) @+25

120 Max

ESR( Ω)

@+25 Max

6.3 Volt Rating @+85 (4Volt Rating @+125)

TCSVS0J476*BAR B 47 3.0 8 3.5

TCSVS0J476*CAR C 47 3.0 8 1.6

TCSVS0J686*BAR B 68 4.3 8 3.5

TCSVS0J686*CAR C 68 4.3 8 1.2

TCSVS0J686*DAR D 68 4.3 8 0.8

TCSVS0J107*BAR B 100 6.3 10 1.2

TCSVS0J107*CAR C 100 6.3 8 1.0

TCSVS0J107*DAR D 100 6.3 8 0.8

TCSVS0J157*CAR C 150 9.5 8 1.3

TCSVS0J157*DAR D 150 9.5 8 0.9

TCSVS0J227*CAR C 220 13.9 8 1.3

TCSVS0J227*DAR D 220 13.9 8 0.7

TCSVS0J337*DAR D 330 20.8 8 0.6

TCSVS0J477*DAR D 470 29.6 10 0.6

10 Volt Rating @+85 (6.3Volt Rating @+125)

TCSVS1A225*AAR A 2.2 0.5 8 8.0

TCSVS1A335*AAR A 3.3 0.5 8 6.0

TCSVS1A475*AAR A 4.7 0.5 8 6.0

TCSVS1A685*AAR A 6.8 0.7 8 6.0

TCSVS1A685*BAR B 6.8 0.7 8 3.5

TCSVS1A106*AAR A 10 1.0 8 4.0

TCSVS1A106*BAR B 10 1.0 8 3.5

TCSVS1A156*AAR A 15 1.5 8 4.0

TCSVS1A156*BAR B 15 1.5 8 3.5

TCSVS1A226*AAR A 22 2.2 8 4.0

TCSVS1A226*BAR B 22 2.2 8 3.0

TCSVS1A226*CAR C 22 2.2 8 1.8

TCSVS1A336*AAR A 33 3.3 12 2.0

TCSVS1A336*BAR B 33 3.3 8 1.8

TCSVS1A336*CAR C 33 3.3 8 1.6

TCSVS1A476*BAR B 47 4.7 8 1.6

TCSVS1A476*CAR C 47 4.7 8 1.2

TCSVS1A476*DAR D 47 4.7 8 0.8

TCSVS1A686*CAR C 68 6.8 8 0.9

TCSVS1A686*DAR D 68 6.8 8 0.8

TCSVS1A107*CAR C 100 10.0 8 1.2

TCSVS1A107*DAR D 100 10.0 8 0.7

TCSVS1A157*DAR D 150 15.0 8 0.8

TCSVS1A227*DAR D 220 22.0 8 0.6

16 Volt Rating @+85 (10Volt Rating @+125)

TCSVS1C155*AAR A 1.5 0.5 8 8.0

* Insert K for ±10% tolerance and M for ±20%

SVS Rating & Part Number Reference

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 13

PART NUMBER CASE SIZECAPACITANCE

()

DC Leakage( )

@+25 Max

DF (%) @+25

120 Max

ESR( Ω)

@+25 Max

TCSVS1C225*AAR A 2.2 0.5 8 6.0

TCSVS1C335*AAR A 3.3 0.5 8 6.0

TCSVS1C475*AAR A 4.7 0.8 8 6.0

TCSVS1C475*BAR B 4.7 0.8 8 3.5

TCSVS1C685*AAR A 6.8 1.1 8 3.5

TCSVS1C685*BAR B 6.8 1.1 8 3.5

TCSVS1C106*AAR A 10 1.6 8 3.0

TCSVS1C106*BAR B 10 1.6 8 3.5

TCSVS1C156*BAR B 15 2.4 8 3.0

TCSVS1C156*CAR C 15 2.4 8 1.8

TCSVS1C226*BAR B 22 3.5 8 2.5

TCSVS1C226*CAR C 22 3.5 8 1.6

TCSVS1C336*CAR C 33 5.3 8 1.5

TCSVS1C336*DAR D 33 5.3 8 0.8

TCSVS1C476*CAR C 47 7.5 8 1.4

TCSVS1C476*DAR D 47 7.5 8 0.8

TCSVS1C686*CAR C 68 10.9 8 1.4

TCSVS1C686*DAR D 68 10.9 8 0.8

TCSVS1C107*DAR D 100 16.0 8 0.8

20 Volt Rating @+85 (13 Volt Rating @+125)

TCSVS1D105*AAR A 1.0 0.5 6 10.0

TCSVS1D155*AAR A 1.5 0.5 8 8.0

TCSVS1D225*AAR A 2.2 0.5 8 7.0

TCSVS1D335*AAR A 3.3 0.7 8 7.0

TCSVS1D335*BAR B 3.3 0.7 8 3.5

TCSVS1D475*AAR A 4.7 1.0 8 6.0

TCSVS1D475*BAR B 4.7 1.0 8 3.5

TCSVS1D685*BAR B 6.8 1.4 8 3.5

TCSVS1D106*BAR B 10 2.0 8 3.0

TCSVS1D106*CAR C 10 2.0 8 1.8

TCSVS1D156*CAR C 15 3.0 8 1.7

TCSVS1D226*CAR C 22 4.4 8 1.6

TCSVS1D226*DAR D 22 4.4 8 0.8

TCSVS1D336*CAR C 33 6.6 8 1.2

TCSVS1D336*DAR D 33 6.6 8 0.8

TCSVS1D476*DAR D 47 9.4 8 0.7

TCSVS1D686*DAR D 68 13.6 8 0.9

TCSVS1D107*DAR D 100 20 8 0.9

25 Volt Rating @+85 (16 Volt Rating @+125)

TCSVS1E684*AAR A 0.68 0.5 6 10.0

TCSVS1E105*AAR A 1.0 0.5 6 8.0

TCSVS1E155*AAR A 1.5 0.5 8 8.0

* Insert K for ±10% tolerance and M for ±20%

SVS Rating & Part Number Reference

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 14

PART NUMBER CASE SIZECAPACITANCE

()

DC Leakage( )

@+25 Max

DF (%) @+25

120 Max

ESR( Ω)

@+25 Max

TCSVS1E225*AAR A 2.2 0.6 8 7.0

TCSVS1E225*BAR B 2.2 0.6 8 4.5

TCSVS1E335*BAR B 3.3 0.8 8 3.5

TCSVS1E475*BAR B 4.7 1.2 8 3.0

TCSVS1E685*BAR B 6.8 1.7 8 2.5

TCSVS1E685*CAR C 6.8 1.7 8 1.9

TCSVS1E106*CAR C 10 2.5 8 1.5

TCSVS1E156*CAR C 15 3.8 8 1.5

TCSVS1E156*DAR D 15 3.8 8 1.0

TCSVS1E226*CAR C 22 5.5 8 1.2

TCSVS1E226*DAR D 22 5.5 8 0.8

TCSVS1E336*DAR D 33 8.3 6 0.9

35 Volt Rating @+85 (22 Volt Rating @+125)

TCSVS1V474*AAR A 0.47 0.5 6 14.0

TCSVS1V684*AAR A 0.68 0.5 6 10.0

TCSVS1V105*AAR A 1.0 0.5 6 10.0

TCSVS1V155*AAR A 1.5 0.5 8 7.5

TCSVS1V155*BAR B 1.5 0.5 8 5.0

TCSVS1V225*BAR B 2.2 0.7 8 4.2

TCSVS1V335*BAR B 3.3 1.2 8 3.5

TCSVS1V475*CAR C 4.7 1.6 8 2.5

TCSVS1V685*CAR C 6.8 2.4 8 2.0

TCSVS1V106*CAR C 10 3.5 8 1.6

TCSVS1V106*DAR D 10 3.5 8 1.0

TCSVS1V156*DAR D 15 5.3 8 0.8

TCSVS1V226*DAR D 22 7.7 8 0.9

* Insert K for ±10% tolerance and M for ±20%

SVS Rating & Part Number Reference

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 15

PART NUMBERCASE

SIZE

CAPACITANCE

()

DC Leakage( )

@+25 Max

DF (%) @+25

120 Max

ESR( Ω)

@+25 Max

4 Volt Rating @+85 (2.5Volt Rating @+125)

TCSVS0G224*PAR P 0.22 0.5 4 25.0TCSVS0G474*PAR P 0.47 0.5 4 25.0TCSVS0G684*PAR P 0.68 0.5 4 20.0TCSVS0G105*PAR P 1 0.5 6 20.0TCSVS0G225*PAR P 2.2 0.5 6 15.0TCSVS0G335*PAR P 3.3 0.5 6 8.0TCSVS0G475*PAR P 4.7 0.5 8 9.0TCSVS0G685*PAR P 6.8 0.5 6 8.0TCSVS0G106*PAR P 10 0.5 8 6.0TCSVS0G226*PAR P 22 0.9 8 6.0

6.3 Volt Rating @+85 (4Volt Rating @+125)

TCSVS0J224*PAR P 0.22 0.5 4 25.0TCSVS0J474*PAR P 0.47 0.5 4 25.0TCSVS0J684*PAR P 0.68 0.5 4 20.0TCSVS0J105*PAR P 1 0.5 6 20.0TCSVS0J225*PAR P 2.2 0.5 6 15.0TCSVS0J335*PAR P 3.3 0.5 6 8.0TCSVS0J475*PAR P 4.7 0.5 8 9.0TCSVS0J685*PAR P 6.8 0.5 6 8.0TCSVS0J106*PAR P 10 0.6 8 6.0TCSVS0J226*PAR P 22 1.4 8 4.0

10 Volt Rating @+85 (6.3Volt Rating @+125)TCSVS1A224*PAR P 0.22 0.5 4 25.0TCSVS1A474*PAR P 0.47 0.5 4 25.0TCSVS1A684*PAR P 0.68 0.5 4 20.0TCSVS1A105*PAR P 1 0.5 6 20.0TCSVS1A225*PAR P 2.2 0.5 6 15.0TCSVS1A335*PAR P 3.3 0.5 6 8.0TCSVS1A475*PAR P 4.7 0.5 8 9.0TCSVS1A106*PAR P 10 1.0 8 6.0

16 Volt Rating @+85 (10Volt Rating @+125)TCSVS1C224*PAR P 0.22 0.5 6 25.0TCSVS1C474*PAR P 0.47 0.5 6 25.0TCSVS1C684*PAR P 0.68 0.5 6 20.0TCSVS1C105*PAR P 1 0.5 6 20.0TCSVS1C225*PAR P 2.2 0.5 6 6.5

20 Volt Rating @+85 (13 Volt Rating @+125)TCSVS1D474*PAR P 0.47 0.5 4 25.0TCSVS1D684*PAR P 0.68 0.5 4 20.0

SVS-P Rating & Part Number Reference

* Insert K for ±10% tolerance and M for ±20%

5. DISSIPATION FACTOR (Tangent of Loss Angle)

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 16

Maximum Dissipation Factor, %

-55 +25 +85 +125

9 4 7 9

10 6 8 10

12 8 10 12

14 10 12 14

16 12 14 16

22 18 20 22

6. Marking

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 17

J case 4.7 6.3V

4 6.3 10 161.0 a B C

1.5 D E F G

2.2 I J K L

3.3 M N O P

4.7 R S T U

6.8 V W X Y

10 Z A

V

+

S

6.3VMarking

CAP. 1.0 1.5 2.2 3.3 4.7 6.8 10

Marking a E J N S W A

【Code Reference】

Polarity (White Stripe)

DC Working Voltage

Marking Description

-Expressed with one letter

-Refer to the 6.3V Marking example shown below

6. Marking specification

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 18

Capacitance Code

(A:1.0 E:1.5 J:2.2 N:3.3 S:4.7 W:6.8)

DC Working Voltage(G:4V J:6.3V A:10V C:16V D:20V)

P case

10 6.3V

Polarity (White Stripe)

Capacitance 1 DIGIT 2 DIGIT

< 1.0 Lower Case Lower Case

1.0≤ Cap.< 10 Upper Case Lower Case

≥ 10 Upper Case Upper Case

V

JA+

【Code Reference】

4 6.3 10 16 20

0.22 gj jj aj

0.33

0.47 gs js as cs ds

0.68 gw jw aw cw dw

1.0 Ga Ja Aa Ca

1.5

2.2 Gj Jj Aj Cj

3.3 Gn Jn An

4.7 Gs Js As Cs

6.8 Gw Jw

10 GA JA AA

15

22 GJ JJ

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 19

C,D case35V 10

DC Working Voltage

Capacitance in (10)

Polarity (White)

1035V

+

+ A106Capacitance Code (10×106pF = 10)

DC Working Voltage(G:4V J:6.3V A:10V C:16V D:20V E:25V V:35V)

A case10V 10

Polarity (White)

B case20V 10

Polarity (White)

Capacitance in (10)

DC Working Voltage

1020V+

7. Taping Specification

The tantalum chip capacitors shall be packaged in tape and reel form for effective use.

Tape : Semitransparent embossed plasticCover tape : Attached with heating press, polyesterThe tension of removing the cover tape, F=10∼70g

7-1. Carrier Tape Dimension

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 20

D1

Embossed

D2P0

P1P2

BA

K

t

F

E

W

Right handOrientation available

Embossed Carrier

Removal speed50mm/sec

15˚F

Cover Tape

Unit : mm (inch)

CaseCode

W±0.3(±0.012)

F±0.1(±0.004)

E±0.1(±0.004)

PO±0.1(±0.004)

P1±0.1(±0.004)

P2±0.1(±0.004)

D1+0.1(+0.004)

D2Min. t A±0.2(±0.008)

B±0.2(±0.008)

K±0.2(±0.008)

J

8(0.315)

3.5(0.138)

1.75(0.069)

4(0.157)

2(0.079)

4(0.157)

ø1.5(0.059)

ø0.6(0.024)

0.25(0.0098)

0.98(0.039)

1.80(0.071)

1.0(0.039)

P

ø1.0(0.039)

0.2(0.008)

1.4(0.055)

2.3(0.091)

1.4(0.055)

A 1.9(0.075)

3.5(0.138)

1.9(0.075)

B

0.3(0.012)

3.3(0.130)

3.8(0.150)

2.1(0.083)

C12

(0.472)

5.5(0.217)

8(0.315)

ø1.5(0.059)

3.7(0.146)

6.4(0.252)

3.0(0.118)

4.8(0.189)

7.7(0.303)

3.3(0.130)

D

7-2. Reel Dimension

7-3 Taping process

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 21

TapeWidth

A ±0.5(±0.079) N Min. C ±0.5

(±0.020)D ±0.5(±0.020)

B ±0.5(±0.020)

G ±0.3(±0.012)

W ±0.5(±0.020) R

8mmø178

(7)

ø70(2.756)

ø13(0.512)

ø26(1.024)

2(0.079)

9(0.354)

12(0.472) 0.99

(0.039)12mm ø60

(2.362)13

(0.511)16.5

(0.511)

8mmø330(13)

ø80(3.150)

ø21(0.827)

2(0.079)

9(0.354)

12(0.472) 0.99

(0.039)12mm 13

(0.511)16.5

(0.511)

(단위 : mm (inch) )

[ 한 릴(Reel)당 제품 수량 ]

Case Code Dia. 178mm Dia. 330mm

J 4,000 pcs/Reel -

P 3,000 pcs/Reel -

A, B 2,000 pcs/Reel 8,000 pcs/Reel

C, D 500 pcs/Reel 2,500 pcs/Reel

G

D R

B

C N A

W

ReelPacked

Part

Empty

Part

Lead Part

Adhesion Tape

Start

Empty Portion Chips Empty Portion Lead Part

50 mm

or more

End

230 mm

or more

180 mm

or more

Cover tape

Carrier Tape

8. Operational Attention

8-1. Resistance to Soldering heat

-Tantalum capacitor should be mounted on each tool in the way of regulated

soldering methods such as vapor phase, Convection, infrared, wave soldering

or hot plate.

-Recommended soldering methods and conditions are as follows.

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 22

100

200

100 200 300

Time(sec)

Cooling

245 Max

Temp.

Pre-heating

Heating

Typical Temperature Profile of Reflow Soldering

400

8-2. Reverse Voltage

As the solid tantalum chip capacitor has polarity in itself, it should be avoided

applying reciprocal current.

In case of short time current load, the applied voltage should not exceed following

range.

25 C : lower value between 10% of rated voltage and 1.0V

85 C : lower value between 5% of rated voltage and 0.5V

8-3. Ripple Voltage

① The sum of DC voltage and peak ripple voltage should not exceed the rated DC

working voltage of the capacitor. This is based on an ambient temperature of 25.

② For higher temperature, permissible ripple voltage shall be derated as follows.

Permissible voltage at 50 : 0.7 × permissible voltage at 25

Permissible voltage at 85 : 0.5× permissible voltage at 25

Permissible voltage at 125 : 0.3× permissible voltage at 25

8-4. Surge Voltage (Derating Voltage)

① When it is used in power circuit like low impedance circuit, it can possibly

increase the malfunction-rate due to the excessive current.

Therefore it is recommended using capacitor of which rated voltage is three-times

higher than applied voltage to reduce the danger of fire due to the short.

【Low-impedance circuits】

Power supply FILTER Power supply BY - PASS

② When switching or discharging current go through the circuit, it is recommended

using series resistor valued more than 3Ω per 1V and limiting current less than

300mA.

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 23

IC+

-

+

-

+

-

+

-

Power

supply

circuit

8-5. Mounting

① A capacitor that has been damaged should be discarded to avoid later problems

resulting from mechanical stress.

② Printed circuit boards on which capacitors are mounted should have a low

thermal expansion coefficient.

③ In reflow soldering, if footprints on printed circuit boards are much wider

than the capacitor terminals, the capacitor position may shift when the solder

melts.

④ With reflow or wave soldering, preheating at 150 max. for 5 min. or less is

recommended.

⑤ Pressure limit when mounting.

Pressure should be less than 500g(pressing time should be less than 5 sec) on φ1.5

vessel when pressed in sticking or centering seizer.

Especially, when using chip parts whose height is more than 1mm and the position of

sticking hole is lowered, huge pressure is forced on the capacitor.

Because of this pressing, capacitors and other parts can be flipped out and it will

be the cause of crack.

⑥ Flux

It should be avoided using high activity or acidity materials instead of rosin

metals.

8-6. Washing board

Use Chlorocene, Isopropyl alcohol, Freon-tes, etc. Operation should be done at the

temperature of 50 or less.

And supersonic wave washing should be done less than 5min at 0.02W/.

① During washing like above, it is recommended that you avoid washing mounted

capacitors with other parts.

And you should be careful in supersonic wave washing because the solid part of

other devices impact and cause damage in the lead.

② When you wash in different way, you should be prepared in advance.

8-7 When soldering irons are used for mounting, recommended conditions are as

follows;

1) Iron power : 30 W

2) Iron tip temperature : 300 max.

3) Soldering time : 3 sec. or less

8-8 Storage condition :

Required to store in normal temperature and humidity

(Temp : 5~35, Humidity : less than 75%RH)

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 24

197±5.0 Front

352±5.0

375±5.0

9. PACKAGING TABLE

( 단위 : mm )

30±1.0

185±1.0 Front

66±1.0

180±1.0

( 단위 : mm )

Inner BOX Outer BOX

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 25

TYPE inch

Taping packaging Box Packaging

packaging

CodeReels Tape Quantity

Weight

(g)

Inner Box Outer Box

ReelsQuantity

Max

Weight

(Kg)

Volume

X10-3

Inner

Box

Quantity

Max

Weight

(Kg)

Volume

X10-3

1608 0603 AR 7"

embo-

ssed

type

4,000 100 5 20,000 0.55 2.197 10 200,000 5.7 26

2012 0805 AR 7" 3,000 100 5 15,000 0.55 2.197 10 150,000 5.7 26

3216 1206AR 7" 3,000 100 5 15,000 0.55 2.197 10 150,000 5.7 26

CR 13" 8,000 700 5 40,000 3.6 9.285 5 200,000 18.2 50.279

3528 1311AR 7" 2,000 180 5 10,000 1 2.197 10 100,000 10.2 26

CR 13" 8,000 800 5 40,000 4.1 9.286 5 200,000 20.6 50.279

6032 2312AR 7" 500 130 4 2,000 0.57 2.197 10 20,000 5.9 26

CR 13" 2,500 650 4 10,000 2.8 9.286 5 50,000 14.2 50.279

7343 2816AR 7" 500 180 4 2,000 0.8 2.197 10 20,000 8.2 26

CR 13" 2,500 1000 4 10,000 4.16 9.286 5 50,000 20.7 50.279

10.PRODUCT FACTORY

Samsung Electro-Mechanics Philippines, Corp.

Block 5, CPIP, Brgy. Batino

Calamba, Laguna

Philippines

11.ENVIRONMENT CONSERVATION

We, Samsung, declare that our component Tantalum capacitor is produced in accordance

with EU RoHS directive.

1. RoHS Compliance and restriction of Br

The following restricted materials are not used in packaging materials as well

as products in compliance with the law and restrintion

- Cd, Pb, Hg, Cr+6, As, Br and the compounds, PCB, asbestos

- Bromic materials : PBBs, PSSOs, PBDO, PBDE, PBB

2. No use of materials breaking Ozone layer

The following ODS materials are not used in our fabrication process.

- ODS material : Freon, Haron, 1-1-1 TCE, CCI4, HCFC

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 26

Parts Materials

① Termination 100% Sn

② Wire Tantalum

③ Pellet Tantalum

④ Mn02 Layer Manganese

⑤ Carbon Layer Colloidal Carbon

⑥ Silver Layer Silver

⑦ Washer Teflon

⑧ Mold EMC

⑨ Silver Adhesive Silver

SOLID TANTALUM CHIP CAPACITORFILE NO.

10-S-CTN001 27

*Termination Solder Coating 100% Sn

Appendix 1 : Interanal Structure