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TactoTek® Smart Molded StructuresInjection Molded Structural Electronics (IMSE™)

Jussi Harvela, CEOwww.tactotek.com

RESHAPE RESTYLE REINVENT

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Design, HMI & Functionality Drive Differentiation

IntuitiveElectronic

Functionality

Modern

UndistractedComfortable

Aesthetics

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Design, HMI & Functionality Drive Differentiation

StylingFormable

IlluminationSensors

CommunicationControls

Perceived ValueSeamless

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Electronics Construction Today Limits Differentiation

Conventional electronics rely on multi-layer construction that imposes design constraints - structure drives design: Separate structural, mechanical

and electrical pieces Flat, rigid PCB dictates form Depth required for illumination

Design & functional differentiation requires 3D embedded smartness: Thin Light weight Seamless Cost-effective Conformal electronics

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Electronics Evolution Creates New Opportunities2020 2025 2030 2035200019801960 1970 1990 2010

Increasing Density

Multilayer IMSE

E l e c t r o n i c s w r a p p e d i n p l a s t i c b o x

Full Digital Manufacturing

Structural Electronics true paradigm

1st Printed Components

Simple Roll2Roll products

3D printed mass production of simple electronics

3D Flexible Circuit BoardR i g i d C i r c u i t B o a r d

2.5D Flexible Circuit Board

Increasing Conductivity

Stretchable Circuit Board

Components optimized for IMSE

MID (LDS)

Aerosol Jet Printing

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IMSE Evolution – 1000s of Person Years Invested

Rapid IMSE Adoption

MedicalAuto-motive

Industrial Appliances

IoT

Consumer Electronics + Advanced Materials + Paper & Printing Technologies

Major Academia Research Program Initiated by Finnish Industry and Financed by Finnish Government

TactoTek spins out from Academia to Industrialize Hybrid Printed Electronics

‘Structural Electronics’ Term coined by IDTechEx

1st Mass Production IMSE Shipments

1970s -1980s

1990s -2010s

2011

2012-2013

2018

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TactoTek® IMSETM Building Blocks

IMSE – Injection Molded Structural Electronics

Chip-based electronics

Printed electronics Injection Molded

Plastic Structures

Process & Design * (IPR + Knowhow) = Digitalized IMSE Mass-Manufacturing Process

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TactoTek IMSETM Process in Nutshell

1.Print decoration, wiring, touch

controls, and antennas

2. Mount components on

flat film

4.Injection mold final

single-part assembly

3.Form 3D shape with

components

MANUFACURING FLOW *SMART* IN-MOLD LABELLING (IML)

High-speed mass manufacturing process Standard processing equipment in each step—

existing capital equipment can be re-purposed

Off-the-shelf certified materials & electronics 1- or multi-film structure Variety of surface materials, including wood

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IMSE Designer™ Enables Customers to Design IMSE PartsCustomer designs the product with TactoTek IMSE Designer™

CAD/CAE tool extensions with IMSE design guidelines and reference designs (Catia, Altium, Cadence)

Material and component libraries

Manufacturing guidelines

Testing guidelines for product performance, functionality and reliability

Training and support

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How it Is Done with IMSEOverhead Control PanelIMSE solution3mm molded material thickness1 molded part + small PCBA150 gram weightTCO more than 25% less

How it Was Done BeforeOverhead Control PanelTraditional electronics assembly45mm assembly depth64 parts + PCBA650 gram weight

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Suunto Smart Connector

10K+ twist and bends50+ washing cycles

www.movesense.com

Customer Case

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Smart Ashtray Cover

3mm thicknessSeat heater controlAir ventilation control

www.quin-automotive.com

Customer Case

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Wooden Door Trim

3mm thicknessIlluminated seat controls

www.novem.com

Customer Case

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Legacy IMSE

35% reduction in CO2eq Significant reductions in manufacturing

energy requirements and complexity Fewer different materials enable leaner

and cleaner manufacturing and more effective end of life management

Up to 80% reduction in part mass Sustainable surface materials Possibilities for biobased plastics

Graph: Screening LCA and environmental impacts of injection molded structural electronics by VTT

-35%

Technological and Sustainable Leadership

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TACTOTEK® – RECOGNIZED LEADER IN IN-MOLD STRUCTURAL ELECTRONICS (IMSETM) Founded 6/2011 95+ employees HQ in Oulu, Finland Sales offices in USA, Germany,

Switzerland, Japan and South Korea Core business: technology licensing and manufacturing

of 3D smart in-mold electronics

Design services to migrate traditional designs into structural electronics designs

Patented and patent pending manufacturing processes and applied uses

Primary markets: Automotive, Appliances, IoT/Wearables, Industrial, Medical Devices

Investors: Conor, VTT Ventures, Faurecia Ventures, Plastic Omnium, Nanogate, Ascend Capital, Leaguer VC, Private Angels, EU H2020

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TactoTek® Smart Molded StructuresInjection Molded Structural Electronics (IMSE™)

Jussi Harvela, CEOwww.tactotek.com

RESHAPE RESTYLE REINVENT