TABLE OF CONTENTS - Panasonic Industrial Devices · PDF filegpio11/bts b2 gpio12/wia c3 ... a1 a7 a9 a11 a12 c8 c9 ... n.c. b7 n.c. b6 n.c. d5 n.c. b5 n.c. b4 n.c. b1 n.c. a8 n.c

1CLASSIFICATION Design Guide No. DS-DG-1026 USB

REV. 0.2

SUBJECT Development Kit for PAN1026 USB Dongle PAGE 1 of 13

CUSTOMER’S CODE PAN1026 USB

PANASONIC’S CODE PAN1026 USB DATE 12.11.2013

TABLE OF CONTENTS

1 Scope of this Document .................................................................................................. 2 2 Bluetooth 4.0 ................................................................................................................... 2 3 Bluetooth marks .............................................................................................................. 2 4 Software related Documents Summary .......................................................................... 3

4.1 Predefined High Level APIs ................................................................................... 3 4.2 Document overview ............................................................................................... 4

5 PAN1026 USB Evaluation kit .......................................................................................... 5 5.1 Block Diagram PAN1026 Module .......................................................................... 5 5.2 Reference Design USB evaluation kit .................................................................... 6 5.3 Placement (Live View) ........................................................................................... 7 5.4 Overview for the USB Evaluation board Options ................................................... 7 5.5 placement recommondations ................................................................................. 8 5.6 Recommended Tools ............................................................................................. 9

6 Development of Applications ......................................................................................... 10 7 Ordering Information ..................................................................................................... 11 8 History for this Document .............................................................................................. 11 9 Related Documents....................................................................................................... 12 10 General Information ...................................................................................................... 13 11 FCC Warning ................................................................................................................ 13 12 Life Support Policy ........................................................................................................ 13


REV. 0.2




1 SCOPE OF THIS DOCUMENT

This Design Guide applies to the Bluetooth development platform PAN1026 USB. The intention is to enable our customers to easily and fast integrate our module PAN1026 in their product.

This guide describes the Hardware and gives usefull hints. Software related documents are described in chapter 4.

Please refer to chapter 6 Development of Applications for an overview.

2 BLUETOOTH 4.0

Bluetooth Low Energy (BLE), part of Bluetooth Ver. 4.0, specifies two types of implementation: Single mode and dual mode. Single mode chips implement the low energy specification and consume just a fraction of the power of classic Bluetooth, allowing the short-range wireless standard to extend to coin cell battery applications for the first time. Dual mode chips combine low energy with the power of classic Bluetooth and are likely to become a de facto feature in almost all new Bluetooth enabled cellular phones and computers.

Single mode Bluetooth 4.0 Low Energy is not backwards compatible with previous Bluetooth standards. Dual mode Bluetooth 4.0 Low Energy is backwards compatible but is not practical for low power devices but targeted to gateway products.

In case BLE is constantly connected and constantly sends data power consumtion will be In case BLE is constantly connected and constantly sends data power consumption will be similar like Classic Bluetooth. The BLE maximal net data rate is about 6Kb/sec compared to 2Mb/sec with Bluetooth EDR. The typical BLE packet size is 20Bytes.

3 BLUETOOTH MARKS

According to the new Bluetooth SIG marks “Bluetooth Smart” (single mode mainly sensors) and “Bluetooth Smart Ready” (dual mode gateway and hub devices) the PAN1026 fulfills criteria to lable your product as a Bluetooth Smart Ready device.


REV. 0.2




4 SOFTWARE RELATED DOCUMENTS SUMMARY

4.1 PREDEFINED HIGH LEVEL APIS

Toshiba Application Note [9]

Make use of the Easy to use High-Level SPP and Bluetooth Low Energy API for PAN1026 setup, connect and data transfer in an easy way. Driver layer provide access to the entire function set of the module. SPP and Bluetooth Low Energy application example is available on Toshiba CortexM3 MCU with FreeRTOS integration. High Level SPP APIs are sufficient for communication with a remote SPP device. With the LE+GATT Driver the use of PAN1026 Command Interface is simplified. It encapsulates Chiron LE MNG, GAP & GATT Commands in one.

High Level SPP APIs High Level BLE APIs Documentation • SPP API Specification

• SPP Driver Specification • SPP Application Note

• BLE API Specification • LE+GATT Driver

Specification • LE Heart-Rate Profile

Application Note Software • SPP Application example

source code • SPP API as source code • SPP drivers as source code • Project files for Toshiba TMPM395 MCU

• LE Application example source code

• LE Heart-Rate Profile example source code

• BLE API source code • LE+GATT driver source

code • Project files for Toshiba

TMPM369 MCU


REV. 0.2




4.2 DOCUMENT OVERVIEW

The individual PDF’s are available for download [5]

Document Version Description

Command Descriptions

TC35661APL_ROM501_Extension_HCI_E_7thAugust2013 7Aug2013 HCI command set description.

TC35661APL_ROM501_GATT_E_20thNovember2013 20Nov2013 GATT command set description.

TC35661APL_ROM501_LE_MNG_E_20thNovember2013 20Nov2013 LE management command set description.

TC35661APL_ROM501_MNG_E_26thJuly2013 26Jul2013 Chip Management command set description.

TC35661APL_ROM501_SDB_E_26thJuly2013 26Jul2013 Server Database command set description.

TC35661APL_ROM501_SMP_SDS_E_21stAugust2013 21Aug2013 Security Manager Protocol command set description.

TC35661APL_ROM501_SPP_E_24thJune2013 24Jun2013 Serial Profile Protocol command set description.

Message Sequence Charts

TC35661APL_ROM501_LE_MSC_E_20thNovember2013 20Nov2013 Low-energy procedures.

TC35661APL_ROM501_MNG_MSC_E_24thJune2013 24Jun2013 Management procedures.

TC35661APL_ROM501_SMP_MSC_E_3rdOctober2013 3Oct2013 Security Manager procedures.

TC35661APL_ROM501_SPP_MSC_E_24thJune2013 24Jun2013 Serial Protocol Profile Procedures.


REV. 0.2




5 PAN1026 USB EVALUATION KIT

PAN1026ETU (EasyToUse) is a development platform for PAN1026 BLE dual module to implement Bluetooth functionality into various electronic devices.

The PAN1026ETU is intended for evaluation purpose and can be used together with EasySPP and EasyBLE Software. The API, a very useful abstracted tool is described on the Toshiba website: http://www.toshiba-components.com/bluetooth/technicaldocuments.html Please contact your local sales office for further details on additional options and services, by visiting www.panasonic.com/rfmodules for US and http://industrial.panasonic.com/eu/ for Europe or write an e-mail to [email protected]

5.1 BLOCK DIAGRAM PAN1026 MODULE

http://www.toshiba-components.com/bluetooth/technicaldocuments.html

http://www.panasonic.com/rfmodules

http://industrial.panasonic.com/eu/

mailto:[email protected]


REV. 0.2




5.2 REFERENCE DESIGN USB EVALUATION KIT

+3V3

+3V3

n.c.

/0n.c.

/02

+5V

0 O

hm/4

7p0

Ohm

/47p

1µ

4µ7

B3U-

1000

P

1k5

+3V3

US

B_A

BLM

15BB

121S

N1

4µ7

+5V

10nF

100n

F

FT23

2RQ

BLM

15BB

121S

N1

100nF4µ

7

+3V3

100n

F

0 0 0 0

0 0+5V

PAN

1026

PAN

1026

n.c.

/0

n.c.

/0

100n

F

n.c.

+3V3

+3V3

Green270

100n

F

SO

2520

-000

032

+3V3

100n

F

0

+3V3

0/n.

c.

-Sup

ply-

Par

t

EN3

IN1

NC

4

OU

T5

IC3

TPS7

6933

R3

R2

R15

C4

C5

C12

C11

S1

R10

12

34

56

78

910

DN

2D

P3

GND@1 GND@2

US

B_G

ND

4

US

B_V

CC1

X2

GND@3 GND@4

L2

C13

C3

C1

IC2 V

CC19

3V3O

UT

16

US

BDP

14U

SB

DM15

OS

CO28

OS

CI27

GN

D4

TXD

30R

XD2

RTS

#32

CTS

#8

DTR

#31

DS

R#6

DC

D#7

RI#

3

CB

US0

22C

BU

S121

CB

US2

10C

BU

S311

CB

US4

9

VC

CIO

1

RE

SET

#18

GN

D24

GN

D17

TEST

26

GN

D20

L1C8

C2

C6

R5

R6

R7

R8

R11

R12

RF

D9

GPI

O5/

FSYN

CC

7G

PIO

4/P

CMC

LKC

6G

PIO

3/P

CMIN

D6

GPI

O2/

PCM

OU

TE7

GPI

O16

/DIN

D2

GPI

O17

/CS0

XC

1G

PIO

18/C

S1X

D1

GPI

O10

/BTA

B3G

PIO

11/B

TSB2

GPI

O12

/WIA

C3

GPI

O13

/BTI

C2

EE

PRO

MW

PF2

GPI

O14

/SCL

E2G

PIO

15/S

DAE1

GPI

O6/

UAR

TTX

F7G

PIO

7/U

ARTR

XE6

GPI

O8/

RTS

F8

GPI

O0/

UR

DYD

4U

RDY

E4U

SB

DPF3

US

BDM

F4

RE

SET

X1

A3

PAN

1026

_P

OR

TS

GPI

O9/

CTS

F5

GPI

O1

D3

SLE

EP

CLK

F6C

LKR

RQE5

VCC

A6V

CCA5

VC

C_D

VD

DBA4

GN

DF1

2G

ND

F11

GN

DF9

GN

DF1

GN

DE9

GN

DE8

GN

DD

8G

ND

D7

GN

DC

9G

ND

C8

GN

DA1

2G

ND

A11

GN

DA9

GN

DA7

GN

DA1

N.C

.C

5N

.C.

C4

N.C

.B9

N.C

.B8

N.C

.B7

N.C

.B6

N.C

.D

5

N.C

.B5

N.C

.B4

N.C

.B1

N.C

.A8

N.C

.A2

VD

DU

SBE3

R13

R1

C10

R4

LED

R14

C9

STA

ND

BY1

GN

D2

VDD

4O

UTP

UT3

IC1

C7

R9

R16

DP

DP

RES

ET

RES

ET

RES

ET

DN

DN

MO

D_R

X

MO

D_R

X

MO

D_T

X

MO

D_T

X

MO

D_C

TS

MO

D_C

TS

MO

D_R

TS

MO

D_R

TS

USB

DP

USB

DP

USB

DM

USB

DM

GPI

O0

GPI

O0

SCL

SCL

SDA

SDA

SLEE

PCLK

SLEE

PCLK

SLEE

PCLK

GPI

O1

GPI

O1

Addi

tiona

l tes

tpin

s

V1.0

Plac

emen

tDiff

eren

ce fo

rC4,

C5,

R1,

R2,

R3,

R13

and

R16

:du

e to

diffe

rent

func

tions

:UAR

Tor

Dire

ctU

SBU

ART

/Dire

ctU

SB //

The

diffe

rent

varia

nts

are

sepe

rate

dby

back

slas

h.Le

ftsi

deis

forU

ART,

right

side

isU

SBdi

rect

.

This

area

will

notb

epl

aced

whe

nU

SBis

used

32.7

68kH

zop

tiona

l Osc

illato

ron

lyne

eded

whe

nsp

ecia

lsle

epm

ode

USB

isN

OT

supp

orte

dye

tby

the

IC

UA

RT

AR

EA

PAN

1026

ETU

Re

fere

nce

Des

ign

with

UA

RT

and

US

BO

ptio

n

DS-

DG

-102

6ETU

-205

IC1

ism

ount

edon

the

boar

d

UFL

GN

D


REV. 0.2




5.3 PLACEMENT (LIVE VIEW)

RTS CTS RX TX

5.4 OVERVIEW FOR THE USB EVALUATION BOARD OPTIONS

RTS CTS RX TX


REV. 0.2




5.5 PLACEMENT RECOMMONDATIONS

PAN1026Outline

Top View

8.7

15.6

Restricted AreaNo copper any layer

5.00

3.00

Min. 15mmMin. 15mm

Dimensions are in mm.

Use a Ground plane in the area surrounding the

PAN1026 module wherever possible.

Min.

40mm

If possible place PAN1026 in the center of mother PCB.

Place PAN1026 at the edge of mother PCB.

PAN1026 WITH ANTENNA PLACEMENT


REV. 0.2




5.6 RECOMMENDED TOOLS EasySPP: This tool is the first step to get familiar with the TCU commands. The issued commands can be copied and then ported to any microcontroller. Hyperterminal is not recommended to use because the commands are in binary format. You will need Microsoft .NET framework version 4, which can be downloaded from the Microsoft website. http://www.pedeu.panasonic.de-Link Easy SPP+BLE EasySPP documentation includes an application example how to connect PAN1026 USB stick and an Android device with the app BlueSPP.

Easy BLE: This tool has the same intention as the EasySPP and shows some example BLE profiles e.g. heart rate sensor. It can be used together with various of the shelf Apps running on iPhone and Android phones supporting BT.4.0. One example is “Wahoo Utility” which is available in the Apples iTunes App Store. http://www.pedeu.panasonic.de-Link Easy SPP+BLE EasyBLE documentation includes an application example how to connect PAN1026 USB stick and an iOS device

http://www.pedeu.panasonic.de/pdf/185ext.zip

http://www.pedeu.panasonic.de/pdf/185ext.zip


REV. 0.2




6 DEVELOPMENT OF APPLICATIONS

Please contact your local sales office for customized development of your individual application. The API is described here: http://www.toshiba-components.com/bluetooth/technicaldocuments.html Recommended toolchain: IAR, J-Link debugger

The BMSKTOPASM369BT(kc) starter kit makes it possible to quickly and easily evaluate Toshiba’s Bluetooth® Dual Mode LSI TC35661-5xx in combination with Toshiba CortexM3 MCU as host MCU. It is made to execute the Toshiba Bluetooth Driver software and debug user application code via an embedded J-Link debugger interface. The TMPM369FDFG Microcontroller offers embedded Ethernet, CAN, USB host, USB device and RS-232 connectivity. Starter Kit Content: • Toshiba TOPAS369BT Board • Segger J-Link JTAG/SWD Emulator with USB interface • J-Link 19-pin Cortex-M Adapter • USB Cable • Rapid Start-up Guide

Please contact your local sales office for further details on additional options and services, by visiting www.panasonic.com/rfmodules for US and http://industrial.panasonic.com/eu/ for Europe or write an e-mail to [email protected]


http://www.panasonic.com/rfmodules

http://industrial.panasonic.com/eu/

mailto:[email protected]


REV. 0.2




7 ORDERING INFORMATION

Ordering part number Description

Development Kits

PAN1026ETU Development Kit (includes 2 USB Sticks)

Modules

ENW89837A3KF PAN1026 CLASS 2 Bluetooth dual mode Module according BT-4.0. 115kBaud Bluetooth® smart ready device

PAN1026 CLASS 2 Bluetooth dual mode Module according BT-4.0. 9k6Baud Bluetooth® smart ready device

8 HISTORY FOR THIS DOCUMENT

Revision Date Modification / Remarks

0.1 05.02.2013 1st version.

0.2 17.12.2013 Several new informations regarding the BLE part.


REV. 0.2




9 RELATED DOCUMENTS For an update, please search in the suitable homepage. [1] PAN1026 Product Flyer

http://pideu.panasonic.de/pdf/185Productflyer.pdf [2] PAN1026 API Description

http://www.toshiba-components.com/bluetooth/technicaldocuments.html [3] PAN1026 Datasheet

http://pideu.panasonic.de/pdf/185Datasheet.pdf [4] EasySPP - BLE PC Evaluation Software for PAN1026ETU and Software-Guide

http://pideu.panasonic.de/pdf/185ext.zip [5] SPP + BLE Documentation and Application Note

http://pideu.panasonic.de/pdf/185ext2.zip [6] Semiconductor Website:

http://www.toshiba-components.com/bluetooth/index.html [7] Application Note Land Grid Array

http://www.pideu.panasonic.de/pdf/184ext.pdf [8] REACH and RoHS Certificate

http://www.pideu.panasonic.de/pdf/182ext2.jpg [9] Bluetooth™ Embedded BLE-GATT

(Bluetooth™ Low Energy – Generic Attribue Profile) Application Note http://www.toshiba-components.com/bluetooth/technicaldocuments.html

[10] Toshiba Bluetooth™ Embedded SPP (Serial Port Profile) Application Note http://www.toshiba-components.com/bluetooth/technicaldocuments.html

http://pideu.panasonic.de/pdf/185Productflyer.pdf


http://pideu.panasonic.de/pdf/185Datasheet.pdf

http://pideu.panasonic.de/pdf/185ext.zip

http://pideu.panasonic.de/pdf/185ext2.zip

http://www.toshiba-components.com/bluetooth/index.html

http://www.pideu.panasonic.de/pdf/184ext.pdf

http://www.pideu.panasonic.de/pdf/182ext2.jpg




REV. 0.2




10 GENERAL INFORMATION © Panasonic Industrial Devices Europe GmbH 2012. All rights reserved. This product description does not lodge the claim to be complete and free of mistakes. Please contact the related product manager in every case. If we deliver ES samples to the customer, these samples have the status Engineering Samples. This means, the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and there may be differences to be published Data Sheet. Engineering Samples are not qualified and are not to be used for reliability testing or series production. Disclaimer: Customer acknowledges that samples may deviate from the Data Sheet and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by

• the use of the Engineering Sample other than for Evaluation Purposes, particularly the installation or integration in an other product to be sold by Customer,

• deviation or lapse in function of Engineering Sample, • improper use of Engineering Samples.

Panasonic disclaimes any liability for consequential and incidental damages. In case of any questions, please contact your local sales partner or the related product manager.

11 FCC WARNING

This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.

The FCC and other regulatory certifications for the PAN1026 will be published in the PAN1026 Datasheet, please refer to [3].

12 LIFE SUPPORT POLICY This Panasonic product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Panasonic customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic for any damages resulting.