TA Document 2001018 IDB-1394 Automotive Specification 11394ta.org/wp-content/uploads/2015/07/20010181.pdf · 1394 Automotive Specification (IDB-1394) TA Document 2001018/1.0, March

Copyright 1996-2004 by the 1394 Trade Association. 1111 South Main Street, Suite 100, Grapevine, TX 76051, USA http://www.1394TA.org All rights reserved. Permission is granted to members of the 1394 Trade Association to reproduce this document for their own use or the use of other 1394 Trade Association members only, provided this notice is included. All other rights reserved. Duplication for sale, or for commercial or for-profit use is strictly prohibited without the prior written consent of the 1394 Trade Association.

TA Document 2001018 IDB-1394 Automotive Specification 1.0 March, 18th 2003

Sponsored by: 1394 Trade Association and the IDB-Forum

Accepted for Release by: 1394 Trade Association Board of Directors.

Abstract: Supplemental information for a high-speed serial bus that integrates well with most IEEE standard 32-bit and 64-bit parallel buses is specified. It is intended to extend the usefulness of a low-cost interconnect integrated into an automobile environment between an embedded backbone and external peripherals. The standard follows the IEEE Std 1212-1991 Command and Status Register (CSR) architecture.

Keywords: Bus, computers, high-speed serial bus, interconnects, automotive.

1394 Automotive Specification (IDB-1394) TA Document 2001018/1.0, March 18th 2003

Page 2 Copyright © 2004, 1394 Trade Association. All rights reserved.

1394 Trade Association Specifications are developed within Working Groups of the 1394 Trade Association, a non-profit industry association devoted to the promotion of and growth of the market for IEEE 1394-compliant products. Participants in working groups serve voluntarily and without compensation from the Trade Association. Most participants represent member organizations of the 1394 Trade Association. The specifications developed within the working groups represent a consensus of the expertise represented by the participants.

Use of a 1394 Trade Association Specification is wholly voluntary. The existence of a 1394 Trade Association Specification is not meant to imply that there are not other ways to produce, test, measure, purchase, market or provide other goods and services related to the scope of the 1394 Trade Association Specification. Furthermore, the viewpoint expressed at the time a specification is accepted and issued is subject to change brought about through developments in the state of the art and comments received from users of the specification. Users are cautioned to check to determine that they have the latest revision of any 1394 Trade Association Specification.

Comments for revision of 1394 Trade Association Specifications are welcome from any interested party, regardless of membership affiliation with the 1394 Trade Association. Suggestions for changes in documents should be in the form of a proposed change of text, together with appropriate supporting comments.

Interpretations: Occasionally, questions may arise about the meaning of specifications in relationship to specific applications. When the need for interpretations is brought to the attention of the 1394 Trade Association, the Association will initiate action to prepare appropriate responses.

Comments on specifications and requests for interpretations should be addressed to:

Editor, 1394 Trade Association 1111 South Main Street, Suite 100 Grapevine, TX 76051, USA

1394 Trade Association Specifications are adopted by the 1394 Trade Association without regard to patents which may exist on articles, materials or processes or to other proprietary intellectual property which may exist within a specification. Adoption of a specification by the 1394 Trade Association does not assume any liability to any patent owner or any obligation whatsoever to those parties who rely on the specification documents. Readers of this document are advised to make an independent determination regarding the existence of intellectual property rights, which may be infringed by conformance to this specification.

TA Document 2001018/1.0, March, 18th 2003 1394 Automotive Specification (IDB-1394)

Copyright © 2004, 1394 Trade Association. All rights reserved. Page 3

Contact information

Much of the information in this document is preliminary and subject to change. Members of the AuWG are encouraged to review and provide inputs for this proposal. For document status updates, please contact:

Brad Little, Chairman 1394 Automotive WG Texas Instruments 6412 Highway 75 South, MS 860 Sherman, TX 75090 E-Mail: [email protected] Phone: 903-868-6496 Fax: 903-868-6245 Chairman 1394 Cable/Connector WG Co-Chairman 1394 Automotive WG Max Bassler Frank Desjarlais Molex Inc. Ford Motor Company 2222 Wellington Ct. AVT Bldg. #5, MD5015 Lisle, IL 60532 20000 Rotunda Dr. E-Mail: [email protected] Dearborn, MI 48121 Phone: 630-527-4490 E-Mail: [email protected] Fax: 630-969-1352 Phone: 313-248-4133 Fax: 313-594-4340

You can also submit comments using the 1394 TA reflector at [email protected] or [email protected]. To subscribe to the reflector, you need to be a member of the 1394 Trade Association. Its web site address is:

http://www.1394TA.org/

Once you are a member, go to the members-only section, and subscribe to the 1394-AV reflector.

NOTE — The information on this page should be removed when this document is accepted.



Table of contents

1. Overview .....................................................................................................................................................9 1.1 Purpose ...............................................................................................................................................9 1.2 Scope ..................................................................................................................................................9

2. References .................................................................................................................................................10

3. Definitions .................................................................................................................................................13 3.1 Conformance Levels.........................................................................................................................13 3.2 Glossary of Terms ............................................................................................................................13 3.3 Acronyms and Abbreviations ...........................................................................................................15

4. Summary of New Features ........................................................................................................................18 4.1 System Requirements .......................................................................................................................18 4.2 System Topology..............................................................................................................................18 4.3 Physical Layer ..................................................................................................................................18

4.3.1 Embedded Devices .................................................................................................................18 4.3.2 Portable Devices/CCP ............................................................................................................19

5. Extended Power Management ...................................................................................................................20 5.1 Automotive Power Management Requirements ...............................................................................20 5.2 New 1394 Automotive Port States ...................................................................................................20

5.2.1 Sleep State Characteristics .....................................................................................................21 5.2.2 Mapping of Port States to Node Modes (Informative) ...........................................................21

5.3 Ultra Low Power Consumption (Informative)..................................................................................22 5.4 Sleep State Detection Circuitry ........................................................................................................23

5.4.1 Automotive FOT Architecture Example (Informative) ..........................................................24 5.5 System Power Master and Local Power Manager ............................................................................25

5.5.1 Entering the Sleep State via a Power Status Signal (Optional)...............................................26 5.6 Port State Transitions .......................................................................................................................26 5.7 Sleep Mode Implementation (Informative) ......................................................................................27 5.8 Customer Convenience Port (CCP) ..................................................................................................31 5.9 CCP Power Requirements ................................................................................................................33

6. Higher Layer Functional Description ........................................................................................................34 6.1 Overview ..........................................................................................................................................34 6.2 State Transitions ...............................................................................................................................35

6.2.1 Transition from Active State to Inactive State (Shutdown)....................................................35 6.2.2 Transition from Active State to Down State (System Failure) ...............................................35 6.2.3 Transition to Active State (Re-Load, Re-Init) ........................................................................35

6.3 System Power Master (SPM) ...........................................................................................................35 6.3.1 System Power Master Decisions (Informative) ......................................................................35

6.4 Local Power Manager (LPM)...........................................................................................................36 6.5 Power Management Protocol (PMP) ................................................................................................36

6.5.1 Procedures for the Power Management..................................................................................37 6.6 Messages ..........................................................................................................................................40 6.7 Automotive CTS CODE...................................................................................................................40

7. Automotive Message Sets and Application Layer Protocols.....................................................................41 7.1 Automotive Message Sets ................................................................................................................41

8. Plastic Optical Fiber (POF) .......................................................................................................................42 8.1 Performance Criteria ........................................................................................................................42

8.1.1 Embedded Network................................................................................................................42 8.1.2 POF Connectors .....................................................................................................................43



8.1.3 POF Cable (Reference) ..........................................................................................................43 8.1.4 Fiber Optic Transceiver (Reference) ......................................................................................44 8.1.5 Materials.................................................................................................................................44

8.2 Dimensional Criteria ........................................................................................................................44 8.2.1 POF Header with Integrated FOT and Inline POF Cable Socket ...........................................45 8.2.2 POF Header with Integrated FOT Printed Circuit Board Spacing (Reference)......................47 8.2.3 POF Header with Integrated FOT Printed Circuit Board Layout (Reference) .......................48 8.2.4 Inline POF Cable Plug............................................................................................................49 8.2.5 Mated POF Interface ..............................................................................................................51 8.2.6 POF Cable (Reference) ..........................................................................................................52

8.3 Performance Validation....................................................................................................................52 8.4 POF Header with Integrated FOT to POF Inline Plug Connector and POF Inline Cable Plug Connector to POF Inline Cable Socket Connector.......................................................................................................53

8.4.1 Testing (Reference) ................................................................................................................53 8.4.2 Test Set Up .............................................................................................................................54 8.4.3 POF Cable ..............................................................................................................................74 8.4.4 FOT (Reference).....................................................................................................................83 8.4.5 POF System Link Embedded Network (Reference)...............................................................90

9. Portable Devices - Customer Convenience Port Definition.......................................................................94 9.1 CCP Socket Performance Criteria ....................................................................................................94 9.2 CCP Dimensional Criteria ................................................................................................................96 9.3 CCP Plating Criteria .........................................................................................................................98

9.3.1 Mating Area Finish on Socket Contacts .................................................................................98 9.3.2 Mating Area Inner and Outer Shell ........................................................................................98 9.3.3 PCB Termination Area Finish on Socket and Shell Contacts ................................................98

9.4 CCP Performance Validation ...........................................................................................................98 9.4.1 Performance Group A: Copper Socket Basic Construction, Workmanship, Dimensions & Plating Thickness.......................................................................................................................................100 9.4.2 Performance Group B: Copper Socket DC Electrical Functionality when Subjected to Mechanical Shock and Vibration......................................................................................................................101 9.4.3 Performance Group C: Copper Socket DC Electrical Functionality when Subjected to Thermal Shock and Humidity Stress ......................................................................................................................102 9.4.4 Performance Group D: Copper Socket Insulator Integrity when Subjected to Thermal Shock and Stress 103 9.4.5 Performance Group E: Copper Socket DC Electrical Functionality when Subjected to Mechanically Cycling and Corrosive Gas Exposure............................................................................................104 9.4.6 Performance Group F: Copper Socket DC Electrical Functionality and Unmating Forces when Subjected to Temperature Life Stress............................................................................................106 9.4.7 Performance Group G: Copper Socket Mechanical Retention and Durability .....................107 9.4.8 Performance Group H - Copper Socket Subjected to Fluid Resistance................................108 9.4.9 Performance Group I: General Tests ....................................................................................110 9.4.10 Signal Propagation Performance Criteria ...........................................................................111

9.5 Power..............................................................................................................................................112 9.5.1 CCP ......................................................................................................................................112

Annex A: Power Budget (Reference) .....................................................................................................113 A.1 Theoretical Total Power Budget..................................................................................................113 A.2 POF Cable ...................................................................................................................................113 A.3 Interface POF Connector .............................................................................................................113 A.4 In-Line POF Connector ...............................................................................................................113 A.5 Bending, Temperature and Thermal Aging .................................................................................113 A.6 System Margin (Two Inline POF Mated Connectors and 9 Meters Total Length of POF Cable)114 A.7 Production Validation..................................................................................................................114



List of figures

Figure 4-1: System Topology .......................................................................................................................19 Figure 5-2: Mapping of Port States to Node Modes ......................................................................................21 Figure 5-3: Maximum Current in Sleep Mode ..............................................................................................22 Figure 5-4: Time Diagram for Sleep Mode ...................................................................................................23 Figure 5-5: Automotive Extended Node Architecture...................................................................................23 Figure 5-6: Principal Setup of the FOT with Sleep State and Wakeup Functionality ...................................24 Figure 5-7: 1394 with PMD Sleep/WakeUp (informative) ...........................................................................25 Figure 5-8: 1394 with PMD w/o Sleep/WakeUp (informative).....................................................................26 Figure 5-9: Port State Transitions..................................................................................................................26 Figure 5-10: Port state machine.....................................................................................................................28 Figure 5-11: Data structures ..........................................................................................................................29 Figure 5-12: Shared variables........................................................................................................................29 Figure 5-13: Node level processing...............................................................................................................29 Figure 5-14: Port actions ...............................................................................................................................30 Figure 5-15: Example for CCP Topology with Legacy Device.....................................................................31 Figure 5-16: Example for CCP Topology with Automotive Devices............................................................32 Figure 5-17: Automotive Device Connecting to a Non-Sleep State Capable Device....................................32 Figure 6-1: Higher Layer Power State Transition Diagram...........................................................................34 Figure 6-2: HL-States Node-Modes Mapping..........................................................................................34 Figure 6-3: Power Management Entities .......................................................................................................36 Figure 6-4: Cooperative (usual) Change to Inactive State (Successful) (Informative) ..................................38 Figure 6-5: Cooperative (usual) Change to Inactive State (Not Successful) (Informative) ...........................39 Figure 6-6: Forced Change to Inactive State (Informative) ...........................................................................39 Figure 8–1: POF Header with Integrated FOT and Inline POF Cable Socket ...............................................45 Figure 8-2: POF Header with Integrated FOT and Inline POF Cable Socket (Section A-A, Detail A1 and Detail A2)

...............................................................................................................................................................46 Figure 8-3: POF Header with Integrated FOT Printed Circuit Board Layout (Reference)............................47 Figure 8-4: POF Header with Integrated FOT Printed Circuit Board Layout (Reference)............................48 Figure 8-5: Inline POF Cable Plug ................................................................................................................49 Figure 8-6: Inline POF Cable Plug (Section A-A, Detail B1, Detail B2 and Detail B3) ...............................50 Figure 8-7: Mated POF Interface Minimum Optical Surface Gap ................................................................51 Figure 8-8: POF Cable Construction Alternatives (Reference) .....................................................................52 Figure 8-9: Energized for Discontinuity POF Header with Integrated FOT to POF Inline Cable Connector Plug

...............................................................................................................................................................54 Figure 8-10: Energized for Discontinuity POF Inline Cable Connector Socket to POF Inline Cable Connector Plug

...............................................................................................................................................................55 Figure 8-11: POF Header with Integrated FOT to POF Inline Cable Plug Connector ..................................56 Figure 8-12: POF Inline Cable Plug Connector to POF Inline Cable Socket Connector ..............................57 Figure 8-13: Output Power (Upper Illustration) and Sensitivity (Either Lower Illustrations) Test Setup.....58 Figure 8-14: POF Header with Integrated Transceiver Shock (Upper illustration) and Vibration (Lower illustration)

Test Fixture............................................................................................................................................65 Figure 8-15: POF Inline Connector Shock and Vibration Test Fixture .........................................................65 Figure 8-16: Cable flexing Test Setup...........................................................................................................73 Figure 8-17: POF Cable Test Setup...............................................................................................................74 Figure 8-18: Cable Bending Test Setup.........................................................................................................77 Figure 8-19: Torsion test set up .....................................................................................................................79 Figure 8-20: Edge and Plane Impact Test Setup............................................................................................83 Figure 8-21: POF System Link Embedded Network.....................................................................................91 Figure 9-1: Proper Plug Mating Orientation Graphic (Reference) ................................................................95 Figure 9-2: Proper Plug Mating Orientation Graphic (Reference) ................................................................95 Figure 9-3: CCP socket body profile and interface from panel opening (Normative)...................................96 Figure 9-4: CCP socket PCB footprint (Reference) ......................................................................................97 Figure 9-5: Contact Resistance and Shield Measurement Locations (Figure 5-27 from IEEE Std 1394b-2002)

...............................................................................................................................................................99



Figure A-1: Automotive Assembly Sequence .............................................................................................114 Figure A-2: Worse Case Power Budget Based on Production.....................................................................115 Figure A-3: Sample Production Template Calculation................................................................................116



List of tables

Table-5 1: Port states .....................................................................................................................................20 Table 8–1: Number of Inline POF Connections ............................................................................................42 Table 8-2: POF Header with Integrated FOT Classes ...................................................................................43 Table 8-3: Inline POF Cable Plug and Socket Class .....................................................................................43 Table 8-4: POF Cable Class ..........................................................................................................................43 Table 8-5: POF Header with Integrated FOT Connector - Sample Quantities by Performance Group.........59 Table 8-6: POF Inline Connectors - Sample Quantities by Performance Group ...........................................59 Table 8-7: POF Connectors - Performance Group A.....................................................................................60 Table 8-8: POF Connectors - Performance Group B.....................................................................................60 Table 8-9 POF Connectors - Performance Group C......................................................................................61 Table 8-9: POF Connectors - Performance Group C (Continued).................................................................62 Table 8-10: POF Connectors - Performance Group D...................................................................................63 Table 8-10: POF Connectors - Performance Group D (Continued) ..............................................................64 Table 8-11: POF Connectors - Performance Group E ...................................................................................66 Table 8-12: POF Connectors - Performance Group F ...................................................................................67 Table 8-13: POF Connectors - Performance Group G...................................................................................68 Table 8-13: POF Connectors - Performance Group G (Continued) ..............................................................69 Table 8-13: POF Connectors - Performance Group G (Continued) ..............................................................70 Table 8-14: POF Connectors - Performance Group F ...................................................................................71 Table 8-14: POF Connectors - Performance Group F (Continued) ...............................................................72 Table 8-15: POF Connectors - Performance Group I ....................................................................................73 Table 8-16: POF Cable - Sample Quantities by Performance Group ............................................................75 Table 8-17: POF Cable - Performance Group A ...........................................................................................75 Table 8-18: POF Cable - Performance Group B............................................................................................75 Table 8-19: POF Cable - Performance Group C............................................................................................76 Table 8-20: POF Cable - Performance Group D ...........................................................................................76 Table 8-21: POF Cable - Performance Group E............................................................................................78 Table 8-22: POF Cable - Performance Group F ............................................................................................80 Table 8-22: POF Cable - Performance Group F (Continued) ........................................................................81 Table 8-23: POF Cable - Performance Group G ...........................................................................................82 Table 8-24: POF Cable Performance Group H..............................................................................................82 Table 8-25: FOT - Sample Quantities by Performance Group ......................................................................83 Table 8-26: FOT - Performance Group A .....................................................................................................84 Table 8-27: FOT - Performance Group B......................................................................................................85 Table 8-28: FOT - Performance Group C......................................................................................................86 Table 8-28: FOT - Performance Group C (Continued)..................................................................................87 Table 8-29: FOT - Performance Group D .....................................................................................................88 Table 8-30: FOT - Performance Group E......................................................................................................89 Table 8-30: FOT - Performance Group E (Continued).................................................................................90 Table 8-31: POF System Link Embedded Network - Sample Quantities by Performance Group ................92 Table 8-32: POF System Link Embedded Network- Performance Group A.................................................92 Table 8-33: POF System Link Embedded Network - Performance Group B................................................93 Table 9-1: Copper Socket - Performance Group A .....................................................................................100 Table 9-2: Copper Socket - Performance Group B......................................................................................101 Table 9-3: Copper Socket - Performance Group C......................................................................................102 Table 9-4: Copper Socket - Performance Group D .....................................................................................103 Table 9-5: Copper Socket - Performance Group E......................................................................................104 Table 9-5: Copper Socket - Performance Group E (Continued)..................................................................105 Table 9-6: Copper Socket - Performance Group F ......................................................................................106 Table 9-7: Copper Socket - Performance Group G .....................................................................................107 Table 9-8: Copper Socket - Performance Group H .....................................................................................108 Table 9-8: Copper socket - Performance Group F (Continued)...................................................................109 Table 9-9: Copper Socket - Performance Group I .......................................................................................110



1. Overview

1.1 Purpose

Technology advances have established a need to introduce multi-media applications into the vehicle passenger compartment. A consistent embedded system network is required and should include a customer convenience port to ensure platform interoperability, portability and scalability not currently provided by IEEE Std 1394-1995, IEEE Std 1394a-2000 and IEEE Std 1394b-2002 specifications.

1.2 Scope

This is a full use standard that is intended to supplement IEEE Std 1394-1995, IEEE Std 1394a-2000 and IEEE std 1394b-2002. It will define the features and mechanisms that provide high-speed extensions in a backward compatible fashion and the ability to signal over single hop distances up to 10 meters with 2 inline connectors in an automotive environment. Critical vehicle functions and services will be addressed that are non-safety related, but not limited to multi-media and telematic applications with target data rates of S100, S200 and S400.

The following approved media and topics are included in this supplement:

- Plastic optical fiber cables and connectors for embedded vehicle system network

- Customer convenience port (CCP) for attachment of portable consumer electronics to the embedded vehicle system network.

- Application Layer Protocol for Automotive implementation

- Power Management for Automotive implementation

The proceedings are arranged in no particular order. Future additions may be added as they are validated and approved by the 1394 Trade Association and the IDB Forum.



2. References

The following standards contain provisions, which through reference in this document, constitute provisions of this standard. All the standards listed are normative references. Informative references are given in Annex A. At the time of publication, the editions indicated were valid. All standards are subject to revision, and parties to agreements based on this standard are encouraged to investigate the possibility of applying the most recent editions of the standards indicated below.

Ref # Reference SectionR1 ANSI Y-14.5-1994 Dimensioning and Tolerancing - Includes Inch and Metric 94 R2 ANSI/EIA 364 Electrical Connector Test Procedures Including Environmental

Classifications D-01

R3 ANSI/EIA 364-09 Durability Test Procedure for Electrical Connectors and Contacts C-99

R4 ANSI/EIA 364-17 Temperature Life with or without Load Test Procedure for Electrical Connectors B-99

R5 ANSI/EIA 364-27 Mechanical Shock (Specified Pulse) Test Procedure for Electrical Connectors B-96

R6 ANSI/EIA-364-04 Normal Force Test Procedure for Electrical Connectors A-02 R7 ANSI/EIA-364-06 Contact Resistance Test Procedure for Electrical Connectors B-00 R8 ANSI/EIA-364-09 Durability Test Procedure for Electrical Connectors C-99 R9 ANSI/EIA-364-10 Fluid Immersion Test Procedure for Electrical Connectors B-02 R10 ANSI/EIA-364-102 Rise Time Degradation Test Procedure for Electrical

Connectors, Sockets, Cable Assemblies or Interconnection Systems 98

R11 ANSI/EIA-364-103 Propagation Delay Test Procedure for Electrical Connectors, Sockets, Cable Assemblies or Interconnection Systems 99

R12 ANSI/EIA-364-13 Mating and Unmating Forces Test Procedure for Electrical Connectors B-98

R13 ANSI/EIA-364-17 Temperature Life with or without Electrical Load Test Procedure for Electrical Connectors B-99

R14 ANSI/EIA-364-18 Visual and Dimensional Inspection Procedure for Electrical Connectors A-84

R15 ANSI/EIA-364-23 Low Level Contact Resistance Test Procedure for Electrical Connectors B-00

R16 ANSI/EIA-364-27 Mechanical Shock (Specified Pulse) Test Procedure for Electrical Connectors B-96

R17 ANSI/EIA-364-28 Vibration Test Procedure for Electrical Connectors D-99 R18 ANSI/EIA-364-46 Continuity Test Procedure for Electrical Connectors A-98 R19 ANSI/EIA-364-65 Mixed Flowing Gas A-98 R20 TIA 455-13 Visual and Mechanical Inspection of Fiber Optic Components,

Devices and Assemblies A

R21 TIA 455-21 Mating durability of Fiber Optic Interconnecting Devices A R22 ANSI/TIA/EIA 455-107 Determination of Component Reflectance or Link/System

Return Loss Using a Test Set A-99

R23 ANSI/TIA/EIA 455-11 Vibration Test Procedure for Fiber Optic Components and Cables FOTP-11 B-94

R24 ANSI/TIA/EIA 455-16 Salt Spray (Corrosion) Test for Fiber Optic Components FOTP-16 A-91

R25 ANSI/TIA/EIA 455-177 Numerical Aperture Measurement of Graded Index Optical Fibers A-92

R26 ANSI/TIA/EIA 455-20 Measurement of Change in Optical Transmittance A-96 R27 ANSI/TIA/EIA 455-32 Fiber Optic Circuit Discontinuities A-90 R28 ANSI/TIA/EIA 455-34 Interconnection Device Insertion Loss Test A-95



R29 ANSI/TIA/EIA 455-35 Fiber Optic Component Dust (Fine Sand) Test A-90 (R95) (R99)

R30 ANSI/TIA/EIA 455-89 Fiber Optic Cable Jacket Elongation and Tensile Strength B-98 R31 ANSI/TIA/EIA-455 Standard Test Procedure for Fiber Optic Fibers, Cables,

Transducers, Sensors, Connecting and Terminating Devices, and Other Fiber Optic Components

B-98

R32 ANSI/TIA/EIA-455-1 Cable Flexing for Fiber Optic Interconnecting Devices B-98 R33 ANSI/TIA/EIA-455-6 Cable Retention Test Procedures for Fiber Optic

Interconnecting Devices B-92

R34 IDB-1394/2 Message Set Document R35 IEC 60695-11-10 Fire Hazard Testing - Part 11-10: Test Flames - 50 W

Horizontal and Vertical Flame Test Methods 99

R36 IEC 60794-1-2 Optical Fibre Cables Part 1-2: Generic Specifications-Basic Optical Cable Test Procedures 99

R37 IEC 60825-1 Safety and Laser Products - Part 1: Equipment classification, requirements and User guide 93

R38 IEC 60973-1-40 Optical Fibres - Part 1-40: Measurement Methods and Test Procedures - Attenuation 01

R39 IEC 61000-4-2 Electromagnetic Capability (EMC) - Part 4-2 Testing and Measurement Techniques Electrostatic Discharge Immunity Test 01

R40 IEC 61280-2-4 Fibre Optic Communication Subsystems Basic Test Procedures Part 2-4: Test Procedures for Digital Systems-Bit Rate Tolerance Measurement 98

R41 IEC 61883-1 Consumer Audio/Video Equipment - Digital Interface Part 1: General

98

R42 IEC 61883-2 Consumer Audio/Video Equipment - Digital Interface Part 2: SD-DVCR Data Transmission

98

R43 IEC 61883-3 Consumer Audio/Video Equipment - Digital Interface Part 3: HD-DVCR Data Transmission

98

R44 IEC 61883-4 Consumer Audio/Video Equipment - Digital Interface Part 4: MPEG2-TS Data Transmission

98

R45 IEC 61883-5 Consumer Audio/Video Equipment - Digital Interface Part 5: SDL-DVCR Data Transmission

98

R46 IEC 61883-6 Consumer Audio/Video Equipment - Digital Interface Part 6: Audio and Music Data Transmission Protocol

98

R47 IEC 61300 Fiber Optic Interconnecting devices and passive components 02 R48 IEC 61300-2-5 Fibre Optic Interconnecting Devices and Passive Components

Basic Test and Measurement Procedures - Part 2-5: Tests - Torsion Twist 95

R49 IEEE Std 1394-1995 Standard for a High Performance Serial Bus 95 R50 IEEE Std 1394a-2000 Supplement for a High Performance Serial Bus 00 R51 IEEE Std 1394b-2002 IEEE Standard for a High Performance Serial Bus

Amendment 2 02

R52 ISO 16750-1 Road Vehicle Environmental Conditions and Testing for Electrical and Electronic Equipment - Part 1: General

R53 ISO 175 Plastics Determination of the Effects of Liquid Chemicals including Water

99

R54 ISO 6722-2 Road Vehicles Unscreened Low Tension Cables - Part 2 Requirements

99

R55 ISO 8092-2 Road Vehicles - Connections for On-Board Electrical Wiring Harnesses - Part 2: Definitions, Test Methods and General Performance Requirements

00

R56 UL 94 Tests for Flammability of Plastic Materials for Parts in Devices and Appliances

96

R57 ANSI/IEEE Std 1212 Information Technology - Microprocessor systems - Control and Status Register (CSR) Architecture for Mircocomputer Buses

01

R58 ANSI/EIA 364-98 Housing Locking Mechanism Strength Test Procedure for 97



Electrical Connectors R59 IEC 61280-1-1 Fibre Optic Communications Subsystem Basic Test Procedures

Part 1-1: Test Procedures for General Communication Subsystems Transmitter Output Optical Power Measurement for Single Mode Optical Power Measurement for Single Mode Optical Fibre Cable

98

R60 ANSI/EIA 364-32Thermal Shock (Temperature Cycling) Test Procedure for Electrical Connectors and Sockets

C-00

R61 ANSI/EIA 364-31 Humidity Test Procedure for Electrical Connectors and Sockets B-00 R62 ANSI/EIA 364-20 Withstanding Voltage Test Procedure for Electrical Connectors,

Sockets and Coaxial Contacts B-99

R63 ANSI/EIA 364-21 Insulation Resistance Test Procedure for Electrical Connectors, Sockets and Coaxial Contacts

C-00



3. Definitions

3.1 Conformance Levels

3.1.1 expected: A key word used to describe the behavior of the hardware or software in the design models assumed by this Specification. Other hardware and software design models may also be implemented.

3.1.2 may: A key word that indicates flexibility of choice with no implied preference.

3.1.3 shall: A key word indicating a mandatory requirement. Designers are required to implement all such mandatory requirements.

3.1.4 should: A key word indicating flexibility of choice with a strongly preferred alternative. Equivalent to the phrase is recommended.

3.1.5 reserved fields: A set of bits within a data structure that are defined in this specification as reserved, and are not otherwise used. Implementations of this specification shall zero these fields. Future revisions of this specification, however, may define their usage.

3.1.6 reserved values: A set of values for a field that are defined in this specification as reserved, and are not otherwise used. Implementations of this specification shall not generate these values for the field. Future revisions of this specification, however, may define their usage.

NOTE — The IEEE is investigating whether the “may, shall, should” and possibly “expected” terms will be formally defined by IEEE. If and when this occurs, draft editors should obtain their conformance definitions from the latest IEEE style document.

3.2 Glossary of Terms

3.2.1 Active: A connected, enabled port that is capable of detecting all Serial Bus signal states and participating in the reset, tree identify, self-identify and normal arbitration phases.

3.2.2 BusOn Active port: A connected, enabled port that is capable of detecting all Serial Bus signal states and participating in the reset, tree identify, self-identify and normal arbitration phases.

3.2.3 byte: Eight bits of data, used as a synonym for octet.

3.2.4 cable plant: All passive communication elements (e. g. optical fiber, connectors, etc.) between the transmitter and the receiver.

3.2.5 compliance point: The physical position where specification requirements are met. Compliance points may include alpha, beta, gamma and delta points for transmitters and receivers.

3.2.6 classes of components: Components capable of operating at either 65°C or 85°C ambient temperature.

3.2.7 consumer electronic devices: Portable devices with an IEEE 1394 cable attachment point for interconnection to the embedded network.

3.2.8 CSR Architecture: A convenient abbreviation of the following reference (see clause 2): ISO/IEC 13213: 1994 [ANSI/IEEE Std 1212, 1994 Edition], Information Technology—Microprocessor systems— Control and Status Register (CSR) Architecture for Microcomputer Buses.



3.2.9 Customer Convenience Port (CCP): Interconnection point that permits the connection and interoperability of portable devices to the embedded network services. Based on 1394b copper bilingual connector as used for consumer electronics.

3.2.10 Down: Describes the state of the Higher Layers as not operational. Data loss may occur in this state. This happens when a device transitions to the Off state.

3.2.11 embedded (POF) network: Plastic optical fiber backbone that permits communication throughout the vehicle along with a discrete copper power system. The embedded network consists of point-to-point connections between the embedded network devices.

3.2.12 embedded network devices: Devices (e.g. Multi-media components) operating on the embedded (POF) network. These devices represent installed (POF) components and do not include portable devices.

3.2.13 Fiber Optic Transceiver (FOT) An optical device that performs, within one header socket, both transmitting and receiving functions.

3.2.14 Full Width Half Maximum (FWHM): Describes the width of a spectral emission at 50%.

3.2.15 Function Control Protocol (FCP): Standard for Digital Interface for Consumer Electronic Audio/Video Equipment as defined by IEC-61883.

3.2.16 Go_Asleep: The process of causing a port in the Active state to enter the Sleep state.

3.2.17 inactive: Describes the state of the Higher Layers as not operational. No data loss occurs in this state.

3.2.18 informative: proven good practice information that assists in the implementation of the standard

3.2.19 jitter: The deviation from the ideal timing of an event. Jitter is composed of both deterministic and Gaussian (random) content. Low frequency deviations are tracked by the clock recovery circuit, and do not directly affect the timing allocations within a bit cell. Jitter that is not tracked by the clock recovery circuit directly affects the timing allocations in a bit cell. Jitter is measured at the nominal receiver threshold power levels for optical signals.

3.2.20 jitter, deterministic (DJ): Jitter with non-Gaussian probability density function. Deterministic jitter is always bounded in amplitude and has specific causes. Four kinds of deterministic jitter are identified: duty cycle distortion, data dependent, sinusoidal and uncorrelated (to the data) bounded. DJ is characterized by its bounded peak to peak value.

3.2.21 jitter, random (RJ): Jitter that is characterized by a Gaussian distribution. Random jitter is defined to be the peak to peak value for BER of 10-12 taken to be 14 times the standard deviation of the Gaussian distribution.

3.2.22 link layer: The Serial Bus protocol layer that provides confirmed and unconfirmed transmission or reception of primary packets.

3.2.23 Local Power Master (LPM): Node Responsible for managing a node’s power mode transition.

3.2.24 mean launch power: The average power for a continuous valid symbol sequence coupled into a fiber.

3.2.25 nodes: A Serial Bus device that may be addressed independently of other nodes. A minimal node consists of only a PHY without an enabled link. If the link and other layers are present and enabled they are considered part of the node.

3.2.26 normative: mandatory information that is required for the implementation of the standard.



3.2.27 numerical aperture (NA): The sine of the radiation or acceptance half angle of an optical fiber, multiplied by the refractive index of the material in contact with the exit or entrance face.

3.2.28 Off: Node is not powered.

3.2.29 On: Node is fully operational.

3.2.30 physical layer (PHY): The Serial Bus protocol layer that translates the logical symbols used by the link layer into electrical signals on the Serial Bus. The physical layer is self-initializing. Physical layer arbitration guarantees that only one node at a time is sending data. The mechanical interface is defined as part of the physical layer.

3.2.31 Power On: The process of causing a node in the Off state to return to the Active state. Power is reconnected to the node.

3.2.32 Power Off: The process of causing a device in the On state to enter the Off state. This occurs when the car battery is disconnected.

3.2.33 power status line: Separate conductor used to transmit sleep and wakeup commands.

3.2.34 Recessed fiber: The POF core is protected within a shroud to prevent damage during handling.

3.2.35 Resume: A signal requiring the port to resume normal operations.

3.2.36 Restore: The process of causing a connection in the Standby state to return to the Active state.

3.2.37 Safe Disconnect: The condition where a mated connector is pulled apart with excessive force without damage to either of the mated components including the attached cable.

3.2.38 Sleep: Ultra low power state for 1394 ports. When a port leaves the sleep state a bus reset is generated.

3.2.39 Standby: A low-power mode of a Beta connection in which only low-power connection signaling takes place. No bus reset is generated as a result of a port entering or leaving the standby mode.

3.2.40 Standby initiator: An active port that transmits the STANDBY configuration request and engages in a protocol with its connected peer PHY to place the connection into the Standby state.

3.2.41 Suspend: To go into a low-power mode of operation while maintaining low-power connection signaling. When a port enters or leaves the suspend state a bus reset is generated.

3.2.42 Suspend initiator: An active port that transmits the SUSPEND configuration request or the TX_SUSPEND signal and engages in a protocol with its connected peer PHY to place the connection in the Suspend state.

3.2.43 System Power Master: Node responsible for managing the entire network’s power mode.

3.2.44 telematics: telematics includes safety, multimedia and communication features within an automobile.

3.2.45 Three-Sided Shroud: Complete coverage of three of the four sides of the header or socket cavity containing a ferrule (integrated or discrete) offering protection during assembly, handling and storage of the POF interface.

3.2.46 WakeUp: The process of causing a port in the Sleep state to return to the Active state.

3.3 Acronyms and Abbreviations µC Microcontroller



1394TA 1394 Trade Association AC Alternating Current ANSI American National Standard Institute AV/C Audio Video Controller BER Bit Error Rate BERT Bit Error Rate Tester Budget Power Budget CCP Consumer Convenience Port CD Compact Disk CDRH Center for Devices and Radiological Health CSR Control and Status Register CSR Control and Status Register CTS Command/ Transaction Set dB Decibels dBm Decibels relative to milliwatt DC Direct Current DJ Deterministic Jitter DUT Device Under Test DVD Digital Video Device EIA Electronic Industries Association EMI Electromagnetic Interference FCP Function Control Protocol FOT Fiber Optic Transceiver FWHM Full Width Half Maximum GND Ground HL Higher Layer IC Integrated Circuit IDB Intelligent Data Bus IEC International Electrotechnical Commission IEEE Institute of Electrical and Electronic Engineers ISO International Standards Organization LED Light Emitting Diode LLC Link Layer Controller LPM Local Power Master MP3 MPEG Layer-3 MSC Message Sequence Charts NA Numerical Aperture OEM Original Equipment Manufacturer PCB Printed Circuit Board Pf Mean Launch Power PHY Physical Layer Pin Input Power PMD Physical Media Dependent PMMA Polymethyl Methacrylate PMP Power Management Protocol POF Plastic Optical Fiber PWB Printed Wiring Board (Same as Printed Circuit Board) Q. C. Quality Check RCLED Resonant Cavity Light Emitting Diode RJ Random Jitter ROM Read Only Memory Rx FOT Receiver SPM System Power Master TAL Transaction Layer TDT Time Domain Test TIA Telecommunications Industry Association



Tx FOT Transmitter UL Underwriters Laboratory VSI Vehicle Service Interface



4. Summary of New Features

4.1 System Requirements

IDB–1394 specification shall supplement the existing IEEE Std 1394-1995, IEEE Std 1394a-2000 and IEEE Std 1394b-2002 standards to permit 1394 use within the passenger compartment environment.

The 1394 Automotive (IDB-1394) specification will define the automotive grade physical layers (e.g. cables, connectors), power modes, and the higher layer protocols needed to ensure interoperability of all IDB-1394 devices.

IDB-1394 requires an IEEE Std 1394b-2002 Bilingual PHY implemented in the node driving the CCP.

4.2 System Topology

IDB-1394 defines a system architecture/topology that permits existing IEEE 1394 consumer electronic devices to interoperate with embedded automotive grade IEEE 1394 devices. The system topology consists of an embedded (POF) vehicle network, the embedded devices, one or more CCP interfaces, and the ability to attach hot-pluggable portable devices. These elements, in total, shall comprise a single logical IEEE 1394 network as shown in Figure 4-1. The embedded and portable devices are not limited to, but consist mainly of multi-media devices.

Embedded devices shall implement a point-to-point tree topology as defined within the IEEE Std 1394b-2002 standard. IDB-1394 imposes no topology limitations (e.g. Daisy-chaining). Loops are permitted within the physical topology interconnect per IEEE Std 1394b-2002.

All link layer and transaction layer implementations conforming to this standard shall meet the performance criteria specified in IEEE Std 1394-1995, IEEE Std 1394a-2000 and IEEE Std 1394b-2002.

All implementations regarding basic serial bus management conforming to this standard shall meet the performance criteria specified in IEEE Std 1394-1995, IEEE Std 1394a-2000 and IEEE Std 1394b-2002.

A node shall conform to the following bus management capability requirement:

• A node transmitting isochronous data shall be isochronous resource manager capable

4.3 Physical Layer

4.3.1 Embedded Devices

Embedded network devices generally refer to those electronic modules physically integrated within the vehicle. Embedded IDB-1394 devices shall utilize the IDB-1394 plastic optical fiber (POF) interface. It is recommended the vehicle provide at least one unused fiber optic port for expansion and test capabilities of the embedded POF network. The embedded network (cables and connectors only) shall be S400 capable to allow expansion as future IDB-1394 devices are introduced. The actual embedded devices and header with integrated FOT shall support either S100, S200, and/or S400 operation. Faster devices shall be backwards compatible and perform automated speed configuration as defined in the IEEE Std 1394b-2002 specification.

In-line POF connectors are permitted in the embedded network and may be inserted between embedded devices to accommodate network routing throughout the vehicle.



IDB-1394 shall, at a maximum, permit operation between any two embedded devices separated by up to 10 meters of fiber with two in-line connectors. The maximum allowable distance between any two embedded fiber optic devices is determined by the optical power budget.

The maximum number of devices is limited to 63 nodes.

4.3.2 Portable Devices/CCP

IDB-1394 allows the connection and interoperability of portable consumer electronic devices to the vehicle’s embedded network. Portable consumer electronic devices include all existing and future consumer electronic devices implementing IEEE Std 1394-1995, IEEE Std 1394a, and IEEE Std 1394b-2002. To accomplish this, IDB-1394 defines a 1394 customer convenience port (CCP) connector providing a bilingual 1394 PHY interface. The CCP shall be capable of interfacing directly with an IEEE Std 1394b-2002 bilingual cable.

There should be a minimum of one CCP connector provided in the IDB-1394 vehicle to provide convenient access to the consumer. Portable consumer electronic devices may be connected as leaf or branch nodes to the CCP. All fall under the limitations of IEEE 1394 specifications.

NOTE — VSI = Vehicle Service Interface

Figure 4-1: System Topology

Radio Head Unit

VSI

Playstation II

Video Game Player

DVD DVD

MP3 Hard Drive

MP3 Hard Drive

Camcorder Camcorder

DVD DVD

CCP: 1394b bilingual electrical connector

Embedded Devices - 1394-POF

IDB – 1394 Multimedia Devices

Others

POF-to Copper

Converter

CD Changer

IEEE 1394 Portable Consumer Electronic

Devices OEM Bus



5. Extended Power Management

5.1 Automotive Power Management Requirements

Car manufacturers require automotive power consumption profiles that cannot be met by the existing 1394 specifications. These profiles are mandatory in order to prevent high battery discharge rates and conserve the total battery charge between vehicle starts (recharge cycles).

A majority of automotive multimedia devices have their own unique power management unit that governs its overall power consumption. This power management unit responds to command words that are used to put the devices into a desired power mode. Sensors are often used to notify the power management unit that an event has occurred and the device must become operational.

This chapter supplements the existing 1394 power management specifications by adding a new port state, which will provide ultra lower power consumption for automotive devices.

5.2 New 1394 Automotive Port States

An overview of the different 1394 port states is given in Table 5-1. A new state is introduced for automotive 1394 devices called the Sleep state. A port that is in the Sleep state shall not send out any signals (toning or bias). A detection circuit shall detect wakeup signals on the databus. A port in Sleep state is unable to detect a disconnection.

Port States defined in 1394b (Informative)

Disable A port configured to neither transmit, receive nor repeat Serial Bus signals. A disabled port shall be reported as disconnected in a PHY’s self-ID packet(s).

Disconnected A port whose connection detect circuitry detects no peer PHY at the other end of a cable.

Active A connected, enabled port that is capable of detecting all Serial Bus signal states and participating in the reset, tree identify, self-identify and normal arbitration phases.

Standby A low-power state of a Beta connection in which only low-power connection signaling takes place. No bus reset is generated as a result of a port entering or leaving the standby state.

Hard Disable A Hard Disabled port is prevented from signaling in any form (signals, toning, bias). A peer port cannot distinguish whether a port is off or hard disabled.

Suspend A low-power state of operation that maintains low-power connection signaling. When a port enters or leaves the Suspend state, a bus reset is generated

Automotive States defined in IDB-1394

Sleep An ultra low power state in which no signaling (toning, bias, signals) takes place. A bus reset is generated as a result of leaving the Sleep state. A detection circuit shall detect bus activity to exit the Sleep state.

Off Port is not powered. This occurs if a node/device is not connected to the power supply or the battery.

Table 5-1: Port states

Active, Suspend, Standby, Disconnected, Disabled and Hard Disabled states are defined in the existing 1394 standards. These state definitions shall not be changed in this specification. Sleep state is characterized by ultra low power consumption as shown in Figure 5-1.



Active

Off = 0A

Standby / Suspend

Pow

er c

onsu

mpt

ion

of 1

394

Wak

e_U

p

Go_

Asl

eep

Res

ume

Res

tore

Sus

pend

_ini

t

Sta

ndby

_ini

t

Pow

er_O

ff

Pow

er_O

n

Sleep

Figure 5-1: Power Consumption of Power Modes

5.2.1 Sleep State Characterist ics

The sleep state is characterized by:

• Ultra low power consumption

• No signal, toning or bias on the transmission line

• Wakeup by traffic, signals or toning on the receiver line or external events

• EMI (electromagnetic interference) shall not initiate the wakeup process

5.2.2 Mapping of Port States to Node Modes ( Informative)

Figure 5-2 shows the mapping of port states and the corresponding node modes, excludes Off and Disconnect states.

PORT STATES

NODE MODES

ACTIVE SUSPEND STANDBY HARD DISABLED

SLEEP

ACTIVE X X X X X

LOW POWER

X X X

ULTRA LOW POWER

X X

Figure 5-2: Mapping of Port States to Node Modes

The port states are: Active, Suspend, Standby, Hard Disabled and Sleep. If any of the ports are in an active state, the node mode is active. If all ports of a node are in the Suspend, Standby or Hard Disabled state, the node can be set into a Low Power mode. If all ports are in Hard Disabled or Sleep state the node can be moved to an Ultra Low Power mode.



5.3 Ultra Low Power Consumption (Informative)

Figure 5-3: Maximum Current in Sleep Mode

The maximum current of a general device is Idevice,max = 100µA (ref Figure 5-3) in the Sleep state. A “general device” includes the entire function of a particular box (eg. phone + network access). The amount of power consumed by the network access circuitry versus the phone or radio is negligible. For example, devices such as CD changers are expected to power down completely so these types of devices will consume essentially zero current in the Sleep state.

The typical current and time requirements for a device in Sleep state are listed below (informative):

• Sleep current per device (informative) ≤ 100µA

• Transition-Time for Node Mode from Ultra Low Power to Active ≤ 50ms

• Timing to turn off any signal and toning ≤ 100ms

• Timing to reactivate the toning for wakeup ≤ additional 100ms

• Timing to turn on the sleep detection circuit ≥ 200ms

Device <100µA (informative)

Node

Port 1

Port2

PortN

LLC

PHY

Power Supply

µC



Figure 5-4: Time Diagram for Sleep Mode

Some devices such as mobile phones may have different limits (to be able to receive an incoming call even when the network is in the Sleep state). The sleep current above is based loosely on a requirement that the vehicle should still start after 500 – 1000 hours of battery drain from the sleeping electronics.

5.4 Sleep State Detection Circuitry

No signals shall be on the bus when the connection is in the Sleep state. The port shall wake from Sleep state on either of the following events:

1. The node is awoken by an external event (e.g. Power Status signal) and sends an internal signal to the ports to wakeup.

2. Bus traffic (e.g. toning, signals) is detected on any connected port on the PHY, which is in the Sleep state.

A detection circuit must be implemented in order to wakeup a port that is in a Sleep state. Figure 5-5 details an example of how this can be achieved.

PMDAdaptor

Detection1394.bPHY

1394LLC

WakeUpSense

databus

Figure 5-5: Automotive Extended Node Architecture

Time [ms] 100 200

Toning

Detect

0

Sleep Command

min. 100ms

min. 200ms

On Off

On Off

Time [ms] 100 200

Toning

Detect

0

Sleep Command

min. 100msmax. 100ms

min. 200ms

On Off

On Off



The detection circuit may be implemented in a variety of ways: discretely, integrated into the FOT or integrated into the PHY.

It is beyond the scope of this specification to define how the wakeup circuitry is implemented.

5.4.1 Automotive FOT Architecture Example ( Informative)

Normally, the optical transceiver consists of the following:

1. Optical transmitter (driver-IC with the electro-optical converter (LED, RCLED or laser diode))

2. Optical receiver (photodiode followed by the pre- and post-amplifier).

3. For low power consumption, wakeup detection and power management circuitry may be integrated into the FOT as shown in Figure 5-6.

Transmitter

wake -up detection

power consumptionmanagement

Receiver

POF

POF

D out D outb

V cc

Sleep - status signal

D in D inb

FOT

Gnd

Figure 5-6: Principal Setup of the FOT with Sleep State and Wakeup Functionality

Signals in and out of the FOT:

Dout, Doutb:

Differential data signal out of the PHY circuit, defined in 1394b, chapter 6.2 at reference point TP2

Din, Dinb:

Differential data signal in the PHY circuit, defined in IEEE Std 1394b-2002, chapter 6.3 at reference point TP3

Sleep-status Signal:

Indicates the Sleep state of the network, activates the wakeup detection circuit and the power consumption management.

Vcc; GND

Power supply and ground pins



The data signals between the PHY and optical transmitter should be galvanically isolated as outlined in 1394b.

If a port is in the Sleep state, the detection circuit, power management and part of the receiver may be powered. The transmitter and receiver (partially) may be powered off by the local power manager. If a wakeup signal is detected, the receiver and transmitter shall be turned on.

5.5 System Power Master and Local Power Manager

The system power master (SPM) is an additional part of a 1394 network that controls the power mode of the entire network. One system power master entity shall be a part of every IDB-1394 network. A local power manager (LPM) entity shall be implemented in each device requiring a specific Sleep state to fulfill low power requirements. It shall be responsible for the local power mode management of a particular node. The local power manager shall receive commands from the system power master. If no LPM is implemented in a device, the ports shall disable the toning upon detection of missing toning from connected ports.

1394 Device 1394 Device

System Power Master

1394 Device

POF

WakeUp / Sleep Signals

Local PowerManager

1394 Device

FOT

WakeUp WakeUp Signals

FOT

WakeUp

Figure 5-7: 1394 with PMD Sleep/WakeUp (informative)

The system power master initiates the Sleep state of the ports by sending software command on the databus. An optical or electrical pulse may awaken a port that is in the Sleep state. This pulse shall trigger the detector circuitry to notify the system power manager that it needs to wakeup the network. Any node may initiate the network wakeup command by transmitting a signal on the databus.

1394 devices cannot change power mode autonomously. The system power master determines the power mode of the entire network and transmits the corresponding commands. The system power master may transmit a command to set a port into the Sleep state. The details on the decision taken by the system power master are implementation specific and are beyond the scope of this specification.

Figure 5-8 illustrates another method of a node’s port entering the Sleep state via an external signal when the wakeup circuitry is not implemented in the FOT. In this example, the system power master initiates the Sleep state of ports by using an external signal. The external line is pulsed to wakeup a port that is in the Sleep state. Power to the FOT may be completely cut in the Sleep state to achieve the lowest possible current consumption.



Figure 5-8: 1394 with PMD w/o Sleep/WakeUp (informative)

5.5.1 Entering the Sleep State via a Power Status Signal (Optional)

1394 devices cannot change power mode autonomously. The system power master determines the power mode of the entire network and transmits the corresponding commands. If Power Status = Low, the network should be in an active mode. If Power Status = High, the power mode of the network is set depending on a decision taken by the system power master. The system power master may transmit a command to set a port into the Sleep state. The details on the decision taken by the system power master are implementation specific and are beyond the scope of this specification.

5.6 Port State Transitions

The transition diagram (Figure 5-9) describes the physical behavior of port state transitions.

Sleep Standby

Suspend

Active

Wake_ Up

Go_Asleep Stby_Init

Resume Suspend_Init

Restore

Hard Disabled

Bus ResetBus

Reset

Bus Reset

Figure 5-9: Port State Transitions

1394 Device 1394 Device

System Power Master

1394 Device

POF

WakeUp / Sleep Signals

Local Power Manager

1394 Device

WakeUpSense

FOT FOT

Power Status Line

WakeUp Signals



The system power master (SPM) initiates power mode transitions of the network. The SPM is a functional component of the higher layers. Higher layer transitions, functions, SPM and LPM will be discussed in Chapter 6. The transition of the network to an ultra low power mode shall be controlled by the SPM via a sleep command (message or external hardwired event) to the nodes of the network.

Upon reception of the sleep command, the node shall begin a power down sequence. The local power manager (LPM) of the corresponding node is responsible for execution of the desired power mode. During the power down sequence, ports shall not transmit any signals (data or toning) on the bus for 200ms. If no signals are received on node’s port this port shall change to the Sleep state (exception: port in hard disabled state). If all ports are in the Sleep or Hard Disabled state, the node may change to the Ultra Low Power mode immediately.

Any node in the Ultra Low Power mode may be awakened by an internal or external event (timer, device is turned on, ignition on… etc). Once awoken, the ports in the Sleep states will be moved to the Active states. Once in the Active state, the port will resume toning and connected ports shall awaken by detecting the corresponding bus activity. The wakeup signal (bus traffic) will be propagated around the bus resulting in the network moving to the Active mode.

In the ignition-off case, the network may be in the Sleep state.

5.7 Sleep Mode Implementation (Informative)

The implementation of sleep mode leverages the existing protocols/techniques used in IEEE Std 1394a-2000 “suspend/resume” and IEEE Std 1394b-2002 “standby”. This allows software to directly control the power states of each port individually, and to control the power states of ports on remote PHYs. In particular it addresses issues of naked phys as it allows remote control of entry to sleep.

Each port shall implement a mode of operation called “sleep-mode”. A per-port register field indicates the state of this mode. If power-reset means of configuring this field are not provided, then it shall be initialized to TRUE.

Each port shall implement a port state identified as P13: Sleep. If a port is in P5 (Suspend), P9 (Standby), P12 (Loop disabled) and sleep_mode is set for the port, then it shall transit to P13.

While a port is in P13, disconnection is not promptly detected or reported. The connected flag maintains the same state as it had before entry into P13. On entry to P13 the port shall ensure that its sleep flag is set. It shall cease toning and shall wait for 2* DISCONNECTED_TONE_INTERVAL for the peer port to cease toning. The port shall then wait until either it detects an incoming tone or until the resume flag is set in the port register. It shall then ensure that the resume flag is set on all other ports in P13, ensure that the connected variable to false and exit to P0: Disconnected. Note that if two disconnected ports in P13 are connected, then the connection is not detected.

In P0: Disconnected, a port shall behave as specified in IEEE Std 1394b-2002 and in particular it will normally commence toning to detect a peer connection. In addition, it shall clear its resume flag, and if it fails to detect a peer connection after sending four tones, then it shall set the sleep flag to cause it to transition back to P13: Sleep. Thus the power on sequence is for the node to detect all connections, and to put all disconnected ports to sleep. Connected ports are treated as in 1394b (the port start transitions to untested).

If a port is in P6 (Disabled) then it shall not transmit tones if sleep_mode is set

The sleep flag is read-only (ru) and accessed as bit 3 of port register 13. The sleep-enabled flag is read-writable (rw) and accessed as bit 4 of port register 13.

The enhancements to the IEEE Std 1394b-2002 port state machine are shown as Figure 5-10. All state transitions are unchanged except where shown in this figure in red. The edits to the C code are shown as red text in Figures 5-11, 5-12, 5-13 and 5-14.



P5: Suspendedsuspended_actions()

! sleep_mode && connected && (resume ||(!suspend_fault && receive_ok))

!connected && !sleepP5:P0

suspend_fault = FALSE;resume_fault = FALSE;

resume_fault = suspend_fault = FALSE;

P9: Standbystandby_actions()

!sleep && connected && (restore ||(!standby_fault && receive_ok))

P9:P10

!sleep && !connectedP9:P0

standby_fault = FALSE;

standby_fault = in_standby = FALSE;

P12: Loop Disabledloop_disabled_actions()

!sleep_mode && connected &&(!loop_disabled || receive_ok)

loop_disabled = FALSE;

!sleep_mode && !connectedloop_disabled = FALSE;

P12:P11

P12:P0

P13: Sleepsleep_actions()

sleep_mode P5:P13P13:P0

sleep_mode

P12:P13

sleep_mode P9:P13

loop_disabled = FALSE;

suspend_fault =resume_fault = FALSE;

standby_fault =in_standby = FALSE;

P9:P13sleep

sleep = FALSE;

P12:P13

P5:P1

P0:P13

Figure 5-10: Port state machine



typedef enum P0, P1, P2, P3, P4, P5, P6, P7, P8, P9, P10, P11, P12, P13 port_state_type;

Figure 5-11: Data structures

// shared between port.c and node.c #ifdef unsubscripted const Beta_mode_only_port; // TRUE if the port does not support DS mode, used to indicate // functions which may be omitted on Beta-only port implementations boolean force_disconnect; // if a restore attempt fails, set true in P10 to force // connection_status to cause a disconnection // also if a loop in a Legacy cloud is detected boolean in_standby; // Port is in State P9:Standby or P10:Restore boolean port_under_test; // port currently being tested to ensure no loop port_state_type port_state; boolean rx_ok; // In DS mode indicates the reception of a debounced TpBias signal // In Beta mode, indicates synchronization with the peer port boolean sending_tone; // true whilst a tone is being transmitted boolean sleep_mode; // supports automotive low power mode boolean untested; // port is connected but untested #else const Beta_mode_only_port[NPORT]; boolean force_disconnect[NPORT]; boolean in_standby[NPORT]; boolean port_under_test[NPORT]; port_state_type port_state[NPORT]; boolean rx_ok[NPORT]; boolean sending_tone[NPORT]; boolean sleep_mode[NPORT]; boolean untested[NPORT]; #endif

Figure 5-12: Shared variables

boolean wake_in_progress() // TRUE if any port waking int i; for (i = 0; i < NPORT; i++) if (sleep_mode[i] && resume[i]) return(TRUE); return(FALSE); void wake_all_ports() int j; for (j = 0; j < NPORT; j++) if (port_state[j] == P13) resume[j] = TRUE; // Resume all asleep ports

Figure 5-13: Node level processing



boolean sleep; // indicates that the port is really well asleep if (!(PMD_STATUS_request() & PMD_LOCAL_PLUG_PRESENT) || (disabled && (hard_disable || in_standby || sleep_mode))) // give up if no plug or hard disabled if (((hard_disable || sleep_mode ) && disabled) || !(PMD_STATUS_request() & PMD_LOCAL_PLUG_PRESENT)) return; // good to return immediately if this becomes // TRUE anywhere from here in // here if (1) tried toning 4 times without detecting a tone; // (2) detected a connection and tried toning twice without detecting a tone; // (3) detected incoming TpBias if (sleep_mode) // go to sleep sleep = TRUE; return; if (dc_connected) // Sleep actions if (port_state == P13) Beta_mode = FALSE; toning = FALSE; while (sleep) // only when really asleep if (signal_detect_OK()) sleep = FALSE; return; // here if P5, P6, P9 or P12 and connectivity established // look for disconnect or report bias/continuous tone if (Beta_mode) // Beta mode - send a tone at periodic intervals know_still_Beta_mode = FALSE; toning = TRUE; // turn on the autonomous toner signal_detect_OK(); // flush any stale values (no need to wait) for (i = 0; i < RESUME_CHECKS; i++) if (port_state == P13) // transited to sleep return; void sleep_actions() if (wake_in_progress() && !sleep) // entered here from suspend, standby or loop_disabled resume = TRUE; // so that we wake up again too as soon as possible activate_connect_detect(0); // background actions will stop toning wait_time(2*DISCONNECTED_TONE_INTERVAL); // long enough for the peer to enter sleep via suspend // or if not sleep-enabled, for the connection to appear disconnected sleep = TRUE; // really asleep now while (sleep && !resume) // background clears sleep on hearing a tone ; wake_all_ports(); connected = FALSE;

Figure 5-14: Port actions



5.8 Customer Convenience Port (CCP)

The CCP is used to extend the in-car network with carry-on devices or after-market devices. To guarantee automotive power management functionality, even in the case of CCP-connected devices, some requirements shall be set:

• The configuration ROM will have a specific section dedicated to indicate the automotive capability of a device.

• Any port (at least any electrical port) of an automotive capable device shall be able to be hard disabled as defined in the existing 1394 specifications.

Non-automotive devices may not support the Sleep state and may cause the network to wakeup erroneously. To prevent this from happening, the CCP port may be hard disabled as shown in Figure 5-15.

Figure 5-15: Example for CCP Topology with Legacy Device

The CCP may remain in automotive listen mode if a sleep mode capable device is directly connected to the CCP (Figure 5-16). The carry-on automotive devices may wakeup the in-car network. All ports of carry-on automotive devices in sleep mode with a connection to legacy devices shall be hard disabled.

SPM

CCP

Legacy Device

X

In-Car Network

Hard disabled during sleep mode

Any Device

Carry-on Devices



SPM CCP

AutomotiveDevice

X

In-Car Network

Hard disabled duringsleep mode

LegacyDevice

Carry-onDevices

AutomotiveDevice

Figure 5-16: Example for CCP Topology with Automotive Devices

If a non-Sleep state capable device is connected to any port of an automotive device or the CCP, the SPM shall detect this device and shall be able to hard disable the peer port or the CCP as shown in Figure 5-17. The SPM shall also be responsible for reactivating the disabled ports upon wakeup. All non-Sleep state capable devices shall be implemented as a leaf node.

SPM

CCP

Non Sleep state capable device

X

In-Car Network

Hard Disabled

Figure 5-17: Automotive Device Connecting to a Non-Sleep State Capable Device



5.9 CCP Power Requirements

The CCP shall provide power to remote devices. The CCP shall be either a Primary power provider or an Alternate power provider as per 1394TA 1999001-1 Rev 1.0 based on OEM implementation. It shall not be a power consumer or a self-powered device.

The power provision may be disabled at the CCP in case of the port being in Sleep state. In the case of a deep fade of battery power, the power provided by the CCP may become unstable or disconnected.

A CCP capable node shall send a self-ID packet during the self-ID phase. It shall define in the “pwr” field the power consumption and source characteristics as described in the IEEE Std 1394-1995 Chapter 4.3.4.1 Self ID Packet.



6. Higher Layer Functional Description

6.1 Overview

This description is based on a physical layer providing means to indicate a power down request and a power up request (e.g. optical, electrical or Power Status signal). The purpose of the described procedure is a flexible and configurable approach to guarantee low power consumption and high user convenience in a multimedia car environment. To achieve this, a software controlled transition between higher layer states should be used. This software control is done by a system power master and distributed local power manager instances in each device (at least in the more intelligent ones).

Active

Down

Inactive

Re-Load SystemFailure

Shutdown Re-Init

Figure 6-1: Higher Layer Power State Transition Diagram

In Figure 6-1, the possible state transitions for the higher layers are shown. No “Off” state is defined in this context. The non-operational states are “Down” and “Inactive”. The Down state describes the state of the higher layer before the first initialization and after a power down without a successfully stored database. In this case (Active => Down), it cannot be guaranteed that the database is consistent. At the next power-on the system shall start with the default initialization. All protocols shall then be synchronous after the database reloads.

The capability to reload the device’s state context after wakeup or power-on shall be required for devices containing a standardized local power manager. If the system power master initiates a Sleep state transition, all necessary data shall be preserved. A device may try to store its database even in the case of a deep-fade.

Figure 6-2 shows the mapping of the higher layer states and corresponding Node modes of the physical layer. The exact mapping is implementation specific.

HIGHER LAYER STATES NODE MODES ACTIVE INACTIVE ACTIVE X X LOW POWER

X X

ULTRA LOW POWER

X

Figure 6-2: HL-States Node-Modes Mapping



6.2 State Transitions

6.2.1 Transit ion from Active State to Inactive State (Shutdown)

The transition from the Active to Inactive state (Shutdown) is a cooperative approach. The system power master using the appropriate procedure initiates this transition. The local power manager will perform the necessary local procedure to guarantee a fast reboot on wakeup. This may include the saving of useful data to non-volatile memory and follow a certain course for taking the hardware components to the Ultra Low Power mode.

6.2.2 Transit ion from Active State to Down State (System Failure)

If the ‘Shutdown’ procedure (ref. 6.2.1) fails for any reason, preventing it from reloading the latest database state (i.e. if the locally saved data has been corrupted), the device may not be able to do a fast reboot. In this case, the transition shall be a full reboot scenario. This may happen due to deep fades or a weak battery.

6.2.3 Transit ion to Active State (Re-Load, Re-Init)

Under normal condition, a device enters the Inactive state initiated by the system power master and stores the necessary information to be able to reload its context after wakeup (ref. 6.2.1). The device shall implement methods to ensure that the software is able to decide whether the stored database is consistent after wakes up. Depending on the contents of the database, the device may boot using the stored information (Re-Load) or using default values (Re-Init). The Re-Init procedure shall be used in any case, where the database has been found inconsistent. This occurs e.g. in the system failure scenario (ref. 6.2.2). After rebooting a device it shall indicate this to the network by sending out a broadcast message RebootIndication to ensure the re-synchronization of the protocols. The message includes an indication whether the reboot has been a re-load or a re-init. The message format is defined in Section 6.6.

6.3 System Power Master (SPM)

The system power master is a dedicated device in the network, responsible for the general decision and execution of any Power Mode change. The SPM receives information about the environmental situation from various sources (network-internal and external). The SPM shall keep track of the Power Modes of all devices in the network. To achieve this, a SPM may send a request to any local power manager (LPM) instance in the network to get the current status. The decision upon a change of Power Mode is taken by the SPM, but it shall be done in a cooperative manner, i.e. an ongoing transmission or action shall usually not be broken by the SPM.

6.3.1 System Power Master Decisions ( Informative)

The SPM decides autonomously about a change of any power mode. In implementations, the SPM enabled device may receive various information about the environmental situation from various sources. Possible external source are:

• Electronic Component Unit • Head-Unit / Dashboard • Ignition Sense • Central Locking • Remote Transmitter • Remote Access



• Anti-Theft Alarm System • Customer Convenience Port • Battery Status Surveillance

Network internal sources are possible as well:

• Connection Status (active and used connections) • User Activity

SPM can also be used for: • Timer between external events

6.4 Local Power Manager (LPM)

The local power manager is the corresponding instance in each device (also included in the device holding the SPM instance). The LPM is responsible for the management of local power modes and the proper execution of commands sent by the SPM.

6.5 Power Management Protocol (PMP)

This section covers the Shutdown procedure, as the Re-Load / Re-Init procedure is basically executed by the Physical Layer and is initiated by means beyond the scope of this standard.

The Power Management Protocol (PMP) defines the communication between SPM and LPM instances. It provides all messages necessary for the power management of all devices in the network. Figure 6-3 shows devices connected via an IDB-1394 Bus. One of these devices (e.g. the 1394-Bus manager) has extended capability to act as a power master.

1394 PHY

1394 PHY

1394 PHY

LPM

LPM

SPM

LPM

Any Device Any Device

Bus Manager

Figure 6-3: Power Management Entities



6.5.1 Procedures for the Power Management

The following Message Sequence Charts (MSC) show typical message flows between the power master and the local power manager in the network. In these examples, a network-wide Sleep state is shown, but also selective-sleep (i.e. put ports of selected devices into Sleep state) may be implemented. This may be accomplished by sending messages (marked as broadcast in the drawings) as unicast or multicast messages to one or more selected devices.

Figure 6-4 shows the procedure that is initiated by the SPM after the decision to put all ports of all nodes in the network into a Sleep state.

1. First is the announcement of the forthcoming mode-change. To reduce the number of used messages, this message (SetPowerState) contains an indicator for the exact purpose (mode:ANNOUNCE | SET | FORCE) of the message. Usually, the Shutdown procedure is initiated by sending a SetPowerState with the mode ANNOUNCE; Indicating that every LPM shall check to see if it’s device is able and willing to change into the announced mode (may be rejected for example in the case of ongoing data-transmission or user action).

2. After performing the internal check, every device shall respond whether it agrees on (ResponseCode: ACKNOWLEDGE) or rejects (ResponseCode: REJECT) the announced power mode change(message: SetPowerState with Parameter ResponseCode = ACKNOWLEDGE or REJECT).

3. After receiving the responses, the SPM may send the SetPowerState message again, with the parameter RequestCode= SET if no REJECT has been received. If at least one device rejects the announcement the power master shall not send the SetPowerState message with the mode. Upon the reception of a SetPowerState message with RequestCode = SET a device shall save it’s internal data, close all active connections and enter power saving condition within 100ms.



MSC Shutdown (Cooperative, Successful)

Figure 6-4: Cooperative (usual) Change to Inactive State (Successful) (Informative)

Device A LPM

Device B SPM

Device B LPM

Device C LPM

SetPowerState (ANNOUNCE)

SetPowerSet (ANNOUNCE)


SetPowerState (ACKNOWLEDGE)SetPowerState

(ACKNOWLEDGE) SetPowerState (ACKNOWLEDGE)

SetPowerState (SET)

SetPowerState (SET)

SetPowerState (SET)

All Devices shall save their Data and enter Power Saving Condition within 100ms

The PowerMaster announcesthe new PowerState (Broadcast)

All PowerManagers agree on the PowerState change

The PowerMaster sets the new PowerState (Broadcast)



MSC Shutdown (Cooperative, Rejected)

Figure 6-5: Cooperative (usual) Change to Inactive State (Not Successful) (Informative)

Figure 6-6 shows a procedure that may be used by a SPM in case of an urgent need for entering power saving condition (e.g low battery). It is also based on the message SetPowerState with parameter RequestCode=FORCE. Upon the reception of this message a device shall put its ports to sleep state and the higher layer to Inactive state within 100ms. The FORCE code may also be used in the case of a rejected announcement.

MSC Shutdown (Not Cooperative)

Figure 6-6: Forced Change to Inactive State (Informative)

SetPowerState (ACKNOWLEDGE)

Device A LPM

Device B SPM

Device B LPM

Device C LPM




SetPowerState (ACKNOWLEDGE) SetPowerState

(REJECT)

The network remains active. The SPM may restart the procedure after some time or may force the change (ref. forced procedure)

The PowerMaster announces the new PowerState (Broadcast)

NOT all PowerManagers agree on the PowerState change

Device A LPM

Device B SPM

Device B LPM

Device C LPM

SetPowerState (FORCE)



The PowerMaster forces the new PowerState (Broadcast)

All Devices shall save their Data and enter Inactive state and Sleep state within 100ms



6.6 Messages

The following messages are defined to control power modes of automotive devices.

Messages: (mandatory) status RebootIndication (

in RebootStatus rebootstat) status SetPowerState (

in RequestCode requestcode in PowerState powerstate out ResponseCode responsecode)

Parameters: (mandatory)

enum RequestCode (ANNOUNCE | SET | FORCE) enum ResponseCode (ACKNOWLEDGE | REJECT) enum PowerState (INACTIVE | ACTIVE) enum RebootStatus (DBCONSISTENT | DBINCONSISTENT)

Vendor specific parameter values are allowed and shall be ignored by a LPM that doesn’t support these additional values. The parameter values defined above shall be supported by every LPM.

The automotive power management commands and responses are transported by the Function Control Protocol (FCP) defined by IEC-61883, proposed standard for Digital Interface for Consumer Electronic Audio/Video Equipment. The FCP provides a simple means to encapsulate device commands and responses within IEEE Std 1394–1995 asynchronous block write transactions.

6.7 Automotive CTS CODE

The cts field within the FCP frame defines the command transaction format used. For the automotive power management commands defined by this document, the cts field shall be the Automotive CTS Code1.

1 as defined in IEC61883-1 Edition 2 Table 8 Command Transaction Set Encoding



7. Automotive Message Sets and Application Layer Protocols

7.1 Automotive Message Sets

All automotive Multimedia devices shall utilize the existing IEC-61883 Function Control Protocol Specifications and the existing 1394 AV/C Specifications, as appropriate. In cases where automotive specific features are implemented (eg. door lock, etc), these functional message sets shall be defined in IDB-1394/2 Message Set Document. The automotive message sets shall utilize FCP as defined in IEC 61883-1-6 [R4].



8. Plastic Optical Fiber (POF)

This clause defines a new media and connectors in order to support the automotive requirements. This new class of unique plastic optical fiber automotive connectors and cable contained in this clause will be defined for implementation within ground vehicles. The connector interface is useable from S100 to S400 speeds dependent on the fiber and optical transceiver capabilities.

The products defined in this clause shall meet Class 1 Eye Safety requirements without requiring “Open Fiber Control” monitoring circuits.

Eye safety requirements are specified IEC-60825-1

Laser eye safety is a measure of how vulnerable the eye is to damage from a particular laser source. This vulnerability is primarily affected by the output power and the wavelength (color) of the laser light, where Class 1 laser devices are the safest and Class 3 laser devices are the least safe.

8.1 Performance Criteria

8.1.1 Embedded Network

The power budget has loss allocations for POF cable, coupling of interconnects, bends through a minimum specified radius, temperature aging of the transceivers and the plastic optical fiber along with system margin. The power budget defines the number of inline connections.

Number of Inline POF Connections

0 1 2 3

Maximum Node-to- Node Total Distance

18 meters

15 meters

10 meters TBD

Table 8–1: Number of Inline POF Connections



8.1.2 POF Connectors

Three POF connectors are used to connect the embedded devices: a POF header with an integrated fiber optic transceiver (FOT), POF inline cable plug and a POF inline cable socket. All must function within and in vehicle automotive environment with the following minimum to maximum temperature ranges:

Temperature Ranges Class 65 Class 85

Storage Temperature -40ºC to +85ºC -40ºC to +85ºC

Ambient Temperature -40ºC to +65ºC -40ºC to +85ºC

Table 8-2: POF Header with Integrated FOT Classes

Temperature Ranges Class 85

Storage Temperature -40ºC to +85ºC

Ambient Temperature -40ºC to +85ºC

Table 8-3: Inline POF Cable Plug and Socket Class

Either an integrated or discrete ferrule design shall be the option of the manufactures. Each mated connector pair must withstand 20 mating and unmating cycles. A locking mechanism is employed to retain the plug and socket. Safe disconnect shall occur without damage to either the latching mechanism or the POF fiber. The maximum insertion force of the mated connectors is 45N and the locking mechanism shall have minimum pullout strength of 100N.

The POF cable shall have minimum single core pullout strength from the POF cable connectors of 60N, pulling only one of the two POF cores. This requirement applies to both the POF inline cable plug and POF inline cable socket connectors.

8.1.3 POF Cable (Reference)

The POF cable must function within and in vehicle automotive environment with the following minimum to maximum temperature ranges:

Temperature Ranges Class 85

Storage Temperature -40ºC to +85ºC

Ambient Temperature -40ºC to +85ºC

Table 8-4: POF Cable Class

The POF cable shall have a step index core of polymethyl methacrylate (PMMA). The POF cable core diameter shall be 980 ± 45µm and the clad diameter shall be 1000 ± 45µm with an Effective Numerical Aperture (NA) 0.60 ± 0.05. The POF cable construction shall be either single or dual jacketed and single or duplex core.



A minimum temporary bend radius of 10mm and a minimum permanent bend radius of 15mm shall not affect cable performance more than ±0.5dB from initial attenuation after environmental exposure.

A minimum tensile strength of the POF cable plus the jacket for a single core shall be 60N, test procedure IEC 60794-1-2-E2. The POF core shall be protected within a three-sided shrouded cavity in both the POF inline cable plug and socket to prevent damage to the end faces when contacted to a flat surface. All references to recessed fiber indicate a three-sided shroud. A dust cover or boot should be used to prevent damage during shipping and handling prior to final assembly.

Depending on the specific requests of the implementer, the POF cable supplier(s) may be required to provide the additional performance data. This data may include spectral attenuation, test procedure IEC 60793-1-4-C1A, numerical aperture, test procedure IEC 60793-1-4-C6, bandwidth, test procedure IEC 60793-1-4-C2A and optical insulation, test procedure IEC 61300-8. These tests have not been included in this specification.

8.1.4 Fiber Optic Transceiver (Reference)

The FOT is incorporated into the POF header socket. A reference performance validation sequence is provided to assist in the connector manufacturer’s qualification of FOT devices to minimize risk in the integration with the header.

The fiber optic transceiver shall be capable of working in both a 3.3 ± 0.3Vdc and 5.00 ± 0.25Vdc voltage systems. The fiber optic transceiver shall have a minimum extinction ratio of 10dB with a maximum overshoot of 25%.

The fiber optic transceiver shall have a maximum 0.55 Numerical Aperture (NA) with a center wavelength (FWHM) @ 25ºC shall be 640 to 660nm with a maximum spectral width (FWHM) of 40nm. The mean launch power shall be –7.5dBm to -2dBm average at 25 ºC.

The fiber optic receiver shall have a minimum receiver input power of -22dBm average and the minimum overload shall be -2dBm average. Temperature range is based on the class of the POF header with integrated FOT.

8.1.5 Materials

Material used to manufacture the POF header with integrated FOT connectors must be capable of withstanding typical industry soldering processes. Thermoplastic materials used for the POF connectors and cable shall have a flammability rating of “HB” according to UL 94 or IEC 60695-11-10.

All POF connector and cable materials shall not have their performance affected by:

Automotive fluids (engine coolants, transmission fluid, brake fluid, windshield washer fluid, alcohol based fuels, diesel fuels, etc.) and

Commercial fluids (coffee, cola, alcohol and ammonia based cleaners, hand lotion, etc.)

8.2 Dimensional Criteria

This clause specifies the physical properties of IDB-1394 POF connectors and cables. Some of the POF connector and cable attributes are not directly controlled in this clause are implied by the performance requirements. Please note that the POF header with integrated FOT and the inline POF cable socket shall have the same dimensional requirements.



8.2.1 POF Header with Integrated FOT and Inline POF Cable Socket

NOTE —

1. All dimensions are in mm. 2. Unless otherwise specified, tolerances linear ±0.15 and angular ± 5º 3. Interpret dimensions and tolerances per ANSI Y-14.5M-1994

Figure 8–1: POF Header with Integrated FOT and Inline POF Cable Socket



NOTE —

1. All dimensions are in mm. 2. Unless otherwise specified, tolerances linear ± 0.15 and angular ± 5º 3. Unless otherwise specified, lead in chamfer = 0.2min X 45º ± 5º 4. Interpret dimensions and tolerances per ANSI Y-14.5M-1994 5. Datum reference added to improve clarity.

Figure 8-2: POF Header with Integrated FOT and Inline POF Cable Socket (Section A-A, Detail A1 and Detail A2)



8.2.2 POF Header with Integrated FOT Printed Circuit Board Spacing (Reference)

NOTE —

1. All dimensions are in mm. 2. Unless otherwise specified, tolerances linear ±0.15 and angular ±5º 3. Interpret dimensions and tolerances per ANSI Y-14.5M-1994 4. Phantom outline of POF header with integrated FOT

Figure 8-3: POF Header with Integrated FOT Printed Circuit Board Layout (Reference)



8.2.3 POF Header with Integrated FOT Printed Circuit Board Layout (Reference)

NOTE —

1. All dimensions are in mm. 2. Unless otherwise specified, tolerances linear ± 0.15 and angular ± 5º 3. Interpret dimensions and tolerances per ANSI Y-14.5M-1994 4. Datum Surfaces

a. Datum X - Top surface of the PC Board b. Datum Y - Centerline of FOT through holes c. Datum Z - Centerline of FOT through holes

5. Phantom outline of POF header with integrated FOT

Figure 8-4: POF Header with Integrated FOT Printed Circuit Board Layout (Reference)



8.2.4 Inl ine POF Cable Plug

NOTE —

1. All dimensions are in mm. 2. Unless otherwise specified, tolerances linear ±0.15 and angular ±0.5º 3. Interpret dimensions and tolerances per ANSI Y-14.5M-1994 4. Integrated or discrete ferrule is the option of the manufactures.

Figure 8-5: Inline POF Cable Plug



NOTE —

1. All dimensions are in mm. 2. Unless otherwise specified, tolerances linear ±0.15 and angular ±0.5º 3. Unless otherwise specified, lead in chamfer = 0.2min X 45º ± 5º 4. Integrated or discrete ferrule is the option of the manufactures. 5. Datum reference added for clarity. 6. Interpret dimensions and tolerances per ANSI Y-14.5M-1994

Figure 8-6: Inline POF Cable Plug (Section A-A, Detail B1, Detail B2 and Detail B3)

Section A-A



8.2.5 Mated POF Interface

NOTE —

1. All dimensions are in mm. 2. Unless otherwise specified, tolerances linear ±0.15 and angular ±5º 3. Interpret dimensions and tolerances per ANSI Y-14.5M-1994 4. Integrated or discrete ferrule is the option of the manufactures.

Figure 8-7: Mated POF Interface Minimum Optical Surface Gap



8.2.6 POF Cable (Reference)

Figure 8-8: POF Cable Construction Alternatives (Reference)

8.3 Performance Validation

Table 1 in ANSI/EIA 364-D(01)shows operating class definitions for different end use applications. The test specifications follow the recommendations for environmental class G2.1 that defines “Year round exposure to heat, cold, humidity, moisture, industrial pollutants and fluids”. The Equipment Operating Environmental Conditions shown for class G2.1 are modified for: Temperature from -40ºC to +85ºC. Class 1.3 further describes as operating in maximum humidity of 95% a “harsh environment”. Marine atmosphere is not anticipated in this implementation.

Samples sizes have determined based on a standard known sampling procedure.

Unless otherwise specified, all measurements shall be made within the following ambient conditions:

a. Temperature: 18ºC to 28ºC

b. Atmospheric pressure: 86kPa to 106kPa

c. Relative humidity: 25% to 75%



Special tests may require tighter control of conditions and are specified in the test procedure.

This standard utilizes LED FOT, for reference, and therefore does not require return loss or reflectance measurement in the testing sequence. If an FOT, other than an LED is chosen, the implementer may request the supplier(s) to provide additional data. This data may include Return loss or reflectance performance data using either IEC 61300-3-6 or ANSI/TIA/EIA 455-107-A(99)test methods.

Depending on the specific location of the embedded network, the implementer may request the POF supplier(s) to provide the additional environmental performance data. Salt Spray, test method ANSI ANSI/TIA/EIA 455-16-a(91), and Corrosive Environment, test method ANSI/EIA 364-65-A(98). The environments may include.

8.4 POF Header with Integrated FOT to POF Inline Plug Connector and POF Inline Cable Plug Connector to POF Inline Cable Socket Connector

The POF header with integrated FOT shall be energized during all tests, unless otherwise specified, at the manufacturer’s nominal operating voltage. The POF inline cable plug and socket shall be tested driven by a signal generator. This testing methodology evaluates both the environmental plus the operating effects of the system for continuous operation during the exposure period.

8.4.1 Testing (Reference)

To make a test simpler and less time consuming, either analog receivers with the same optical/mechanical behavior as the digital devices, or to use digital devices with access to an analog electrical signal shall be used to measure the responsivity or responsivity change of an analog receiver and the sensitivity of a receiver with integrated signal conditioning

Tests can be done with continuous – DC - or modulated – AC - light source. Testing the POF header interface shall use the AC coupled version to avoid bias drift problems, which hide connection, induced effects. Also it leaves open the use of AC coupled receivers. (Frequency e.g. 1kHz, 50% duty cycle). Then the test results are:

Modulated AC light source responsivity = RMS Voltage [mV] / Optical PowerAC [µW]

Continuous DC light source responsivity = (“Light On” Voltage – “Light Off” Voltage) [mV] / Optical Power [µW]

In case of looking for changes only, results are:

Slow sampling version:

in dB = 10 x log(responsivity (time) / responsivity (start))

or

% deviation = 100 x (1 - responsivity (time) / responsivity (start))

Fast sampling version for transients expected to occur (vibration/mechanical load)

The fast sampling mode shall use discriminator settings for the responsivity. The discriminators are set to start voltage ± deviation voltage to get drop and spike events. The deviation is calculated out of the dB limits specified in the data sheet. This reduces the amount of data because they are stored only in case of an event. To check the proper function of the measurement system additional sequential storage of data should be performed to check proper functioning of the test equipment.



8.4.2 Test Set Up

NOTE — 1 . Test chamber indicates either the environmental chamber or test fixture

Figure 8-9: Energized for Discontinuity POF Header with Integrated FOT to POF Inline Cable Connector Plug

OPTICAL REFERENCE

PC INLINE POF CABLE

TEST

POF

POF HEADER WITH

OPTICAL TO ELECTRICAL CONVERTER

DISCONTINUITY METER

1



NOTE — 1 . Test chamber indicates either the environmental chamber or test fixture

Figure 8-10: Energized for Discontinuity POF Inline Cable Connector Socket to POF Inline Cable Connector Plug

INLINE POF CABLE PLUG

OPTICAL REFERENCEPLANE

TEST CHAMBER

INLINE POF CABLE SOCKET

OPTICAL TO ELECTRICAL CONVERTER

PULSE GENERATOR

DISCONTINUITY METER

1



NOTE — 1 . Test chamber indicates either the environmental chamber or test fixture.

2 . Test chamber optional to shield from external light effects during measurements.

Figure 8-11: POF Header with Integrated FOT to POF Inline Cable Plug Connector

OPTICAL REFERENCE

PC INLINE POF CABLE

POF HEADER WITH

TEST

POF

POWER

SIGNAL

SIGNAL

REFERENCE DETECTOR (Tx TEST)

REFERENCE LIGHT SOURCE (Rx TEST)

REFERENC

1 2



NOTE — 1 . Test chamber optional to shield from external light effects during measurements.

Figure 8-12: POF Inline Cable Plug Connector to POF Inline Cable Socket Connector

1



NOTE — 1. Test chamber optional to shield from external light effects during measurements.

Figure 8-13: Output Power (Upper Illustration) and Sensitivity (Either Lower Illustrations) Test Setup



8.4.2.1 Sample Quantit ies by Performance Group

Number of Samples by Group

Sample Description A B C D E F G H I

POF header socket with integrated FOT not assembled to printed circuit board 5 0 0 0 0 0 0 39 10

POF header sockets with integrated FOT assembled to printed circuit board 5 11 11 11 11 11 11 0 30

Inline POF cable plug not assembled to POF cable 5 0 0 0 0 0 0 39 10

Inline POF cable plug assembled to 7 ± 0.1m POF cable 5 11 11 11 11 11 11 0 30

Table 8-5: POF Header with Integrated FOT Connector - Sample Quantities by Performance Group


Sample Description A B C D E F G H I

POF inline cable plug not assembled to POF cable 5 0 0 0 0 0 0 39 10

POF inline cable plug assembled to 7 ± 0.1m POF cable 5 11 11 11 11 11 11 0 30

POF inline cable socket not assembled to POF cable 5 0 0 0 0 0 0 39 10

POF inline cable socket assembled to 7 ± 0.1 meters of POF cable 5 11 11 11 11 11 11 0 30

Table 8-6: POF Inline Connectors - Sample Quantities by Performance Group



8.4.2.2 Performance Group A - POF connectors basic construction, workmanship and dimensions

Test Measurements to be performed

Requirements Phase

Test ID No. Severity or conditions

Title ID No. Performance level

A1 Visual and dimensional inspection

TIA 455-13 A

Unmated and unmounted connectors

Dimensional Inspection

Per Figures 8-1, 8-2, 8-5, 8-6 and 8-7

No defects that would impair normal operations. No deviation from dimensional tolerances.

Table 8-7: POF Connectors - Performance Group A

8.4.2.3 Performance Group B - POF Connectors Output Power, Responsivity/Sensit ivity and Insert ion Loss when Subjected to Temperature Life


Requirements Phase



Output Power ANSI/EIA 455-34 A(95)

Header Only: Initial baseline measurement -10.25dBm MIN.

Responsivity or Sensitivity

ANSI/EIA 455-34 A(95)

Header Only: Initial baseline measurement -21.25dBm MAX.

B1 Durability TIA 455 21 A 10 cycles; manual cycling at a rate of 300 cycles/h max

Insertion Loss

ANSI/EIA 455-34 A(95)

Inline Only: Initial baseline measurement 2.5dB MAX.

Output Power ANSI/EIA-455-20A-96

Header Only: Maximum change of ±1.5dB from initial baseline measurement and -11.75dBm MIN.


ANSI/EIA-455-20A-96

Header Only: Maximum change of ±1.0dB from initial baseline measurement and -20.25dBm MAX.

B2 Thermal Aging

ISO 8092-2 (00) Par 4.18

(85ºC) Mated; Energized; collect data at 100h 200h 500h 1008h

Insertion Loss

ANSI/EIA-455-34A

Inline Only: Insertion loss 2.5dB MAX.

Table 8-8: POF Connectors - Performance Group B



8.4.2.4 Performance Group C - POF Connectors Output Power, Responsivity /Sensit ivity Insertion Loss when Subjected to Stepped Temperature and Thermal Shock


Requirements Phase






ANSI/EIA-455-20A-96


C1 Durability TIA 455 21 A

10 cycles; manual cycling at a rate of 300 cycles/h max

Insertion Loss

ANSI/EIA-455-34A


C2 Stepped Temperature

ISO 16750-1 Par. 5.2

Class 65 only: Temperature: +25ºC to -40ºC to +65ºC @ 5ºC Class 85 only: Temperature: +25ºC to -40ºC to +85ºC Both Classes: Mated; energized; Change temperature in 5ºC steps; 0.5h or until temperature equilibrium is reached;

Continuity Header Only: Figure 8-14 Inline Only: Figure 8-15

Detector sensitivity at 50% of open circuit voltage for 1 microsecond




ANSI/EIA-455-20A-96


C3 None

Insertion Loss

ANSI/EIA-455-34A


Table 8-9 POF Connectors - Performance Group C



Test Measurements to be

performed Requirements Phase



C4 Thermal Shock

ISO 8092-2 Par 4.23

Class 65 only: 100 Cycles (-40ºC to +85ºC); Class 85 only: 100 Cycles (-40ºC to +85ºC); Both Classes: Mated; Energized






ANSI/EIA-455-20A-96


C5 None

Insertion Loss ANSI/EIA-455-34A


Table 8-9: POF Connectors - Performance Group C (Continued)



8.4.2.5 Performance Group D- POF Connectors Output Power, Responsivity /Sensit ivity and Insertion Loss when Subjected to Dust, Mechanical Shock, Vibration and Impact


Requirements Phase






ANSI/EIA-455-20A-96


D1 Durability ANSI/EIA-455-21A


Insertion Loss

ANSI/EIA-455-34A


D2 Dust ISO 8092-2 (00) Par. 4.22

6 h @ 23ºC 16h @ 63ºC (no dust) 6h @ 63ºC Mated; energized 8h agitate every 15 min.






ANSI/EIA-455-20A-96


D3 None

Insertion Loss

ANSI/EIA-455-34A


D4 Mechanical Shock

ISO 8092-2 (00) Par 4.19

[100 g’s with 5ms duration] 1000 shocks in both directions of three mutually perpendicular axis; mated; energized)






ANSI/EIA-455-20A-96


D5 None

Insertion Loss

ANSI/EIA-455-34A


Table 8-10: POF Connectors - Performance Group D




Requirements Phase

Test ID No. Severity or Conditions


D6 Vibration ISO 8092-2 (00) Par 4.11

Class B [10 - 81Hz with ± 0.75 displacement; 81 to 500Hz at 20 g’s and 500 to 2000Hz at 18 g’s] 8h in each mutually perpendicular axis Mated; Energized






ANSI/EIA-455-20A-96


D7 None

Insertion Loss

ANSI/EIA-455-34A


D8 Impact (Drop)

ISO 8092-2 (00) Par 4.20

8 drops from: a. 1.2m b. 2.4m Mated; Energized






ANSI/EIA-455-20A-96


D9 None

Insertion Loss

ANSI/EIA-455-34A


Table 8-10: POF Connectors - Performance Group D (Continued)



NOTE — 1. Discontinuity connection eliminated for clarity.

Figure 8-14: POF Header with Integrated Transceiver Shock (Upper illustration) and Vibration (Lower illustration) Test Fixture

NOTE — 1. Discontinuity connection eliminated for clarity.

Figure 8-15: POF Inline Connector Shock and Vibration Test Fixture



8.4.2.6 Performance Group E - POF Connectors Output Power, Responsivity/Sensit ivity and Insert ion Loss when Subjected to Mechanical Durabil ity


Requirements Phase



Mating only 45N Maximum Output Power ANSI/EIA-

455-20A-96 Header Only: Initial baseline measurement -10.25dBm MIN.


ANSI/EIA-455-20A-96


E1 Mating and unmating forces

ISO 8092-2 Par. 4.3

Manual mating

Insertion Loss

ANSI/EIA-455-34A


E2 Mate and unmating forces

ISO 8092-2 Par. 4.3

Manual unmating

Unmating only

45N maximum with latch depressed

Unmating only

ANSI/EIA 364-13A-83 (90)

45N maximum with latch depressed




ANSI/EIA-455-20A-96


E3 Durability TIA 455 21 A


Insertion Loss

ANSI/EIA-455-34A


E4 Mating and unmating forces

ISO 8092-2 Par. 4.3

Mate only Latch Retention

ANSI/EIA 364-38A-83 (90) pull at a rate of 50 mm/min

100N minimum with latch engaged

Table 8-11: POF Connectors - Performance Group E



8.4.2.7 Performance Group F - POF Connectors Output Power, Responsivity/Sensit ivity and Insert ion Loss when Subjected to Humidity Stress


Requirements Phase






ANSI/EIA-455-20A-96


F1 Durability TIA 455 21 A 10 cycles; manual cycling at a rate of 300 cycles/h max

Insertion Loss

ANSI/EIA-455-3AA





ANSI/EIA-455-20A-96


F2 Humidity (cyclic)

ISO 8092-2 Par. 4.10

10 cycles (240 h) (+25ºC and 45-75%RH to +65ºC and 95% RH to -40ºC and RH uncontrolled ; nonenergized )

Insertion Loss

ANSI/EIA-455-34A


Table 8-12: POF Connectors - Performance Group F



8.4.2.8 Performance Group G - POF Connectors Output Power, Responsivity/Sensit ivity and Insert ion Loss when Subjected to Thermal Age, Vibration Thermal Shock and Humidity Stress


Requirements Phase



Output Power

ANSI/EIA-455-20A-96



ANSI/EIA-455-20A-96


G1 Durability ANSI/EIA-455-21A


Insertion Loss

ANSI/EIA-455-34A


G2 Thermal Age

ISO 8092-2 Par. 4.18

Class 65 only: Method A Condition 3 (85ºC) Class 85 only: Method A Condition 4 (85ºC) Both Classes: Mated; energized;



Output Power

ANSI/EIA-455-20A-96



ANSI/EIA-455-20A-96


G3 None

Insertion Loss

ANSI/EIA-455-34A


G4 Vibration ISO 8092-2 Par. 4.11

Class B [10 - 81Hz with ± 0.75 displacement; 81 to 500Hz at 20 g’s and 500 to 2000Hz at 18 g’s] 8h in each mutually perpendicular axis Mated; energized



Table 8-13: POF Connectors - Performance Group G




Requirements Phase






ANSI/EIA-455-20A-96


G5 None

Insertion Loss

ANSI/EIA-455-34A


G6 Thermal Shock

ISO 8092-2 Par 4.22

Class 65 only: 100 Cycles (-40ºC to +65ºC;) Class 85 only: 100 Cycles (-40ºC to +85ºC;) Both Classes: Mated; energized;






ANSI/EIA-455-20A-96


G7 None

Insertion Loss

ANSI/EIA-455-34A


G8 Humidity (cyclic)

ISO 8092-2 Par. 4.10

10 cycles (240 h) (+25ºC and RH 45-75% to +65ºC and RH 95% to -40ºC and RH uncontrolled; non-energized )

None

Table 8-13: POF Connectors - Performance Group G (Continued)




Requirements Phase






ANSI/EIA-455-20A-96


G9 None

Insertion Loss

ANSI/EIA-455-34A


Table 8-13: POF Connectors - Performance Group G (Continued)

8.4.2.9 Performance Group H - POF Connectors when Subjected to Fluid Resistance


Requirements Phase



H1 Fluid Compatibility (Commercial fluids) @ 25ºC

ISO 6722-2 (99) Par. 1.1

ISO 175 fluids: a.) coffee b.) cola c.) 10% alcohol

based cleaner d.) 10%ammonia

based cleaner e.) hand lotion Immerse 3 samples of connectors in each fluid @ 25ºC ± 2ºC for 0.5h

Visual TIA 455-13 A

No visible evidence of connector degradation.



H2 Fluid Compatibility (Automotive fluids) @ 25ºC

ISO 6722-2 (99) Par. 1.1

ISO 1817 fluids: a.) Sulfuric Acid

of 1.26 specific gravity (battery acid)

b.) 85% ethanol + 15% REF fuel C (alcohol based fuel)

c.) 90% IRM 903 + 10% t-xylene (diesel fuel)

Immerse 3 samples of connectors in each fluid @ 25ºC ± 2ºC for 0.5h

Visual ANSI/EIA-455-13A


Table 8-14: POF Connectors - Performance Group H




Requirements Phase



H3 Fluid Compatibility (Automotive fluids) @ +25ºC

ISO 6722-2 (99) Par. 1.1

ISO 1817 fluids: a.) 50% ethylene

glycol and 50% distilled water (anti-freeze)

b.) ASTM IRM-903 (power steering fluid)

Immerse 3 samples of connectors in each fluid @ 25ºC ± 2ºC for 0.5h



H4 Fluid Compatibility (Automotive fluids) @ +25ºC

ISO 6722-2 (99) Par. 1.1

ISO 1817 fluids: a.) SAE RM66-

04 (brake fluid)

b.) Citgo #33123 (transmission oil)

c.) ASTM IRM-902 (engine oil)

Immerse 3 samples of connectors in each fluid @ 25Cº ± 2ºC for 0.5h



Table 8-14: POF Connectors - Performance Group H (Continued)



8.4.2.10 Performance Group I - POF Connectors General Tests


Requirements Phase



I1 None Cavity to Cavity Isolation (10 plugs and 10 sockets)

IEC 61300 Par. 3.8

-30dB less than reference sensitivity level

I2 Cable axial pull (10 plugs)

ANSI/EIA 455-6 B (92)

Fix plug housing and apply load of 50N for one minute on cable axis


No jacket tears of visual exposure of POF. No jacket movement greater than 1.5mm at the point of exit.

I3 Cable flexing (10 plugs)

ANSI/EIA 455-1 B (98)

Condition I, dimension “X”=5.5 times cable diameter; 100 cycles in each of two planes; See figure 8-16


No jacket tears of visual exposure of POF. No jacket movement greater than 1.5mm at the point of exit.

Table 8-15: POF Connectors - Performance Group I

Figure 8-16: Cable flexing Test Setup



8.4.3 POF Cable

8.4.3.1 Test Set Up

NOTE — 1. Test chamber optional to shield from external light effects during measurements.

Figure 8-17: POF Cable Test Setup




Number of Samples by Group Sample Description

A B C D E F G H

POF cables (2 cores) 3 ± 0.1m long 0 0 0 11 11 39 11 11

POF cables (2 cores) 7 ± 0.1m long 11 11 11 0 0 0 0 0

Table 8-16: POF Cable - Sample Quantities by Performance Group

8.4.3.3 Performance Group A - POF Cable Attenuation when Subjected to Temperature Life


Requirements Phase



A1 None Attenuation IEC 60793-1-40 Method B

Initial baseline measurement 1.75dB MAX.

A2 Temperature Life (High Temperature Storage)

IEC 60794-1-2-F1

(+ 85ºC) 3000h

Attenuation IEC 60793-1-40 Method B

Maximum change of ±1.7dB from initial baseline measurement and 3.45dB MAX.

Table 8-17: POF Cable - Performance Group A

8.4.3.4 Performance Group B - POF Cable Attenuation Subjected to Low Temperature


Requirements Phase



B1 None Attenuation IEC 60793-1-40 Method B


B2 Low Temperature

IEC 60794-1-2-F1

-40ºC 3000h



Table 8-18: POF Cable - Performance Group B



8.4.3.5 Performance Group C - POF Cable Attenuation Subjected to Thermal Shock and Humidity


Requirements Phase



C1 None Attenuation IEC 60793-1-40 (01)Method B


C2 Thermal Shock

IEC 60794-1-2-F-1 (99)

1000 Cycles (-40ºC to +85ºC with 0.5h at temperature limits)



C3 Humidity (Steady State)

IEC 60794-1-2-F-1 (99)

85% RH at +85ºC for 96h



Table 8-19: POF Cable - Performance Group C

8.4.3.6 Performance Group D - POF Cable Attenuation when Subjected to Bending Stress


Requirements Phase



D1 None Attenuation IEC 60793-1-40 Method B


D2 Static Bending

IEC 60794-1-2-E-11 (99)

Bend angle 90º ± 5º around a diameter defined in Figure 8-18



D3 Static Bending

IEC 60794-1-2-E-11 (99)

Bend angle 180º ± 5º around a diameter defined in Figure 8-18



D4 Cyclic Bending

IEC 60794-1-2-E-6 (99)

Bend angle 180º ± 5º around a diameter defined in Figure 8-18 for 10,000 cycles



Table 8-20: POF Cable - Performance Group D



Figure 8-18: Cable Bending Test Setup



8.4.3.7 Performance Group E - POF Cable Attenuation when Subjected to Torsion Stress


Requirements Phase



E1 None Attenuation IEC 60793-1-40 Method B


E2 Static Torsion

IEC 60794-1-2-E-7 (99)

Torsion Angle 360º for 10 cycles; see Figure 8-19



E3 Cyclic Torsion

IEC 61300-2-5 (95) To Be Confirmed

Torsion Angle ± 180º for 10000 cycles; see Figure 8-19



Table 8-21: POF Cable - Performance Group E



Figure 8-19: Torsion test set up



8.4.3.8 Performance Group F - POF Cable Attenuation when Subjected to Fluid Resistance


Requirements Phase



F1 None Attenuation IEC 60793-1-40 Method B




F2 Fluid Compatibility (Commercial fluids) @ 25ºC

ISO 6722-2 Par. 1.1

ISO 175 fluids: a.) coffee b.) cola c.) 10% alcohol

based cleaner d.) 10%

ammonia based cleaner

e.) hand lotion Immerse 1m section of 3m length for each fluid immerse 3 samples @ 25ºC ± 2ºC for 0.5h


No visual degradation



F3 Fluid Compatibility (Automotive fluids) @ 25ºC

ISO 6722-2 Par. 1.1

ISO 1817 fluids: a.) Sulfuric Acid

of 1.26 specific gravity (battery acid)

b.) 85% ethanol + 15% REF fuel C (alcohol based fuel)

c.) 90% IRM 903 + 10% t-xylene (diesel fuel)

Immerse 1m section of 3m length for each fluid immerse 3 samples @ 25ºC ± 2ºC for 0.5h



Table 8-22: POF Cable - Performance Group F




Requirements Phase





F4 Fluid Compatibility (Automotive fluids) @ + 50ºC

ISO 6722-2 Par. 1.1

ISO 1817 fluids: a.) 50% ethylene


b.) ASTM IRM-903 (power steering fluid)






F5 Fluid Compatibility (Automotive fluids) @ 80ºC

ISO 6722-2 Par.1.1

ISO 1817 fluids: a.) SAE RM66-

04 (brake fluid)

b.) Citgo #33123 (transmission oil)

c.) ASTM IRM-902 (engine oil)




Table 8-22: POF Cable - Performance Group F (Continued)

8.4.3.9 Performance Group G - POF Cable Attenuation when Subjected to Compressive Load

Phase Test Measurements to be performed

Requirements





G1 None Attenuation IEC 60793-1-40 Method B


G2 Crush Test (edge) (Compressive load)

IEC 60794-1-2-E-4 (99)

Weight: 105kg Load time: 3 ± 0.5m Edge profile see Figure 8-20



Table 8-23: POF Cable - Performance Group G

8.4.3.10 Performance Group H - POF Cable Attenuation when Subjected to Cyclic Impact


Requirements Phase



H1 None Attenuation IEC 60793-1-40 Method B


H2 Impact (edge) (5 samples)

IEC 60794-1-2-E-4 (99)

Weight: 1kg Drop height 50mm ± 5mm 10 cycles see Figure 8-20



H3 Impact (plane) (5 samples)

IEC 60794-1-2-E-4 (99)

Weight: 1kg Drop height 50mm ± 5mm 10 cycles see Figure 8-20



Table 8-24: POF Cable Performance Group H



Figure 8-20: Edge and Plane Impact Test Setup

8.4.4 FOT (Reference)



Sample Description A B C D E

FOT(s) not assemble to pc board 0 0 0 0 0

FOT(s) assembled to pc board 22 22 22 22 22

Table 8-25: FOT - Sample Quantities by Performance Group



8.4.4.2 Performance Group A - FOT Output Power and Responsivity/Sensit ivity when Subjected to Temperature Life


Requirements Phase



Output Power IEC 61280-1-1 (98)

FOT Only: Initial baseline measurement -7.5dBm MIN.

A1 None


IEC 61280-1-1 (98)

FOT Only: Initial baseline measurement -22dBm MAX.

Output Power IEC 61280-1-1

FOT Only: Maximum change of ±1.0dB from initial baseline measurement and -8.5dBm MIN.

A2 Thermal Age

ISO 8092-2 (00) Par. 4.18

(85ºC) Energized; collect data at a. 100h b. 200h c. 500h d. 1008h Responsivity

or Sensitivity IEC 61280-2-4

FOT Only: Maximum change of ±0.5dB from initial baseline measurement and -21.5dBm MAX.

Table 8-26: FOT - Performance Group A



8.4.4.3 Performance Group B - FOT Output Power and Responsivity/Sensit ivity when Subjected to Stepped Temperature and Thermal Shock


Requirements Phase





B1 None


IEC 61280-2-4




B2 Stepped Temperature

ISO 16750-1 Par. 5.2

Class 65 only: Temperature: +25ºC to -40ºC to +65ºC @ 5ºC Class 85 only: Temperature: +25ºC to -40ºC to +85ºC Both Classes: energized; Change temperature in 5ºC steps; 0.5h or until temperature equilibrium is reached; collect data continuously


IEC 61280-2-4


B3 Thermal Shock

ISO 8092-2 (00) Par. 4.23

Class 65 only: 100 Cycles (-40ºC to +85ºC); Class 85 only: 100 Cycles (-40ºC to +85ºC); Both Classes: Energized

None



B4 None


IEC 61280-2-4


Table 8-27: FOT - Performance Group B



8.4.4.4 Performance Group C - FOT Output Power and Responsivity/Sensit ivity when Subjected to Dust, Mechanical Shock, Vibration and Impact


Requirements Phase





C1 None


IEC 61280-2-4


C2 Mechanical Shock

ISO 8092-2 (00) Par. 4.19

[100 g’s with 5ms duration] 1000 shocks in both directions of three mutually perpendicular axis; mated; energized)

None



C3 None


IEC 61280-2-4


C4 Vibration ISO 8092-2 (00) Par. 4.11

Class B [10 - 81Hz with ± 0.75 displacement; 81 to 500Hz at 20 g’s and 500 to 2000 Hz at 18 g’s] 8h in each mutually perpendicular axis Mated; Energized

None

Table 8-28: FOT - Performance Group C




Requirements Phase

Test ID No. Severity or Conditions Title ID No. Performance level

Output Power

IEC 61280-1-1


C5 None


IEC 61280-2-4


C6 Impact (Drop)

ISO 8092-2 (00) Par. 4.20

8 drops from: a. 1.2m b. 2.4m (nonenergized)

None

Output Power

IEC 61280-1-1


C7 None


IEC 61280-2-4


Table 8-28: FOT - Performance Group C (Continued)



8.4.4.5 Performance Group D - FOT Output Power and Responsivity/Sensit ivity when Subjected to Humidity Stress


Requirements Phase





D1 None


IEC 61280-2-4


D2 Humidity (cyclic)

ISO 8092-2 (00) Par. 4.10

Class 65 and Class 85: 10 cycles (240h) (+25ºC and 45-75% RH to +85ºC and 95% RH to -40ºC and RH uncontrolled; energized)

None



D3 None


IEC 61280-2-4


Table 8-29: FOT - Performance Group D



8.4.4.6 Performance Group E - FOT Output Power and Responsivity/Sensit ivity when Subjected to Thermal Age, Vibration Thermal Shock and Humidity Stress


Requirements Phase





E1 None


IEC 61280-2-4


E2 Thermal Aging

ISO 8092-2 (00) Par. 4.18

Class 65 only: Temperature: +25ºC to -40ºC to +65ºC Class 85 only: Temperature: +25ºC to -40ºC to +85ºC Both Classes: Energized; Change temperature in 5ºC steps; 0.5h or until temperature equilibrium is reached;

None



E3 None


IEC 61280-2-4


E4 Vibration ISO 8092-2 (00) Par. 4.11


None

Table 8-30: FOT - Performance Group E

Phase Test Measurements to be performed

Requirements







E5 None


IEC 61280-2-4


E6 Thermal Shock

ISO 8092-2 (00) Par. 4.22

Class 65 only: 100 Cycles (-40ºC to +85ºC); Class 85 only: 100 Cycles (-40ºC to +85ºC); Both Classes: (energized)

None



E7 None


IEC 61280-2-4


E8 Humidity (cyclic)

ISO 8092-2 (00) Par. 4.10

10 cycles (240h) (+25ºC and 45-75% RH to +65ºC and 95% RH to -40ºC and RH uncontrolled; non-energized)

None



E9 None


IEC 61280-2-4


Table 8-30: FOT - Performance Group E (Continued)

8.4.5 POF System Link Embedded Network (Reference)

8.4.5.1 Test Set Up



Figure 8-21: POF System Link Embedded Network

18 meters of POF Cable with no POF inline connector pairs (upper illustration),

15 meters of POF Cable with one POF inline (middle illustration)

10 meters of POF Cable and two POF in line connector pairs (lower illustration)

8.4.5.2 Sample Quantit ies by Performance Groups


Sample Description A B



Zero Inlines connect

One Inlines connect

Pairs

Two Inlines connect

Pairs

POF header socket with integrated FOT not assembled to printed circuit board 5 0 0 0

Inline POF cable plug not assembled to POF cable 5 0 0 0

Inline POF cable socket not assembled to POF cable 5 0 0 0

POF header sockets with integrated FOT assembled to printed circuit board 0 22 22 22

Inline POF cable plug to cable plug assembled to 18± 0.1m POF cable 5 11 0 0

Inline POF cable plug to cable socket assembled to 7.5± 0.1m of POF cable 5 0 22 0

Inline POF cable plug to cable plug assembled to 3.3± 0.1m POF cable 5 0 0 11

Inline POF cable plug to cable socket assembled to 3.3± 0.1m of POF cable 5 0 0 22

Table 8-31: POF System Link Embedded Network - Sample Quantities by Performance Group

8.4.5.3 Performance Group A - POF Embedded Network Basic Construction, Workmanship and Dimensions


Requirements Phase



A1 Visual and dimensional inspection

TIA 455 13 A

Unmated and unmounted connectors

Dimensional Inspection

Per Figures 8-1, 8-2, 8-5, 8-6, 8-7

No defects that would impair normal operations. No deviation from dimensional tolerances.

Table 8-32: POF System Link Embedded Network- Performance Group A



8.4.5.4 Performance Group B- POF Embedded Network Output Power, Responsivity/Sensit ivity and Insert ion Loss when Subjected to Thermal Age, Vibration Thermal Shock and Humidity Stress

The DUT shall be tested with a pseudo random (29 – 1) with a BER of 1•10-12. The power level shall be at the receiver’s limit according the specification. To get a more reliable test result, the bit sequence may be in a “mixed mode” with predefined frame bits and random data bits. The test shall run for a minimal time period such that an expected average error count of 10 may occur. (e.g. at 120dBm and above BER >84s). In the case of parallel testing, the test time of each DUT shall be synchronized with the test cycle.


Requirements Phase

Test ID No. Severity or conditions Title ID No. Performance level

B1 Durability TIA 455 21 A


Bit Error Rate

IEC 61280-2-4 (98)

IEEE Std 1394b-2002 Clause 7.7.5

B2 Thermal Aging

ISO 8092-2 (00) Par. 4.18

(85ºC for 1008h) Mated; non-energized;

Bit Error Rate

IEC 61280-2-4


B3 Vibration ISO 8092-2 (00) Par. 4.11


Bit Error Rate

IEC 61280-2-4


B4 Thermal Shock

ISO 8092-2 (00) Par. 4.22

Class 65 only: 100 Cycles (-40ºC to +65ºC); Class 85 only: 100 Cycles (-40ºC to +85ºC); Both Classes: Mated; energized; collect data continuously

Bit Error Rate

IEC 61280-2-4


B5 Humidity (cyclic)

ISO 8092-2 (00) Par. 4.10

10 cycles (240h) (+25ºC and 45-75% RH to +65ºC and 95% RH to -40ºC and RH uncontrolled; energized)

Bit Error Rate

IEC 61280-2-4


Table 8-33: POF System Link Embedded Network - Performance Group B



9. Portable Devices - Customer Convenience Port Definition

This clause specifies the electrical and physical properties of IDB-1394 Customer Convenience Port (CCP) used to interconnect portable devices to the automotive embedded network. This is a unique class of products with an automotive grade CCP socket mating with a consumer plug. Some of the connector attributes are not directly specified in this clause and are implied by the performance requirements in this clause. The basic test sequences found in this chapter are based on the IEEE Std 1394b-2002. Some of these test parameters may be more or less stringent from typical automotive testing and may be enhanced by the implementers. The interface detail is found in IEEE Std 1394b-2002 and shall be considered normative.

The temperature conditions that they will experience are:

Operating Temperature: -40°C and +85°C

Storage Temperature: -40°C and +105°C

A.1.1 (These temperature conditions are based on the IEEE Std 1394b-2002 standard for copper connectors.)

Table 1 in ANSI/EIA 364 D(01)shows operating class definitions for different end-use applications. The test specifications follow the recommendations for environmental class G2.1 that defines: "Year round exposure to heat, cold humidity, moisture, industrial pollutants and fluids." The Equipment Operating Environmental Conditions shown for class G2.1 are modified for: Temperature -40°C to +85°C. Class 1.3 further described as operating in maximum humidity of 95%, a "harsh environment. To verify the performance requirements, performance testing is specified according to the recommendations, test sequences and test procedures in ANSI/EIA 364.

9.1 CCP Socket Performance Criteria

The CCP socket as defined in this clause will be within the passenger compartment of a vehicle.

The CCP socket is used to interconnect consumer portable devices to the embedded network. The CCP socket mating interface dimensions and inner and outer shield isolation shall be as defined in IEEE Std 1394b-2002. The CCP socket shall inter-mate with both the IEEE Std 1394b-2002 Bilingual Type 2 (IEEE Std 1394-1995, 6 circuit plug to IEEE Std 1394b-2002 Bilingual plug) and Type 3 (IEEE Std 1394a-2000, 4 circuit plug to IEEE Std 1394b-2002 Bilingual plug) cable assemblies. All dimensions relating to the placement of the CCP socket with respect to the mounting panel as specified in this clause shall be met.

A minimum durability of 7500 cycles is required for the CCP socket.

A maximum force of 60N applied to the front of the CCP socket shall not result in damage socket.



Implementation of the dust cover is left to the discretion of the system implementer. A pictorial illustration demonstrating the proper plug orientation should appear either on the dust cover door or near the CCP socket location to assist in proper orientation of the plug prior to insertion.

Figure 9-1: Proper Plug Mating Orientation Graphic (Reference)

Additionally, the manufacturer should use the 1394TA Connector Icon shown in Figure 9-2 for proper identification.

Figure 9-2: Proper Plug Mating Orientation Graphic (Reference)

Some of the connector attributes are not directly specified in this section and they are implied by the performance requirements in this clause.

The 1394TA will provide the Icon upon final icon approval.



9.2 CCP Dimensional Criteria

NOTE —

1. All dimensions are in mm. 2. Unless otherwise specified, tolerances linear ± 0.15 and angular ± 5º 3. Interpret dimensions and tolerances per ANSI Y-14.5M-1994 4. Panel opening details are common to single and dual bay parts

Figure 9-3: CCP socket body profile and interface from panel opening (Normative)

• Single Bay Panel Opening

• Dual Bay Panel Opening



NOTE —

1) All linear dimensions are in mm 2) Unless otherwise specified, tolerances linear ± 0.15 and angular ± 5º 3) Interpret dimensions and tolerances per ANSI Y-14.5M-1994 4) Datum Surfaces

a) Datum J - Top Surface of PC Board b) K and K1 - Orientation hole closest to pad matrix c) L and L1 - Remaining orientation hole

5) Phantom outline of CCP socket 6) Pad layout details are common to single and dual bay socket

Figure 9-4: CCP socket PCB footprint (Reference)

• Dual Bay PCB Footprint Layout

• Single Bay PCB Footprint Layout



9.3 CCP Plating Criteria

9.3.1 Mating Area Finish on Socket Contacts

It is necessary to standardize the electroplated finish on the contacts to assure the compatibility of sockets from different sources. The following standardized electroplatings are compatible and one shall be used on the mating interface.

a) 1.27µm (50µin) minimum gold over 1.27µm (50µin) minimum nickel

b) 0.25µm (10µin) minimum gold over 0.76µm (30µin) palladium nickel alloy (80% Pd-20% Ni) minimum over 1.27µm (50µin) minimum nickel

9.3.2 Mating Area Inner and Outer Shell

Both shells shall be plated with a minimum of 3.04µm (120µin) tin or tin alloy with a suitable barrier underplate of either copper or nickel.

9.3.3 PCB Termination Area Finish on Socket and Shell Contacts

It is acceptable to use an electroplate of tin or tin alloy for the PCB terminations with a minimum thickness of 3.04µm (120µin) tin or tin lead alloy with a suitable barrier of either copper or nickel.

9.4 CCP Performance Validation

Unless otherwise specified, all measurements shall be made within the following laboratory ambient conditions:

1) Temperature: 18°C to 28°C.

2) Atmospheric pressure: 86kPa to 106kPa.

3) Relative humidity: 25% to 75%.

Special tests may require tighter control of conditions and are specified in the test procedure.

Visual examination of the test samples for acceptable workmanship and physical damage that will prevent mechanical and electrical operation shall be performed initially and after each environmental and stress test.

Workmanship generally accepted by the electrical and electronics industry and commonly used in electrical connector and cable assembly evaluation is required for all samples submitted for qualification. Any deviation from these accepted physical and or workmanship standards during the qualification program shall be deemed as failure.

To verify the performance requirements, performance testing is specified according to the recommendations, test sequences and test procedures in ANSI/EIA 364.

All contact positions shall be measured. Sample identification and contact position number shall identify the data measurements. The results of each test shall be recorded as data.

Unless otherwise specified in the specific procedures used, measurements following exposure shall be performed within 24 hours and after the samples have recovered to room ambient conditions. The test samples shall be handled in a manner so as not to disturb the contact interface. It is preferred to perform measurements without handling the test samples.



NOTE — Subtract bulk wire resistance of length “X” from measurement

V

PWB Socket

Plug

Wire termination “X”

Wire

I

V I

PlugCable I V

I

V

Cable

SocketPWB

Figure 9-5 illustrates the measurement locations for both contact resistance and shield continuity. It shall be used for all product evaluation testing.

Figure 9-5: Contact Resistance and Shield Measurement Locations (Figure 5-27 from IEEE Std 1394b-2002)



9.4.1 Performance Group A: Copper Socket Basic Construction, Workmanship, Dimensions & Plating Thickness.

Sample Description Number of CCP samples

Sockets, not assembled to printed circuit board 4 Sockets, assembled to printed circuit board 0

Plugs, not assembled to cable 4 Cable assemblies with a Plug assembled to one end, 25 ± 1cm long. 0


Phase Title ID No. Severity or conditions

Title ID No.

Requirements Performance Level

A1 Visual and

dimensional

inspection

ANSI/EIA

364-18A-84

Unmated

connectors

Dimensional

Inspection

Per figures from

IEEE Std 1394b-

2002 for the

Bilingual Socket

and figure 9-2

No defects that would

impair normal operations.

No deviation from

dimensional tolerances

A2 Plating Thickness Plating Thickness Clause 9.1.3 Record thickness

No deviation from plating

materials and thickness

specification

Table 9-1: Copper Socket - Performance Group A



9.4.2 Performance Group B: Copper Socket DC Electrical Functionality when Subjected to Mechanical Shock and Vibration




Test Measurements to be performed Phase Title ID No. Severity or

conditions Title ID No.


B1 Mating and

unmating forces ANSI/EIA 364-

13 B(98)

Mount socket

rigidly. Insert plug

by hand.

Low Level

Contact

Resistance

ANSI/EIA

364-23A-85 50 mΩ maximum initial per

mated contact

B2 Vibration ANSI/EIA

364-28D-99

Condition I

(See Note A)

Continuity ANSI/EIA

364-46A-98 No discontinuity at 1µs or

longer. (Each contact)

B3 None Low Level

Contact

Resistance

ANSI/EIA

364-23A-85 30mΩ maximum change

from initial per mated

contact

B4 Mechanical

Shock (Specified

Pulse)

ANSI/EIA

364-27B-96

Condition A or

Condition E

See Note A

Continuity ANSI/EIA

364-46A-98 No discontinuity at 1µs or

longer. (Each contact)

B5 None Low Level

Contact

Resistance

ANSI/EIA



contact

NOTE —

1) Connectors are to be mounted on fixture to simulate typical usage.

2) The CCP socket shall be mounted to a panel, which is permanently attached to the fixture. A printed circuit board in accordance with the pattern shown in Figure 8-3 for the CCP socket being tested. The printed circuit board shall be permanently affixed to the fixture. The plug shall be mated with the socket and the other end of the cable shall be permanently clamped to the fixture. Refer to Figure 4-10 in IEEE Std 1394-1995 for details.

Table 9-2: Copper Socket - Performance Group B



9.4.3 Performance Group C: Copper Socket DC Electrical Functionality when Subjected to Thermal Shock and Humidity Stress






Title ID No.


C1 Mating and


13 B(98)

Mount socket

rigidly. Insert plug

by hand.

Low Level

Contact

Resistance

ANSI/EIA 364-

23 B(00)

50mΩ maximum initial per

mated contact

C2 Thermal Shock ANSI/EIA 364-

32 C(00)

10 cycles

(mated)

Condition I

Low Level

Contact

Resistance

ANSI/EIA



contact

C3 Humidity

(Steady state) ANSI/EIA 364-

31 B(00)

Condition A

(96h)

Method II

Low Level

Contact

Resistance

ANSI/EIA



contact

Table 9-3: Copper Socket - Performance Group C



9.4.4 Performance Group D: Copper Socket Insulator Integrity when Subjected to Thermal Shock and Stress





Phase Title ID No.

Severity or conditions

Title ID No.


D1 Withstanding

Voltage ANSI/EIA 364-20 B(99)

Test Voltage

100Vdc ± 10Vdc

Method C

Unmated

Withstanding

Voltage

ANSI/EIA

364-20A-83

(R90)

No flashover.

No spark over.

No excessive leakage

No breakdown.

D2 Thermal Shock ANSI/EIA 364-

32 C(00)

Test Condition I

10 Cycles

Unmated

None

D3 Withstanding

Voltage ANSI/EIA 364-

20 B(99)

Test Voltage

100Vdc ± 10Vdc

Method C

Unmated

Withstanding

Voltage

ANSI/EIA

364-20A-83

(R90)

No flashover.

No spark over.

No excessive leakage

No breakdown.

D4 Insulation

Resistance ANSI/EIA 364-

21 C(00)

Test Voltage

100Vdc ± 10Vdc

Method C

Unmated

Insulation

Resistance

ANSI/EIA

364-21B-95 100MΩ minimum between

adjacent contacts and

contacts and shell

D5 Humidity

(Cyclic) ANSI/EIA 364-

83 B(00)

Condition A

(96h)

Method III

non-energized

Omit 7a and 7b

None

D6 Insulation

Resistance ANSI/EIA 364-

21 C(00)

Test Voltage

100Vdc ± 10Vdc

Method C

Unmated

Insulation

Resistance

ANSI/EIA

364-21B-95 100MΩ minimum between

adjacent contacts and

contacts and shell

Table 9-4: Copper Socket - Performance Group D



9.4.5 Performance Group E: Copper Socket DC Electrical Functionality when Subjected to Mechanically Cycling and Corrosive Gas Exposure






Title ID No.


E1 Mating and


13 B(98)

Mount socket rigidly.

Insert plug by hand

Low Level

Contact

Resistance

ANSI/EIA

364-23A-85 50mΩ maximum initial per

mated contact

E2 Continuity See Figure 8-4 for

measurement

locations

Contact

resistance

braid to inner

shield

ANSI/EIA 364-

06 B(00)

50mΩ maximum change

from initial from braid to

inner shield at 100mA 5Vdc

open circuit max

E3 Durability ANSI/EIA 364-

09 C(99)

Subgroup (a): 2

mated pairs 5

cycles

Subgroup (b): 4

mated pairs 3750

cycles

automatic cycling at

500 cycles / h ±50

cycles / h (Replace

plugs every 750

cycles)

None

E4 None Low Level

Contact

Resistance

ANSI/EIA



contact

E5 Continuity See Figure 8-4 for

measurement

locations

Contact

resistance

braid to inner

shield

ANSI/EIA

364-06A-83

(R90)




open circuit max

Table 9-5: Copper Socket - Performance Group E




Phase Title ID No. Severity or Conditions

Title ID No.


E6 Mixed Flowing

Gas ANSI/EIA 364-

65 A(98)

Class II exposure

Subgroup (a): 2

pairs 1 day

unmated

Subgroup (b): 4

pairs 10 days

mated

Low Level

Contact

Resistance

ANSI/EIA



contact

E7 Durability ANSI/EIA

364-09B-91

Subgroup (a): 2

mated pairs 5

cycles

Subgroup (b): 4

mated pairs

3750 cycles

automatic cycling

at 500 cycles/h

±50 cycles/h

(Replace plugs

every 750 cycles)

Low Level

Contact

Resistance

ANSI/EIA



contact

E8 Mixed Flowing

Gas ANSI/EIA 364-

65 A(98)

Class II exposures:

Subgroup (a): 2

pairs 10 day

mated

Subgroup (b): 4

mated pairs 10

days mated

Low Level

Contact

Resistance

ANSI/EIA



contact

E9 Continuity See Figure 8-4

for measurement

locations

Contact

resistance

braid to inner

shield

ANSI/EIA

364-06A-83

(R90)




open circuit max

Table 9-5: Copper Socket - Performance Group E (Continued)



9.4.6 Performance Group F: Copper Socket DC Electrical Functionality and Unmating Forces when Subjected to Temperature Life Stress






Title ID No.


F1 Mating and

Unmating Forces ANSI/EIA 364-

13 B(98)

Mount socket

rigidly,

Mating only.

F2 None Low Level

Contact

Resistance

ANSI/EIA

364-23A-85 50mΩ maximum initial per

mated contact

F3 Continuity

(shell)

See Figure 8-4 for

measurement

points

Contact

resistance braid

to inner shield

ANSI/EIA 364-

06 B(00)




open circuit max

F4 Temperature Life ANSI/EIA

364-17B-99

Method A

Condition 2

(79°C)

96h

(mated)

Low Level

Contact

Resistance

ANSI/EIA



contact

F5 Continuity

(shell)

See Figure 8-4 for

measurement

points

Contact

resistance braid

to inner shell

ANSI/EIA 364-

06 B(00)




open circuit max

Final unmating force:

10.0N min to 39.0N max

F6 Mating and

Unmating Forces ANSI/EIA 364-

13 B(98)

Mount Socket

rigidly

Mating and

Unmating

Forces

(Unmating only)

ANSI/EIA

364-13A-83

(R90) 75N maximum

Table 9-6: Copper Socket - Performance Group F



9.4.7 Performance Group G: Copper Socket Mechanical Retent ion and Durabil i ty


Number of PWR samples

Sockets, not assembled to printed circuit board 6 6 Sockets, assembled to printed circuit board 0 0

Plugs, not assembled to cable 60 6 Cable assemblies with a Plug assembled to one end, 25 ± 1cm long. 0 0

Test Measurements to be performed Phase Title ID

No. Severity or conditions

Title ID No.


G1 Mating and


13 B(98)

Mount socket

rigidly. Insert by

hand.

Mating only

G2 Mating and


13 B(98)

Auto rate:

25mm/min

Unmating only ANSI/EIA

364-13A-83

(R90)

Unmating force at the end

of durability cycles:

10.0N minimum

39.0N maximum

G3 Durability ANSI/EIA

364-09C-99

Automatic cycling

to 7500 cycles

with plug

replacement

every 750 cycles

Unmating only ANSI/EIA 364-

13 B(98)

Unmating force at the end

of durability cycles:

10.0N minimum

39.0N maximum

Table 9-7: Copper Socket - Performance Group G



9.4.8 Performance Group H - Copper Socket Subjected to Fluid Resistance





Requirements Phase



H1 Fluid Resistance (Commercial fluids) @ 25ºC

ANSI/EIA 364-10 B(02) or ISO 175 (99)

Fluid: a) coffee b) cola c) 5% - 10%

alcohol based cleaner

d) 5% - 10% ammonia based cleaner

e) hand lotion For each fluid immerse 3 samples @ 25ºC ± 2ºC for 0.5 h

Visual ANSI/EIA 364-18A-84


H2 Fluid Resistance (Automotive fluids) @ 25ºC

ANSI/EIA 364-10 B(02) or ISO 175 (99)

Fluid: a) Sulfuric Acid of

1.26 specific gravity (battery acid)

b) 85% ethanol + 15% REF fuel C (alcohol based fuel)

c) 90% IRM 903 + 10% t-xylene (diesel fuel)

For each fluid immerse 3 samples @ 25ºC ± 2ºC for 0.5 h



Table 9-8: Copper Socket - Performance Group H




Requirements Phase



H3 Fluid Resistance (Automotive fluids) @ +50ºC

ANSI/EIA 364-10 B(02) or ISO 175 (99)

Fluids: a. 50% ethylene


b. ASTM IRM-903 (power steering fluid)

For each fluid immerse 3 samples @ 50ºC ± 2ºC for 0.5h



H4 Fluid Resistance (Automotive fluids) @ 80ºC

ANSI/EIA 364-10 B(02) or ISO 175 (99)

Fluids: a. SAE RM66-04

(brake fluid) b. Citgo #33123

(transmission oil)

c. ASTM IRM-902 (engine oil)

For each fluid immerse 3 samples @ 80Cº ± 2ºC for 0.5h



Table 9-8: Copper socket - Performance Group F (Continued)



9.4.9 Performance Group I: General Tests

Suggested procedures to test miscellaneous but important aspects of the interconnect system are given in Table 9.9. Since the tests listed below may be destructive, separate samples shall be used for each test. The number of samples to be used is listed under the test title.

Total Number of samples with breakdown listed in Table 9-9.




Test Measurements to be performed Phase Title ID No. Severity or

conditions Title ID No.


I1 Electrostatic

Discharge

(3 Sockets)

IEC 61400-4-2

(01)

1 to 8 kV steps.

Use 8 mm ball

probe. Test

unmated.

Evidence of

discharge


impair normal operation.

No deviation from

dimensional tolerances

I2 Polarization

Effectiveness

(3 sockets and 3

plugs)

ANSI/EIA 364-

04 A(02)

60N applied by

the plug to the

face of the socket

mounted on a PC

board

Visual

Examination


impair normal operation.

Table 9-9: Copper Socket - Performance Group I



9.4.10 Signal Propagation Performance Criteria

The test procedures for all parameters listed in this clause are described in annex K of IEEE Std 1394-1995, annex B of IEEE Std 1394a-2000, ANSI/EIA 364-102 and ANSI/EIA 364-103. Any test condition exceptions will be noted in association with each parametric requirement.

9.4.10.1 Test Hardware

The connector only test fixturing described in IEEE Std 1394b-2002 shall be used. Specifically the following:

• Section 5.4.1.1 Connector only differential test fixture along with Figures 5-30, 5-31 and 5-32

• Section 5.4.1.3 Test fixture schematic along with Figure 5-36

• Section 5.4.1.4 Pad positioning to PHY function map along with Figures 5-14

9.4.10.2 Signal Impedance

The differential mode characteristic impedance of the signal pairs within the cable section shall be measured by time domain reflectometry with the cable assembly differential test fixture at less than 80ps rise time in order to establish adequate measurement resolution; the recommended procedure is described in annex clause K.3 of IEEE Std 1394-1995 and annex clause B.2 of IEEE Std 1394a-2000 with the following exception in test condition; evaluate differential impedance over a 150ps exception window with test points at:

• connector insertion plane -25ps

• connector insertion plane (reference point, so offset will be 0ps (zero ps))

• connector insertion plane +50ps



The exception window is extended ±25ps beyond the beginning and end of a typical mated connector in order to evaluate settling performance. Also note that in making time domain measurements multiply all real time values by 2X to account for round trip.

• ZTPACONN = (110 ± 20) Ω (differential)

• ZTPBCONN = (110 ± 20) Ω (differential)



9.4.10.3 Signal Pairs Rise Time Degradation

The differential risetime degradation shall be measured through the mated connector section using a differential TDT with an injected risetime of 70 ps or less to establish sufficient measurement resolution. The recommended procedure is described in ANSI/EIA 364-102 using the connector only differential test fixture.

• trise TPA ≤ 100ps

• trise TPB ≤ 100ps

9.4.10.4 Signal Pairs Intra-pair Propagation Skew

The connector only skew measured with the connector only differential test fixture with an injected risetime of 70ps or less shall be:

• Intrapaircon < 10ps

• Interpaircon < 15ps

9.4.10.5 Connector Crosstalk

The TPA-TPB signal-to-signal crosstalk shall be measured within the mated connector section in the time domain using the connector only differential test fixture and a differential TDT at 80ps (10% - 90%) to emulate operation of the mated connector at S3200 operation. All transmit and receive ports are sourced and terminated respectively with 50 Ω loads.

• XNEXT, XFEXT ≤ 3%

9.5 Power

9.5.1 CCP

The power pair contacts, locations #6 and #8, within the socket shall be capable of operating and continuously maintaining 1.5A maximum with a 10ºC temperature rise over ambient.



Annexes

Annex A: Power Budget (Reference)

The optical power budget requires a differential of 16.1dB between the optical transmitter and receiver port at a reference distance of 18 meters. The optical power budgets are typically specified from/to the fiber optic transceiver attachment points to the printed circuit board at both ends. This method is not utilized within this specification since it does not guarantee power levels at the connector interface. For reference, an 18.1dB transceiver-to-transceiver power budget was used when determining the 14.5dB power budget requirement specified below. This guarantees operability between all optical devices of the IDB-1394 POF embedded network.

A.1 Theoretical Total Power Budget

S100 Operation (Frequency of 125 Maud)

Mean Launch Power: Pf = -7.5dBm (See Note A)

Minimum FOT Input Power: Pin = -22dBm (Note B)

Minimum Power Budget: Budget = Pin - Pf = 14.5dB (1)

A.2 POF Cable

Maximum POF Cable Loss: 0.25dB/meter (2)

A.3 Interface POF Connector

Maximum Coupling Loss Between FOT and Plug 2.0dB (3)

NOTE — Maximum loss includes all causes of degradation such as temperature, humidity, chemicals, solvents, etc.

A.4 In-Line POF Connector

Maximum Loss in each Inline POF Connector Pair 2.5dB (4)

A.5 Bending, Temperature and Thermal Aging

Maximum Loss of POF Cable for Bending 0.5dB (5)

Maximum Loss of POF Cable for Temperature 0.1dB (6)

Maximum Loss of FOT for Temperature 1.5dB (7)

Maximum Loss of POF Cable for Thermal Aging 1.0dB (8)

Maximum Loss of FOT for Thermal Aging 1.5dB (9)



A.6 System Margin (Two Inline POF Mated Connectors and 9 Meters Total Length of POF Cable)

System Margin = (1) - [(2) *9 meters] + (3) + [(4) * 2] + (5) + (6) + (7) + (8) + (9)

= 14.5 - 13.85 = 0.65dB

Note A - The interface point for the mean launch power specification is a 1 meter length of POF fiber located immediately after the plug of the connector attached to the POF Header with integrated FOT.

Note B - The interface point for the minimum FOT input power is located between the plug of the connector and the POF Header with integrated FOT.

Note C – Maximum loss includes all causes of degradation such as temperature, humidity, chemicals, solvents, etc.

A.7 Production Validation

The system margin is required to include additional losses that occur during production of the wiring subassemblies and introduction of these assemblies into the automobile. The assembly sequence of an automotive fiber optical system starts from individual components to a finished harness mounted in a vehicle as shown in figure A-1.

Figure A-1: Automotive Assembly Sequence

In order to ensure the proper vehicle function of the optical link, a worst-case production power budget is calculated using the checked loss/power numbers.



The assembly chain scenario, as shown in Figure A-2, is based on component and POF cable assembly data sheet values, which will approximate the final optical link assembly from multiple suppliers.

In addition to the theoretical power budget calculation, the actual component values, the test equipment tolerances are included the calculation. This calculation is more pessimistic, but will be more reliable for components in high unit volume production. By using this methodology, each fiber cut lead is produced as an assembly. The cut leads are then assembled into a wiring harness. The wiring harness is then tested. The final check is done after vehicle assembly and covers power and loss performance at room temperature conditions with all components installed in the vehicle. All of the environmental effects are included based on test results from the component validation process. Adding the testing of the transmitter and receiver will result in 6 test points and their associated test tolerances.

Assuming a test tolerance at each point of 0.3dB the system margin of 2.7 has been consumed. These test tolerances have been included in the stated maximum component values listed in the theoretical power budget. It is important to note that these tolerances exist and discussions between the supplier and the purchaser must agree on the test tolerance and the test method to ensure proper measurement.

Figure A-2: Worse Case Power Budget Based on Production

R x

R e c e iv e r

T x

T ra n s m it te r

T e s te d T ra n s m it te r O p t ic a l P o w e r

T e s te d L in k L o s s


T e s te d R e c e iv e r S e n s it iv ity

A s s e m b le d L in k L 1 a

A s s e m b le d L in k L 1 b

a d d . L o s s A g in g /E n v iro n m e n t

m a x L o s s P lu s m a r g in


A s s e m b le d L in k L 1 c

Rx

Receiver

Tx

Transmitter Inline Inline

min. TransmitterOptical Power

min. Receiver Sensitivity

FiberLoss

Inline Loss

FiberLoss

Inline Loss

FiberLoss

Power Budget

L2a L2b L2c



Fiber Lead Assembly 3 leads:

Maximum lead loss L1 = L® + test tolerance Maximum reading number L1® [dB]

Fiber Harness Assembly 3 wiring assemblies (optionally with integrated inline(s))

Maximum link loss L2 = L2® + test tolerance Maximum reading number L2® = L1 + Harness assembly loss [dB]

Fiber Car Assembly (optionally with integrated inline(s))

Maximum link loss L3 = L2® + test tolerance Maximum reading number L3® = L2 + Car assembly loss [dB]

Testing of Receiver

Minimum receiver sensitivity PR = PR® + test tolerance Minimum threshold number PR® [dBm]

Testing of Transmitter

Minimum transmitter coupled output power P(T) - test tolerance Minimum threshold number P(T) [dBm]

Figure A-3: Sample Production Template Calculation

Documents

TA Document 2001018 IDB-1394 Automotive Specification 11394ta.org/wp-content/uploads/2015/07/20010181.pdf · 1394 Automotive Specification (IDB-1394) TA Document 2001018/1.0, March