Systemy do lutowania selektywnego

Selective Solderingwith the EBSO SPA Line

Many components can due to theire thermal sensitivity not be soldered with a tra-ditional wave solder process (LCD displays). Other PCB’s are due to SMD com-ponent layout issues also can’t be soldered successfully using the traditional wave solder process. Further more often the very costly custom made solder masks to cover the SMD components are difficult to make and not justifiable so customers finish up hand soldering parts. To automate this process the answer is selective sol-dering. EBSO already had machines like SPA 300-F and 400-F developed in the year 2002, this machine concept also allows small to medium companies with smaller budgets and production lots to enter this attractive new technology. The SPA Line starts from manual machines all the way up to fully automatic solder centres.

Soldernozzle for rework system SPA-R

Miniwave with

overflow wetable

solder nozzle

With this particular product line up EBSO has become the world market leader. Pro-duct specific solder nozzles and masks round off the enormous know-how EBSO has in this new emerging soldering technology. Selective soldering makes your THT solder process more efficient and safer due to exact control of flux quantity, preheat and solder temperature. With over 30 well trained distributors world wide, EBSO can provide best service in pre- and after-sales.

All SPA machines are built with the same solder pot technology made of fully tita-nium which is best for lead free solder alloys. The patented unique “QUICK RE-LEASE” solder pump is a revolution in terms of maintenance time. This system al-lows full access to the solder pot within seconds, hence it increases your production efficiency.

The EBSO Offline programming software together with the inte-grated Photo-Editor allows fastest

Solder pot with dual nozzle technology and IR-preheat

programming times.

„QUICK RELEASE”

solder pump

Simply turn pump 45°

and the pump is ready

to remove

Photo-Editor makes programming easy

and comfortable

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EBSO - Urz¹dzenia do lutowania selektywnego

SPA-RRework and Manual Soldering

The bench top machine SPA-R is a manual solder station to rework leaded compo-nents such as connectors etc.

Due to RoHS conform electronics the lead free solder temperature raised which made the rework of THT components with a solder iron even more difficult then it was before.

The solution is the SPA-R which makes this process less painless. Furthermore, for manual soldering of small and medium batches the SPA-R can be used as well.

Soldering of a connector

SPA-R with laserpointer to ease

component centering over nozzle

SPA-R insight

straightforward

engineering

XY-Table with position

fixing

Different solder nozzle

sizes and customized

nozzles

Easy to operate

Timer-function

Solder pump and solder bath made of fully titanium for lead free solder alloys equipped

with the “QUICK RELEASE” pump technology

On the fly wave hight regulation

Wave standby-function to reduce tack time

Save of 5 programs

Easy solder nozzle interchange

No limits in board size

Optional N2-supply

Optional laserpointer to ease component centering over nozzle

P

XY-table roduct Highlights:

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EBSO - Urz¹dzenia do lutowania selektywnego

SPA 200The low-cost Solution for Selective Soldering

For PCB boards not larger then 200 x 200 mm this batch machine is the most cost-efficient solution for selective soldering but offers all advantages of the technology.

The Technology:

Very little footprint of 1m² only at lowest cost of ownership

220 V single phase power at 3,5 KW

Solder area up to 200 x 200

Solder pot made of full titanium - best for lead free

Solder pump with unique “QUICK RELEASE”-System

Wide range of different solder nozzles

7° soldering to 0° possible

Wetable and jet wave solder nozzles from 3 to 25 mm

Nitrogen inert

Microdrop fluxing as standard for selective point and line fluxing

Powerful 1,5 KW bottom IR-preheater

Optional 40 program storage in machine

Process monitoring of

Flux level

Solder level

Programming with comfortable Offline- and Photo-Editor

EBSO SPA 200

in use

Inside view of the

EBSO SPA 200

Soldering process with the wetable nozzle

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EBSO - Urz¹dzenia do lutowania selektywnego

SPA 300-F / SPA 400-F Etablished worldwide

Since we introduced the SPA 300-F / SPA 400-F to the market in 2003 more then 250 machines has been installed so far.

The concept of the machine allows many options for the requirements of the cus-tomers demand.

The Technology: Very little footprint of 1m² only at lowest cost of ownership

Small footprint at lowest cost of ownership

ROI in one year

Solder area up to 400 x 400 mm

Full titanium solder pot - best for lead free

Pump unit with unique „QUICK RELEASE“-System

Wide range of solder nozzles

Simultaious soldering due to smart dual-nozzle technology - doubles your throughput

Wetable and jet wave nozzles from 3 to 25 mm

Customized nozzles

N2 inert

Single and dual sprayfluxer or microdrop fluxer

Optional 2 flux-pots to run different fluxers (i.e.: VOC and VOC-free)

Powerful 2,5 KW IR-preheater

Optional top site preheat 2,0 KW

Easy change pot system for different alloys optional with 2 solder pots in machine (SPA 400-F only)

Saves up to 40 solder programs

Closed loop drives incl. encoder at stepper motors reaches +/- 0,1 mm accuriacy in positioning

Adjustable speed up to 20 m/min

Automatic timer function

Process monitoring of

Flux level

Air and N2

Temperature

Solder level control and automatic solder wire feeder

Easy „point and click“ programming with the smart Offline- and Photo-Editor software

Production at Werma Signal Lights in Germany: 3 SPA machines, inbetween operator working place insures

highest flexibiliy and throughput - always 3 different (or same) products are in production at the same time

Dual-Nozzle with

„QUICK-RELEASE“-

Pump

Custom made

multi dip nozzle

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EBSO - Urz¹dzenia do lutowania selektywnego

SPA 500 ModularIndivudal Solutions for High-end Selective Soldering

Closed loop XYZ-portalsystem with servo-drives

Solder angle under 0° and 7° free to program

Max. PCB size 510 x 510 mm

Max. solder mask size 550 x 550 mm

Precise-spray and/or microdrop fluxer for point and line fluxing incl. 2 l flux pot and

flux level monitoring

Titanium solder pot and solder pump - best for lead free

Pump unit equipped with unique „QUICK RELEASE“-design

Solder frame reckognition with integrated collision avoidance

Dual nozzle for simultaneaous soldering to double throughput

Possibility of 4 fluxers (i.e.: 2 drop, 2 spray oder 4 spray fluxer)

2 Flux pots to run 2 differnet fluxers (i.e.: VOC and VOC-free)

Top Site Preheat

Optional Inline

2 solder pots in machine with max. solder area of 510 x 510 mm on both solder pots

i.e.: 1 solder pot dipping process 2nd solder pot selective miniwave wave

Wide range of solder nozzles and customized such as dipping nozzles

Wetable and jet wave nozzles

N2 inert

Easy change pot option

Saves up to 40 solder programs

Travel speed up to 20 m/min

Process monitoring of

Flux level

Air and N2 supply

Solder level and automatic solder wire feeder

Wave height

Easy „point and click“ programming with the smart Offline- and Photo-Editor software

The new modular plattform can be equipped for the individual product require-ment in high-end / high-volume selective soldering process.

Unique Technology Advantages:

Top site preheat

Dual nozzle

Soldering under

0° or 7°

SPA-500 as inline

with gripper unit

Change pot system

Closed loop XYZ-portalsystem with servo-drives

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EBSO - Urz¹dzenia do lutowania selektywnego

Programmingwith the EBSO Offline-Editor

The EBSO Offline-Editor is a windows based software to create a solder program for each individual solder joint. With an easy “point & click” tool a reliable solder

Advantages: You can consider neighbour SMD components Visual orientation on the board while programming Solder joint offsets are easier to control Program changes can be done quicker

Programming can´t be easier

Photo-Editor with a picture

of the board from CAD

Keep the overview with

neighbouring SMD components

through the Photo-Editor

Simple editing with the Offline-Editor

Gerber import

Offline means no programming on the machine (machine can work during setup of a new product)

Open adjustments for all process parameters

Demo mode

Compatible to all EBSO selective soldering machines from SPA 200 to SPA 500 Modular

The Gerber Import provides Features to Import Drill Gerber Files

Many times Gerber datas are difficult to filter, EBSO offers the Photo-Editor. Simply scan the bare PCB board you want to solder or create an image file of your board out from your CAD program.

Open the EBSO Photo-Editor, import this image and just click on the points where you want to solder. Coordinates will be calculated by the software.

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EBSO - Urz¹dzenia do lutowania selektywnego

Technical data LengthWidthHeightWeightColour

TransportsystemTransportangle

Max. PCB sizeMax. frame / fixture size

Max. clearance on solder sideMax. transportspeed

Position accuracy over fluxer,Preheater and solder nozzle

Fluxermodule

Flux pot

FluxspeedSpray width (nozzle diameter 0,3 mm)

PreheaterPower

SoldermoduleNozzles (refer to data sheet)

Smallest nozzle diameter

Min. neighbour component clearanceSolder capacity

Max. temperatureUpheat timeSolder time

Position speedNitrogen technology

N2N2 supply

PreasureConsumption

N2 typeInline

AirPressure

SPS

Automatic timerWorking hours counter

Maintenance controlPassword protectionManual Operation

Electrical dataPower

Power tolerance rangePower consumption

Fuse rateExhaust

Exhaust powerExtension tube

Enviroment temperaturePermanent sound level

Further Welded iron frame

Safety emergency stop switch

SPA 500 Modular

2000 mm1950 mm1350 mm500-800 kgRAL 7035XYZ axis carrier system with servo drives

0° or 7° free programmable510 x 510 mm550 x 550 mm25 mmX axis = 1850 cm/minY axis = 1900 cm/minZ axis = 1000 cm/min

+ - 0,1 mmPrecise spray fluxer,Optional microdrop-fluxer2 l stainless steel flux pot and fittings incl. flux level monitoringMax. 19 m/min programmable3-6 mm (Sprayfluxer)IR-emmiters2,5 KWTitanium solder bath and pump Jet wave nozzleOverflow nozzleSpecial nozzles3,0 mm on overflow nozzles4,0 mm on jet wave nozzles1,5-3 mm (depends on nozzle type)Approx. 35 kg400°CApprox. 35 minutes0,1-0,4 m/min programmableXY axis 18 m/min

by user (bottles, tank, generator are suitable)N2-covering over solder bath and pump unit

2 bar1,5-3 m³/h adjustable2.7 or 99,9 % N2Standard SMEMA with conveyor and gripper

6 barSiemens S7-200 SPS incl.touch-screen panel

Wave height, fluxer, preheat,solder temperature

3 x 230 / 400 V, N, PE 50 / 60 Hz+6%, -10%Max. 15 KWMax. 3 x 16 A

150 m³/hØ 100 mm15-30°C< 50 dB

SPA 400-F

1600 mm1200 mm1500 mm400 kgRAL 7035XYZ axis carrier system with stepper motors and encoder 7° fix 400 x 400 mm440 x 440 mm25 mm18 m/min

+- 0,1 mmPrecise spray fluxer,Optional microdrop-fluxer2 l stainless steel flux pot and fittings incl. flux level monitoringMax. 18 m/min programmable3-6 mm (Sprayfluxer)IR-emmiters2,5 KWTitanium solder bath and pump Jet wave nozzleOverflow nozzleSpecial nozzles3,0 mm on overflow nozzles4,0 mm on jet wave nozzles1,5-3 mm (depends on nozzle type)Approx. 35 kg400°CApprox. 30 minutes0,1-0,4 m/min programmableXY axis 18 m/min

by user (bottles, tank, generator are suitable)N2-covering over solder bath and pump unit

2 bar1,5-3 m³/h adjustablefrom 2.7-

6 barSiemens S7-200 SPSincl. touch-screen panel

Wave height, fluxer, preheat,solder temperature

3 x 230 / 400 V, N, PE 50 / 60 Hz+6%, -10%Max. 5,5 KWMax. 3 x 16 A

150 m³/hØ 100 mm15-30°C< 50 dB

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EBSO - Urz¹dzenia do lutowania selektywnego

SPA 300-F

1150 mm900 mm 1450 mm 250 kgRAL 7035XYZ axis carrier system with stepper motors and encoder 7° fix 300 x 300 mm 340 x 340 mm 25 mm18 m/min

+- 0,1 mmPrecise spray fluxer,Optional microdrop-fluxer2 l stainless steel flux pot and fittings incl. fux level monitoringMax. 18 m/min programmable3-6 mm (Sprayfluxer)IR-emmiters2,5 KWTitanium solder bath and pump Jet wave nozzleOverflow nozzleSpecial nozzles3,0 mm on overflow nozzles4,0 mm on jet wave nozzles1,5-3 mm (depends on nozzle type)Approx. 35 kg400°CApprox. 30 minutes0,1-0,4 m/min programmableXY axis 18 m/min

by user (bottles, tank, generator are suitable)N2-covering over solder bath and pump unit

2 bar1,5-3 m³/h adjustablefrom 2.7-

6 barSiemens S7-200 SPSincl. touch-screen panel

Wave height, fluxer, preheat,solder temperature

3 x 230 / 400 V, N, PE 50 / 60 Hz+6%, -10%Max. 5,5 KWMax. 3 x 16 A

150 m³/hØ 100 mm15-30°C< 50 dB

SPA 200

1000 mm800 mm1450 mm120 kgRAL 7035XYZ axis carrier system with stepper motors

7° fix /optional 0°200 x 200 mm230 x 230 mm25 mm18 m/min

+- 0,1 mm-Precise micro drop fluxer2 l stainless steel flux pot and fittings incl. flux level monitoringMax. 18 m/min programmable-IR-emmiters1,5 KWTitanium solder bath and pump Jet wave nozzleOverflow nozzleSpecial nozzles3,0 mm on overflow nozzles4,0 mm on jet wave nozzles1,5-3 mm (depends on nozzle type and PCB design)Approx. 20 kg400°CApprox. 30 minutes0,1-0,4 m/min programmableXY axis 18 m/min

by user (bottles, tank, generator are suitable)N2-covering over solder bath and pump unit

2 bar1,5-3 m³/h from 2.7-

-Siemens S7-200 SPSincl. panel----Wave height, fluxer, preheat,solder temperature

230 V, N, PE50 / 60 Hz+6%, -10%Max. 3,5 KWMax. 16 A

150 m³/hØ 100 mm15-30°C< 50 dB

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SPA R

700 mm400 mm250 mm35kg--

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2 bar / 1-3 m³ adjustable-

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EBSO - Urz¹dzenia do lutowania selektywnego