Switched Capacitor Voltage Converters with Shutdown in SOT ...ww1.microchip.com/downloads/en/DeviceDoc/21366b.pdf · 5 1 C3 C1 C2 VIN VOUT RL TC1219 TC1220 C1– IN OUT C1+ GND Device

2002 Microchip Technology Inc. DS21366B-page 1

M TC1219/TC1220

Features

• Charge Pumps in 6-Pin SOT-23A Package• >95% Voltage Conversion Efficiency

• Voltage Inversion and/or Doubling• Operates from +2.5V to +5.5V• Up to 25mA Output Current

• Only Two External Capacitors Required • Low Power Consumption• Power-Saving Shutdown Mode

• TC1220 Compatible with 1.8V Logic Systems

Applications

• LCD Panel Bias• Cellular Phones• Pagers

• PDAs, Portable Dataloggers• Battery-Powered Devices

Device Selection Table

Package Type

General Description

The TC1219/TC1220 are CMOS “charge-pump”voltage converters in ultra-small 6-Pin SOT-23Apackages. They invert and/or double an input voltagewhich can range from +2.5V to +5.5V. Conversionefficiency is typically >95%. Switching frequency is12kHz for the TC1219, 35kHz for the TC1220. Whenthe shutdown pin is held at a logic low, the device goesinto a very low power mode of operation, consumingless than 1µA of supply current.

External component requirement is only two capacitorsfor standard voltage inverter applications. With a fewadditional components a positive doubler can also bebuilt. All other circuitry, including control, oscillator,power MOSFETs are integrated on-chip. Typical supplycurrents are 60µA (TC1219), 115µA (TC1220).

All devices are available in 6-pin SOT-23A surfacemount packages.

Functional Block Diagram

PartNumber

PackageOsc.Freq.(kHz)

OperatingTemp.Range

TC1219ECH 6-Pin SOT-23A 12 -40°C to +85°C

TC1220ECH 6-Pin SOT-23A 35 -40°C to +85°C

C+

C–

TC1219ECHTC1220ECH

1 2 3

5 4

VIN

SHDN GND

6-Pin SOT-23A

NOTE: 6-Pin SOT-23A is equivalent to the EIAJ SC-74

OUT

6

TC1219TC1220

VIN

V–

Output

C+

C–

C1

C2

Input

GND

OUT

SHDNON

OFF

+

+

Negative Voltage Inverter

Switched Capacitor Voltage Converters with Shutdown in SOT Packages

TC1219/TC1220

DS21366B-page 2 2002 Microchip Technology Inc.

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings*

Input Voltage (VIN to GND)....................... +6.0V, -0.3V

Output Voltage (OUT to GND).................. -6.0V, +0.3VCurrent at OUT Pin..............................................50mAShort-Circuit Duration – OUT to GND ............Indefinite

Power Dissipation (TA ≤ 70°C) 6-Pin SOT-23A .........................................240mW

Operating Temperature Range............. -40°C to +85°CStorage Temperature (Unbiased) .......-65°C to +150°C

Stresses above those listed under "Absolute MaximumRatings" may cause permanent damage to the device. Theseare stress ratings only and functional operation of the deviceat these or any other conditions above those indicated in theoperation sections of the specifications is not implied.Exposure to Absolute Maximum Rating conditions forextended periods may affect device reliability.

TC1219/TC1220 ELECTRICAL SPECIFICATIONS

Electrical Characteristics: TA = -40°C to +85°C, VIN = +5V, C1 = C2 = 10µF, (TC1219), C1 = C2 = 3.3µF (TC1220), TA = 25°C unless otherwise noted.

Symbol Parameter Min Typ Max Units Device Test Conditions

IDD Supply Current ——

60115

115325

µA TC1219TC1220

ISHDN Shutdown Supply Current — 0.1 1.0 µA SHDN = GND, VIN = 5V (Note 2)

VMIN Minimum Supply Voltage 2.5 — — V RLOAD = 1kΩ

VMAX Maximum Supply Voltage — — 5.5 V RLOAD = 1kΩ

FOSC Oscillator Frequency 619

1235

2056.3

kHz TC1219TC1220

VIH SHDN Input Logic High —1.51.81.5

————

————

VTC1219

TC1220

RLOAD = ∞VIN = VMIN to 3VVIN = >3V to VMAXVIN = VMIN to VMAX

VIL SHDN Input Logic Low — — 0.5 V VIN = VMIN to VMAX

PEFF Power Efficiency ——

9695

——

% RLOAD = 1kΩ

VEFF Voltage Conversion Efficiency 95 99.9 — % RLOAD = ∞

ROUT Output Resistance — 25 65 Ω TC1219/TC1220 ILOAD = 0.5mA to 25mA (Note 1)

Note 1: Capacitor contribution is approximately 20% of the output impedance [ESR = 1/ pump frequency x capacitance].2: VIN is guaranteed to be disconnected from OUT when the converter is in shutdown..


TC1219/TC1220

2.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1.

TABLE 2-1: PIN FUNCTION TABLE

Pin No.(6-Pin SOT-23A)

Symbol Description

1 OUT Inverting charge pump output.

2 VIN Positive power supply input.

3 C– Commutation capacitor negative terminal.

4 GND Ground.

5 SHDN Shutdown input (active low).

6 C+ Commutation capacitor positive terminal.

TC1219/TC1220


3.0 DETAILED DESCRIPTION

The TC1219/TC1220 charge pump converters invertthe voltage applied to the VIN pin. Conversion consistsof a two-phase operation (Figure 3-1). During the firstphase, switches S2 and S4 are opened and S1 and S3are closed. During this time, C1 charges to the voltageon VIN and load current is supplied from C2. During thesecond phase, S2 and S4 are closed, and S1 and S3are opened. This action connects C1 across C2,restoring charge to C2.

FIGURE 3-1: IDEAL SWITCHED CAPACITOR CHARGE PUMP

VOUT = – (VIN)

C1

C2

TC1219/1220

Phase 1

VINS1

S3 S4

S2

OSC


TC1219/TC1220

4.0 APPLICATIONS INFORMATION

4.1 Output Voltage Considerations

The TC1219/TC1220 perform voltage conversion butdo not provide regulation. The output voltage will droopin a linear manner with respect to load current. Thevalue of this equivalent output resistance is approxi-mately 25Ω nominal at +25°C and VIN = +5V. VOUT isapproximately -5V at light loads, and droops accordingto the equation below:

VDROP = IOUT x ROUTVOUT = – (VIN – VDROP)

4.2 Charge Pump Efficiency

The overall power efficiency of the charge pump isaffected by four factors:

1. Losses from power consumed by the internaloscillator, switch drive, etc. (which vary withinput voltage, temperature and oscillatorfrequency).

2. I2R losses due to the on-resistance of theMOSFET switches on-board the charge pump.

3. Charge pump capacitor losses due to effectiveseries resistance (ESR).

4. Losses that occur during charge transfer (fromthe commutation capacitor to the outputcapacitor) when a voltage difference betweenthe two capacitors exists.

Most of the conversion losses are due to factors (2) and(3) above. These losses are given by Equation 4-1(b).

EQUATION 4-1:

The 1/(fOSC)(C1) term in Equation 4-1(b) is theeffective output resistance of an ideal switchedcapacitor circuit (Figure 4-1 and Figure 4-2). The valueof RSWITCH can be approximated at 0.5Ω for theTC1219/TC1220.

The remaining losses in the circuit are due to factor (4)above, and are shown in Equation 4-2. The outputvoltage ripple is given by Equation 4-3.

EQUATION 4-2:

EQUATION 4-3:

FIGURE 4-1: IDEAL SWITCHED CAPACITOR MODEL

FIGURE 4-2: EQUIVALENT OUTPUT RESISTANCE

a) PLOSS (2, 3) = IOUT2 x ROUT

b) where ROUT = [ 1 / [fOSC(C1) ] + 8RSWITCH +

4ESRC1 + ESRC2]

PLOSS(4) = [(0.5)(C1)(VIN2 – VOUT2) + (0.5)

(C2)(VRIPPLE2 – 2VOUT VRIPPLE)] x fOSC

VRIPPLE = [ IOUT / 2 x ( fOSC) (C2)] + 2 ( IOUT) (ESRC2)

V+ VOUT

RLC2C1

f

V+ VOUT

REQUIV

REQUIV =

RLC2f x C1

1

TC1219/TC1220


4.3 Capacitor Selection

In order to maintain the lowest output resistance andoutput ripple voltage, it is recommended that low ESRcapacitors be used. Additionally, larger values of C1will lower the output resistance and larger values ofC2 will reduce output ripple. (Equation 4-1(b) andEquation 4-3).

Table 4-1 shows various values of C1 and thecorresponding output resistance values @ +25°C. Itassumes a 0.1Ω ESRC1 and 2Ω RSWITCH. Table 4-2shows the output voltage ripple for various values ofC2. The VRIPPLE values assume 10mA output loadcurrent and 0.1Ω ESRC2.

TABLE 4-1: OUTPUT RESISTANCE VS.C1 (ESR = 0.1Ω)

TABLE 4-2: OUTPUT VOLTAGE RIPPLE VS. C2 (ESR = 0.1Ω)IOUT 10mA

4.4 Input Supply Bypassing

The VIN input should be capacitively bypassed toreduce AC impedance and minimize noise effects dueto the internal switching of the device Therecommended capacitor depends on the configurationof the TC1219/TC1220.

4.5 Shutdown Input

The TC1219/TC1220 is enabled when SHDN is high,and disabled when SHDN is low. This input cannot beallowed to float. (If SHDN is not required, see theTCM828/829 data sheet.) The SHDN input can be onlydriven to 0.5V above VIN to avoid significant currentflows.

4.6 Voltage Inverter

The most common application for charge pumpdevices is the inverter (Figure 4-3). This applicationuses two external capacitors: C1 and C2 (plus a powersupply bypass capacitor, if necessary). The output isequal to -VIN plus any voltage drops due to loading.Refer to Table 4-1 and Table 4-2 for capacitorselection.

FIGURE 4-3: VOLTAGE INVERTER TEST CIRCUIT

C1 (µF) TC1219ROUT(Ω)

TC1220ROUT(Ω)

1 100 45

3.3 42 25

10 25 19.4

30 19.3 17.5

C2 (µF) TC1219VRIPPLE (mV)

TC1220VRIPPLE (mV)

1 419 145

3.3 128 45

10 44 16

30 16 7

3

2

45

1

C3

C1

C2

VIN

VOUT

RLTC1219TC1220

C1–

IN

OUT C1+

GND

Device C1 C2 C3TC1219 10µF 10µF 10µFTC1220 3.3µF 3.3µF 3.3µF

SHDN

6

+

++


TC1219/TC1220

4.7 Cascading Devices

Two or more TC1219/TC1220 can be cascaded toincrease output voltage (Figure 4-4). If the output islightly loaded, it will be close to (-2 x VIN) but will droopat least by ROUT of the first device multiplied by the IQof the second. It can be seen that the output resistancerises rapidly for multiple cascaded devices.

4.8 Paralleling Devices

To reduce the value of ROUT, multiple TC1219/TC1220’s can be connected in parallel (Figure 4-5).The output resistance will be reduced by a factor of Nwhere N is the number of TC1219/TC1220. Eachdevice will require its own pump capacitor (C1), but alldevices may share one reservoir capacitor (C2).However, to preserve ripple performance the value ofC2 should be scaled according to the number ofparalleled TC1219/TC1220.

FIGURE 4-4: CASCADING MULTIPLE DEVICES TO INCREASE OUTPUT VOLTAGE

FIGURE 4-5: PARALLELING MULTIPLE DEVICES TO REDUCE OUTPUT RESISTANCE

C1 C1

C2

6 6

4

3

4

1

2 2

1

3

C2

VIN

VOUT

VOUT = -nVIN

TC1219TC1220

TC1219TC1220

. . .

. . . SHDNSHDNVIN55

"1" "n"

+

+ +

+

C1 C1

65

4

3

4

1

2 2

1

3

C2

VOUT

VOUT = -VIN

ROUT = ROUT OF SINGLE DEVICE

VIN

NUMBER OF DEVICES

TC1219TC1220

TC1219TC1220

. . .

. . .

SHDNSHDN

Shutdown Control

56

VIN

+

+

+

"1" "n"

TC1219/TC1220


4.9 Voltage Doubler/Inverter

Another common application of the TC1219/TC1220 isshown in Figure 4-6. This circuit performs two functionsin combination. C1 and C2 form the standard invertercircuit described previously. C3 and C4 plus the twodiodes form the voltage doubler circuit. C1 and C3 arethe pump capacitors and C2 and C4 are the reservoircapacitors. Because both sub-circuits rely on the sameswitches if either output is loaded, both will drooptoward GND. Make sure that the total current drawnfrom both the outputs does not total more than 40mA.

4.10 Diode Protection for Heavy Loads

When heavy loads require the OUT pin to sink largecurrents being delivered by a positive source, diodeprotection may be needed. The OUT pin should not beallowed to be pulled above ground. This isaccomplished by connecting a Schottky diode(1N5817) as shown in Figure 4-7.

4.11 Layout Considerations

As with any switching power supply circuit good layoutpractice is recommended. Mount components as closetogether as possible to minimize stray inductance andcapacitance. Noise leakage into other circuitry can beminimized with the use of a large ground plane.

FIGURE 4-6: COMBINED DOUBLER AND INVERTER

FIGURE 4-7: HIGH V– LOAD CURRENT

C1

D1

D2

D1, D2 = 1N4148

6

4

1

23

C2

C4C3

VIN

VOUT = -VIN

VOUT = (2VIN) –(VFD1) – (VFD2)

TC1219TC1220

Shutdown Control

5

+

+

++

TC1219TC1220

GND

OUT

4

1


TC1219/TC1220

5.0 TYPICAL CHARACTERISTICS

Circuit of Figure 4-3, VIN = +5V, C1 = C2 = C3, TA = 25°C unless otherwise noted.

Note: The graphs and tables provided following this note are a statistical summary based on a limited number ofsamples and are provided for informational purposes only. The performance characteristics listed herein arenot tested or guaranteed. In some graphs or tables, the data presented may be outside the specifiedoperating range (e.g., outside specified power supply range) and therefore outside the warranted range.

6055504540

0

30252015

35

105

2.5 3.5 4.5 5.5

SUPPLY VOLTAGE (V)

Output Resistancevs. Supply Voltage

65

OU

TP

UT

RE

SIS

TA

NC

E (

Ω)

TC1220

TC1219

CAPACITANCE (µF)

TC1220Output Current vs. Capacitance

60

55

50

45

40

25

20

15

35

30

-40 -20 0 20 40 60 80

TEMPERATURE (°C)

TC1219 Output Resistancevs. Temperature

65

OU

TP

UT

RE

SIS

TA

NC

E (

Ω)

VIN = 3.3V

VIN = 5.0V

40

35

30

25

20

5

0

15

10

0 105 15 2520 30

45

VIN = 4.75V, VOUT = -4.0V

VIN = 3.15V, VOUT = -2.5V

TC1219Output Current vs. Capacitance

CAPACITANCE (µF)

OU

TP

UT

CU

RR

EN

T (

mA

)

0 105 15 20 25 30

CAPACITANCE (µF)

TC1220Output Voltage Ripple vs. Capacitance

450

400

350

300

250

50

0

200

150

100

0 105 25 20 25 30

CAPACITANCE (µF)

TC1219Output Voltage Ripple vs. Capacitance

500

450

400

350

300

250

50

0

200

150

100

500

OU

TP

UT

VO

LT

AG

E R

IPP

LE

(m

Vp

-p)

OU

TP

UT

VO

LT

AG

E R

IPP

LE

(m

Vp

-p)

40

35

30

25

20

5

0

15

10

0 105 15 2520 30 35 40 45 50

45

VIN = 4.75V, VOUT = -4.0V

VIN = 3.15V, VOUT = -2.5VVIN = 4.75V, VOUT = -4.0V

VIN = 3.15V, VOUT = -2.5V

VIN = 4.75V, VOUT = -4.0V

VIN = 3.15V, VOUT = -2.5V

14

13

12

8

11

10

9

-40 0-20 20 40 60 80 -40 0-20 20 40 60 80

TEMPERATURE (°C)

TC1219Pump Frequency vs. Temperature

15

PU

MP

FR

EQ

UE

NC

Y (

kHz)

140130120

100908070

50

110

60

20100

4030

2.5 3.5 4.5 5.5

SUPPLY VOLTAGE (V)

Supply Currentvs. Supply Voltage

150

SU

PP

LY

CU

RR

EN

T (

µA)

TC1220

TC1219

35

45

40

20

30

25

TEMPERATURE (°C)

TC1220Pump Frequency vs. Temperature

PU

MP

FR

EQ

UE

NC

Y (

kHz) VIN = 5.0V

VIN = 5.0V

VIN = 3.3VVIN = 3.3V

TC1219/TC1220


TYPICAL CHARACTERISTICS (CONTINUED)

Output Voltage vs. Output Current

-0.5

-5.5

-1.5

-2.5

-3.5

-4.5

0 5 10 15 20 25 30 35 40OUTPUT CURRENT (mA)

0.5

OU

TP

UT

VO

LT

AG

E (

V)

VIN = 3.3V

VIN = 5.0V

100

90

80

70

60

30

20

10

0

50

40

0 105 15 2520 30 35 40 45 50

CURRENT (mA)

Efficiency vs. Output Current110

EF

FIC

IEN

CY

(%

)

VIN = 3.3V

VIN = 5.0V


TC1219/TC1220

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

TC1219/TC1220 CodeTC1219ECH AMTC1220ECH AN

6.2 Taping Form

1 & = part number code + temperature range2

(two-digit code)

ex: 1219ECH = A M

3 represents year and quarter code

4 represents production lot ID code

User Direction of Feed

Component Taping Orientation for 6-Pin SOT-23A (EIAJ SC-74) Devices

DeviceMarking

PIN 1

Standard Reel Component OrientationFor TR Suffix Device(Mark Right Side Up)

Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size

6-Pin SOT-23A 8 mm 4 mm 3000 7 in

Carrier Tape, Number of Components Per Reel and Reel Size

TC1219/TC1220


6.3 Package Dimensions

.069 (1.75)

.059 (1.50).122 (3.10).098 (2.50)

.075 (1.90)REF.

.020 (0.50)

.014 (0.35) .037 (0.95)REF.

.118 (3.00)

.110 (2.80)

.057 (1.45)

.035 (0.90)

.006 (0.15)

.000 (0.00).024 (0.60).004 (0.10)

10° MAX. .008 (0.20).004 (0.09)

SOT-23A-6

Dimensions: inches (mm)

2002 Microchip Technology Inc. DS21366B-page13

TC1219/TC1220

Sales and Support

Data SheetsProducts supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-72773. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification SystemRegister on our web site (www.microchip.com/cn) to receive the most current information on our products.

TC1219/TC1220

DS21366B-page14 2002 Microchip Technology Inc.

NOTES:


TC1219/TC1220

Information contained in this publication regarding deviceapplications and the like is intended through suggestion onlyand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.No representation or warranty is given and no liability isassumed by Microchip Technology Incorporated with respectto the accuracy or use of such information, or infringement ofpatents or other intellectual property rights arising from suchuse or otherwise. Use of Microchip’s products as critical com-ponents in life support systems is not authorized except withexpress written approval by Microchip. No licenses are con-veyed, implicitly or otherwise, under any intellectual propertyrights.

Trademarks

The Microchip name and logo, the Microchip logo, FilterLab,KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,PICSTART, PRO MATE, SEEVAL and The Embedded ControlSolutions Company are registered trademarks of Microchip Tech-nology Incorporated in the U.S.A. and other countries.

dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,In-Circuit Serial Programming, ICSP, ICEPIC, microPort,Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Modeand Total Endurance are trademarks of Microchip TechnologyIncorporated in the U.S.A.

Serialized Quick Turn Programming (SQTP) is a service markof Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of theirrespective companies.

© 2002, Microchip Technology Incorporated, Printed in theU.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.


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Switched Capacitor Voltage Converters with Shutdown in SOT ...ww1.microchip.com/downloads/en/DeviceDoc/21366b.pdf · 5 1 C3 C1 C2 VIN VOUT RL TC1219 TC1220 C1– IN OUT C1+ GND Device