ID ID
NVH VolkswagenDr. Bruns
MSC Nastran BEGIN MODULEEND MODULE
ID ID
2:Volkswagen
NVH
MSC Nastran INCLUDE ID
OEM (NVH)
(Engineering Reality)General Motors, (AVs)Chris Kinser
Kinser General Motors Kinser Boss Kettering Award3Kinser Kettering
UniversityRensselaer Polytechnic Institute,USA
Volume X - Winter 2019 | mscsoftware.com | 11 10 | Engineering
Reality Magazine
General Motors GM
Global Autonomous Driving Center
General Motors US
10
GM Hexagon/MSC ?
5GM
?
General Motors Advances
GMGM
GM
Volume X - Winter 2019 | mscsoftware.com | 21 20 | Engineering
Reality Magazine
25 271010 90% Apple
CAE CAE
.
10
Hexagon/MSC e-Xstream Engineering iPoint GmbH ICME(Integrated
Computational Material Engineering; )1 iPoint Systems
MaterialCenter 2020 iPoint (iPCA)MSC Software MaterialCenter
2020
REACH RoHS CAE s.
1. “Engineering for Sustainability - A Practical Guide for
Sustainable Design” by G. Jonker, Elsevier Press, 2012, ISBN
044453846
2. “Your Data can Save the World”, Ola Rollén Keynote Speech, HxGN
LIVE 2019, Las Vegas, USA https://www.youtube.com/
watch?v=tYWuwVJylVQ
3. “World Commission on Environment and Development, Our Common
Future”, Brundtland, G.H. United Nations Report A/42/427,
1987
4. “Towards Sustainable Design in the Sports & Leisure
Industry”, Hanna, R.K & Subic, A, International Journal of
Sustainable Design 1(1), January 2008
5. “Sustainable Growth Thanks to Using Materials Smarter, Less
& Longer”, Victoire de Margerie, ICME Conference, Bordeaux,
France, October 1st 2019
Volume X - Winter 2019 | mscsoftware.com | 21
MaterialCenteriPoint
Volume X - Winter 2019 | mscsoftware.com | 23 22 | Engineering
Reality Magazine
Adams Real Time
Tony Ge, Ford Motor Company Eric Pesheck, Paspuleti Rahul Naidu,
Michael Collingridge, Hemanth Kolera-Gokula, MSC Software
MSC (Hardware in the Loop; HIL)
Volume X - Winter 2019 | mscsoftware.com | 23 22 | Engineering
Reality Magazine
Volume X - Winter 2019 | mscsoftware.com | 25 24 | Engineering
Reality Magazine
Adams 2017Adams Real Time (Adams RT) Adams
MSC Adams RT HIL 3
• : Adams OS Adams RT
• : HIL Adams Solver FMI
co-simulationFMU (Functional Mock-up Unit)
• HIL HIL OS FMU
OSAdams RT Adams
5 K&C
Adams RT FMUHIL FMU Adams FMU FMU
HIL
1: 50% OSSOutput Shaft Speed
2: 50%
ACC
HIL
MBD www.mscsoftware.com/5myths
Volume X - Winter 2019 | mscsoftware.com | 27
AI /
Volume X - Winter 2019 | mscsoftware.com | 29 28 | Engineering
Reality Magazine
AdamsCADLM Lunar (ROM) 2 2 Adams Adams Lunar Adams
ROM Adams ROM ROM
10 MSCCADLM
(Multi-Body Dynamics; MBD)
1 (Reduced Order Modeling; ROM)
ROM LunarROM ROMAdams ROM
CADLM
: www.cadlm.com
Volume X - Winter 2019 | mscsoftware.com | 31 30 | Engineering
Reality Magazine
Finite Element : FE
HPC CPUNVIDIA GPUGPUCPU GPU
MSC Nastran
GPU Niveditha Krishnamoorthy,
Manager, MSC Software
GPUHPC MSC Nastran50 MSC NastranGPU 1 MSC Nastran 1 GPU GPU NVIDIA
NVH
GPUMSC Nastran GPU
GPU
GPUCPU GPU I/O GPU 10.11 CPU 0.012100 x 100 GPU GPU GPU 0.11
10000 x 10000 GPU
GPUCAEComputer- Aided-Engineering OEM CPU
GPU MSC Nastran 2019
Volume X - Winter 2019 | mscsoftware.com | 59 58 | Engineering
Reality Magazine
GPU20 CPU CPU1GPU 2 CPU2GPU 3 () GPUCPU 10 BLASGPU
CPUGPU GPU GPU GPU GPU GPU CPU CPUGPU CPU
CPU/ GPU 2GPU4 CPU CPU GPU GPU2GPU20 4 GPU12
MSC NastranGPU 1 GPUCPU CPU/GPU NVIDIA GPU
1
2
3
BLAS GPU 1GPU BLAS 3~10 GPU 2GPU620 .
112GPU - A 56,000 x 192,000, 100%; B 92,000 x 192,000, 1.5%;
20Intel Xeon CPU; NVIDIA Tesla K40 GPU; 2NVIDIA Tesla K40 GPU
2 50,000 x 50,000 ; 20Intel Xeon CPU; 20Intel Xeon CPU + 2 NVIDIA
Tesla K40 GPU; 20Intel Xeon CPU + NVIDIA Tesla K40 + Quadro GV100
GPU; 20Intel Xeon CPU + 2 Nvidia Tesla V100 GPU
GPU Nastran BLASGPU GPUCPU GPU/CPU GPU/ CPU
GPUNVIDIA CUDA ToolkitNVIDIA GPU 4000500 CPUGPU 1
GPU DOF (SOL 111 3 GPU GPU 1535 0.44
3GPU SOL 111 20.5M DOF2050 30,0004; 20Intel Xeon CPU; 20Intel Xeon
CPU + NVIDIA Tesla K40 GPU
4Volvo Car Corporation 43.5M DOF
Volvo Car CorporationNVH CAE Andrzej PietrzykVolvoMSC Nastran
2019GPU 50MSC Nastran
512GPU 4150050,000 ; 20Intel Xeon CPU; 20Intel Xeon CPU + NVIDIA
Tesla K40 GPU; 20Intel Xeon CPU + 2 NVIDIA Tesla K40 GPU
4
5
6
2GPU 4200073,600 ; 20Intel Xeon CPU; 20Intel Xeon CPU + 2NVIDIA
Tesla K40 GPU; 20Intel Xeon CPU+2NVIDIA Tesla V100GPU
1500 Hz 50,000 2GPU11.3 7.2 2000 Hz73,000 CPU2 Tesla K40 GPU
30.318.1
GPU BLAS5 Tesla K40 CPU Quadro GV100Tesla V100 23CPU GPU BLASTesla
K40 GPU 10Tesla V100CPUIntel MKL 2030
Illia Silin
Volume X - Winter 2019 | mscsoftware.com | 61 60 | Engineering
Reality Magazine
US MaterialCenter
United States Army Combat Capabilities Development Command
Armaments Center
CCDC AMAMAdditive Manufacturing
AM AM(4340/4140/17−4) PBFPowder Bed Fusion; EOS M290 ARCAM A2X AM
HIP
EDMCNC X/
AM AM AM AM
1. COTSCommercial Off-the-Shelf;
2.
3.
4.
5. AM AM
6.
1: AM
2: AM(CCDC)
Volume X - Winter 2019 | mscsoftware.com | 63 62 | Engineering
Reality Magazine
L-PBF?
AM ?
AM AMAM AM AM
4: 325AM
5: 3D
AM
4 AMS2759
AM
AM
• EOSM290, ProX320, SLMEOSM280
• 43401
6: 5 - AM
CCDCAM MSC MaterialCenter
• • (CAD/STL/MAGICS
AM
AM
Volume X - Winter 2019 | mscsoftware.com | 65 64 | Engineering
Reality Magazine
; AM AM ePDM
8: MSC MaterialCenterAM
MSC SoftwareMaterialCenter
AM
1. “Left of Test” MaterialCenter Work Request, Pedigree MSC
Software MaterialCenter 10
2. “Right of Test”
PTC WindchillePDM CCDC AM 11
AM ePDM AM
AM
“Army Efforts in Metals Additive Manufacturing & Data
Management”, R. Carpenter, SME Smart Manufacturing Series –
Additive Manufacturing, 07 June 2018
10: AM
Volume X - Winter 2019 | mscsoftware.com | 65
Volume X - Winter 2019 | mscsoftware.com | 67 66 | Engineering
Reality Magazine
10x ICME
HexagonMSC Software10x ICME (Integrated Computational Material
Engineering;) 10x ICMEOEM HexagonMSC Software 10x ICME 10x
ICMEICME
Roger Assaker, CEO at e-Xstream engineering
Chief Material Strategist, MSC Software
HxGN
CAD/PLM CAD/PLM
CAE CAM
ERP/CAD/PLM
2. – 23
3. – PDFExcel
4. – IP
5. – 10x ICME iPoint-systems GmbH
6. – MSC Software10x ICMEFEA
7. – FEA10x ICME
8. AMAdditive Manufacturing – AM AM10x ICME AM
9. AI – 10x ICMEAI
10. Digital ContinuityMaterial Twin – 10x ICME .
Volume X - Winter 2019 | mscsoftware.com | 69
VIRES VTD
AUDI AG: Andreas Kern Technical University of Munich: Manuel
Schiller Institute of Transportation Systems: Daniel Krajzewicz
VIRES, part of Hexagon: Marius Dupuis