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Surface elemental segregation and the Stranski–Krastanow epitaxial islanding transition A.G. Cullis * , D.J. Norris, M.A. Migliorato, M. Hopkinson Department of Electronic and Electrical Engineering, University of Sheffield, Mappin Street, Sheffield S1 3JD, UK Received 17 June 2004; accepted 18 October 2004 Available online 13 January 2005 Abstract It is shown that a new segregation-based mechanism underpins the Stranski–Krastanow (S–K) epitaxial islanding transition in both the In x Ga 1x As/GaAs and Si 1x Ge x /Si systems over wide ranges of growth conditions. Quantitative segregation calculations allow critical ‘wetting’ layer thicknesses to be derived and, for the In x Ga 1x As/GaAs system (x = 0.25–1), such calculations show good agreement with experimental measurements. The segregation-mediated driving force is considered to be important, also, for all other epitaxial systems which comprise chemically similar but substantially misfitting materials and which exhibit the S–K transition. # 2004 Elsevier B.V. All rights reserved. Keywords: Epitaxy; Stranski–Krastanow transition; Islanding transition; Quantum dot 1. Introduction Epitaxial films grow upon crystalline substrates by one of three mechanisms: (i) 2D layer-by-layer growth (Frank and Van der Merwe [1]), (ii) 3D island growth (Volmer and Weber [2]) and (iii) 2D layer growth followed by 3D islanding, (Stranski and Krastanow (S–K) [3]). For systems with zero or small lattice mismatch, 2D layer-by-layer growth typically occurs, while for systems with highly mismatched and dissimilar materials 3D island growth usually takes place. For epitaxial systems with similar materials and high lattice mismatch, the two-stage S–K growth mode usually occurs. Here, a very thin, flat epitaxial layer is formed first and a transition to 3D island growth takes place at a certain critical thickness. This growth mode has received experimental study across wide materials areas from metals to semiconductors (ref. [4] describes early work). For semiconductors, the transition has assumed importance since the islands formed can be exploited as quantum dots in advanced electronic devices. Therefore, many semi- conductor epitaxial systems exhibiting the S–K growth mode have been studied in-depth, including In x Ga 1x As/GaAs [5–11], InP/In x Ga 1x P [12,13], GaSb/GaAs [14] and SiGe/Si [15–20]. www.elsevier.com/locate/apsusc Applied Surface Science 244 (2005) 65–70 * Corresponding author. E-mail address: a.g.cullis@sheffield.ac.uk (A.G. Cullis). 0169-4332/$ – see front matter # 2004 Elsevier B.V. All rights reserved. doi:10.1016/j.apsusc.2004.10.066

Surface elemental segregation and the Stranski–Krastanow epitaxial islanding transition

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Page 1: Surface elemental segregation and the Stranski–Krastanow epitaxial islanding transition

www.elsevier.com/locate/apsusc

Applied Surface Science 244 (2005) 65–70

Surface elemental segregation and the Stranski–Krastanow

epitaxial islanding transition

A.G. Cullis*, D.J. Norris, M.A. Migliorato, M. Hopkinson

Department of Electronic and Electrical Engineering, University of Sheffield, Mappin Street, Sheffield S1 3JD, UK

Received 17 June 2004; accepted 18 October 2004

Available online 13 January 2005

Abstract

It is shown that a new segregation-based mechanism underpins the Stranski–Krastanow (S–K) epitaxial islanding transition

in both the InxGa1�xAs/GaAs and Si1�xGex/Si systems over wide ranges of growth conditions. Quantitative segregation

calculations allow critical ‘wetting’ layer thicknesses to be derived and, for the InxGa1�xAs/GaAs system (x = 0.25–1), such

calculations show good agreement with experimental measurements. The segregation-mediated driving force is considered to be

important, also, for all other epitaxial systems which comprise chemically similar but substantially misfitting materials and

which exhibit the S–K transition.

# 2004 Elsevier B.V. All rights reserved.

Keywords: Epitaxy; Stranski–Krastanow transition; Islanding transition; Quantum dot

1. Introduction

Epitaxial films grow upon crystalline substrates by

one of three mechanisms: (i) 2D layer-by-layer growth

(Frank and Van der Merwe [1]), (ii) 3D island growth

(Volmer and Weber [2]) and (iii) 2D layer growth

followed by 3D islanding, (Stranski and Krastanow

(S–K) [3]). For systems with zero or small lattice

mismatch, 2D layer-by-layer growth typically occurs,

while for systems with highly mismatched and

dissimilar materials 3D island growth usually takes

* Corresponding author.

E-mail address: [email protected] (A.G. Cullis).

0169-4332/$ – see front matter # 2004 Elsevier B.V. All rights reserved

doi:10.1016/j.apsusc.2004.10.066

place. For epitaxial systems with similar materials and

high lattice mismatch, the two-stage S–K growth

mode usually occurs. Here, a very thin, flat epitaxial

layer is formed first and a transition to 3D island

growth takes place at a certain critical thickness. This

growth mode has received experimental study across

wide materials areas from metals to semiconductors

(ref. [4] describes early work). For semiconductors,

the transition has assumed importance since the

islands formed can be exploited as quantum dots in

advanced electronic devices. Therefore, many semi-

conductor epitaxial systems exhibiting the S–K

growth mode have been studied in-depth, including

InxGa1�xAs/GaAs [5–11], InP/InxGa1�xP [12,13],

GaSb/GaAs [14] and SiGe/Si [15–20].

.

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A.G. Cullis et al. / Applied Surface Science 244 (2005) 65–7066

Fig. 1. Variation in critical thickness of the initial flat layer for the

islanding transition as a function of deposition flux In concentration:

measured values are data points and predicted WCNH values are

presented as continuous curve (after [31]).

2. The basic mechanism of the Stranski–

Krastanow transition

Theoretical models based upon energy calculations

and rate equations [21–28] have been formulated in

order to attempt to explain the features of the 2D–3D

S–K transition. It is generally considered that, when

2D islands exceed a critical size, they should

transform into 3D islands and this has been employed

to model the transition. Nevertheless, the fundamental

driving force for the transition had not been

determined [29] until recent studies of Walther

et al. [30] and Cullis et al. [31] threw new light upon

the mechanism relating to growth of the initial wetting

layer and the critical thickness which it must attain

before the islanding transition occurs. Detailed

measurements [30] of S–K island and ‘wetting’ layer

composition were performed for the InxGa1�xAs/

GaAs system. These measurements led to the proposal

[30,31] that the transition to island growth is

controlled by segregation of elemental In to the

surface of the initial flat crystalline ‘wetting’ layer

(referred to here as the WCNH mechanism). The

segregation-based mechanism is straightforward and

is fundamentally applicable to all materials systems

exhibiting the S–K transition (where the growth

technique does not significantly suppress segregation

– see below). It is considered here with special

reference to the InxGa1�xAs/GaAs system, with some

consideration also of the Si1�xGex/Si system.

In order to produce islands by molecular beam

epitaxy (MBE) in the InxGa1�xAs/GaAs system, either

an alloy or binary material (InAs) is deposited. As the

initial flat epitaxial layer forms, the WCNH mechan-

ism for the S–K transition specifies that the strain

introduced by the vertical segregation of the largest

atomic species (In) in the deposited material provides

the driving force for the transition. This In segregation

results in an increase in surface lattice parameter, as

observed by RHEED [32]. Also, the magnitude of the

strain has been estimated by atomistic simulation [31].

The segregation itself has been simulated using the

Fukatsu/Dehaese model [31,33,34], which considers

exchange of the Group III species between the top two

layers during growth and demonstrates that the surface

layer exhibits a very substantial deviation from the

deposition flux In concentration. If a relatively dilute

(x = 0.25) alloy is deposited, the surface monolayer

attains [31] a saturation value of 80–85% In for initial

layer thicknesses in excess of �2.5 nm. With

increasing deposition flux In concentration, the

surface In concentration increases progressively to

saturation values which, themselves, rise.

Under the WCNH mechanism, a critical surface

concentration of In (and associated strain) must build

up before the S–K islanding transition can take place.

Now, it has been shown [10] that a deposition flux of

25% In is approximately the lowest that will induce

the S–K transition. Therefore, it is possible to identify

the corresponding critical surface In concentration as

the above-mentioned figure, i.e., 80–85% In. It is then

predicted that, for any particular deposition flux, the

S–K transition will take place after the surface In

concentration rises to this critical level so that, using

the segregation model, it is possible to estimate [31]

the critical thickness for the transition of the initial flat

‘wetting’ layer to islanding as a function of deposited

In concentration. This procedure gives the continuous

‘theoretical’ curve in Fig. 1, which extends from

0.3 nm thickness for InAs deposition to �2.5 nm

thickness for a deposition flux of 25% In.

From cross-sectional images of MBE InxGa1�xAs/

GaAs islands it was shown [30] that, for an In

deposition flux concentration of 25%, the ‘wetting’

layer thickness was �3 nm. Similar observations have

been made [31] for growth with In deposition flux

concentrations of 35 and 55%, which have yielded

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A.G. Cullis et al. / Applied Surface Science 244 (2005) 65–70 67

Fig. 2. Schematic illustration of variation of adatom number density during progression of S–K islanding transition.

critical ‘wetting’ layer thicknesses of �1.5 and

�1.0 nm, respectively. These experimental thick-

nesses are also plotted in Fig. 1, together with a

critical ‘wetting’ layer thickness of 0.4 nm (1.6

monolayers [11]) for InAs deposition.

It is clearly evident from Fig. 1 that the curves

derived from theory and experiment exhibit exactly

the same form and are displaced from one another by

no more than �0.1–0.5 nm. This small displacement

may result, at least in part, from neglect of any

induction period during island nucleation. Also, the

experimental values should be corrected for the loss of

near-surface In-rich monolayers during initial island

formation. In addition, it is possible that implementa-

tion of an enhanced multilayer segregation model [35]

would give an even closer fit to experiment. However,

the near coincidence of the curves lends strong support

for the importance of segregation in determining the

S–K 2D–3D transition point, as embodied in the

WCNH mechanism [30,31].

Fig. 3. Schematic illustration of free energy variation for surface

atomic clusters and stable islands during progression of S–K island-

ing transition.

3. Stranski–Krastanow transition details

3.1. General S–K transition phenomena for

InxGa1�xAs/GaAs

The S–K transition may be described in terms of

near-surface free energy changes. Based upon the

WCNH model, as the transition point is approached the

concentration of In in the surface layer tends towards its

maximum value driven by segregation. The large and

increasing strain in the uppermost crystal layer makes it

increasingly difficult for atoms from the deposition flux

to join this layer, so that the number density of adatoms

increases also, as indicated qualitatively in Fig. 2. The

thermodynamic features of this process are illustrated

in Fig. 3 where the free energy of the initial array of

adatoms and atomic clusters at first rises (A–B) due to

the increasing adatom concentration and the increasing

number density of unstable growth nuclei. However, as

ever larger nuclei are formed, at some point critical

nuclei appear (point C on the curve in Fig. 3), the

expansion of which leads to the formation of stable

islands. The growth of the latter, which are very effec-

tive sinks for adatoms, leads to a rapid decrease in

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A.G. Cullis et al. / Applied Surface Science 244 (2005) 65–7068

adatom number density (right-hand side of Fig. 2) and a

corresponding rapid decrease in surface free energy

(right-hand side of Fig. 3) with the production of a

stable state for the system having 3D islands. At the

actual S–K transition point, the overall surface

structure is very strained and, as observed for the

InxGa1�xAs/GaAs system [36], the general disorder

together with the high adatom number density (the peak

in Fig. 2) can lead to the production of a poor RHEED

pattern. It has even been proposed elsewhere that, at the

precise transition point, the surface may actually melt

[37] and/or a ‘floating layer’ of InAs or metallic In may

be produced [38,39]. There is no direct evidence for

such gross surface changes at the present time (indeed,

in the SiGe/Si system, in situ STM work [40] shows

that surface atomic order is retained at the S–K

transition point (see below)) and, in any case, it is not

clear how melt formation would lead to island growth

on an otherwise flat surface. However, a suitably

increased adatom concentration would lead directly to

island nucleation and growth.

The increased surface strain energy, resulting from

the segregation-induced elevated surface In concen-

tration, has a pronounced effect upon layer surface

growth structures in the InxGa1�xAs/GaAs system. For

example, for a low deposition flux In concentration of

15%, the layer-by-layer growth results [10] in the

formation of a very flat surface with evenly spaced

monolayer (ML) surface steps and few, if any, ML

islands. However, an increase in the deposition flux In

concentration to 20% results [10] in a change in

surface step configurations with the formation of

narrow protuberances at step fronts and the production

of many ML islands. The step front distortions would

be expected to yield elastic relaxation by unidirec-

tional expansion across the narrow protuberances. The

ML islands are the expected [22] precursors of 3D

islands produced by the S–K transition when the

deposition flux In concentration is further increased to

25%. Similar ribbon-like wetting layer surface

structures are seen in other systems (e.g., AlSb/GaAs,

GaSb/GaAs and InSb/GaAs) for layers undergoing the

S–K islanding transition [14].

3.2. The S–K transition in other epitaxial systems

Growth in the Si1�xGex/Si epitaxial system has

been studied by many workers [15–20] and it is

important to consider the nature of the islanding

transition. Indeed, it has been shown [17,20,41] that,

for the growth of Ge on Si, the initially deposited

monolayers are flat and exhibit scattered pits or

trenches. At a critical thickness, the S–K transition

occurs by the nucleation of islands (generally ‘hut

clusters’) located at the edges of the pits, while the

layer between the islands remains flat and displays a

regular lattice structure [20,40,41]. This appears to be

an S–K transition with the same characteristics as

that which occurs by the WCNH mechanism for

InxGa1�xAs/GaAs; however, Ge segregation is clearly

involved, while the distribution of the islands pro-

duced is simply determined by preferred nucleation

sites at edges of the pre-existing pits.

It has been indicated that, for Si1�xGex alloy

growth on Si under a restricted range of conditions,

island formation may take place due to an Asaro-

Tiller-Grinfeld (ATG) instability [19,42–44]. There-

fore, it is crucial to confirm the island formation

mechanism for Si1�xGex alloy layer growth. Focusing

first upon MBE, deposition of the alloy on Si has been

carried out [45] for a range of layer thicknesses,

followed by studies of the growth morphology using

the atomic force microscope (AFM). Growth of layers

with x-values of 0.3 and 0.5 has demonstrated that the

islanding mechanism has fundamentally the same S–K

nature as for basic Ge/Si. This is illustrated in Fig. 4

which shows a layer with x = 0.3 at mean deposit

thicknesses of 2.5 and 10 nm. It is clear that, at 2.5 nm

thickness, the overall layer is very flat but exhibits an

array of shallow flat-bottomed pits (the dark features).

However, at this thickness, island formation has

already taken place such that all the islands (the bright

features) lie along pit edges. Indeed, the general

growth behaviour seems to be of the type which

yielded ‘quantum fortress’ structures seen for lower

temperature growth [46]. When the mean deposit

thickness is increased to 10 nm, the islands have

grown substantially larger and have increased in

number density. Most importantly, there is no

evidence for an ATG instability (see Fig. 4a), which

would induce rippling of the whole surface. Therefore,

we may say that, for MBE growth and over at least the

range x = 0.3–1, the morphological characteristics of

islanding in the Si1�xGex/Si system are as expected for

a standard S–K transition. In possible contradistinc-

tion, for growth of Si1�xGex/Si by chemical vapour

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A.G. Cullis et al. / Applied Surface Science 244 (2005) 65–70 69

Fig. 4. AFM images of Si0.7Ge0.3 alloy layers grown on (0 0 1) Si at 700 8C by MBE at layer thicknesses of (a) 2.5 nm and (b) 10 nm.

deposition (CVD), it has been reported [19] that an

S–K transition to island formation occurs for x > 0.6,

while for 0.2 < x < 0.6 an ATG (nucleationless)

instability leads to island growth. The latter may

occur due to the presence of hydrogen surfactant

which would be expected [47] to partially suppress Ge

segregation processes. More studies are required in

this area.

The experimental work described here relates

primarily to MBE growth of strained layers showing

the S–K islanding transition in the InxGa1�xAs/GaAs

and Si1�xGex/Si systems. However, many other MBE-

and CVD-grown epitaxial systems of similar materials

with high misfit exhibit the S–K transition. It is

conjectured that, in most if not all cases, the WCNH

mechanism involving elemental segregation is likely

to underpin the initial island formation process.

4. Conclusions

The manner in which the WCNH segregation

mechanism is expected to drive the S–K islanding

transition is considered in detail. Across the complete

range of deposition fluxes for MBE growth of the

(0 0 1) InxGa1�xAs/GaAs epitaxial system, there is

excellent agreement between theory (involving in

segregation) and experiment regarding derivation of

critical ‘wetting’ layer thickness. This gives strong

support for the segregation-based mechanism. Further-

more, the morphological characteristics of the initial

growth of Si1�xGex/Si for both MBE and ranges of

CVD deposition show the same features of S–K

islanding and are expected to be similarly driven by Ge

segregation. It is considered that, for all other epitaxial

systems exhibiting the S–K transition, when elemental

segregation within the ‘wetting’ layer is not suppressed,

such segregation will be a key factor determining the

critical point at which islanding occurs.

Acknowledgements

Dr T. Grasby is thanked for Si1�xGex/Si growth and

EPSRC is thanked for financial support. Extremely

helpful discussions with Profs. B.A. Joyce, A.

Madhukar, I. Goldfarb and J. Tersoff are gratefully

acknowledged.

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