SUMMARY: Latest results on the Minicrate performance Status of chamber production Torino line

fgasparini LHCC Review May 04 1

SUMMARY:Latest results on the Minicrate performanceStatus of chamber productionTorino lineThe High Voltage Boards problem/statusThe new installation sequenceStatus of Minicrates components Minicrates production/schedule

RED = criticalORANGE = not yet stable

The status of the Barrel DTfgasparini 11/5/2004



Efficiency of correct BX assignment Time resolution of different quality trigger

HH contribute the 65%HL contrbute 22%LL contribute 2%Uncorrelated (only one PHI SL) ~ 10%TEST BEAM MAY 04


Double track trigger efficiency (default mode)

TEST BEAM MAY 04


Two tracks trigger efficiency

default

backup

default

backup

Backup is set if TSMS is deadThere are two TSMDs :one per half chamber

TEST BEAM MAY 04


TS Ghost suppression

1st track

2nd track

Events with fake tracks : 40-60 % !! Disabled Enabled

6 %

Fake tracks: low quality

Outer SL

Inner SL

Single segments in outer SL

• Data

oTrigger emulationon TDC data

TEST BEAM MAY 04


MINICRATE Autotrigger

The MC can generate a Level 1 Accept Trigger in standalone modeThe feature was tested in Legnaro with cosmic rays. The MC clock is free running at 40 MHz The cosmic tracks are randomly distributedThe TDCs are stopped by the MC L1A with an error of +- 1 clock wrt the time of passage of the track : 25 nsec/sqrtf 12 = ~ 8 nsec = 400 micron that will dominate the final chamber resolution

Asking the MC to select HH triggers only,allows a large rate of events (~ 100 Hz)The reconstruction efficiencyof the parent track is better than 99%

MB1 MCrate

MB3 chamber

Distribution of HH trigger in a MB3 chamber with MB1 Minicrare

1 Dead tube

COSMIC RAYS


angle distribution of the tracks reconstructed in the event

layer 7 550 m

Residual 7 point fit ~ 400 m resolution

Layer 1

2

3

4

PHI

THETA

1 TDC count = .78 nsec

+- 18 nsec

The Minicrate “measure” the max. drift time in steps of 25 nsc.The Max.drift time,computed form the TDC data, is “flat” within +- 18 nsec as expected

COSMIC RAYS


Chamber assembly in LNL,Aachen and CIEMAT stable at > 20 ch/yearSL for 146 chambers assembled 119 chambers at ISR104 ch. Measured at Alignment Bench at ISR

Installation and handling tools for ISR and SX5 completed(last :the large cradle for MB4 ready in June/July)

First MB4 chamber under assembly in Torino (1 month delay wrt Oct.)

I-BEAMS final shipment from Protvino 28 June 04 than the largest assembly plotter will be moved to ISR

PLATES 96% of plates cut in Torino end production in Dubna march 05 keep the line in Dubna until installation is completed

HVB failure:preseries for 400 new HVBoards PCBs ordered : delivery in May

Ready to start first assembly of Minicrates in Legnaro at end of May.(3 months delay wrt October)


ISR Tunnel April 2004

115 Chambers in ~ 22 Stacks + 5 MB3 due May 4th

In total the old boards have been substituted in:

6 MB1, 3 MB1/9-11 5 MB2, 2 MB2/10 6 MB3 = 20 chambers


0

50

100

150

1/1/2001 1/1/2002 1/1/2003 1/1/2004

Date

To

tal S

up

erla

yers

pro

du

ced

Aachen

Madrid

Padova

435/680 = ~ 64% of the full lot 435/600 =~ 73% of the lot due by the 3 sites


Superlayers

0

70

140

1/1/2001 1/1/2002 1/1/2003 1/1/2004

Date

Su

per

laye

rs p

rod

uce

d

Aachen PhiAachen ThetaMadrid PhiMadrid ThetaPadova PhiPadova Theta


Chambers

0

10

20

30

40

50

60

70

80

1/1/2001 1/1/2002 1/1/2003 1/1/2004

Date

Cam

ber

s p

rod

uce

d

Aachen

Madrid

Padova


0.00

10.00

20.00

30.00

40.00

50.00

60.00

0 20 40 60 80 100 120Phi Super Layer Number

Da

ys

(in

clu

din

g S

at

an

d S

un

)

Aachen

Madrid

Padova

0.00

10.00

20.00

30.00

40.00

50.00

60.00

0 10 20 30 40 50

Theta Super Layer Number

Da

ys

(in

clu

din

g S

at

an

d S

un

)

Aachen

Madrid

Padova


Integral of produced chambers /quarter.

DT Chamber Production (18DT/site/year)

-20

30

80

130

180

230

Q4-01

Q1-02

Q2-02

Q3-02

Q4-02

Q1-03

Q2-03

Q3-03

Q4-03

Q1-04

Q2-04

Q3-04

Q4-04

Q1-05

Q2-05

Q3-05

All

DT

s

Planned

Achieved

Achieved - Planned

120

The green slope is 70 ch/year for 4 sitesThe 3 operational sites are running at 23.3 ch/site/year

140


40 chambers (80 Superlayers, of the largest MB4) have to be produced in Torino.

A first dummy Superlayer was assembled successfully (March/April)

Assembly of the First MB4 for YB+2 top started May 3rd.

End inst.window (V 34.0) chambers needed ?achievable in Torino? Max min 5 ch in 04 than 2/month

1 July 05 (mag.test) 18 (YB+2/+1/0) 10 (YB0 may 05) 15

1 Mar. 06 (end SX inst.) 30 (YB-2/-1) 20 (no sectors1,7,10,12) 29 (dec.05)

Sept.06 (end UX Inst) 40 (sect. 1&7) 40 (may 06) 39

Actual rate in the 3 sites is 1.9 ch/month (23.3/year) INFN Milestone is 4 SL (2 ch) by July

The Torino target


Status of Torino MB4 Production Line

[email protected]

First dummy Sl : wire position measurement

Wire seen by CCD camera

Wire image sw-reconstruced

residual distribution (micron)

-100-50

050

100150

0 50 100

wire number

res

idu

al (

mic

ron

)


Chamber calibration status

Total quantity to be calibrated: 269 (250 in CMS, 19 spare)

Assembled and calibrated: MB1 32MB2 32MB3 28MB4 (all types) 12Total calibrated: 104

Calibration speed: (max) 4 chambers/day

Next period: June-August’04

Bench stability: Regularly measured with LTD *:No movement detected

* LTD = Laser Tracker Distancemeter (<40 µm precision)


HV BOARDS

HVB STORY


Shown are the outer layers,the break down occurs acrossthe brown channels. In the center of them is the line carryingthe HV for the wires (3.8 KV) .The inner layers carry the HV for cathode and strips.


The three layers of the 1st and 2nd board generation with insulating channels 1.5 mm wide . The other three are the symmetric image.Below the outer layer of the 3rd generation with channels enlarged to 2.8mm . The inner layers are identical to the Old design.

3800 Volts ground

+1800 Volt

- 1200 Volt


Total lot of HVB 10850

Type of board total PCB rej. Accepted boards Infant failure Installed in IHEP in IHEP in chambers in chambers

1st generation 7000 6% 3700 1.7% 3700

The 7000 Include a bad batch 21% 2300 6~7% 0

Improve quality Control on PCB production, change the parameters of prepreg no flow deposition

2nd generation 2600 0 2600 0 2600

As above but Increase channel width HV-Ground in outer layers

3rd generation 1600 0 1600 0 ~1000

2nd and 3rd Gen. = SUBSTANTIAL IMPROVEMENT ON INFANT MORTALITY ( no failures)

3rd generation was supposed of at least 5000 boards , production stopped after long term failures of 8 out of 1080 boards of the 1st generation (3000 hours under HV and 5 months in gas) (end Jan 04)


1st Gen . HVB FAILURES in chambers (3700 boards):

1.7 % faults in the first 500 hours

0.25% between 500 and 1000 hours

0.08% between 1000 and 1500

0.05 % between 1500 and 2000

0.00 % between 2000 and 3000 hours

In Jan 04 8 out of 1080 boards in chambers ready for installation failed at the

switch on of the HV after 3 month under HV and 3~6 months in gas 0.7%

2nd and 3rd Gen. Boards failure in chambers 0 / ~ 3000 boards

PCBs are produced by a firm, the assembly of the componentsis done in IHEP. The final test lasts 12 hours in gas at 4000 VNo failure can be attributed to mistakes during the assembly


IN summary:

Failures occurred in the 1st generation boards only in the outer layer (3800 volts) along the long straight lines AND along the bent ones.

No failure in the inner layers (1800 and –1200)

Field values in inner and outer layers are often comparable.

Failures are at the interface between outer prepreg and FR4 PCB

In Feb. 04 200 old boards of the bad batch were put in a vessel at 3 bar in Ar/CO2 for one month after a HV normal test of 24 hours : 4 failed at the switch on after the treatment.


2

1st generation good board failures

Section of 1st gen board of the bad batch

1st gen. Good board that failed


We found indication that :

the week point is the bad adhesion of the no flow prepreg to the FR4,The fabrication procedure could leave microbubbles trapped at the interface.

Absorption of gas can worsen this weakness.

Improved boards are visibly and experimentally betterHowever we can’t safely predict the long term behavior.Events are too rare and can depend on unknown parameters(operation mode,handling etc….)

ACTION:

MAKE NEW BOARDS: avoid use of prepreg no flow, and minimizesthe direct contact of HV insulating parts with the gas.This can be done by adding two extralayers. (from 6 to 8 layers).


insulation

“Prepreg flow’

“Prepreg no flow”

CROSS SECTION OF OLD and NEW HVB

WIRES 1

STRIPS 1

CATHODES 1

STRIPS 2

WIRES 2

In this layer are the distribution lines of HVto the wires and the pads to sold components:Resistors,capacities and connection wires

CATHODES 2

“Prepreg no flow”

In this layer wires connectionsonly

Soldering pads in the new outer layerFlow prepreg

1,2,3rd generation boards NEW BOARDS


old

new

added layer

No ground plane in the Wire layers (3)Channels in the inner layers were enlarged (1,2)

1

2

3

4


The total lot of boards is about 10850

In agreement with CMS ,to avoid dramatic delay in the installation, we are installing the 1600 Boards available from the 3rd generation in the chambers to be installed in YB+2,the most accessible one . Change the sequence of installation in the yokes

Use the NEW Boards in the YB+1 etc in Nov…Dec.

In the mean time the sites will equip their chambers with old boards of any type that will be gradually substituted with the NEW before installation of chambers in the yokes.

9250 NEW Boards are needed for wheels +1,0,-1,-2

The collaboration agreed to produce 11000 new boards

9250 for the installed chambers 1750 as spares (for spare chambers and in case of problems in YB+2)Total ~ 11000


89 10 11

4 356

89 10 11

4 356

89 10 11

4 356

1 2 3

4 5 6

YB+2 YB+1 YB0

v 33.2 JAN 05 By the time of the magnet test v 34.0 July 05

OLD

NEW

CHANGE OF THE INSTALLATION SEQUENCE

3rd gen.boards New Boards New Boards

89 10 11

4 356

89 10 11

4 356

89 10 11

4 356

YB+2 YB+1 YB0

1

2

3

4

5

6


New PCB design,approved by DT and CMS,and review by a primary firm in the HV field. Feb.-March

Discussion with several companies,offers and choice of 2 companies April

A preseries of 200 PCBs was ordered to each firm: Aprildelivery 2nd half of May.

Test preseries (3 weeks max.) end June assemble ~ 200 HVB for 4 ~ 5 YB+1 chambers July

Share production between the two companiesDelivery 1st batch of 2000 PCBs expected end July.

IHEP is setting up a fast assembly line capable of 1200 boards/month(full lot in 9 months , completed by April 05)Components are under procurementFirst batch of NEW HVB for YB+1 expected by end Sept.

APPROVAL OF Fund. Ag. IS PENDING


TSS ASICs

TSM: 3 pASICs

TRACO ASICs

TRB SB/CB TRB

trigger-, monitoring-, synch- data path

Control path

to Sector Collector

to Slow Control JTAG, Parallel Interface

Drift Tubes Local Trigger Electronics Boards Production Status


Multichip Ceramic Module: 4 BTI per module.

• Almost half production done (~5500/12500).

• A lot of 2500 modules re-tested successfully by Metallux: only 5 (=0.2%) modules rejected.

BTIM

• The 40 prototypes, foreseen at the beginning of April, are delayed to end of May.

• Late delivery of components

CCBCCB linkControl Boards.


• Boards already available:

– 29 TRB-φ

– 9 TRB-θ

TRBTrigger Boards.

– 50 TRB-φ

– 20 TRB-θ

– 10 TRB-φ-32

Enough for ~15 minicrates.

The need of a 2nd preseries delayed the delivery of the first batch……………assume delivery of 200 TRB by september

From first preseries of 55 (Jan 04) Bad yield of fabrication From Second preseries (subm. Feb 04)

under test at the firm delivery in two weeks


TSS 1300 tested chips (yield 94%)

done sep 2003

TSMSTSMD

850 tested chips (yield 97%)

done jan 2004

SB 290 boards(yield 95%)

40 available sep03burn in

50 in may04200 in nov.04

SectColl 63 boards proto sep04prod spring05

OptoRX 63 boards proto sep04


Server Board

TRB1 TRB2 TRB3

TRB4 TRB5 TRB6

TRTH1 TRTH2Sector Collector


PLAN for MINICRATE ASSEMBLY:

Read-out part assembled and tested in CIEMAT (planned 12/month)

Assembly of the Trigger part and full test in two sites: first in Legnaroand a second by september in Bologna (NEW). (16/month ?)

A stand to test the MC after installation in chambers should operational at ISR in July.

First batch of 10 Readout MC from CIEMAT expected today in Legnaro ( 5 MB1 L, 3 MB2 L, 2 MB3 L)

First assemblies of the Trigger part in Legnaro end of May (CCB availability)

Expected delivery of first 5 MB1 MC for YB+2 top within July.


Install. Sequence YB+2 bottom June/July no MC

Yb+2 Top July to Nov. 17 MC

YB+1 Bottom Dec 19 MC

YB+1 Top Jan 12

etc……

MC prod readout + trigger needs for

July 32 >= 5 5 MB1 YB+2 topSeptember 44 >=17 17 complete YB+2 topOctober 56 >= 33Nov. 68 49 36 YB+1 bottomDec 74 57 48 YB+1 topJan 86 73 May > 134 137 126 YB+2,+1 and 0

Assume 200 TRB available by mid SeptemberProd speed of readout MC: 12/monthProd speed of complete MC: sept . 12/month than 16/month 8 in Dec


1st generation HVB replaced by 3rd gen. in all chambers apart for 20channel HVBs in the MB2 Theta SL

BOTTOM


The chambers in red are built with HVB_3rd but they are naked and must undergo the alignment calibration

TOP

Documents

SUMMARY: Latest results on the Minicrate performance Status of chamber production Torino line