Status of Stripixel Sensor + SVX4 Test

Junji TojoRIKEN

VTX MeetingJune 1st, 2004

R&D Goals

• Evaluation of the detector technology used for the outer barrel strip layers

• The primary candidate is the stripixel sensor + SVX4 chip.

• R&D items– Measure S/N w/ the v2 prototype sensor (400um/500um) + SV

X4 chip.

– Study of charge sharing property : principle of single-sided 2-dim sensitivity.

– Matching test w/ DC-coupling and AC-coupling (SVX4 is design for AC-coupling sensor).

The Current Detector Setup

• The 400um thick v2 prototype sensor

• CDF SVX4 hybrid

• DC-coupling btw sensor and SVX4

• ORNL SVX4 readout board (PHENIX DAQ mimic)

• Laser test bench

Snapshot of DAQ Operation

Serial parameter configuration

Operation w/ LabVIEW DAQdesigned by ORNL

Timing configuration

DAQ GUI

SVX4 Operation

FEClk L1A PR2 Preamp Reset

Reset cell N

Cell N sample 1 Cell N sample 2

Level 1 accept for cell N with a delay of 5

Pedestal acquisition cycle. (Also returns a digitized cell to the pipeline).

PreampReset shown during pedestal acquisition cycle, but this can occur any time.

Timing diagram for the acquire cycle

Serial configuration parameters

Status

• Towards measurement of S/N w/ the DC-coupled 400um sensor+SVX4

• Laser tests at RIKEN– Laser pulse synchronized with (internal) 10MHz beam cloc

k– External Trigger (L1A) input made from scaled down bea

m clock– Timing scan (timing btw laser pulse and L1A)– Laser spot focusing (possible up to 10um dia.)– Serial parameter adjustment in SVX4 ← We are here now.– Absolute calibration to obtain S/N

• Charge injection to SVX4 and/or a radioactive source

Laser Signals • L1A timing scanned

– Adjustable in 30 clocks in SVX4

• Laser focusing– Profile showed sharp peak

– There is still a room to improve (up to ~10um dia.)

• Laser intensity corresponding to the ADC channels of the signal can be adjustable.

To be adjusted to 1 MIP equivalent.

• Need to understand the noise.

ADC (ch)

# SVX4 ch

AD

C (

ch)

Detectors to Be Tested• What we have in our hands

– V2 prototype sensor : 3×400um (QAed), 4×500um (not QAed), 2×500um

– Eight CDF SVX4 hybrids

– Pitch adaptors for DC/AC-coupling and one-dim readout

– One ORNL SVX4 readout board

• Possible detector configuration– Selection in 400/500um thick, DC/AC-coupling and one/two-dim readout

– Note : Pre-production sensors are 500um thickness.

– Save SVX4 hybrids to be used for both this R&D and pre-production sensor evaluation

– Save the man power in ORNL ROC development

• Detectors to be made and tested in minimum requirement– [400um thick sensor, DC-coupling, one-dim readout (the current detector)]

– 500um thick sensor, AC-coupling, one-dim readout

– 500um thick sensor, DC-coupling, two-dim readout (w/ new pitch adaptor)

Schedule• S/N w/ 400um thick sensor, DC-coupling and one-dim readout b

y late June.

• Two QAed 500um sensors ready around the middle of June.

• Wire-bonder will be ready at RIKEN by the end of June.

• New pitch adaptor for 2-dim readout will be ready in early July.

• Fabrication of 500um thick sensor, AC-coupling and one-dim readout and measurement of S/N from early July to the middle of July.

• Fabrication of 500um thick sensor, DC-coupling and two-dim readout and measurement of S/N from the middle of July to the end of July.

Stripixel Sensor + SVX4 Chip Test• Goals

– Show enough S/N (>10) with stripixel sensor + SVX4 chip.• Tests

– DC-coupling scheme as the 1st step. If fails, AC-coupling scheme will be tested.– DC-coupling test by resetting SVX4 during RHIC abort gap.– AC-coupling test by decoupling sensor with SVX4. Cu/PI flex on SMD (R&C) will be used.– AC-coupling test by decoupling sensor with SVX4. “RC chip” will be used.

• Stripixel sensor v2– 400μm thick sensor : 4 sensors were fabricated. 2 sensors are available and 2 sensors are before Q

A and laser-dicing.– 500μm thick sensor : 4 sensors are under processing and will be fabricated by the end of March.

• SVX4 hybrid– CDF SVX4 4-chip hybrid is used.– One hybrid in RIKEN : Used for DC-coupling test.– One hybrid in ORNL : Used for SVX4 readout board development.– Eight hybrids for R&D : Used for AC-coupling & 2D readout tests. Under nego. with FNAL.

• Detector– Gluing & Wire-bonding for DC-coupling detector at a company (Hara-Seiki in Japan).– Completed.

• SVX4 readout board– Readout of CDF SVX4 4-chip hybrid w/ PHENIX DAQ mimic– Used for Sensor+SVX4 tests.– Sent to RIKEN soon.

The slide shown at the Upgrade DC Meeting on March 10th.

Arrived at RIKEN from Vince on March 15th.

Under testing at RIKEN.

Response received from FNAL (Ed&Yasuyuki).