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iNEMI Medical Packaging WorkshopSeptember 17, 2010, Berlin

State of the Art of Assembly and Packagingof Electronic Modules for Medical Implants

J. GoßlerMicro Systems Engineering GmbH

Schlegelweg 17D-95180 Berg/Germany

© Micro Systems Technologies Sept. 17, 2010iNEMI Medical Packaging Workshop; Berlin

MST Group – 5 highly innovative technology companies

Solutions for medical devices from conceptto serial production

© Micro Systems Technologies Sept. 17, 2010iNEMI Medical Packaging Workshop; Berlin

MST Group – 8 locations, more than 900 employees

• System develop.& VLSI design

• Advanced assembly (med-tech)

MSEI*Lake Oswego - Denver

- Houston, USA

• LTCC substrates• Adv. assembly• Design services

MSEB**Berg, Germany

• Feedthroughs for med-tech implants

CC FeedthroughsErlangen, Germany

• Batteries for med-tech implants

LITRONIKPirna, Germany

• Electrophysiology products

VascoMedBinzen, Germany

• High-reliability HDI/microvia substrates

DYCONEXBassersdorf,Switzerland

* MSEI: Micro Systems Engineering, Inc.**MSEB: Micro Systems Engineering GmbH, Berg Holding company: Micro Systems Technologies GmbH, Baar, Switzerland

© Micro Systems Technologies Sept. 17, 2010iNEMI Medical Packaging Workshop; Berlin 4

Topics

1. Introduction

2. Substrates

3. Assembly

4. Interfaces

5. Systems

6. Future


Introduction

Major challenges for electronics in biomedical implants

• Reliability (active lifetime up to somedecades)

• Compatibility with hermeticenvironment

• high packaging density / low weight


Introduction

Benefits from human body environmentand hermetic housing

• constant moderate temperature

• very dry and inert atmosphericenvironment

• no severe vibration or mechanicalshock


Substrates

Circuit Board Technology

• Packaging and wiring density against requirements of expected integration level

• Basic requirements for functional properties as

HF performance

dielectric strength

system reliability


Substrates

Rating

Cost

LTCC HTCC PCB FR4 PCB PI

Wiring Density

HF-Performance

Conductor Resistance

3D

Humidity Absorption


Substrates

LTCC / HTCCPCB rigid (FR4)

PCB flex (Polyimide)


Electronic Modules

Can

Feedthrough

Battery

Elektronic module

Typical assembly; example heart pacemaker


Assembly

Interconnect technology options

• Chip&Wire Technology

(always combined with standard SMT)

• Chip Scale Package (CSP)

• µBGA


Assembly

Chip&Wire-Technology


Assembly


Advantages Disadvantages

no additional packaging stepsafter waferfab

increased floorspacerequirements

reliable, well knowntechnology reduced HF performance

configuration flexibility bydifferent bond options

sequential (slow) interconnectprocess

some flexibility in case of die shrinks

mechanical protectionrequired


Assembly


Single chamber pacemaker

Substrate / Hybrid:- thickfilm hybrid on Al2O3 substrate- printed resistors- 9 up array on 4“ square panel- 2 interconnect layers- one side SMT, one side C&W


Assembly


Single chamber pacemakerwith increased functionality

Substrate / Hybrid:- 4 layer LTCC substrate- printed resistors- 6 up array on square panel- 5 interconnect layers- one side SMT, one side C&W- no SMDs on C&W side- perforated straight edges for

singulation after assembly


Assembly


Three chamber pacemaker withhome monitoring functionality

Substrate/ Hybrid:- 6 layer LTCC substrate on 4“ square panel- 7 interconnect layers- overall conductor length 2,01 m- 642 vias- perforated „D shape“ for singulation after assembly


Assembly

Chip Scale Package (CSP)

Sn63Pb37

Polymer

Al-PadDie-Passivation

CuUBM


Assembly



small package (down to real chip size)

additional wafer scaleprocesses (redistribution + bumping)

can be attached in standardsurface mount processes

redistribution layer criticalconcerning crosstalk

parallel (fast) interconnectprocess underfill recommended


Assembly

Dual chamber pacemaker withhome monitoring functionality

Substrate/ Module:- rigid flex PI substrate- 2 interconnect layers- test points outside circuit on panel- laser singulation



Assembly

µBGA


Assembly

µBGA


rugged package additional packaging (wirebond, transfer mold)

can be attached in standardsurface mount processes reduced HF performance

parallel (fast) interconnectprocess

limited availability if not „high volume“

full electrical test afterpackaging


Assembly

µBGA

Dual chamberpacemaker on FR4 PCB

Substrate/ Module:- FR4 substrate- 4 interconnect layers- 6 up array on panel- no clean solder

assembly- laser singulation


Interfaces

Typical interface requirements

• I/Os to external actors and/or sensorsfor diagnostic or therapy

• Communication

• Internal


Interfaces

Electrodeplugs

Feedthroughs

Requirements:

- hermeticity in human bodyenvironment for implant lifetime

- reliable internal and externalinterconnects

- external interconnects compatiblewith human body environment

Internalinterconnects to battery


Interfaces

Feedthroughs

Quadrupolar feedthroughfor two bipolar electrodes

Bipolar feedthrough solderedto flex interconnect


Interfaces

Communication coils and antennas

Freestanding coil withinterconnects by welding

Laminated flat coil withsoldered interconnects

Antenna for RF communication in header


Systems

Dual chamberpacemaker

Welded and glued coil on topof soldered SMDs

Glued acceleration sensor, interconnect by soldered flex

Glued plastic lid

Components attached inChip&Wire technology

- HTCC substrate- SMT- Chip&Wire- welded and glued coil- plastic lid


Systems

Dual chamber pacemakeron rigid flex substrate

- flex arm with connectors forbattery

- flex arm with solderedfeedthrough

- chip scale packages

- trim resistor µBGA

- acceleration sensor


Systems

Schematic of technology:rigid flex withCSP

IC mit Umverdrahtungund Lotbumps

Underfill (optional)

Polyimid mit Cu-Metallisierung undMikro-Vias

Versteifungsmaterial(z.B. FR-4)

Flexibler Bereich zumFalten der Schaltung undzur Realisierungintegrierter Verbindungs-elemente (z.B. zur Batterie)

Flexible area for foldingand external connections(battery, feedthrough)

IC with redistributionlayer

Polyimide with Cu metallization and microvias

Stiffener(FR4)

Underfill (optional)


Systems

Finished foldedmodule and assembly schematic


Systems

Implantable Rescue Device (IRD)Single chamber pacemaker with limiteddefibrillator function and RF telemetry

- LTCC hybrid for controller

- FR4 PCB with SMT and Chip on Board for high voltage and power section as daughterboard


Systems

Implantable Cardioverter/Defibrillator(ICD)

Assembly schematic

Unfolded Module


Future

Further miniaturization of components

• COB-technology in power section

• 3-D-packaging for ASICS

• Integrated arrays for passive components


Thank you for your attention.

Micro Systems Engineering GmbHSchlegelweg 17DE-95180 BergGermanywww.mst.com/[email protected] +49 (9293) 78-0Fax +49 (9293) 78-41

Micro Systems TechnologiesNeuhofstrasse 4CH-6341 [email protected] +41 (43) 266 11 00Fax +41 (43) 266 11 11

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State of the Art of Assembly and Packaging of Electronic ...thor.inemi.org/webdownload/newsroom/Presentations/Med_Pkg_Sept2… · State of the Art of Assembly and Packaging of Electronic