C O N F I D E N T I A L P R O P R I E T A R Y

July 1, 2015

HISTORY

CONFIDENTIAL PROPRIETARY

1995

1998

1999-2001

2002-2004 Founded Stars USA, Formed a distribution alliance in Germany

2005-2006

Listed in SET 2009

Launched production of camera modules Enter optical components & medical devices markets To certify ISO 13485 and TL 9000

Recovered from the Great Flood of Thailand

Won “National Innovation” awards 2010

2012-2014

2015-2016

Applied FCOG and FCOF for LCD Module assembly

Certified ISO 9001 and ISO 14001:1996

Moved to Plant 2, Received BOI privileges

Founded

SMT ORGANIZATION

CONFIDENTIAL PROPRIETARY

CEO Peerapol W.

CFO Yunyong S.

CPO Prompong C.

COO Dr.Kavee T.

CBDO Dr.Tattee K.

Finance

Accounting

Operation / NPI Infrastructure Management

Business Development

HR

Program Management

QA

Sr. Director Suwapat C.

Sales & Marketing

Customer Service

Advanced Engineering

Production Planning

Supply Chain

Inventory Management

WORLD CLASS CUSTOMERS

CONFIDENTIAL PROPRIETARY

Nor

th A

mer

ica

/ US

A E

urop

e Ja

pan

/ A

sia

Wafer Level Packaging / Sub-Assy Module Assembly PCBA / COB

MANUFACTURING STRENGTHS

CONFIDENTIAL PROPRIETARY

•  Strategic Partnership with customers

(Cost , Sourcing, Design & Development)

•  High volume / High mix low volume demand management

•  Process design, Turnkey transfer and Ramp up capability, IP Protection

•  Quality Systems: ISO9001:2008, TS16949, ISO14001, OHSAS18001, RoHS Compliance , EICC, CSR-DIW

ISO13485/TL9000 - Plan to certify in 2015-2016

ISO22301 - Plan to certify in Q4’2015

•  ERP Syteline, MES, BI managing massive purchased parts and sub-assemblies to support customer products

•  Complete product traceability from incoming material to Final product

•  Lean Manufacturing Practices

!  Continuous process improvement

!  Six Sigma

ENGINEERING STRENGTHS

CONFIDENTIAL PROPRIETARY

•  Provide “Vertical Integrated Solution” !  Wafer / Chip level !  Packaging / Sub assembly !  PCBA / COB !  Finished goods / Module assembly

•  DOE, DFM, NPI, FMEA, Prototyping and Engineering Support Services

•  Process development and optimization

•  Tooling and fixture design !  Solidworks, Autocad !  Semi- Automation to full automation

•  Test development

!  Hardware and Software

•  Diagnostic and failure analysis

CONFIDENTIAL PROPRIETARY

PROCESS & TEST CAPABILITY

Surface Mount Technology :

•  Soldering Process !  IR Reflow and Wave Soldering !  13 Heating zones and 3 Cooling zones !  100% RoHS Compliant !  Solder printing / Jetting process !  Capacity 22 M points / day (15 Lines:

Assemble-on, Panasonic, Juki, Yamaha)

•  Component Mounting !  Passive components as small as 01005 !  Various IC Packages : BGA, µBGA,

QFP, Flip Chip, COB !  Thru-hole Components

•  Placement Accuracy +/- 0.02 mm

•  Fine Pitch QFP 0.4 mm, BGA 0.8 mm

•  Conformal Coating, IPC Class III

•  Visual Inspection !  3D Solder Volume Inspection !  X-Ray (2D and 3D) !  AOI

•  PCBA Testing !  ICT (HP 3070) !  Functional Test

Packaging / Sub Assembly :

PROCESS & TEST CAPABILITY

Wafer / Chip Level Process :

CONFIDENTIAL PROPRIETARY

•  Dispensing !  Dispensing or Stamping !  Air pressure / Lead screw !  Smallest dot size 0.1 mm ᴓ

•  Die Bonding (28 Automatic Machines) !  Eutectic and Epoxy Bonding !  Mounting Accuracy down to +/- 1.5 µm (post

bonding) !  Can handle chips from Blue ring, Waffle tray, Gel-pak !  Die shear test

•  Wire Bonding (99 Automatic Machines) !  Ball, Wedge and Ribbon Bonds !  Ball-Stich-on-Ball (BSOB) !  Deep access / large area !  Au, Ag alloy, Cu, CuPd and Al (wedge) Wires !  Pitch 70 µm !  Wire pull test

•  Back Grinding (6”, 8”,12”) !  Down to 50 µm thickness !  Accuracy 2 µm

•  Laser Dicing !  Stealth accuracy +/- 2 µm, Die size 0.4 mm !  Hasen cut to handle Multi-Chips size in the same

Wafer !  8 inches wafer

•  Mechanical Saw

ROBUST SUPPLY CHAIN

CONFIDENTIAL PROPRIETARY

Strategic

- Global Supply Chain with Low Cost

Region Focus

- Material Cost Reduction !  Volume leverage/Consolidation !  Localization !  Vertical Integration

- Material Lead Time Reduction !  Fast Commitment to

Secure Business

- Excellent Warehousing and Logistics Management

- Reduced Exposure to Excess and Material Cancellation

Technical

Tactical

KEY EMPLOYEES BACKGROUND

CONFIDENTIAL PROPRIETARY

Engineering (Avg. Experience 10 yrs)

Management 22 Engineering 112 Marketing / Program 15 MC / PC / Production 70 QE 18 Support 56 TOTAL 293

MC / PC / Production

QE Support

Management

Marketing / Program

“We have various fields of Engineer:- Electrical, Telecom., Mechanical, Industrial, etc.”

“We can provide high mix low volume demand with very lean manufacturing practice.”

11 CONFIDENTIAL PROPRIETARY

2009-2011 2012-2014 2015-2016

Leaded

Leadless 0.85 mm. Nominal

Leadless 0.75 mm. Nominal

Leadless 0.50 mm. Nominal

Leadless 0.40 mm. Nominal

Leadless 0.33 mm. Nominal

Leadless 0.28 mm. Nominal

Technology

8L SOIC

8/14/16/20/28/38L TSSOP

3/5/6L SC70

5/6L TSOT23

8L SOIC EPAD

5/6L SOT 8/10L MSOP

8/10L MSOP EPAD

COL/ Stack die COL / Stacked die

6L DFN2.5x2 6L DFN 3.5x2.5 6L DFN5.0x3.2 4L DFN 2.5x2 4L DFN 3.5x2.5 4L DFN 5.0x3.2

8L TDFN2x3 12L TDFN3x3 12L TQFN3x2

4L UDFN 1x1 8L UDFN 2x2 8L UDFN 2.0x1.2 2L UDFN COL 8L UDFN 2.2x2.0

4L XDFN1x1 6L XDFN1.2x1.2 8L XDFN1.6x1.2

4L XDFN1.1x1.1 8L XQFN1.6x1.6 8L XQFN2.0x2.0

6L X2DFN 0.825x0.85

2L XDFN1x0.6

8L UDFN 2x3

3L SOT 4L SOT143

DAF WBC 12 in Wafer Ag wire FCOL

16L TQFN 3x3 6L TDFN3x3

10L UDFN 3.2x1.2 8L UDFN 3.5x2.0

IC PACKAGING PORTFOLIO & ROADMAP

FAILURE)ANALYSIS)AND)RELIABILITY)TEST)CAPABILITY)

Temperature Cycling

Pressure Cooker Test

Stress Test

Moisture Sensitivity Test

Analysis Capability

Reliability Capability

Temperature-Humidity Test High / Low Temp. Test Temperature Storage Test Solderability Test

Destructive

Cross-Sectioning

De-Capsulation

Createring Test

Dye & Pry

Mechanical Microprobing

Electrical Analysis

Non-Destructive SEM (Scanning Electron Microscopy) X-Ray Radiography Optical Microscopy EDX (Energy Dispersive X-Ray) SAM (Scanning Acoustic Microscopy)

FA AND RELIABILITY TEST CAPABILITY

CONFIDENTIAL PROPRIETARY

FA CAPABILITY

CONFIDENTIAL PROPRIETARY

Visual Inspection / SEM / EDX

SAM / X-Ray examination

Decapsulation / Cross-Section

Electrical Analysis

Mechanical Micro-probing

Bond Pad Cratering Test

Dry & Pry

Non-Destructive :

Destructive :

RELIABILITY CAPABILITY

CONFIDENTIAL PROPRIETARY

Temperature & Humidity Test

High/Low Temp. Storage Test

Temperature Cycling

Highly Accelerated Stress Test (HAST)

Pressure Cooker Test (PCT)

Moisture Sensitivity Level

Test

Solderability Test