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ST in ADAS Uwe Voelzke Technical Marketing Manager EMEA Region – ADG Marketing & Application

ST in ADAS - ACAMP · Q2 2016 Revenues Others 3% Automotive and Discrete Group (ADG) 11 Microcontrollers ... Agenda 32 40 min Speaker ST in ADAS Company Overview ST in Automotive

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ST in ADAS

Uwe Voelzke

Technical Marketing Manager

EMEA Region – ADG Marketing & Application

Agenda 2

40 min

Speaker

ST inADAS

Company Overview

ST in Automotive

ST in ADAS

Conclusion

Uwe Voelzke

Agenda 3

40 min

Speaker

ST inADAS

Company Overview

ST in Automotive

ST in ADAS

Conclusion

Uwe Voelzke

Who We Are 4

• Approximately 43,200 employees worldwide

• Approximately 8,300 people working in R&D

• 11 manufacturing sites

• Over 75 sales & marketing offices

• A global semiconductor leader

• 2015 revenues of $6.90B

• Listed: NYSE, Euronext Paris and Borsa Italiana, Milan

Front-End

Back-End

Research & Development

Main Sales & Marketing

As of December 31, 2015

Where You Find Us

Making everyday things smarter, connected and more aware of their surroundings

5

Making driving safer, greener and more connected

Enabling cities to make more of available resources

Enabling the evolution of industrytowards smarter, safer and more efficient factories and workplaces

Making homes smarter, for better living, higher security, and less waste

Application Strategic Focus 6

Safer

Greener

More connected

SmartIndustry

SmartCity

SmartThings

The leading provider of products and solutionsfor Smart Driving and the Internet of Things

SmartHome

Discrete & Power Transistors

Dedicated Automotive ICs

Analog, Industrial & Power Conversion ICs

Product Family Focus 7

The leading provider of products and solutionsfor Smart Driving and the Internet of Things

Portfolio delivering complementarity for target end markets, and synergies in R&D and manufacturing

Digital ASICs

General Purpose & Secure MCUs

EEPROM

MEMS & Specialized

Imaging Sensors

Flexible and Independent Manufacturing

8

Front-End

Back-End

Morocco

France(Crolles, Rousset, Tours)

Italy(Agrate, Catania)

Malaysia

Singapore

Philippines

China(Shenzhen)

Malta

An Unwavering Commitment to R&D 9

Advanced research and development centers around the globe

~ 15,000 patents; ~9,000 patent families; more than 500 new filings (in 2015)

~ 8,300 people working in R&D and product design

As of December 31, 2015

Customer Base

Top 10 OEMs*:AppleBoschCiscoContiDeltaHP

HuaweiSamsungSeagate

Western Digital

Top 5 Distributors*:Arrow Electronics

AvnetEdom

WintechYosun

*Listed alphabetically

FY15FY15

Top 10 OEMs

Other OEMs

Distribution

10

33%

22%

42%

Q2 2016 Revenues

Others 3%

Automotive and Discrete Group

(ADG)

11

Microcontrollers and Digital ICs

Group (MDG)

Analog and MEMS Group

(AMG)

56%

16%

28%

% by product group % by location of order shipment

Americas

EMEA

Asia Pacific

In 1Q16, ST realigned its product families into three product groups: Automotive and Discrete Group (ADG); Analog and MEMS Group (AMG) and Microcontrollers and Digital ICs Group (MDG).

A Global Semiconductor PlayerRegional Sales and Sales by Channel

12

~68%

~32%

% by market channel

FY2015

OEM

Distribution

% by location of order shipment

58%16%

26%

Americas

EMEA

Asia Pacific

A Global Semiconductor PlayerRegional Sales by Shipment and Region of Origin

13

% by location of order shipment % by region of origin

FY2015

35%

33%

32%

Americas

EMEA

Asia Pacific

58%16%

26%

Americas

EMEA

Asia Pacific

~17,300

~9,900

~9,600

~4,700

~800~800

Present in over 35 countries

Asia

France

Italy

Mediterranean

Americas

Rest of Europe

People are Our Foundation 14

Manufacturing ~ 65%Research & Development ~ 19%

Marketing & Sales, Divisional Functions,Administration & General services

~ 16%

…working everyday to increase the quality and experience of life for all

As of December 31, 2015

Our Longstanding Commitmentto Sustainability

15

1995 2000 2005

ST Environmental commitment

1st Environmental Decalogue

1st ST Environmental report

1st Environmental Certification ISO14001

2010

4th edition of ST “Environment, Health &

Safety Decalogue”

ST signatory of United Nations

Global Compact

1ST Safety & Health

Certification OHSAS 18001

2015

1st Energy ManagementcertificationISO 50001

Creation of ST

Foundation

ST member of the EICC

Launch of reforestation

programs

Deployment of ST Health Plan

Launch of ST Principles for Sustainable Excellence

Creation of ST Ethics

Committee

STSustainability

Strategy

5th edition of ST “Environment,

Health & Safety Decalogue”

New Sustainability

Strategy

1st ST Sustainability

Council

ST Quality Strategy 16

Our quality goal : “To provide our customers with the highest level of quality excellence in the semiconductor industry.”

A comprehensive approach built around 7 pillars

Cus

tom

ers

Cha

nge

man

agem

ent

Pro

duct

& te

chno

logy

de

velo

pmen

t

Man

ufac

turin

g

& s

uppl

y ch

ain

Peo

ple

Bus

ines

s pr

oces

ses,

tool

s &

indi

cato

rs

Eco

nom

ic v

alue

Pro

activ

e qu

ality

Rea

ctiv

e qu

ality

DPPM reduction Zero excursions Flawless execution

Quality Excellence Objectives

Agenda 17

40 min

Speaker

ST inADAS

Company Overview

ST in Automotive

ST in ADAS

Conclusion

Uwe Voelzke

30 years leadership in Automotive 18

9026 components in average by car

components shipped every second

/s

32%of ST revenue donein Automotive (in 2015)

1in ADAS, braking, EMS, audio, lighting,…

+

Automotive and Discrete GroupWho We Are

19

• A global semiconductor leader

• ADG 2015 Revenue: 2.72B$

• Leader in several market segments and applications domains

• Automotive Divisions 2015 Market Share ≈ 13%

• Discrete Divisions 2015 Market Share ≈ 7%

• Approximately 2400 employees worldwide

• #3 Automotive Supplier World-wide(*)

• Complete product and technology portfolio

• Independent manufacturing

• Quality is a mustAs of December 31, 2015

(*) Strategy Analytics April 2015 (before NXP-FSC merge)

Automotive and Discrete GroupDivisional Global Figures

20

Automotive Divisions Discrete Divisions

1.72B$2015

Revenues

19% through

Distribution

Automotive Digital Division

Audio & Body Division

Power Train & Safety Division

26%

35%

39%

1.004B$2015

Revenues

51% through

Distribution

Power Transistors Division

ASD & IPAD Division

55%

45%

Automotive and Discrete Group

2015 Split by Geography 21

AMERICAWell Positioned in USA

EMEASolid link with European

Industry Leaders

Greater China and South AsiaGrowing Faster than Market

Japan and Korea

Historical Presence in Japan.Korea a new high growth

market

17%

18%

38%

49%

33%

19%

12%

14%

% by location of shipment

% by customer origin

Global presence around the world

Sustained Growth across different Geographies.

Strategic partnership at major innovators

OEMs.

469M$ 1027M$ 332M$902M$

Automotive Application Demand Evolution 23

Source: Strategy Analytics Apr 2015

Growth outside of ADAS and HEV/EV is comparatively weak. These two systems areas are the major growth drivers. More risk to HEV/EV forecast than for ADAS. Most ADAS risk is on the upside, in the event of more legislation

Market DataTop10 Auto Semi Suppliers 24

Technology Landscape 25

Technology in Development

ViPower 180 nm

BCD 90 nm

eFlash 28 nm

28 nm FD-SOI

40 CMOS RF

Manufacturing/Products in Design

ViPower 350 nm

BCD 110 nm

eFlash 40 nm

CMOS 40 nm

BiCMOS 180 nm

Tailored technology roadmap for automotive

With dedicated multi-site in-house manufacturing

Agrate

Catania

Rousset

Crolles

Singapore

0.2µm Oxide Filled TrenchNew Trench IGBT1700V Silicon Carbide (SiC)600V Gallium Nitride (GaN)

0.35µm Oxide Filled Trench1200V Superjunction1200V Silicon Carbide (SiC)

HV Scr Triacs 1500VSiC Pschottky 650V

HV Scr Triacs 2000VSiC Pschottky1200V

Package Innovation 26

Digital with advanced CMOS

Integration and miniaturization based on BGAs.

Towards Flip Chip &WLP

Power & BCD

High dissipation, miniaturized packages (PSSO, QFNs)

Going Leadless & System in package

Applicative Advanced

Cost-effectivenessMulti-chip ApproachRespecting the Environment

27

LEADFRAMEPackage

LAMINATE SUBSTRATEPackage (BGA)

WAFER LEVELPackage

MEMS & SENSORSPackage

Thermal Capability

HighPincount

Automotive Grade

Qualification

Multi-Chip Integration

Cost & Miniaturization

Package Evolutionmajor automotive developments

STMicroelectronics Mockup

Physical dimensions:L=14 mmW=14 mmH=1.1 mm

12 layers 6 layer cavity6 layer base

Two cavity sizes:6.8 mm7.8 mm

250 um pads, 500 um pitch

26/10/2016 28

The Rapidly Transforming CarThe automobile is being transformed by connectivity and technology

improving safety, enhancing the driver experience and lowering the environmental impact

29

• Assisted driving, autonomous driving• Enhanced vision• Precise positioning• Active safety• Adaptive lighting, auto braking

Safer• Vehicle electrification• Efficient engine management • Eco Navigation• Efficient LED lighting

Greener• Vehicle to vehicle, vehicle to infrastructure

communication• Smartphone integration• Enhanced telematics, insurance box• Data and video streaming• Cyber security

More Connected

Semiconductors are Driving Change in the automotive industry

30

• Multicore microprocessors• Sensor fusion• Video processing• Data streaming• Infotainment processors• Radio Frequency transmitters and receivers

• High integration smart power• Power components

• High energy motor controllers• Battery managers

• Video cameras• Sensors

Greener

Car Digitalization Analog and Power Technologies

Safer More Connected

Semiconductor Content Increasing 31

$330

$1.390

$50 $60

$100

$200

$500

$150

Si contentAverage Car

Powertrain Chassis Infotainment &Connectivity

ADAS Electrification Premiumadd-on

Si contentPremium Car

Source: Strategy Analytics, ST

Silicon Pervasiveness: 2015 semiconductor content per vehicle

Safer and More Connected

Greener Driving Experience

Agenda 32

40 min

Speaker

ST inADAS

Company Overview

ST in Automotive

ST in ADAS

Conclusion

Uwe Voelzke

Smart Driving : Safer

Product• Having the car drive better than we can -

maintaining a safe distance to other cars, remaining perfectly in our lane and at the right speed, and always watching for threats

• Making driving safer for the driver and car occupants, and for other road users, by actively helping to avoid accidents and by minimizing their impact if they occur

What Safer Driving Means

ST is making driving safer

Safer Driving Technologiesvehicle to vehicle connectivity, positioning, sensors, image processing, radar, adaptive lighting, active and passive safety, intelligent braking and stability control, processors and secured microcontrollers

33

Smart Driving : More Connected

ST is making driving more connected

Product• Bringing our personalized entertainment and

connected experience into the car environment in a safe and easy-to-use manner

• Allowing vehicles to communicate with each other (V2V) and to the Infrastructure (V2I)

What More Connected Driving Means

34

More Connected Driving Technologiesprocessors (audio, telematics, V2X), tuners, sensors, amplifiers, wireless connectivity

ST has all the key technologiesto drive automotive change: digital, analog and power

35

from commodity to super-integrated ASICs

High

Low

Com

plex

ityC

ompl

exity

• Telematics processors• Vision and RADAR based processors• Radar 24/77 GHz transceivers• Engine control and power management ICs• Ignition controllers and drivers• Analog and digital audio processors• Car network (wired and wireless) ICs• Braking/ABS drivers• Audio Amplifiers • Passive safety sensors and controllers• Car power management• Door module drivers• Internal external light controllers• Memory ICs• Operational Amplifiers• Protections

Super-integrated ASICs8/16/32-bit auto-grade microcontrollers

Vehicle dynamics controllersGPS/GNSS low-noise amplifiers & receivers

Secure modulesAnalog, digital and satellite tuners

DC, stepper and multiphase motor controllersHD imaging ICs

Auto MEMs, gyroscopes, accelerometersCar networking ICs

LED and active lighting driversCommunication transceivers

Alternator and Voltage regulatorsConfigurable Drivers and Switches

ProtectionsPower Discretes

(MOSFETs, IGBT’s, Diodes)

••••••••••••••

36

ADAS System ST ViewMultiple Technologies Leading to Enhanced Safety

ADAS

Signal

Processing

Positioning

Telematics

Connectivity

Vehicle networkHMI

Machine Vision system

RCCC

Vision

sensor

RCCC

Vision

sensor

Vision

Processor

Vision

Processor

Auto Braking

Curve WarningActive front lighting

Pedestrian detection

Short rangeRadar

Long rangeRadar

Radar system

FF Camera

Radar

Processing

Controller

Blind spot detection

Sensor Fusion Processor

Top View system

RGB

Vision

sensors

RGB

Vision

sensors

Image

Stitching

Processor

Image

Stitching

Processor

ISPISPTop View Cams

Driver Monitor

Radar Sensors

An

ten

na

s

MM

IC

An

ten

na

s

MM

IC

Sensor Fusion Box

Radar

MMIC

Radar

MMIC

LIDAR

Processor

LIDAR

Processor

LIDAR

Sensor

LIDAR

Sensor

Ultrasonic

Processor

Ultrasonic

Processor

ULtrasonic

Sensors

ULtrasonic

Sensors

Lidar system

USS system

Lidar SensorsLa

sers

SP

AD

Lase

rs

SP

AD

USS Sensors

TR

X-F

ilte

r

Front Facing and Surround View Cameras 37

ECU

ImagerBridge

Imager

Imager

Bridge

Bridge

ECU

Phy

Phy

Phy

Switch

Front Camera Top-View Camera

Imager

Bridge

Phy

Cabin Camera

MRC 40-80m 70°-120°EBA NCAP

FRC 250m 35°...

SVC-RVC 5-10m 180°...

…2016

1.3MPix

2.2MPix

2021 +….

38

Sampling

FeasibilityBSIFSI AEC-Q100-2

compliant

Automotive HDR Systems Roadmap4MPix

Q1 2018

VG6640

Ethernet RVCSmart RVCBasic SVCDashCam)

LCRVCLVDS-RVCMid-Range SVCHigh-End SVCIn-Cabin (DashCam)

VGx769ALight

VGx769AFull FFC-ADAS

LVDS-RVCMid-Range SVCHigh-End SVCIn-Cabin (DashCam)

VGx869A

3D Sensor

FFC-ADASLVDS-RVCMid-Range SVCHigh-End SVCIn-Cabin

7.5$

HDR HDR Global Shutter

1.6MPix

Q4 2018

1.6MPixIn-Cabin (DMC)

VG6640

2.5MPix

STV0991ISP

STV0971ISP

ISP

STV0971ISPISP

STV0971ISP

FFC-ADASLVDS-RVCMid-Range SVCHigh-End SVCIn-Cabin (DashCam)

ISP

VL55100.5MPix

Night Vision

2009….

SiGe

BiCMOS

Fully Integrated transceiver

SiGe BiCMOS technology

ST Automotive Radar

Solution for 24Ghz and 77Ghz

77 GHz

24GHz

Modular transceiver for multiple channels configurations

40M+ MMIC units shipped

World leading 24GHz supplier

LRR FMCW

4RX + 3TX

STRADA770

WLBGAWLBGA

BiCMOS9MW

SRR MRR LRR

`PPAPQ4’17

ST Automotive RadarRoadmap

Test Chips

TX+RX+MOD

WLBGA

BiCMOS9MW

Test Chips

TX+RX+MOD

WLBGA

BiCMOS9MW

24GHz 2st Gen

RX & TX

QFN

BiCMOS9

24GHz 3nd Gen

RX & TX

Fractional PLL

BiCMOS9

24GHz 4nd Gen

RX & TX

Fractional PLL

BiCMOS9

76-81GHz

STRADA260/A261

24GHz 2st Gen

2RX & 2TX

STRADA260/A261

QFN/BiCMOS9

STRADA262/A263

24GHz 3nd Gen

2RX & 2TX

STRADA262/A263

QFN/BiCMOS9

1st Gen TRX

1TX + 2RX

STRADA226

QFN/BiCMOS9

2nd Gen TRX

1TX + 3RX

STRADA431

QFN/BiCMOS9

Concept Proof

4RX + 3TX

Test Chip

WLBGA

BiCMOS9MW

FMCW

4RX + 3TX

STRADA772

WLBGAWLBGA

BiCMOS9MW

SRR

SRR MRR

SRR MRR SRR MRR

SRRSRR MRR

24GHz

MRR

24GHz 1st Gen

TX

STRADA240

QFN/BiCMOS9

SRR

STRADA264/A265

24GHz 4nd Gen

4RX & 2TX

STRADA264/A265

QFN/BiCMOS9

SRR MRR

Concept Proof

TX+RX+MOD

Test Chips

WLBGAWLBGA

BiCMOS9MW

LRR MRR

PPAPQ4’14

PPAPQ2’17

PAPPQ4’16

PPAPQ2’17

SOPQ3’10

SampleQ3’14

MRR

LRR

2016201520142013201220112009 2010 2017 2018 2019 2020 2021

2nd Gen FMCW

Multifuntion TRX

STRADA77C

WLBGAWLBGA

RF CMOS

SRR MRR

SOPQ3’11

3th Gen TRX

MultiFunction

STRADA432

QFN/BiCMOS9

SRR MRR

Concept

Concept

MRR

PMCW

TRX

STRADA790

WLBGAWLBGA

BiCMOS9MW

SRR MRRConcept

Agenda 41

40 min

Speaker

ST inADAS

Company Overview

ST in Automotive

ST in ADAS

Conclusion

Uwe Voelzke

Diverging Forces driving Automotive Electronics42

Exponential Complexity growth

Quality and Reliability on

harsher and harsher user profiles

Cost pressure

INNOVATION INNOVATION

Threads from Connectivity

So what’s the problem with all that…

The car is becoming an electronic technology hub… 43

Innovation driven by Automotive Mega Trends

� Zero casualties

� Active & Passive Safety

� ADAS

� ISO26262 compliancy

� Automated Drive

� Data Management

� Data Security

� …

� Mobility for Everyone

� Electrification of the Car

� 48V Board Net

� CO2 Reduction

� Entertainment Fun

� Connectivity

� Intelligent mobility

� …

AutonomousDriving

Conclusion 44

• Autonomous Driving needs multiple sensors• Camera• RADAR• CAR2X• LIDAR

• Cost, complexity and technology are changing the rules• The safety bar is getting high and mandates complex

techniques • Functional safety• Security• Virtualization

• New Ways of cooperation between suppliers at differentlevels are needed

Takeaways

• ST is a leader in the Automotive market

• ST is leader in ADAS technologies and in Infotainment, ready to enable autonomous driving and the pervasion of car connectivity

• Car connectivity and increased safety requirements are rapidly boosting the semiconductor content per car

45

Connected DrivingConnected Driving

Assisted DrivingAssisted Driving

Green and Safe DrivingGreen and Safe Driving