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HPC Products Group
ISR Proprietary3/24/2005
SprayCool Energy Smart Data Center Program
Jointly Funded by
OSD and Defense Microelectronics Activity
DoE and Pacific Northwest National Laboratory
2
HPC Products Group
ISR Proprietary3/24/2005
Overview
• Brief Company Overview• Brief Technology Overview• FAQ• Energy Smart Data Center Program Overview
• Energy Savings• Facility Savings
• Conclusion
3
HPC Products Group
ISR Proprietary3/24/2005
About ISR – Mission
“To enable our customers to compete and excel through our development and delivery of innovative
system solutions. Our customers choose us because we deliver the electronics industry’s
highest performing, most reliable and cost effectiveproducts and services.”
SprayCool is an Enabling TechnologySprayCool is an Enabling Technology
4
HPC Products Group
ISR Proprietary3/24/2005
About ISR – History & Products
1980s 1990s 2000s1980s 1990s 2000s
2002 – Won DOE contract for SprayCool demonstration with hybrid electric vehicles2003 – Won 1st contract for SprayCool for display systems2003 – Migrated successful EFV products to TOC environment2003 – Completed 1st surveillance system to locate and identify hostile snipers2004 – First flight demonstration in tactical aviation – Navy EA-6B2004 – Won DOE contract for datacenter demonstration
1998 – Signed contract to provide USMC a parallel path for their critical EFV C4I suite1998 – Delivered 1st SprayCool base station for telecom industry1999 – Began work on new solutions developed to support high altitude applications2001 – Navy contract for SprayCool power supplies2001 – Awarded SDD contract for EFV program2001 – Achieved ISO 9000 certification
Isothermal Systems Research founded with SBIR funding aimed at solving thermal issues with space-based weapons systems for the Star Wars Program
1988 – ISR begins operations1989 – Company moves to Seattle, WA1992 – ISR relocates to eastern Washington1994 – Delivered 1st server to NSA1997 – NSA supercomputer
Broad Industry Experience, Now Focusing on Computing Applications
Broad Industry Experience, Now Focusing on Computing Applications
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HPC Products Group
ISR Proprietary3/24/2005
Market Segments
Revolutionary electronics optimized for spray cooling
Computing/Telecom
Ability to use electronics in extreme temperature
environments, while saving weight
Isolation of custom and COTS electronics from harsh
environments
Avionics / SensorsGround Mobile
6
HPC Products Group
ISR Proprietary3/24/2005
Basic SprayCool Architectures
Spray COTS boards in sealed enclosure
Blade applications (VME, cPCI etc.)Heat exchanger can be remotely locatedSealed from all contaminatesLow-cost technology refresh
Global SprayCool Architecture
Modular SprayCool ArchitectureSpray only the high heat producing components locally
Motherboard applications (ATX etc.)Heat exchanger can be remotely locatedAllows sealed COTS enclosuresImproves performance of conduction cooled boards
Flexible, Scalable Solutions for Retrofit, Current and Future Capabilities Flexible, Scalable Solutions for Retrofit, Current and Future Capabilities
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HPC Products Group
ISR Proprietary3/24/2005
FAQs
• Fluids: • Safe, Inert, Non-Toxic, Non-Flammable Dielectric Liquid, No EPA
Regulations on Disposal or Transportation• ISR has Long-Term Fluid Compatibility Knowledge Database, No Issues
with Industry Standard Materials • Use Best Practices for Cable I/O Routing for Fluid I/O
• Hardware Applications: • Everything from Single Die to Total System Solutions• Processors, Power Electronics, RF Electronics, etc…
• Performance:• 500Watts/in2, Up to 2000Watts/cm2 (Most Computing Applications will
Never Exceed Several Hundred Watts/cm2)• Reliability:
• SprayCool Systems Have High Availability and Redundancy as Well as IMPI Capability
• SprayCool Technology Increases Electronics Reliability 3-4X• Cost:
• SprayCool System Save Money
8
HPC Products Group
ISR Proprietary3/24/2005
Problem Plaguing Data Centers
• Air Cooling Appears to be Low Cost but Has Many Secondary Cost Impacts• Poor Thermal Performance and Thermal Cycling
• Results in Low Reliability • Results in Reduced Performance (Processor Throttling)
• High Air Flow Requirements, Air Handling, Floor Tiles, Top Down,A/C – At or Near Limits• Results in Increased Vertical and Horizontal White Space• Results in Excessive Noise• Results in High Energy Costs• Results in High Construction Cost
9
HPC Products Group
ISR Proprietary3/24/2005
Program Overview
• Objective: • To Demonstrate TCO Savings when Applying SprayCool
Technology to High Performance Computing (Energy and Facility)
• Description: • Phase I: Convert a Rack of HP Air-Cooled rx2600 Servers and
Build MPB Prototype for Demonstration• Phase II: Install Rack of Globally SprayCool MPB and do
Feasibility Studies for Cooling Additional Items, e.g. Mass Data Storage, Power Distribution
• Phase III: Install Several Racks of SprayCool Processing Nodes, Employ Them, Demonstrate Mass Data Storage Cooling and Power Distribution
• Results:• Phase I: Initial Results Cooling Only Processors Yields a
COP Increase from 1.00 to 1.97• Phase II: Analysis shows a potential for a COP of 6.00• Phase III: Analysis shows potential for a COP as high as
13.00• Funding:
• Jointly Funded by DoE and DoD (PNNL and DMEA)
ISR Proprietary and Confidential
10
HPC Products Group
ISR Proprietary3/24/2005
Phase I Methodology
• Rack of Air-Cooled rx2600 Servers Baselined• Benchmark Baseline Testing Performed at PNNL and ISR
Integration Lab• Testing Performed on Single Server in Air then again after
Conversion to SprayCool – Ambient Temperatures 21C• Testing Performed on Rack of 18 Servers in Air then again after
Conversion to SprayCool – Ambient Temperatures 21C• Servers Run As-Received from HP• Processors fully loaded with 6 instances of BurnI2• Servers benchmarked using Linpack (1 and 1.5 hour, single
instance)• Rack Level System Due for Installation at PNNL in Q2
• System will be in Production for One Year for Testing and Evaluation
ISR Proprietary and Confidential
11
HPC Products Group
ISR Proprietary3/24/2005
Phase I Air-Cooled rx2600 Converted to SprayCool
SprayCool HP rx2600SprayCool HP rx2600
Air-Cooled HP rx2600Air-Cooled HP rx2600
ISR Proprietary and Confidential
12
HPC Products Group
ISR Proprietary3/24/2005
Phase I SprayCool Rack of HP rx2600s
Rack ManifoldRack Manifold
Fluid I/OTMFluid I/OTM
Service Loop Utilizes Cable Arm
Service Loop Utilizes Cable Arm
ISR Proprietary and Confidential
13
HPC Products Group
ISR Proprietary3/24/2005
Technology for the Future
The Future of High-PerformanceComputing
• 380 Watt Dual AMD Opteron6Ux160mm Board, 32Gb
• Advanced cooling combined with highly integrated 3D electronics
• Maximized memory density through stacking and advanced packaging
• Very Low Profile (VLP) DIMM leverages new DRAM module
• Increased performance• Provides higher reliability at lower
power • Reduced Size and Weight
The Future of High-PerformanceComputing
• 380 Watt Dual AMD Opteron6Ux160mm Board, 32Gb
• Advanced cooling combined with highly integrated 3D electronics
• Maximized memory density through stacking and advanced packaging
• Very Low Profile (VLP) DIMM leverages new DRAM module
• Increased performance• Provides higher reliability at lower
power • Reduced Size and Weight
14
HPC Products Group
ISR Proprietary3/24/2005
Technology for the Future
Rugged Transit Case
Rugged Transit Case
1U Appro Dual Opteron Server
1U Appro Dual Opteron Server
2U SprayCool Thermal Management Unitn+1 Redundant Pumps Liquid to Air or Liquid to Liquid
2U SprayCool Thermal Management Unitn+1 Redundant Pumps Liquid to Air or Liquid to Liquid1U Redundant 48 VDC
Power Supply1U Redundant 48 VDC
Power Supply
KVM Switch KVM Switch ISR SprayCool Chassis20 Slot cPCI 6U x 160mm 700 Watts per Slot48 VDC Power DistributionEnvironmental IsolationTessera Dual Opteron
MPB
ISR SprayCool Chassis20 Slot cPCI 6U x 160mm 700 Watts per Slot48 VDC Power DistributionEnvironmental IsolationTessera Dual Opteron
MPB
2U SCSI hard drive unit
2U SCSI hard drive unit
Quick Release Levers for Simple Service
Quick Release Levers for Simple Service
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HPC Products Group
ISR Proprietary3/24/2005
Saves Energy
05
1015202530354045505560657075808590
50 55 60 65 70 75 80 85 90 95
PROCESSOR POWER [W]
PRO
CES
SOR
TEM
PER
ATU
RE
[°C
]
AIR COOL 240CFM, 22C AIR
AIR COOL 125CFM, 22C AIR
GEN I BARE, 30C FLUID
GEN I LIDDED, 30C FLUID
GEN II LIDDED, 30C FLUID
• SprayCool Processors Running at 100% Performance • At Maximum Performance Processors only dray 62Watts
as opposed to 89Watts for Air Cooled running with equivalent performance
• SprayCool Processors Running at 100% Performance • At Maximum Performance Processors only dray 62Watts
as opposed to 89Watts for Air Cooled running with equivalent performance
16
HPC Products Group
ISR Proprietary3/24/2005
Saves Energy
(2)19,000 Watts
Fans
Server
TMU & Blower Chiller Cooling
Tower
CPUCPUs: ~ (1)156,000 W + 294,000 W
Outside
CPU
Dielectric Glycol Water
(6)36,000 Watts
Pumps
20,000
36,000Watts
Pumps
(7)72,000Watts
Compressor
(5)4,500 Watts
Pumps
Total for Cooling:
228,500
450,000 /
228,500 =
COP:
1.97
Total Energy: 678,500 Watts
(156 kW removed
from facility air)
(4)41,000 Watts
Fans
Lieberts
AirBypass
17
HPC Products Group
ISR Proprietary3/24/2005
Saves Facilities Cost
• Facilities Construction Costs for a Tier 3 Critical Data Center are ~$1500sqft
• Average Square Footage per 19” Rack is 50sqft (Include Rack Space, Cold and Hot Isles, Walk Space, Battery Back-up, etc…
• So Average Construction Cost per Rack is $75,000• So Average Cost per Rack Unit for a 44RU Rack is
Around $1700• SprayCool Technology Ensures NO Horizontal or Vertical
White Space is Required for Cooling Electronics, Reclaiming Facilities Construction Costs
• SprayCool Solutions Provide Immediate ROI Through Cost Avoidance for New Facilities Construction