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SPECIFICATION SIPLACE S-27 HMHigh Speed SMD Placement System
SPECIFICATION
S
1
Subject to changewithout notice.
Edition 11202-S-27-e
Order NoA10002-P141-T3-X-7600
Machine Description 3
Line Design 4
Placement Heads 5Head ModularityPlacement AccuracyComponent Range12-Nozzle Collect & Place Head for High Speed Component Placement6-Nozzle Collect & Place Head for High-Speed Large Component PlacementNozzle Changer
PCB Conveyor 10Single ConveyorDual ConveyorCeramic Substrate Centering (Option)PCB Bar Code for Production-Controlled Manufacturing (Option)
Component Supply 14Changeover TableTape FeederBulk Case FeederStick Magazine FeederGuard for Feeder LocationsMatrix Tray Changer (Option)Component Bar Code Scanner for Set-Up and Refill Check (Option)SIPLACE External Set-Up Station (Option)
Vision Sensor Technology 21PCB Vision ModulePCB Position RecognitionBad Board RecognitionPosition Recognition of FeederAlgorithms to determine the X-/Y-Position and the Rotation Angle of ComponentsStandard Component Vision Modules for 12- and 6-Nozzle Collect & Place HeadDCA-Vision Module for 12- and 6-Nozzle Collect & Place Head(Option)
Machine Criteria 26Placement AccuracyPlacement ReliabilityMapping (Option)
High Speed SMD Placement SystemSIPLACE S-27 HM
2
SIPLACE Software Architecture 29Line Programming SystemStation Computer
Technical Data 30Signal InterfacesConnectionsDimensions and Set-Up ConditionsTransporting and Commissioning
Possible Machine Configuration 35
High Speed SMD Placement SystemSIPLACE S-27 HM
SIPLACE S-27 HM
3
Description
The high-speed SMD placementsystem SIPLACE S-27 HM com-bines high placement speed withflexibility and accuracy. In contrastto classic chipshooters, a Collect& Place procedure is applied here.SIPLACE S-27 HM placement ma-chines are equipped with two X-/Y-main gantries. Each gantry featu-res a star-shaped Collect & Placeplacement head with either 12or 6 nozzles.
The placement heads alternatelypick up components from the sta-tionary component feeder and
place components on the PCBwhich is also motionless. This hasdistinct advantages:
§ Component tapes of all sizescan be replenished by splicing anew reel of components to theend of a depleting reel. This eli-minates machine stoppage dueto component replenishment.
§ Stationary, vibration-free feed-ers ensure a reliable pick-up ofeven the smallest components(e.g., 0201 and 0402 chips).
§ Thanks to the flexible Collect& Place Heads – whose ideal
nozzle set-up is automaticallyspecified – the path can beminimized and the sequence ofplacement optimally adjusted.
§ Populating a stationary PCBalso prevents components fromshifting during placement.
Speed coupled with economic ef-ficiency and set-up reliability is theSIPLACE S-27 HM recipe for suc-cess. The first components are al-ready being picked up while thePCB is being moved in. While oneCollect & Place Head is placingcomponents, the other one ispicking components up.
The product capability is enhancedby optional add-on features suchas component bar code scanner,automatic nozzle changer orchangeover tables which can beset up outside the machine andexchanged in a matter of minutes.
§ Additional changeover tablesenables the reduction of job set-up time increasing machineutilisation.
§ Dual Conveyor eliminates thenon-productive PCB loadingtimes thus increasing machinesoperating efficiency.
§ Automatic nozzle changers forboth changeover and storage ofnozzles.
§ PCB Barcode Reader used forproduct controlled productionchangeover.
§ Component Bar Code Scannerused for feeder set-up verifica-tion.
§ To achive the best placementquality we recommend to orderan 0201 enhance kit.
§ Ceramic Substrat Centering.
§ Matrix Tray Changer (MTC) forhigh speed IC-mounting.
Machine Description
Technical Data
Type of placement head 12-Nozzle Collect & Place Head and/or6-Nozzle Collect & Place Head
Number of gantries 2
Benchmark placement rate a 12/12 26,500 cph6/12 19,500 cph6/6 17,000 cph
Component Range 0.6 x 0.3 mm2 (0201) to 32 x 32 mm2
Max. placement accuracy(at 4 sigma) a
90 µm (12-Nozzle C & P Head)70 µm (6-Nozzle C & P Head)
PCB dimensions (L x W)
Single conveyor
Dual conveyor
50 x 50 mm2 to 495 x 460 mm2 /2" x 2" to 19.5" x 18"(optional up to 610 mm length)
50 x 50 mm2 to 495 x 216 mm2 /2" x 2" to 19.5" x 8.5"(with LBO optional up to 610 mm length)
Feeding capacity 118 tracks, 8 mm tape
Component table Quick changeover table with integrated wheels,reel holder and scrap bin, SIPLACE MTC
Types of Feeder modules Tapes, Bulk Cases, Stick Magazines, Surf Tapefeeders, application-specific OEM feeders
Operating system Microsoft Windows / RMOS
Power 2 kW
Compr. air requirements 5.5 - 10 bar, 400 Nl/min, tube ½"
Vacuum pump (Option) 5.5 - 10 bar, 200 Nl/min, tube ½"
a) As defined in Scope of Service and Delivery SIPLACE.
4
BareBoardLoader
Screen Printer
Reflow Oven
SIPLACE HS-60
SIPLACE S-27 HM
MagazineLoader
Example of a SIPLACE Placement Line
SIPLACE HS-60
Description
Flexibility and adaptability charac-terize the modular SIPLACE de-sign. Each production line can beindividually composed of similarand different modules.
Because of the small size and ro-bust construction of the SIPLACEmodules, they can be recombinedquickly and easily to accommodatechanges in production requirements.
The SIPLACE family of placementmachines offers the right productfor each purpose – from the veryhigh-speed placement systemSIPLACE HS-60 to the high-speedSMD placement system SIPLACES-27 HM and the flexible place-ment systems SIPLACE F5 HMand SIPLACE HF.
SIPLACE line-level optimizationtools generate single set-ups forsingle products or for severalproducts as well as several set-upsfor several products. Also, productprograms can be transferred fromline to line even when the machineconfigurations are different.
The SIPLACE SMT platform –always at the cutting edge oftechnical innovation – guaranteesmaximum productivity due to itsfully modular concept, which al-lows you to reconfigure your entirefactory in a matter of minutes.With SIPLACE, you benefit from aworldwide network of global sup-port and a compatibility acrossseveral machine generations,which means a long-termprotection of your investment.
Line Design
Technical Data
System SIPLACE SMD placement lines
Modules SIPLACE HS-60 / SIPLACE S-27 HM /SIPLACE F5 HM / SIPLACE HF
PCB conveyor Automatic width adjustment
PCB dimensions (L x W)
Single conveyor
Dual conveyor
50 x 50 mm2 to 508 x 460 mm2 /2" x 2" to 20" x 18"(optional up to 610 mm length)
50 x 50 mm2 to 460 x 216 mm2 /2" x 2" to 18" x 8.5"(optional up to 610 mm length)
Ceramic substrate dimensions(L x W)
50 x 50 mm2 to 101.6 x 177.8 mm2
2" x 2" to 4" x 7"
Placement speed Depends on layout of modules
Space required 4 m² / SIPLACE S & F modules6.8 m² / SIPLACE HS module6.0 m2 SIPLACE HF module
5
Description
Head Modularity allows the cus-tomer to specify the machine headconfiguration according to thecomponent range and output re-quirements. The 6-Nozzle and the12-Nozzle Collect & Place Headcan be interchanged to accommo-date changing manufacturing re-quirements.
The X/Y-gantry features twoplacement heads: the 6-Nozzle orthe 12-Nozzle high-speed Collect &Place Head.
The possible configuration choicesare:
§ Two 12-Nozzle Collect & PlaceHeads.
§ Two 6-Nozzle Collect & PlaceHeads.
§ One 6-Nozzle Collect & PlaceHead and one 12-NozzleCollect & Place Head.
Placement head configuration canalso be changed in the field by or-dering the respective head recon-figuration kit (head included) andnozzle changer.
Exchanging the Collect & PlaceHeads requires reconfiguration ofthe station software and recalibra-tion of the machine by trained per-sonnel. Also – if used – the auto-matic nozzle changer has to bereplaced to match the head used.The reconfiguration will take about8 hours with a trained servicetechnician.
Changing a placement head andreconfiguring a SIPLACE machinewhen and where required allowsthe customer to benefit from theflexibility of different placementheads without having to invest inseveral SIPLACE machines.
Placement Heads:Head Modularity
Placement Heads for SIPLACE S-27 HM
6-NozzleCollect & PlaceHead
12-NozzleCollect & Place
Head
Placement Principle of SIPLACE S-27 HM
À 6-Nozzle or 12-Nozzle Collect & Place HeadÁ X-/Y-Gantry System Fixed Component Supplyà Fixed PCB
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Placement Heads:Placement AccuracyComponent Range
Placement Accuracy a
Placement Head
Placement Accuracy
12-NozzleCollect & Place Head
12-NozzleCollect & Place Headwith DCA (Option)
6-NozzleCollect & Place Head
6-NozzleCollect & Place Headwith DCA (Option)
X/Y Accuracy ± 67.5 µm ± 67.5 µm ± 52.5 µm ± 52.5 µm3Sigma Rot.-Accuracy ± 0.525° ± 0.525° ± 0.225° ± 0.225°
X/Y Accuracy ± 90.0 µm ± 90.0 µm ± 70.0 µm b ± 70.0 µm b4
Sigma Rot.-Accuracy ± 0.700° ± 0.700° ± 0.400° ± 0.400°
X/Y Accuracy ± 135.0 µm ± 135.0 µm ± 105.0 µm ± 105.0 µm6Sigma Rot.-Accuracy ± 1.050° ± 1.050° ± 0.450° ± 0.450°
a) As defined in Scope of Service and Delivery SIPLACE.b) When SIPLACE S-27 HM is equipped with two 6-Nozzle Collect & Place Heads only one can reach 70.0 µm, the second reaches 80.0 µm.
Component Range
12-NozzleCollect & Place Head
12-NozzleCollect & Place Headwith DCA Option)
6-NozzleCollect & Place Head
6-NozzleCollect & Place Headwith DCA (Option)
Component size0.6 x 0.3 mm2 c
to18.7 x 18.7 mm2
0.6 x 0.3 mm2 c
to13 x 13 mm2
1.6 x 0.8 mm2
to32 x 32 mm2
1.6 x 0.8 mm2
to13 x 13 mm2
Max. component height 6 mm 6 mm 8.5 mm 8.5 mm
Max. component weight 2 gr 2 gr 5 gr 5 gr
Placement force 2.4 - 5.0 N 2.4 - 5.0 N 2.4 - 5.0 N 2.4 - 5.0 N
Performance See table on page 3 See table on page 3 See table on page 3 See table on page 3
Min. pitch lead / bump d 500 / 350 µm 400 / 200 µm 500 / 560 µm 400 / 200 µm
Min. ball / bump diam. d 200 µm 110 µm 320 µm 110 µm
c) 0201 (recommended to order the special 0201-kit).d) Depends also on specification of components (quality, vision...)
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12-Nozzle Collect & Place Head for High Speed Placement
Component Pick-Up/Placement
SegmentRemovalPoint
Turning tothe PlacementPosition
ComponentVision
Description
The 12-Nozzle placement headoperates on the Collect & Placeprinciple. In contrast to classic chipshooters, the 12 vacuum nozzlesof the SIPLACE Collect & Placehead rotate around a horizontalaxis. This does not only savespace:
Due to the small diameter com-pared to chip shooters, the cen-trifugal forces are significantlylower. The results are high-speed,reliable placement and the samecycle time for all components.
Components are picked up andplaced reliably with the aid of vac-uum followed by a gentle air kiss.A number of vacuum tests moni-tors if the component has beenpicked up and placed accurately.
Various control and self-learningfunctions further enhance the de-pendability of the system:
§ The optical recognition of feederpositions records the exact posi-tion of the feeder table.
§ A camera on the placement head(component vision module) de-termines the exact position ofeach component on the nozzle.
§ For every feeder the pick-upoffsets are averaged over thelast ten pick-ups. This enablesthe head to dial-in on the pre-cise pick point for each compo-nent.
§ In addition, the package form isalso checked. If the actual geo-metric dimensions of the com-ponent do not correspond tothose programmed, the compo-nent is rejected.
§ Components rejected by the vi-sion system are dumped into abin, reject feeder or matrix tray.Any rejected component getsautomatically placed during arepair run.
§ Warpage of the PCB is accom-modated by sensor stop acti-vated z-axis placement. The sys-tem also keeps the last tenpositions of the z-axis at com-ponent placement and uses theaverage of these values to im-prove the drive down and placespeed of the cycle.
§ To check very small compo-nents, such as 0201, it is helpfulto use a component sensor.This infra-red sensor checks thepresence of components beforepick-up and placement, ensuringreliable handling of even thesmallest components.
Placement Heads:12-Nozzle Collect & Place Head for High SpeedComponent Placement
Technical Data
Stroke of Z-axis max. 16 mm
Programmable placement force 2.4 to 5.0 N
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Description
The 6-Nozzle placement headoperates on the Collect & Placeprinciple.
The cycle time of the 6-NozzleCollect & Place Head – and thusthe real achievable performance– depends on the dimensions andthe number of leads / bumps ofthe component.
Mechanically and electrically, the6-Nozzle Collect & Place Head isstructurally very similar to the 12-Nozzle Collect & Place Head.
Placement Heads:6-Nozzle Collect & Place Head for High-SpeedLarge Component Placement
6-Nozzle Collect & Place Head for High Speed Placement oflarge components
OpticalCentering
ComponentTurning
ComponentRejection
SegmentRemoval Point
Technical Data
Stroke of Z-axis max. 16 mm
Programmable placement force 2.4 to 5.0 N
9
Description
A nozzle changer corresponding tothe Collect & Place Head in usecan be installed to the left of thePCB conveyor with no loss offeeder capacity. It will change thenozzle set-up of the placementhead quickly and reliably for thespecific nozzle configuration validto a job. Damaged or faulty nozzlescan be exchanged via the menufunction on the station computer.
Placement Heads:Nozzle Changer
Technical Data
12-Nozzle Collect & Place Head
Type of nozzle All standard nozzles of nozzle series 7xx/9xx(special nozzles must be tested individually)
Capacity 8 magazines, each with 12 nozzles of onenozzle type
Nozzle changing times About 2 s per nozzle
6-Nozzle Collect & Place Head
Type of nozzle All standard nozzles of nozzle series 7xx and 8xx(special nozzles must be tested individually)
Capacity 5 magazines, each with 6 nozzles of one nozzleseries
Nozzle changing times About 2 s per nozzle
Position of Nozzle Changers
ComponentFeeders forCollect & PlaceHeads
PCB
Nozzle Changer for 12-Nozzle Collect & Place Head(7 Magazines, each with 12 Nozzles, Option)
and/or
Nozzle Changer for 6-Nozzle Collect & Place Head(5 Magazines, each with 6 Nozzles, Option)
ComponentFeeders forCollect & PlaceHeads
10
PCB
Axle
Conveyorbelt
Clamp
Description
On SIPLACE S-27 HM the in-lineconveyor system guarantees aquick adjustment to new PCBwidths. The change is made eitherat the station computer using themenu function or from the linecomputer via the automatic widthadjustment unit.
The PCB is clamped from thebottom to the top side of theconveyor. This offers severaladvantages:
§ Higher real placement rate
§ Robust PCB recognition (camerafocus point)
§ Shorter PCB change time
§ Easier change of fixed conveyoredge right/left also in field
§ Quicker learning function, as thePCB height does not effect theZ-stroke, resulting in higherplacement rates
The conveyor can be ordered witha fixed rail on right or left. As stan-dard the SIPLACE placement sys-tems are available with a singleconveyor system.
PCB Conveyor:Single Conveyor
Technical Data
PCB dimensions See table on page 3
PCB thickness 0.5 to 4.5 mm
Max. PCB weight 3 kg
Max. PCB warpage Top: 4.5 mm - PCB thicknessBottom: 0.5 mm + PCB thickness
Free space on PCB bottom side Standard: 25 mm,Option: max. 40 mm
PCB conveyor height 830 ± 15 mm (Standard)900 ± 15 mm (Option)930 ± 15 mm (Option)950 ± 15 mm (Option) SMEMA
Fixed conveyor edge Right (standard), left (option)
Type of interface Siemens (standard); SMEMA (option)
Component-free PCBhandling edge 3 mm
PCB loading time 2.5 s
PCB Conveyor
PCBTransport Direction
PCB Clamping
11
PCBTransport Direction
Description
Thanks to reduced non-productivetimes the dual PCB conveyor cansubstantially increase the through-put, depending on the program. Itmakes it possible to transport twoPCBs through the machine.
Asynchronous transport
A PCB is moved into the machinein “slack time” while the otherPCB is being populated. The non-productive time caused by thePCB transport is completely elimi-nated. The increase in placementspeed reaches 30%, dependingon the components placed onthe PCB.
Synchronous transport
Two PCBs are populated simulta-nously. The real placement ratecan be increased, especially whenboards with only a few compo-nents are handled.
The conveyor is already preparedfor Flexible Dual Conveyor mode,which allows the handling of PCBswith a maximum width of 380 mm.
PCB Conveyor:Dual Conveyor
Technical Data
PCB dimensions See table on page 3
Fixed conveyor edge Right (standard), left (option)
Asynchronous and Synchronous Transport on Dual Conveyor
Transport mode Asynchronous Synchronous
View
Placement programper conveyor
same or different same or different
PCB widthper conveyor
same same or different
Ink spot recognition possible not possible
Automatic width adjustment possible not possible
Dual Conveyor with Asynchronous Transport Flexible Dual Conveyor
Modus 2: Single Conveyor
Modus 1: Dual Conveyor
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Description
Like the PCB vision module, opti-cal centering of ceramic substrateis conducted with the aid of refer-ence marks (fiducials). Dependingon the contrast ratio the machineactivates a standard lighting or theoblique lighting.
§ On ceramic and CM blue light.
§ On flexible PCBs using visionmodule without IF-filter infraredlight.
PCB Conveyor:Ceramic Substrate Centering (Option)
Technical Data
Substrate dimensions 50 x 50 mm2 to 101.6 x 177.8 mm2 /2" x 2" to 4" x 7"
Substrate thickness 0.5 to 4.5 mm
Substrate model Unscribed (no difficulty)Scribed (after test)
Contact in conveyor 2.5 mm
Substrate bottom clearance 12 mm
Compressed air connection 5.5 bar
Optical Centering via PCB Cameraand Mechanical Fixation
FixedTransportSide
Stopper
CeramicSubstrate
X-Centering
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Restrictions for Bar Code Reading of PCB Sizes 460 x 460 mm2
Description
The SIPLACE PCB bar code scan-ner supports the flexible produc-tion of SMD products and en-hances placement reliability. Itrecognizes all code types in gen-eral use for industrial applications.
The laser scanner reads the barcode label on the top and/or bot-tom of each PCB moving duringtransport. On the basis of the barcode information the line computerautomatically selects the correctplacement program from the pre-viously prepared bar code assign-ment list and sends it to the sta-tion. This procedure is performedin slack time while a PCB alreadyin the machine is being populated.If a number of PCBs with thesame bar code are moved in oneafter the other, the program is onlytransferred the first time. The fol-lowing preconditions apply for allproducts which are to be manufac-tured with the aid of the PCB barcode:
§ identical component set-up atthe individual machines in theline
§ all PCBs of same width.
The bar code filter can be utilized,if only certain information con-tained in the bar code is relevant.
PCB Conveyor:PCB Bar Code for Production-Controlled Manufacturing (Option)
Technical Data
Bar-code-free PCB edge 3 mm on left and right parallel to PCBtransport direction (the additional restric-tions shown in figure at the bottom applyfor scanning the bar code from above)
Label dimensions Stroke width: W: 0.19 < W ≤ 0.3 mm(corresponds to high + medium density)Stroke length: ≥ 4 mm a
Length of scanning window: ≤ 90 mm
Label alignment on PCB b Parallel or at right angles to the PCBtransport direction, preferably next tofixed conveyor side
Recommended label colors(contrast ratio > 70%as per DIN 66236)
Color coding: black, dark green or darkblueBackground: white, beige, yellow, orange
Code types Code 39, Code 128 / EAN 128,Codabar, 2/5 IATA 2/5 industrial,2/5 interleaved, UPC, EAN,Pharma Code, EAN Addendum(more upon request)
Complete bar code Max. 25 charactersDefinition of a bar code filter possible
Safety of the laser scanner Laser diode 670 nm (red) / 1 mWLaser protection class 2, degree ofprotection IP65
Station and line software from Version 502.xxx
Scan-in/analysis time Slack time (T ≤ 1 s), as parallel to theplacement of preceding PCB
a) This value can only be met if the bar code label on the PCB moves through the bar code scanner at right angles to the machine’s direction of transport.b) Depending on where the bar code label is located on the PCB, the position of the bar code scanner can be easily adjusted in the input conveyor belt.
460 46018.5 3
118
23
8 3
restricted restricted
PCBTransportDirection
46
0
46
0
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Description
Each side of the machine isequipped with a changeover table.As option, a MTC with a narrowcomponent table can be placed.
The component feeders are sta-tionary during the placement proc-ess, therefore it is possible to refillcomponents or splice tapes with-out stopping the machine.
Either individual feeders or the en-tire changeover table can be ex-changed during changeover.
Use of component bar codes withthe aid of an optional componentbar code scanner guarantees thecorrect assignment of the compo-nent to the track.
To make full use of the advantagesof the component changeover ta-ble, the entire set-up including thecheck can also be conducted out-side the machine at the optionalSIPLACE set-up station. Thechangeover tables are equippedwith rollers and have an integratedpneumatic lifting device, eliminat-ing the need for a lifting device.Exchanging the tables takes lessthan 2 minutes per module.
Component Supply:Changeover Table
Technical Data
Insert (exchangeable) In all SIPLACE placement modules
Feeder locations 59 x 8 mm tracks per table,118 x 8 mm tracks per machine
Feeder modules SIPLACE feeders for tapes,stick magazines, Bulk Cases
Accessories Tape container, waste container,empty tape cutter
Splicing Tool
Mobile Changeover Table
Feeder Table
Centering PositionCompressed Air
Feeder Connection
Reel Container
Reject Bin
Exchange of a Feeder Changeover Table
SIPLACE Station
MobileChangeover
Table
15
Description
The tape reels of the feeder mod-ules are housed in the tape con-tainer of the component change-over table. A cutter automaticallychops up empty tape coming outof the tape container.
Feeders used on SIPLACE are dis-tinguished by a short cycle timeand a high-precision pick-up posi-tion. Even product diversity andsmall batch sizes can be handledeasily since the feeder set-up canbe changed quickly.
The increment of the tape cycle isjust as variable as the use of tapematerials. Thanks to the generalpurpose tape feeding moduleswhich are equally suitable for pa-per and blister tapes, a small rangeof module types will be sufficient.Activated by a signal from thecomponent table, the modulescontrol the entire feeder sequencethemselves, including the auto-matic take-up of the strips.
The S Feeders series featureshorter cycle times and they canhandle tapes with 2 mm grids(8 mm S). 8 mm S and12/16 mm S are equipped withcomponent cover.
The feeders can be used in otherSIPLACE machines as well.
Component Supply:Tape Feeder
Technical Data
Packaging Model Feederlocations
Transportdistance
Max. Heightof component
Paper andblister tapes
2 x 8 mm S a
3 x 8 mm S3 x 8 mm S b
12/16 mm S
1111
2 or 4 mm2 or 4 mm 2 mm4 - 12 mm c
2.5 mm2.5 mm0.7 mm14 mm
Blister tape 24/32 mm S 1.5 4 - 32 mm c 14 mm
Tape reels Ø 7" to 19" (178 - 475 mm)
Feeder cycle S-feeder to 20 mm transport distance < 150 ms
a) Fiducial for recognition of position of feeders;b) only for 0201 and 0402;c) adjustable in increments of 4 mm.
Tape Feeder Modules S
24 / 32 mm S
12 / 16 mm S
3 x 8 mm S
2 x 8 mm S
16
Description
The SIPLACE Bulk Case feederwith 2 tracks is used to handlecomponents packaged in standardbulk containers. It transports rec-tangular and cylindrical passivecomponents to the pick up area ofthe machine. To replenish thesupply, the Bulk Cases are re-moved and replaced outside themachine eliminating stoppages forreplenishment.
Essentially, this feeder moduleconsists of a base which holds 2feeder rails. The components areseparated and transported throughthe feeder rail via compressed air.
The principle of stationary compo-nent tables has been tried andtested specifically with Bulk Casecomponents. Vibrations, whichdeveloped when other placementmethods are used may causewear to the components compro-mising quality and reliability of thecomponents.
The stationary component tablealso brings decisive advantages forstick magazines. The general pur-pose vibratory stick feeder can berefilled during the placement proc-ess.
The feeders can be used in otherSIPLACE machines as well.
Component Supply:Bulk Case FeederStick Magazine Feeder
Technical Data
Bulk Case feeder a
Type of packagingBulk Case
Feeder rails for Chip 0402 component height 0.35 mmChip 0402 component height 0.50 mmChip 0603 component height 0.45 mmChip 0603 component height 0.80 mmChip 0805 component height 0.45 mmChip 0805 component height 0.60 mmChip 0805 component height 0.85 mmChip 0805 component height 1.25 mmMini-Melf
Feeder location 1 feeder location for 2 differentcomponent types
Stick magazine feeder Type III With control electronics
Number and width of tracks 3 x 9.5 mm2 x 15 mm1 x > 15 mm1 x 30 mm
Feeder location 1
a) Fiducial to recognize position of feeder.
Bulk Case Feeder and Stick Feeders
Bulk Case Feeder
Stick FeederType III
17
Description
Some local safety requirementsdictate that all feeder locationsmust be equipped with feeders.If the feeder set-up does not fill allfeeder locations, guards may beused in place of the modules.
SAFETYWARNING
Component Supply:Guard for Feeder Locations
The following guard-variants can be used:
1 SIPLACE guard for 1 location
2 SIPLACE guard for 6 - 10 locations
3 SIPLACE guard for 11 - 20 locations
Various Guards for Feeder Locations
32
1
18
Description
For high-volume production envi-ronments requiring a wide rangeof components, the use of aSIPLACE Matrix Tray Changer ishighly recommended. The MatrixTray Changer is a high-speed, high-capacity component delivery sys-tem for SIPLACE S-27 HM.
The SIPLACE S-27 HM can beequipped with up to two MatrixTray Changers, one on each side.When high-volume production re-quirements include larger or tray-type components, the SIPLACEMTC is the best solution.
Technology
§ Two independent tray carriers,each with a JEDEC tray capacity
§ Each tray carrier is equippedwith a separate drive system
§ Set-up of the MTC is carried outin accordance with the existingSIPLACE optimization routine
§ The carrier is moved to the levelof the tray to be accessed, thenthe tray is moved precisely tothe access area for pick-up bythe placement head
§ A separate control unit is con-nected via interface cable
§ Operator information is availablevia SIPLACE station computer
§ Easy handling due to removablewaffle pack carriers
§ Large storage capacity andmultiple component set-uppossibilities
§ When a waffle pack tray is de-pleted, an alternate tray can beaccessed
§ Quick changeover of wafflepack tray magazines containingup to 10 waffle pack trays
§ External set-up is possible
Component Supply:Matrix Tray Changer (Option)
Technical Data
Dimensions (L x W x H)
of Matrix Tray Changer (MTC)
of cassette
of Waffle Pack Tray Carrier (WPTC)
of JEDEC tray
1,350 mm x 775 mm x 1,499 mm
354.1 mm x 154.8 mm x 131 mm
371 mm x 146 mm x 410.1 mm
320 mm x 135 mm
Stroke vertical (betweenWPTC 1 and WPTC 40)
502.5 mm
Stroke horizontal (betweenreference and component position)
approx. 640 mm
Spacing between levels 11 mm
Spacing between cassettes 134.5 mm
Storage capacity 80 WPTCs
Changeover time (over 5 levels) < 2 s
Weight of MTC
basic configuration
partially equipped
fully equipped
500 kg incl. cassettes and WPTCs
approx. 532 kg incl. components
600 kg incl. tapes and feeders
Weight of moving mass (equipped) 43.5 kg per tower
Weight of cassette approx.7.5 kg
Max. floor load fully equipped
per foot
per castor
2.78 kg/cm2
4.01 kg/cm2
Min. component size (L x W) 5 mm x 5 mm
Max. component height 13.5 mm a
Max. noise generation 80 dBA
a) When using components higher than 7.62 mm only every other tray can be used.
Electrical Connection (separate from machine power connection)
Frequency 50 Hz / 60 Hz
Phases 1; 3
Voltage 230/400 V or 110/208 V (USA)
Rated current 2.7 A or 4.2 A (USA)
Fusing 3 x 16 A
Rated current at max. load 2 A
19
Description
The bar code scanner enables aquick and reliable check of com-ponent set-up and refill. The barcodes of the tracks and the loadedcomponents assigned to thetracks (bar code labels on tapes,Bulk Cases, etc.) are read in with ahand scanner. An audible and opti-cal signal acknowledges a suc-cessful reading operation. If the la-bel is damaged the bar code canbe entered at the keyboard.
The allocation of the componentsto their respective track is de-scribed in the set-up data. An errormessage is displayed if the datareceived from the bar code scan-ner does not conform to the set-updata.
If the set-up check is switched on,it becomes a mandatory step inthe set-up process. If it isswitched off the set-up check isoptional.
Component Supply:Component Bar Code Scanner for Set-Up and Refill Check(Option)
Technical Data
Connection Station computer
Data input Bar code scanner or keyboard
Number of characters Max. 40
Restrictions Bar codes beginning with number 1 or 2and with less than 5 characters
Number of bar codes Max. 6 per component
Number of filtersto extract relevant data Max. 1 per bar code
Preset code types Code 39 (standard or full ASCII),Code 2 from 5 interleaved and normal,Code 128, UPC/EAN/JAN codes(more on request)
ComponentControl
Set-Up File
Track Bar Code
ComponentBar Code
Scanner
The scanner checks the corresponding track andthe components
20
Description
The component changeover tablescan be set up and checked at anexternal SIPLACE set-up stationquickly and without machine idletime. The costs for production in-volving a wide variety of compo-nents are greatly reduced. Duringthe bar code check outside themachine, 10 minutes of machinestandstill are eliminated per set-upchange. All current data from up to4 lines are accessible over a link tothe line computer via a Local AreaNetwork (LAN).
In the case of the SIPLACE S-27HM a component changeover ta-ble is part of the standard equip-ment. Additional changeover ta-bles are required for optimal useof the set-up station.
Component Supply:SIPLACE External Set-Up Station (Option)
Technical Data
Operating system Windows NT 4.0
Set-up check Per bar code scanner
Component table change Time expanded: 2 min / table side
Example for SIPLACE Set-Up Station
Line
LAN
Line Computer
PC for External set-up
LAN Scanner
Serial Interface
Tape ReelwithBar Code
MobileChangeoverTableMobile
ChangeoverTables
21
Description
The SIPLACE S-27 HM has a num-ber of vision modules and a centralvision system to evaluate the re-corded image data ensuring highplacement accuracy.
At the machine´s X-gantry the PCBvision module is mounted. It isused to find the PCBs´ positioning-offsets within the conveyor sys-tem.
This vision module is also requiredto measure the machine originand/or the feeder positions on oneside of the table. It consists of asingle CCD camera with integratedlighting and optics.
The offsets in the position of thePCBs are determined with thehelp of at least two but generallythree reference fiducial marks onthe PCB. When the PCB arrives atthe placement area the positioningsystem with its PCB vision modulemoves to the programmed markposition.
Using the Geometrical Alignmentallows to choose predefined marksfrom a menu (e.g. cross, circle,square). The size of the mark isprogrammed at the Station Com-puter. From this time on form andsize of the mark is defined andknown.
With this data the PCB visionmodule is able to search and rec-ognize the mark at the predefinedposition on the PCB or ceramicsubstrate without further assis-tance. For this reason it placesseveral small evaluation windowsat the assumed border of themark. Within these evaluationwindows the vision system looksfor contrast transitions betweenbright and dark. After finding suchcontrasts the actual position of themark can be assigned by compari-sion with the predefined – andthus known – form and size.
Evaluation operations calculatepossible PCB offsets against givenvalues of X-, Y- and Theta-axis.
Saving the mark by teaching is notnecessary any more.
Additional functions of the PCBvision module are recognition ofthe position of the feeders andceramic substrate (optional) andrecording of the machine data in-cluding mapping.
In addition, the bad board recogni-tion unit handles “ink spots” withthe aid of the PCB vision module.
Vision Sensor Technology:PCB Vision Module
Technical Data
Reference marksLocal marks
Library memoryRecognition of bad boards
up to 3 (subpanels and multiple panels)up to 2 per component(may be of different type)up to 255 types of reference marksper subpanel
Image analysis Correlation principle (geometricalignment) based on gray-scale values
Lighting method Front lighting
Recognition time fiducial/bad board marks
0.4 s a
Camera’s field of view 5.7 x 5.7 mm
a) Software 502.xx required.
Geometrical Alignment
Camera’s field of view
Pixel
Ink spot, e.g. square
Evaluation window
22
Description
Different reference mark shapesprove to be optimal depending onthe condition of the surface.
Particularly advisable for bare cop-per surfaces with little oxidation isthe single cross. Maximum recog-nition reliability is achieved due tothe high information content. Rec-tangle, square and circle are less“informative” but save space, arerugged, and can even be usedwhen oxidation is at an advancedstage.
Advisable for tinned structures arecircle or square because in thiscase the ratio of the mark dimen-sions to the presolder thickness isparticularly favorable.
Vision Sensor Technology:PCB Position Recognition
Reference Mark Criteria
Locate 2 marksLocate 3 marks in addition
X-/Y-position, rotation angle, mean distortionShear, distortion in X- and Y-direction
Mark shapes Synthetic marks e.g., circle, cross, square,rectangle, rhombus, circular ring, squarering, octagonal ring (choose from menu)
Mark surface:CopperTin
Without oxidation and solder resistWarp ≤ 1/10 of structure width,both with good contrast to environment
Mark dimensionsCircleCross
Rectangle/squareRhombus
Diameter: 0.3 - 3 mmLength and width: 0.3 - 3 mmLine thickness: 0.1 - 1.5 mmEdge length: 0.3 - 3 mmTransversal length: 0.3 - 3 mm
Mark environment Clearance around reference mark notnecessary if there is no similar markstructure in the search area
Teach Synthetic Fiducial
Fiducial Editor
23
Description
In the cluster technology eachsubpanel is assigned an ink spot.If this is present during the meas-urement via the PCB vision mod-ule, the corresponding subpanel ispopulated. It is also possible to ac-complish the population of thesubpanel when the ink spot ismissing. With this function it ispossible to eliminate costs due tounnecessary population of faultysubpanels.
Global Ink Spot
Each bad board evaluation needstime, so naturally the consumedtime increases with the number ofsubpanels per PCB. Using a globalink spot can result in a significantreduction of these secondarytimes.
The PCB vision module searchesat positions taught before for thedefined fiducial. In case of recogni-tion there is no following evalua-tion of subpanels. The system al-lows the customer to choose alsothe opposite interpretation.
Position Recognition of Feeder
The pick-up position of the com-ponents can be determined pre-cisely with the aid of the positionrecognition of the feeder. It is acti-vated each time after a change offeeder or component table. Theoffset in position relative to thestored ideal position is determinedon the basis of fiducials on thefeeder modules using the PCB vi-sion module. This provides a veryhigh pick-up reliability even for thevery first component. This is par-ticularly important with small com-ponents.
Vision Sensor Technology:Bad Board RecognitionPosition Recognition of Feeder
Ink Spot Criteria
Evaluationmethod for fiducials for structures
brightness methodcontrast method
Shapes and sizes offiducials/structures for
brightness method
contrast method
square or circular formsedge length/diameter 0.3 - 5 mm
rectangular formsedge length 0.3 - 5 mm
Masking material mat dark (light-absorbing)not recommended: white or shiny
Ink spot recognition time 0.3 s for each method
24
Description
The component vision modulesperform a critical contribution toplacement accuracy and reliability.It dependably recognizes all pack-age forms (= geometric dimen-sions of the component) illumi-nated at various angles from anumber of planes. To illuminateeach component optimally, theluminosity of the individual planescan be adjusted individually in 256levels.
Aside from the dimension of theSMD component, the vision sys-tem determines the lead numberand pitch (lateral IC lead bend) aswell as the rotation angle and X-/Y-offset. Components which are notsuitable are rejected and automati-cally corrected in a repair cycle.Rotational and X-/Y-offsets are cor-rected at the turning station of theCollect & Place Head or via thegantry axes. A relevant X-/Y-pick-up offset is calculated from thepositions of a number of compo-nents from one track. This is fac-tored in accordance with the self-learning principle during the sub-sequent pick-up of components.
Prior to placement the requiredgeometrical dimensions of onecomponent type are entered intothe package form (GF) editor, cre-ating a synthetic model of theSMD module. This task is simpli-fied by the comprehensive on-lineinformation and Help system.Later the central SIPLACE visionsystem, to which all other visionmodules are connected, analyzesthe gray-scale picture of the com-ponent vision module. To this end,suitable algorithms are used forthe pertinent package type. Due tothe combination of algorithms, thevision system also functions relia-bly under the most difficult condi-tions, e.g., in the case of differentreflection behavior by the leads ordisruptive influences from the out-side.
The algorithms are used for allcomponent vision modules.
Vision Sensor Technology:Algorithms to determine the X-/Y-Position and theRotation Angle of Components
Algorithm Component Determined on the basis of
Size Driven Chip the component’s outline(profile/gradients)
Row Driven IC several component leads(correlation method)
Corner Driven IC all component leads(correlation method)
Lead Driven Complex IC each component connection(High-Accuracy-Lead-Extraction method)
Grid/Ball/Bump BGA, µBGA,Flip Chip
all defined balls and bumps(gradients/ball or bump centering)
25
Description
Standard Component VisionModule for 12- and 6-NozzleCollect & Place Head
The standard component visionmodule is directly integrated intothe Collect & Place Head. Whilethe component is cycling into thenext station of the Collect & PlaceHead, the recorded image isevaluated by the central vision sys-tem. The component rotation isthen corrected by the appropriateangle based on the position off-sets determined with vision in-spection.
DCA Vision Module for 12- and6-Nozzle Collect & Place Head
The DCA vision module was de-veloped specifically for secure,fast and reliable recognition of FlipChips and Bare Dies. But alsostandard SMDs can be handledwith this vision module including0201 capacitors and resistors.
The DCA vision module option of-fers the possibility to process withone machine SMDs, Flip Chips andBare Dies without problems, thusachieving a maximum of flexibility.
The DCA-Vision Module option re-places the Standard ComponentVision Module.
Vision Sensor Technology:Standard Component Vision Modules for 12- and 6-NozzleCollect & Place HeadDCA-Vision Module for 12- and 6-Nozzle Collect & Place Head(Option)Standard Component Vision Module for the 12-Nozzle C & P Head
Component size minimum 0.6 x 0.3 mm2 (0201) /maximum 18.7 x 18.7 mm2
Component range See table on page 6
Camera’s field of view 24 x 24 mm2
Illumination Front light(3 freely programmable planes)
Pixel size 50 µm
Standard Component Vision Module for the 6-Nozzle C & P Head
Component size minimum 0.6 x 0.3 mm2 (0201) /maximum 32 x 32 mm2
Component range See table on page 6
Camera’s field of view 39 x 39 mm2
Illumination Front light(2 freely programmable planes)
Pixel size 80 µm
DCA-Vision Module for 12- and 6-Nozzle C & P Head
Component size: minimum 0.6 x 0.3 mm2 (0201) /maximum 13 x 13 mm2
Component range Flip Chips, Bare Dies, Standard SMDs
Camera’s field of view 15.6 x 15.6 mm2
Illumination Front light(4 freely programmable planes)
Pixel size 27.5 µm
26
Description
Various factors contribute to theplacement accuracy of theSIPLACE S-27 HM machine, e.g.,the stationary PCB during theplacement process. As no accel-erations are acting on the placedcomponents, their position contin-ues unchanged. The PCB moves inand out at a coordinated speedwhich is automatically reduced justbefore the nominal position isreached.
A further guarantee for long-termhigh placement accuracy is theposition recognition of the axes ofthe gantry and placement head bymeans of optical scanning by in-cremental encoders. Revolvingstar and segments of the Collect& Place Head are positioned bymeans of high-resolution glass in-cremental panels. The X- and Y-axes are positioned with the helpof the metal scales on each gantryaxis.
To determine the placement accu-racy on SIPLACE machines, highlyprecision glass components withmounted structures are placed ona dimensionally accurate glassmapping plate. The results are sta-tistically evaluated and presentedas a Gaussian standard distribu-tion. In the case of the 6-NozzleCollect & Place Head at theSIPLACE S-27 HM the placementaccuracy is ± 70 µm at a statisticalreliability of 4 sigma. If the accu-racy value ± 70 µm is divided bythe sigma value 4, the result is thestandard deviation S of 1 sigma =± 17.5 µm (as defined in Scope ofService and Delivery SIPLACE).
A machine capability analysis isconducted for each machine ac-ceptance test.
Machine Criteria:Placement Accuracy
Technical Data Gantry
Drive Brushless AC TemperatureControlled Motor
Position measuring system(X/Y)
Linear scales
Resolution of X-/Y-axis 2.5 µm
Speed of X-axis max. 2.5 m/s
Speed of Y-axis max. 2.5 m/s
Placement Accuracy see table on page 6
Standard Deviation - dpm
-4σ -3σ -2σ σ x σ 2σ 3σ 4σ
2700 dpm
60 dpm
P Point of Inflection
27
Description
In addition to correct positioning,placement reliability is important.
On the SIPLACE S-27 HM this isensured through a number of con-trol functions, such as vacuumchecks and component visiontesting during the placement se-quence.
Out of tolerance components arerejected, placed on the repair listand automatically processed dur-ing a repair cycle. An offset in theposition of the PCB relative to theconveyor system (PCB vision) andan offset of the X-axis, Y-axis or ro-tation of the component relative tothe midpoint of the nozzle (com-ponent vision) trigger an immedi-ate correction to ensure placementaccuracy.
Since the PCB is fixed, the com-ponents remain in the exact posi-tion they are placed. The stationarycomponent table ensures a pre-cise pick up. Options, such as thecomponent bar code scanner, canbe added to further enhance reli-ability.
Machine Criteria:Placement Reliability
Placement Principle of SIPLACE S-27 HM
À 6-Nozzle or 12-Nozzle Collect & Place HeadÁ X-/Y-Gantry System Fixed Component Supplyà Fixed PCB
28
Description
Despite the highly stable machineframe, slight distortions of the gan-try axes cannot always be avoided.With the aid of the mapping proc-ess the high placement accuracyof the machine is preservedthroughout its entire service life.
With this calibrating procedure,which can be conducted quicklyand easily, the PCB camera recog-nizes the fiducials on a mappingcalibration plate placed in its oper-ating area. Any distortions are re-vealed by comparing the nominalgrid on the glass plate with the ac-tual grid “drawn” by placementhead. These distortions are takeninto account during all further posi-tioning of X-/Y-axes and thus com-pensated for.
Machine Criteria:Mapping (Option)
Technical Data
Dimensions of the mappingtest plate
520 x 460 mm2 (for single conveyor)520 x 215 mm2 (for dual conveyor)
Number of measurementpoints
13 x 11 (standard resolution)26 x 21 (high resolution)
Ambient temperature duringcalibration + 20° ± 3°C
Components of the option Test plate (special glass)Calculation data (disk)Case for secure storage
Nominal Grid of Mapping Plate and Actual Grid withDeviations Due to Gantry
CorrectedPosition
29
Description
Line Programming System
The Line Programming Systemsprogram, optimize and controlcomplete SIPLACE placementlines. Consequently secondarytimes are reduced and maximumproductivity is guaranteed.
To meet these targets, twosoftware programs can be used:The Linux based LRL (Linux LineComputer), or SIPLACE Pro,which runs on standard PCwith Windows 2000.
Station Computer
The station computer in conjunc-tion with the machine controllerwith its realtime capability per-forms the following jobs: digitalcontrol of the machine gantrysystems; control of PCB inputand output and of PCB transport;monitoring functions, handling ofmalfunctions and output of errormessages (including Help system);ensuring the optimal quality of theplacement process.
For more details and information onfurther software options please seeSIPLACE Software Specification.
SIPLACE Software Architecture:Line Programming SystemStation Computer
Line Programming System
Station Computer
Functions
Line Programming System for
Software
Data PreparationOptimizationLine controlLine monitoringData management
LRL 503.02 (Linux) orSIPLACE Pro 1.4 (Windows 2000)
Station Computer for
Software
Machine controlMachine monitoringMachine operation
SW 503.01
30
1. After switching-on the station
Technical Data:Signal Interfaces
Signal Interface (20-Pin Ribbon Cable Connector)
to upstream station x3 to downstream station x4
Pin 13 GND 24 V Pin 10 Reserved
Pin 14 Arrived Pin 9 Reserved
Pin 15 Permission Pin 8 Reserved
Pin 19 Request Pin 4 +30 V DCunsaturated
Pin 20 GND 24 V for request / re-leased (contact separation)
Pin 5 GND 24 V
Pin 18 Released Pin 6 +24 V DC
Pin 12 Trouble signal loop Pin 11 Trouble signal loop
Pin 11 Pin 12
Pin 3 +24 V DC Pin 15 Permission
Pin 2 GND 24 V Pin 13 GND 24 V for per-mission / arrived(contact separation)
Pin 1 +30 V DC unsaturated Pin 14 Arrived
Pin 8 Reserved Pin 18 Released
Pin 9 Reserved Pin 19 Released
Pin 10 Reserved Pin 20 GND 24 V
Requirement
Delivery
Permission
Receival
Requirement
Delivery
Permission
Receival
Transport Direction
Conveyor Section 1PCBSensor
PCBSensor Conveyor Section 2
Station ntransportsPCBto delivery
Station n+1is ready toreceive PCBs
Conveyor 1 is On Conveyor 2 is Off
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Technical Data:Signal Interfaces
2. PCB handling has started
Conveyor 1 is On Conveyor 2 is On
Transport Direction
Conveyor Section 1 Conveyor Section 2
Station ndelivers PCBto station n+1
Station n+1waits for PCBfrom station n
Requirement
Delivery
Permission
Receival
Requirement
Delivery
Permission
Receival
PCBSensor
Transport Direction
Conveyor Section 1PCBSensor Conveyor Section 2
Station nhas justdelivered PCB
Station n+1waits for PCB fromstation n, but hasnot received it
Requirement
Delivery
Permission
Receival
Requirement
Delivery
Permission
Receival
PCBSensor
3. PCB is at delivery
Conveyor 1 is Off Conveyor 2 is On
Conveyor 1 is Off Conveyor 2 is On
Transport Direction
Conveyor Section 1PCBSensor Conveyor Section 2
Station n Station n+1has just receivedthe PCB
Requirement
Delivery
Permission
Receival
Requirement
Delivery
Permission
Receival
4. PCB transport is finished
A detailed documentation of thePCB transport signal interface isavailable on request.
32
Technical Data:Connections
Connections and Energy Required
Main voltage requirement 230/400 V∼ / 119/208 V∼ / 3 x 200 V∼± 5%, 50/60 Hz
Power 2 kW
Circuit breaker 3 x 16 A
Power outage max. 20 ms
Compressed air requirements 5.5 - 10 bar, 400 Nl/min, ½" tube
Vacuum pump (Option) 5.5 - 10 bar, 200 Nl/min, ½" tube
Compressed Air Specification
Particles: max. particle size by density,based on ISO/DIS 8573-1 Class
Particle sizeParticle density
0.1 µm0.1 mg/m³
Dew:Pressure dewpointDewpoint
Class 4+ 3° C
Oil:max. oil contentParticle density
Class 10.01 mg/m³
Pressure Supply
Power Supply: 3 m Cable with CEKON-Connector 3 x 16A
PCB TransportDirection
Signal Interface
LAN Supply
230 Inner Edge Fixed Side of Transport
33
Technical Data:Dimensions and Set-Up Conditions
Values
Length 1587 mm
Width of basic module 1921 mm
Width with two changeover tables 2641 mm
Height from transport to warning lamp 1120 mm
Weight of basic module 1500 kg
Weight with two changeover tables 2000 kg
Room temperature
Humidity
Between 15° and 35°C
30-80%, on average not higherthan 45%, so that no condensa-tion can ever form on the machine
Maximum noise development 74 dBA
SIPLACE S-27 HM
1036
360
375
Height of PCB transport830 ± 15 mm (standard)900 ± 15 mm (option)930 ± 15 mm (option)950 ± 15 mm (option)SMEMA
Foot height 120 mm
1120
1587
725
7401921
2641
All Units in mm
Height of PCB transport
360
34
Description
Transporting
Use a fork lift with a lifting forceof 6 tons to move the SIPLACE S-27 HM placement machine. Forks2 m long are required for a packedmachine, 1.5 m for an unpackedone.
Pick the machine up with the forklift at the locations especially de-signed and identified as being forthis purpose.
When setting up the SIPLACE S-27 HM, make certain that the sur-face it is placed on possesses therequired load bearing capacity.
Commissioning
For commissioning, install the fol-lowing components which werenot premounted upon delivery:
§ Monitor
§ Keyboard
§ Warning lamp
§ Component changeover tables.
Technical Data:Transporting and Commissioning
Transport dimensions
Length with packingWidth with packingHeight with packing
2150 mm1850 mm1600 mm
Center of gravity (X,Y coordinates) 0 mm, 0 mm
Floor load (more details about floor characteristics on request)
Total weight of equipped machine 2 metric tons
Permissible surface load sub-floor(load per unit area on mounting feet)(based on assumed distribution ofmachine weight to three machine legsa)
9 kg/cm2
a) Worst case scenario; 4 legs per machine installed, area per leg: 104 cm2.
SIPLACE S-27 HM with Transportbox
Footprints
PCB Transport Direction
Dimension ofTransport Box
35
Left Side (Gantry 1) Right Side (Gantry 2)
6-Nozzle Collect & Place Head 12-Nozzle Collect & Place Head
Nozzle Changer
Changeover Table with20 feeder locations forTapes, Sticks and Bulk
Reject Bin
Reject Bin
Matrix TrayChanger
Changeover Table with9 feeder locations forTapes, Sticks and Bulk
Nozzle Changer
3-Section Conveyor with automaticwidth adjustment for PCBs from
50 x 50 mm2 up to 610 x 460 mm2
( 2" x 2" up to 24.5" x 18" )PCB TransportDirection
1.20 m
Possible Machine Configuration
Shunting Radius forChangeover Table
1.20 m
PCB Transport Direction
SMD Placement Systems from Siemens
Siemens DematicElectronic Assembly Systems Inc.3140 Northwoods Parkway, Suite 300Norcross, GA 30071, USATel.: +1 – 770 – 797 - 30 00Fax: +1 – 770 – 797 - 30 94e-mail: [email protected]
Siemens DematicShanghai, 20F Majesty Building, No. 138Pu Dong Avenue Shanghai P.R.China 200120Tel.: +86 – 21 – 58 87 – 30 30Fax: +86 – 21 – 58 87 – 61 00
Siemens Dematic AGElectronic Assembly Systems SD EA1Rupert-Mayer-Straße 44D-81359 MünchenTel. +49 – 89 - 208 00 – 276 00Fax +49 – 89 - 208 00 – 366 92e-mail: [email protected]
Siemens Dematic Pte. Ltd.Electronic Assembly Systems2, Kallang Sector, 4th FloorSingapore 349277Tel. +65 – 67 40 – 74 06Fax +65 – 67 40 – 74 12e-mail: [email protected]
The information in this specificationconsists only of general descriptionsand / or performance features, whichis not contractually binding.Any specific performance features/ capabilities will only be binding ifcontractually agreed.
Edition 1 1202-S27-eOrder No A10002-P141-T3-X-7600
Subject to changes without notice.
Siemens Dematic AGInternet: http://www.siplace.com
