SPECIALIZED COMPETENCES - Eurotronics · Due to continuous investment in developing world-class fine-line microvia ... solution for our customers helps to resolve early design issues,

Grote Hondstraat 32, B-2018 Antwerpen - [email protected]+32 3 281 1699

SPECIALIZED COMPETENCES

What are the core competences of Eurotronics?A lot of customers choose Eurotronics as a total solution provider for the entire printed circuit board production process. This allows them to gain time, cut costs and minimize risks.

How does Eurotronics stand out?In the more than twenty five years of its existence, Eurotronics has built up a broad range of knowledge and experience in the field of printed circuit board manufacturing. The advantage is that Eurotronics has established a long term representational relationship with one of the finest state-of-the-art manufacturing facilities, China Eagle Electronics, situated in China. Our multidisciplinary team of technical and commercial experts strives to quickly find the most creative and pragmatic solutions. Our goal is to always create an added value for your product by providing constant quality and delivery performance.

In which fields/markets is Eurotronics represented?Eurotronics has executed projects in, amongst others, the following fields/markets: Renewable energy, Electric Drive, Automotive, Medical field, Communication, Broadcast equipment, Satellite Navigation (for aviation, agriculture and container placement etc.), Sports and leisure.

How does the cooperation with Eurotronics work?Whether it concerns production, engineering or services, Eurotronics always creates a suitable addition to the existing customer capacity. Customers will submit the command and quality control over the total production process to Eurotronics because knowledge, experience and control sometimes have shortcomings internally.

What is our procedure?Eurotronics screens every project for feasibility, technical completeness/accuracy and manufacturability. (Design for Manufacturability) Where/if necessary, alternatives can be developed and discussed with the customer. Based on the final analyses, the production method is selected and our engineers execute a final check to eliminate possible discrepancies with the actual production process. Eurotronics is used to cooperating with product, purchasing, R&D and project managers as well as engineers and management, and has developed a reliable communication.

What is the lead time for production of a printed circuit board?This depends of course on many circumstances, such as the availability of the laminates and the complexity of the printed circuit board (for example the number of pressing cycles). On average, production and delivery of a batch of printed circuit boards will take from 2 to 6 weeks. Prototypes can be delivered to your warehouse from 10 working days. To manage all this properly, refinement of our logistical system is essential. Therefore, we have a thorough communication with our logistic services in Asia and Europe and they too are constantly being monitored and evaluated.

Which technologies does Eurotronics apply?For the production of your printed circuit boards, Eurotronics implements the most common as well as the most complex technologies: ‘Blind and Buried’ via technology, High Density Interconnect technology, Rigid Flex, Ultra Fine Line technology, Laser drilling, Controlled Impedance etc.

How are the manufacturing processes guaranteed?Eurotronics attaches great value to transparent and thorough production monitoring of the factory automation system, which enables us to closely follow-up each step in the production process. This is why we require strict compliance to the IPC criteria for base materials. Each outgoing batch is accompanied by a written quality report, based on the general IPC standards. Furthermore, your designs are protected by non-disclosure agreements. You can also rest assured the environment and the human rights are being respected.

How does Eurotronics guarantee the quality?The outgoing inspection at the factory is the incoming inspection for our customers. Eurotronics takes full responsibility for this and has guaranteed its quality by, amongst others, ISO 9001, ISO14001,UL ,IPC-TM-650 Class 2, IPC-2615 Class 2 for dimensions and tolerances, IPC-A-600 Class 2 for delivery and, at explicit request, we can even guarantee IPC Class 3 for qualification and performance, as well as for delivery.Our production facilities are certified with a green label and apply the latest directions on RoHS and REACH.

How far does the international experience of Eurotronics go?Eurotronics has customers in high technology niche markets throughout Europe, who distribute their products worldwide. By doing so, we have a lot of experience and knowledge of international guidelines and demands on the fields of transportation, packaging, production etc.

Which volumes can Eurotronics handle?The assignments Eurotronics executes vary in volume from a few prototypes to mass production.

Can Eurotronics also run/manage my stock?In addition to production, Eurotronics offers optimized services in the field of logistics, transportation and stock control.


MULTI LAYERS

Inner Layer

Outer Layer

Inner Layer

Outer Layer Partial hybrid + embedded copper coin

Inner Layer

Outer Layer

Press-fit copper coinEmbedded Capacitance

High Layer Count + HDI

High Layer Count + HDI + GF

Thermal Management

Hybrid Stack-up

Normal Tg

Middle Tg

High Tg

Halogen Free

Low Dk/Df

Stagged gold fingers

Eurotronics' technical and production capabilities have kept pace with the ever growing demands due to product design, processor speed requirements, component scaling, increased thermal performance... all pushing towards cutting edge Printed Circuit technologies.

Min. Thickness Core

201530

5.0mm

609.60mm x 685.80mm

3mil (76.20μm)

6Oz (210μm)

6Oz (210μm)

2.5mil (63.5μm)

2.7mil (68.50μm)

Max. Copper Thickness (depending on the line & space requirements)

Impedance Control Tolerance

Min. PTH (Mechanical) - Depending on Aspect Ratio

Max. Aspect Ratio (Mechanical Drill)

Min. Line Width

Max. Layer Count

Max. Finished Thickness

Max. Production Panel Size

2.5mil (63.5μm)

3mil (76.20μm)

7%

0.15mm

10:1

3mil (76.2μm)

1:1

Solder Mask Clearance +/-20μm

Solder Mask Registration 40μm

YES

Advanced YES

Embedded Copper Coin, Press-fit Copper Coin, Metal Base, Heavy Copper

YES (Rogers RO4000 series + FR4)

Min.Laser Drill Size

Max. Aspect Ratio (Laser Drill)

Surface Finishing ENIG (NiAu), OSP, ENIG+OSP, Immersion Tin, Immersion Silver, Lead Free HASL, HASL, Gold Finger Plating, Selective Hard Gold, Soft Gold, Flash Gold

3M:C-PLY14, 19C-PLY14;Faradflex:BC24, BC12TM;Dupont:HK4

Min. Line Space

Material*

KB6160A, S1141, NP-140

IT158, S1000, TU662, NP-155FTL,

IT180A, S1000-2, 370HR, 370Turbo, IS-FR406, NP-175FTL, TU768

IT140G, IT150G, R1566, MCL-BE-67G, S1155

RO4350B, RO3003, RO3006, N4000-13(SI), N4000-13EP(SI), ARLON TC350

*On request we can provide almost any type of special material on the market

General capabilities- Multilayer

Partial Hybrid +Embedded copper coin

Press-fit copper coin

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HIGH DENSITY INTERCONNECT (HDI)

Three step HDI

Copper Filling VOP + FVVOP Stack Via Design

Any Layer

Extensive Modular Edge PTH

Carbon Ink Technique

Embedded ESD

Middle Tg

High Tg

Halogen Free

RCC

ELIC structure

Due to continuous investment in developing world-class fine-line microvia technology, together with our partner manufacturing facility Eurotronics has become a well known microvia board provider. Our creativity, experience and commitment to provide a complete solution for our customers helps to resolve early design issues, shorten lead time, and provide a high quality cost effective product. Our HDI-substrates can be found mainly in applications where high reliability is of crucial importance.

+/-20μm

40μm

14 Layers

50.8μm

50.8μm

7%

50/228μm

0.1mm

0.8:1

10:1

0.35mm

+/-50μm

YES

YES

YES

IT158, EM825, S1000 H, TU662, NP-155FTL,

IT180A, S1000-2, S1170, EM320

EM825

LG LGF-2000G/LGF-2000GA LG LGF-2000/LGF-2000HF, MITSUI MR500, MATSUSHITA R-0880

Surface Finishing

Max. Layer Count


Min. Finished Thickness

Min. Thickness Core

201520

2.6mm

0.3mm

50μm

ENIG (NiAu), OSP, ENIG+OSP, Immersion Tin, Immersion Silver

YES

Advanced

Material

YES

YES

Min. Line Width

Min. Micro Via Design

Min. Line Space


Solder Mask Clearance

Solder Mask Registration

Min. Finished Through Via Size

Max. Aspect Ratio Laser Drill Via Hole

Max. Aspect Ratio PTH

ELIC Level

Min. BGA Pitch

Layer To Layer Registration Tolerance

General capabilities- HDI

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BACKPLANES & HIGH LAYER COUNT

Inner Layer

Outer Layer

Inner Layer

Outer Layer

Inner Layer

Outer Layer

Advanced Embedded Capacitance

Middle Tg

High Tg

Halogen Free

Low Dk/Df

Backplane 34 layers

Whether a customer needs passive, active or high-bandwidth backplanes,... We are dedicated to provide backplane and high layer count circuit solutions that deliver high-speed performance, value and reliability.

2015

6Oz (210μm)

2.5mil (63.5μm)

2.7mil (68.50μm)

2.5mil (63.5μm)

48

8.0mm

609.60mm x 914.40mm

3mil (76.20μm)

6Oz (210μm)

3mil (76.20μm)

7%

0.15mm

10:1

4mil (101,6μm)

1:1

IS415, N4000-13(SI), N4000-13EP(SI), FR408HR, Megtron4, Megtron6, T150D, IT150DA, IT200LK, RO4350B

Surface Finishing ENIG (NiAu), OSP, ENIG+OSP, Immersion Tin, Immersion Silver, Lead Free HASL, HASL, Gold Finger Plating, Selective Hard Gold, Soft Gold, Flash Gold

3M:C-PLY14, 19C-PLY14;Faradflex:BC24, BC12TM;Dupont:HK4

IT158, S1000-2, TU662, NP-155FTL

IT180A, S1000-2, 370HR, 370Turbo, IS-FR406, NP-175FTL, TU768

IT140G, IT150G, R1566, MCL-BE-67G, S1155

Min. Thickness Core

Max. Copper Thickness (depending on the line & space requirements)

Min. Line Width

Max. Layer Count


Max. Production Panel Size

Min. Line Space

Material


Min. PTH (Mechanical) - Depending on Aspect Ratio

Max. Aspect Ratio (Mechanical Drill)

Min.Laser Drill Size

Max. Aspect Ratio (Laser Drill)

General capabilities-Backplane&HLC

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FLEXIBLE & RIGID FLEX

Coverlay

Adhesive

FR4 (High Tg)

Shielding Film Arlon AD255A (Immersion Ag)Stiffener

PTFE

Standard Large

Panel Size 304.80mm x 500.38mm 500.38mm x 609.60mm

Active Area 279.40mm x 474.98mm 474.98mm x 584.20mm

Minimum Unit Size

Line

Spacing

Line

Spacing

7 Layer Rigid Flex with "Bikini Technology" and NiAu finish for Al wirebonding

Acrylic: Dupont FR, LF

Early involvement in the design stage of your flexible circuitry is crucial. We support our customers with the right selection of base materials and production methodes to maximize performance and durability with the most cost effective advantages. On special request, we can even provide an assembled end product!

2015

FCCL

Max. Layer Count 14

Adhesive: Dupont FP, LF

Acrylic: Dupont FR, LF

TUC TU-862, TU722; EMC EM-370(D), EMC EM285, ITEQ IT180A, Shengyi S1000-2

Adhesiveless: Dupont Pyralux AC,AP, AK; Doosan, Panasonic

FLEXIBLE PRINTED CIRUITS (FPC)

1.6mm

25μm (Standard); 12.5μm (Advanced)

1.5mil (38μm)

Min. Dielectric Thickness

Inner Layer**

Outer Layer***


1.5mil (38μm)

1.5mil (38μm)

1.5mil (38μm)

Normal Pre-Preg: TU-72P, TU-86P, E-37B(D), EM-285B, ITEQ, Shengyi

Arlon AD255A

Material

No/Low Flow Pre-Preg: TU-84P, Doosan, ITEQ, ShengyiPre-Preg

Tatsuta, Toyo

Panel Dimensions

6.35mm x 6.35mm

PI, FR4, Stainless steel, Aluminum, Ceramic


FLEXIBLE & RIGID FLEX

Line

Spacing

Line

Spacing

Dielectric Thickness

<2mil (50.8μm) Double sided flex + 6 layer rigid<24mil (609.6μm)

<63mil (1.6mm)

Outer Layer

Inner Layer

Inner Layer Anti-Pad

Blind & Buried Via's

Filled Micro Via's

POFV

ELIC Level

Back Drilling

RFPC with micro via technology

D+8 (tolerance depends on the design)

Solder Mask Dam

***Outer layer spacing depends on the actual design, via filling, track width

RIGID FLEX PRINTED CIRUITS (RFPC)Max. Layer Count 16

Max. Finished Thickness Standard 1.6mm; Advanced 2.4mm

Min. Dielectric Thickness 25μm (Standard); 12.5μm (Advanced)

Inner Layer**1.5mil (38μm)

1.5mil (38μm)

Design Symmetric/Asymmetric stack-up; 1-F-1; 2-F-2; 3-F-3, 0.4mm BGA,ELIC

Aspect Ratio (By drilled hole size)

**Applicable on 18μm base copper, without copper plating

10% (5% achievable after process tuning)

Standard: 6mil (152.4μm), Advanced 4mil (101.6μm) - Mechanincal Drilled

Standard: 3mil (76.20μm), Advanced 2mil (50.8μm)

Solder Mask Registration

Surface Finishing

12 layers

Micro Via Technology

Standard: 3mil (76.20μm), Advanced 2mil (50.8μm)


ENIG (NiAu), ENEPIG, OSP, ENIG+OSP, Immersion Silver, Gold Finger Plating, Selective Hard Gold

Outer Layer***2mil (50.8μm)

2mil (50.8μm)

Standard: 3mil (76.20μm), Advanced 2mil (50.8μm) - Laser Drilled

Standard: 8mil (203.2μm)), Advanced 6mil (152.4μm) - Mechanincal Drilled

Minimum Hole Size (FPC)

10:1 (Standard); 14:1 (Advanced)

Minimum Pad Size

8mil (203.2μm)

8mil (203.2μm)

14mil (355.6μm)

Solder mask, Resin, Copper

Documents

SPECIALIZED COMPETENCES - Eurotronics · Due to continuous investment in developing world-class fine-line microvia ... solution for our customers helps to resolve early design issues,