Upload
others
View
1
Download
0
Embed Size (px)
Citation preview
Space Coast Chapter Meeting held at Mack Technologies, FL
V O L U M E 5
I S S U E 2
I N S I D E T H I S I S S U E :
Chapter Mtg & Interview 1, 5
Technical Article 2-4
Meet an Officer 6
GLOBAL
PARTICIPATING
MEMBERS Henkel Electronic Materials LLC
The Space Coast Chapter of the
SMTA held a local meeting on
9-12-13. The topic was Ad-
vanced SMT Rework methods.
The meeting was graciously
held at Mack Technologies in
Melbourne Florida. Lunch, and
refreshments were served.
The meeting was attended by
29 guests and the three subject
matter experts; Mike Newman,
Todd DeZwarte, and Larry Hin-
kle. The audience was made up
of over 20 technology compa-
nies from the local chapter, in-
cluding Harris Corp., Rockwell
Collins, DRS, Mack Technolo-
gies, Test Medics and MC As-
sembly.
The meeting opened with Brad
Latraverse, A board member of
the SC SMTA, introducing the
panel of Subject matter experts.
An overhead presentation was
used to convey a collaboration
of specific topics and tech-
niques previously prepared by
the panel.
Each of the subject mater ex-
perts shared their experiences
and best practices, as Brad led the
panel through the topics. A few
minutes into the meeting the audi-
ence began to direct some of the
discussion by sharing their applica-
tions, challenges and experiences.
The conversations continued on for
the next 45 minutes as the panel
fielded more and more questions
from the audience. As the allotted
time began to run short, the meet-
ing was concluded with announce-
ments of upcoming SMTA local
and international events.
Space Coast SMTA conducts interview at Eastern Florida State College
As part of the ongoing effort to create a SMTA
local student chapter, Mark Leyden from R.S.
Hughes conducted an interview with Mark Ed-
wards, Adjunct Electronics Instructor
and Susie VanMeter, Director of Corp Services
& Workforce Training.
Susie and Mark, thank you for having me
this morning. So tell me how BCC, now East-
ern Florida State College, got started and
when did it recognize that there was a need
to train folks in the electronics industry?
Mark: I know from the very beginning they had
an electronics course for technicians and for
engineers. In the days of the Apollo program,
there was a need for people to be skilled and
have training in the do’s and don'ts's of working
around flight hardware; especially electronics.
The circuitry for aerospace had to be very pre-
cise and exact and reliable, highly reliable.
Maxwell King, the guy who started the college,
realized that there was a definite need here for
that.
Ok, so Aerospace really was the initial driver
for this college? Mark: I would say so. Susie:
The Space Tech Program was begun here and
we would train technicians to work on the rock-
ets and they would learn everything there was
to do. It turns out there are a lot of companies in
Brevard County that could use many of the
skills that these technicians learned, not just for
space. And that’s what carried a lot of them
from layoff to jobs. Transferable skills.
So where are we now?
Susie: EFSC has the highest graduation rate
among community colleges in Central Florida.
In 2010, the college reported over 25,000 stu-
dents enrolled for courses. It’s ranked 19th in
the 1,200 community colleges in the nation.
That is phenomenal.
What is EFSC doing to get that high a grad-
uation rate? Mark: Paying attention to the stu-
dents. There’s a lot of mentoring that goes on at
EFSC also. Susie: This college has always done
an outstanding job in advertising and being also
highly recognized in our training and skills
from everything from training through degrees.
CORPORATE MEMBERS
Continued on Page 5
AV Repair Concept 2 Market, Inc. Conelec of Florida, LLC Control Micro Systems, Inc. DiagnoSYS Systems, Inc. Florida MicroElectronics Harris Corporation Inovaxe Corporation Mack Technologies MC Assembly Mercury Marine EPM Rockwell Collins Semipack Services, Inc. SolTec Electronics Stanley Supply & Svces. STARboard TECHnology Symetrics Industries, LLC The Jefferson Project Tropical Stencil, Inc.
J A N U A R Y , 2 0 1 4
ELECTRONIC ASSEMBLY
CLEANING MATERIALS
Electronic assembly cleaning material
options cover three classes that in-
clude solvent, co-solvent, bi-solvent,
semi-aqueous, and aqueous composi-
tions. During the pre-ozone depletion
era, CFC-113 and rosin-based flux
compositions were the standard. In
today’s environment, the cleaning
agent of choice is selected based on
the soil to be cleaned, throughput,
readily-available cleaning equipment,
compatibility with materials of con-
struction, cost, and environmental
regulations. All cleaning material
types comprise strengths and weak-
nesses. In most cases, the application
drives the cleaning material type.
Best in Class Cleaning Agents
Electronic assembly cleaning materi-
als are designed to remove a broad
array of flux technologies including
organic acid, rosin, resin, and poly-
meric structures from mixed technolo-
gy circuit boards.
The building blocks (Figure 8) used to
formulate best in class cleaning agents
are solvency to dissolve resin struc-
tures; reactive agents to buffer and
saponify soils; wetting agents to lower
surface tension and improve penetra-
tion under low standoff components;
and minor ingredients to improve ma-
terials compatibility and control foam
propagation under high pressure.
Oxygenated organic materials dissolve
rosin and resin (solute) structures nat-
urally present in many flux types. The
interaction of resin/rosin with solvent(s)
increases the dissolution rate (Figure 9).
Solvents are selected on the basis of
“like dissolves like” commonly re-
ferred to as the solvated state, where-
by organic resin flux residues are dis-
solved by oxygenated solvent mole-
cules. Solvent dissolution is a kinetic
process and is quantified by its rate.
The rate of dissolution depends on the
solvent and solute, temperature,
impingement pressure, and interfacial
surface tension.
For electronic assembly defluxing, the
solvent materials interact with the
polar solvent, water. Dissolving the
flux residue involves different types of
intermolecular interaction: hydrogen
bonding, polarity and dispersive at-
tractions. The hydrogen bonding, ion-
dipole, and dipole-dipole interactions
occur from the water and water’s in-
teraction with oxygenated solvents
(Figure 10). The oxygenated solvents
interact with water to improve dissolu-
tion of organic acid ions necessary to
leave an ionically clean assembly.
For aqueous cleaning fluid designs,
mild alkalinity provides two im-
portant functions: 1. Improving the
cleaning rate and 2. Maintaining a
consistent pH by forming a strong
buffer. Rosin, commonly used in flux
compositions, is a solid form of resin
obtained from pine trees and some
other plants. To improve the cleaning
rate, alkaline materials are used to
react (saponify) with the rosin/resin
to increase the rate of
dissolution (Figure 11). Additionally,
the alkaline source is used to react
with a weak acid to form a buffer that
keeps the pH at a nearly constant val-
ue. An optimal pH range of 9-11 pre-
vents redeposition of flux soils and
ionic constituents onto the circuit
assembly after the cleaning process.
Wetting agents lower the surface ten-
sion of the cleaning fluid, by reducing
the droplet size, improving spreading,
and lowering the interfacial surface
tension. Surface active agents form
micelles that contain a lipophilic end
to dissolve oily soils and hydrophilic
ends to hydrogen bond with water.
Wetting agents reduce surface tension
of water by adsorbing at the liquid-
gas interface (Figure 12). These mate-
rials reduce the interfacial tension
between oil and water by adsorbing at
the liquid-liquid interface. When mi-
celles form in the cleaning solution,
their tails encapsulate an oil droplet,
and their ionic polar heads form an
outer shell that maintains favorable
contact with water. Wetting agents
improve penetration under the Z-axis
to remove flux residues under compo-
nents.
Strategies for Addressing White Residue
and Localized Contamination (Part 2)
P A G E 2
Continued on Page 3
By Mike Bixenman, Phil Zhang, Chris Shi
Figure 9: Like Dissolves Like
Figure 10: Solubility of the Flux Residue
Figure 11: Flux Dissolution Driven by Reactivity
for improved mechanical and chemi-
cal energy. The objective mechanical
cleaning systems is to reduce time by
using by maximizing the physical
energy delivered at the surface to be
cleaned.
Fluid management is critical in main-
taining an electronic assembly clean-
ing process. Individual module con-
tainment and specifically with the
wash chemistry is essential. Fluid de-
livery is critical for penetrating and
rapidly breaking the flux dam under
low standoff components. Air man-
agement is critical to reducing chemi-
cal odors in the workspace while min-
imizing the amount of wash fumes
exhausted from the machine. Fluid
storage is critical for long wash bath
life. Fluid control is critical in main-
taining the proper wash bath concen-
tration within the cleaning process
tolerance.
Cleaning equipment design issues in
any of these areas can and will upset
the cleaning process over time. Issues
such as high wash consumption, steam
out of the machine, foaming in the
wash and or rinse, exhaust losses, and
poor cleaning all result from an imbal-
ance caused by one or more of these
factors. Process issues may not show
up when the machine is initially
charged with cleaning chemistry and
started up, but slowly creep in over
time. Lack of process optimization
results in higher defect rates, which
typically render white residue for-
mation and unacceptable levels of
ionic residues on the surface and un-
der component gaps.
To improve cleaning under low stand-
off components, research data indi-
cates that fluid flow, pressure at the
board surface, directional forces, and
time in the wash improve the process
cleaning rate. The wash section of the
cleaning machine is highly important.
Research data findings indicate that
flux not adequately removed in the
wash will not be removed in the rinse
sections. Cleaning data studies show
that high levels of fluid across the
board surface decrease needed clean-
ing time. Directional forces that pro-
vide a 360° impingement pattern dur-
ing the wash exposure decreases time
in the wash. Maintaining pressure
with flow also decreases the amount
of time required in the wash section.
Wash impingement effects can be
generated using various nozzle and
pump technologies. To improve
cleaning efficacy, boards are initially
sprayed in the pre-wash section using
fan jets. The pre-wash zone brings the
circuit card up to process tempera-
ture, which starts the flux softening
process. In the wash section, nozzle
jets provide uniform wash coverage.
Board geometry, density, and compo-
nent types are impinged upon using a
combination of nozzle technologies
that provide various levels of fluid
flow, pressure at the board surface,
and directional forces. Printed circuit
boards with increased density and
component shadowing require a long-
er wash time to allow wash fluid to
penetrate blind gaps.
To remove all flux residues under
gaps less than 2 mils, time in the
wash and wash temperature are criti-
cal parameters. The wetting effects of
flux during the reflow soldering pro-
cess cause the flux to penetrate under
small component gaps and create a
flux dam (Figure 14). To break the
flux dam, the cleaning fluid and im-
pingement energy must first dissolve
the residue to create an opening for
the wash fluid to flow under the com-
ponent. Hard flux residues take long-
er time to dissolve than do soft flux
residues, which increases wash com-
plexity. The static cleaning rate
(dissolution in the absence of im-
pingement energy) of the wash chem-
istry is driven by the cleaning materi-
al compatibility with flux soil, rate of
dissolving the flux soil, concentra-
tion, part fixturing, and wash temper-
ature effects. The cleaning material
static cleaning rate may vary on dif-
ferent flux residues. To address these
complexities, best in class cleaning
material designs are formulated to
work on most flux residue types, but
the rate varies for both hard and soft
flux residues, with the key variable
representing the length of the wash
section, the nozzle design, and wash
time.
P A G E 3 Cleaning, from Page 2
Minor ingredients formulated into the
cleaning agent address two important
functions: Control wash bath foam
when processing in high pressure
equipment and decrease the rate of
metal alloy corrosion. Foam is a sub-
stance that is formed by trapping
many gas bubbles at the liquid inter-
face. Rapid turn over of the wash tank
and high pressure jets create a condi-
tion to trap and grow gaseous tight
foam. To break or retard foam, anti-
foaming agents are added to the engi-
neered composition to inhibit foam
formation (Figure 13).
The second class of minor ingredients
includes materials that decrease the
corrosion rate of tin, lead, aluminum,
and yellow metals. Alkaline saponi-
fied cleaning materials chemically
react with soft metals. Corrosion in-
hibitors form a passivation layer - a
thin film on the surface of the alloy(s)
that stops access of the corrosive sub-
stance to the metal. Properly designed
cleaning agent inhibition packages
reduce
oxidation and reduction reactions.
Solder joints, aluminum heat sinks,
anodized aluminum and copper are
protected from exposure to the clean-
ing media
Cleaning Equipment
Cleaning equipment designs are cate-
gorized into two classifications: batch
and inline. Increased complexity of
board and component geometry cou-
pled with more difficult solder paste
and flux formulations, drives the need
<90 >90
Figure 12: Wetting
Figure 13: Controlling Foaming
Continued on Page 4
P A G E 4 V O L U M E 5 I S S U E 2
Controlling the Wash Process
As cleaning complexities increase, the
cleaning process window narrows.
Wash bath consistency over time is
critically important. High energy
cleaning machines drive with pres-
sure, heat, and fluid flow. Fluid losses
in the wash must be monitored and
controlled to assure consistency over
time. Lack of wash tank control leads
to cleaning agent depletion and even-
tually to incomplete cleaning The
chemical wash tank has a critical soil
loading level at which cleaning will
drop off. As flux soils load into the
wash tank, the level of soil will in-
crease over time. Additionally, wash
tank fluid will be lost over time to
exhaust and drag-out. To maintain
control between the upper and lower
design limits, additional cleaning ma-
terial will need to be added when the
wash tank is replenished. Failure to
add cleaning material when replenish-
ing the wash tank with water will re-
duce bath life. Adding wash chemistry
at optimal levels will extend bath life
and assure cleaning consistency over
time (Figure 15).
Bath Life Simulation
To maintain wash bath consistency
over time, programmable logic pro-
cess control units are design to moni-
tor the wash bath (Figure 16). As wa-
ter is added, cleaning chemistry is also
added to a preset concentration level.
The process control unit monitors the
concentration of cleaning chemistry
and water within the upper and lower
pre-set requirements.
Properly controlled wash baths reduce
variation and consistency for cleaning
leading edge designs.
Process Integration
Cleaning process optimization re-
quires a balanced of chemical and
mechanical effects. The job of the
cleaning material is to remove flux
residue and ionic contaminants. As
previously discussed, aqueous clean-
ing material designs contain reactive
materials at various concentration
levels. On certain flux types, higher
reactivity increases the static cleaning
rate, but can cause other issues. When
cleaning flux residue under low stand-
off components, longer wash time is
needed. Highly reactive cleaning ma-
terials create several compatibility
concerns in the form of solder joint
attack, anodized aluminum attack, dry
film solder mask removal, part mark-
ing removal, component attack,
polymer/adhesive attack, and a range
of other issues. Highly reactive clean-
ing materials saponify rosin, which
can create a foam condition as the
wash bath loads.
Best in class cleaning materials exhib-
it other important properties. The va-
por pressure of each material used in
the compositional make-up influences
evaporative loss rates. The dissolution
rate on higher molecular weight resin
structures used in low residue and lead
-free flux compositions influences the
static cleaning rate. The rate of clean-
ing material solvency in water can
influence the cleaning rate and
defoaming properties. The cleaning
material wetting forces is critical to
penetrating low standoff gaps. Proper-
ly designed, the cleaning material rap-
idly dissolves rosin /resin structures,
wetting low standoff gaps, inhibits
solder joint attack, overcomes compat-
ibility concerns, works at low concen-
trations, and provides long bath.
The cleaning machine design is equal-
ly important. Fluid management is
critical in maintaining an economic
cleaning process. Individual module
containment and specifically with the
wash chemistry is essential. Fluid de-
livery is critical for penetrating and
rapidly breaking the flux dam under
low standoff components. Air man-
agement is critical to reducing chemi-
cal odors in the workspace while min-
imizing the amount of wash fumes
exhausted from the machine. Fluid
storage is critical for long wash bath
life. Fluid control is critical in main-
taining the proper wash bath concen-
tration within the cleaning process
tolerance.
CONCLUSION
Leading edge circuit board design
failures are attributed to feature size
reduction, which increases the risk of
defects randomly induced by process
flaws. Cleaning processes take on a
whole new cleaning definition of re-
moving residue that can be seen visu-
ally and residue entrapped under com-
ponents that is commonly out of sight.
Cleaning process optimization re-
quires a balance of chemical and me-
chanical effects. Best in class cleaning
materials remove a wide range of flux
materials, decrease droplet size, ex-
hibit wide material compatibility, sta-
ble under pressure, and support pro-
cess control. Best in class cleaning
machines offer fluid management,
fluid delivery, air management, fluid
storage, and fluid control. The sum of
the parts must be integrated and con-
trolled.
♦ Dr. Mike Bixenman is the CTO of
Kyzen Corporation.
♦ Phil Zhang is Kyzen’s territory man-
ager for NorthernChina.
♦ Chris Shi is Kyzen’s territory man-
ager for Southern China.
Figure 14 Impingement Needed to Break Flux Dam
Figure 15: Bath Life Simulation
Figure 16: Process Control System
Continued from Page 3
P A G E 5 V O L U M E 5 I S S U E 2
Continued from Page 1
Mark: The board of directors and original founders knew what
they were doing and knew what was needed. They must have
brought in some good people to get it all set up right.
What specific departments are there that are training folks
to go into the various fields of the electronics industry?
Mark: This department, which is Workforce Training and devel-
opment. Technical and Professional Workforce Training. Right,
so part of it is IPC training and we get into basic soldering, cir-
cuit board repair, crimped cables and harnesses, as well as in-
spection capability. For inspectors on how to inspect the soldera-
bility of a board or something like that. What’s the default? Does
it meet the IPC requirements? IPC is a nonprofit organization,
worldwide, and they support the ISO 9000. So companies who
want government contracts that are ISO, their technicians have
to be somewhat certified in soldering, circuit board repair, in-
spection, there’s some different ones right now, and they’re get-
ting more. They’re talking about adding fiber optics in the very
near future. Susie: The college
found out that this was important
to companies in Brevard County
and that’s where I come in with
Corporate Services. We go to com-
panies and write specific custom-
ized contract training. If something
is a semester course, and they only
want certain things out of it, we
can customize it to meet the com-
panies’ needs. We go into the com-
pany itself and many times we’ll
hold the training on site so that the
employees don’t lose time travel-
ing to and from their worksite to
get the training. It’s been very suc-
cessful.
I see you teach everything from fiber optics to ESD aware-
ness, to composites inspection, this is amazing! I know a lot
of companies who could benefit from this. I’m not sure if
they’re aware of this yet, but they should be. Susie: Some-
times it’s the best kept secret in Brevard County. Mark: These
are IPC members by location all over Florida; United Launch
Alliance, Lockheed Martin, MC Assembly and many others.
This is great, you guys are really getting integrated in the
community. Now someone who doesn’t have the job yet but
wants to get certified so they can have credentials that will
help them get hired? Mark: Right, oh yeah big time.
And that’s separate from a current full-time enrolled student
with the college already? Susie: Yes because these are non-
credit courses. This whole area is non-credit, so it’s skill build-
ing. Mark: You have a whole phenomenal choice of career fields
now. And all of them are precision and all of them are very ex-
act. You just have to find something you like. In some cases, you
can work your way through it, and become an apprentice, and
your employer may help you pay for your college and your de-
gree. But it’s up to you. You have to be motivated, they’re not
going to come up and hand it to you on a silver platter.
As you know, over the last 10-15 years, a lot of manufactur-
ing has been outsourced overseas to China. Thankfully,
we’re starting to see some of that come back. But it does look
like in some areas of manufacturing, we’re still not as com-
petitive as we need to be. To the point where, the last five
manufacturing engineers hired from a large defense technol-
ogy company in Brevard County were picked up in Puerto
Rico. They’re not even looking in our local area as often as
they used to. That’s kind of sad. Why do you think that is?
Mark: Basically it comes down to one word and I hate to say it
but society has demotivated a lot of our kids, they’re spoiled.
They are used to having everything given to them, and they
don’t want to work for it.
So you don’t think it’s that the per-
ception of a career in manufacturing
has been tarnished in the public eye in
favor of more white collar-type jobs?
Mark: No not in America. Because even
in the early 1900’s and 1920’s, it was
pretty industrialized but people back
then worked, they wanted to work. We
had immigrants from all parts of the
world coming into the United States.
People were motivated because they
came from Europe where there was pov-
erty, people were starving to death. The
WWII motivated everybody, and we had
prosperity basically all the way up to the
1980’s and 90’s. The economy was go-
ing like crazy. But kids today, it’s not
that they don’t have a clue, but its hard to get them to find out
what they really want to do. But you know what, I’m so glad to
see the industry that’s moving into the Melbourne Airport area
and even here in Cocoa as well.
How can the local Space Coast Chapter of the SMTA help
motivate kids to be excited about the industry? Susie: I think
spreading the word to companies that could use the training to
let them know that we’re here and available. I think going to all
of the high school fairs and career days and they would welcome
you at any one of those. Kids need to see examples of the elec-
tronics in real world products used in their lives.
So just being aware of those real world, locally-developed
technologies may be just the spark to get these kids heading
in the right direction and go on to leading the United States
back to the top. Thank you very much for your time.
Eastern Florida State College interview continued
Mark Edwards, Electronics Adjunct Professor outside the Vocational Training Building
Why join SMTA? To be affiliated with the leading industry or-
ganization for those involved in SMT and oth-er advanced packaging technologies To gain access to the top technologists and
experts in the industry To receive leading edge technical information To acquire information to help you stay com-
petitive
Membership Categories: Global - $ 1495
Corporate - $ 450
Individual - $ 75
Participating - $ 50
Associate (Student/Retiree) - $ 5
For more information go to www.smta.org
Highlight your company by advertising in the
SMTA Newsletter. Four issues are planned for each year
Contact Ken Lawrence for more information.
(321) 394-4143 - [email protected]
One Issue:
Business Card: $25
1/4 Page: $50
Three issues:
Business Card: $50
1/4 Page: $125
Six issues:
Business Card: $100
1/4 Page: $200
ADVERTISING Space Available
SMTA Mission Statement We are an international network of
professionals who build skills, share practical experience and develop solutions in electronic assembly
Including micro-systems, emerging technologies, and related
business operations.
P A G E 6 V O L U M E 5 I S S U E 2
Upcoming SMTA EVENTS: February 19, 2014 11:00AM - Lunch Technical Meeting
A case study on automating the assembly pro-
cess of components traditionally hand soldered.
hosted by: Tom Borkes of the Jefferson Project
$20 Members $30 Non-members @
Mack Technologies, FL 7505 Technology Drive, Melbourne, FL
Meet a Chapter Officer Joan Carroll—Treasurer, Space Coast SMTA
It all began when
my family relo-
cated to the tech-
nology-rich town
of Huntsville,
Alabama from the
pre-technology
rich city of San
Jose, CA. After
graduation from
Auburn Universi-
ty with a B.S. degree in Marketing (War Ea-
gle) I went back to Huntsville to work for a
manufacturers’ representative company,
Advanced Components Marketing in a tem-
porary capacity while I searched for a “real”
job. Three months later I was hired as a full
time employee. Shortly after that I relocated
to Winter Park, FL and went to work for an-
other manufacturers’ representative company,
(thanks to networking), HHP Associates
where I stayed from 1991 through 2005. I
enjoyed my time at HHP enjoying consistent
growth year over year and winning several
sales contests which sent me to awesome trips
to Japan. In 2006 I left the industry to pursue
a career as a credit manager. I thought I
would actually be working in the world of
finance and managing credit with this UK
based company. In the electrical distribution
world, the title “credit manager” is code for
collection agent. If you have ever had any
experience with a credit manager I can almost
100% guarantee it was not pleasant. I never
thought I would miss the electronics industry
like I did. I truly missed meeting with engi-
neers, seeing new designs, specifying compo-
nents and working on manufacturing issues to
help make our parts fit into real products;
products that help people be it medical, indus-
trial and test equipment or military equipment
that directly assists our armed forces defend
our freedoms. In 2009, it was back to elec-
tronics with REStronics, another manufactur-
ers’ representative firm. This was different
than what I had known before: equipment,
manufacturing supplies and process related
issues. I knew I was right at home with this
national company: the great reputation of the
ownership and the support and resources for
their sales force. How had this whole world
existed while I was chasing down specifica-
tions for fans and switches? Five years later I
am still working in the manufacturing world
and loving it most of the time.
In my spare time I am a compulsive volun-
teer. Of course SMTA has been an awesome
experience working to provide meaningful
meetings and solutions for the problems that
keep our manufacturing partners up at night.
The friends I have met through SMTA have
been such a positive experience with my eve-
ryday work life and I feel very fortunate to
work with this exceptional group.
In the very early hours of the morning I lead a
marathon training group through a local run-
ning store program, Track Shack Marathon-
fest. I am up to 39 marathons completed in
18 states including most of the majors, New
York, Chicago, Marine Corp and Boston and
2 internationals, Quebec City and Berlin.
As a lady from the South, college football
has always been an important thread of my
life and I spend time as a volunteer on the
Associates Board and as a Bowl Scout with
Florida Citrus Sports. Also as a lady from the
South and my sorority days behind me, for
many years I have been a member of the Jun-
ior League of Greater Orlando, a wonderful
organization that really makes a difference
addressing needs in our local community. I
serve on other boards in the Orlando and
Winter Park communities. I am an active
member of the Cathedral Church of St. Luke
in downtown Orlando which is an awesome
place to worship; the clergy, congregation,
historical building and incredible music pro-
gram all make it great.
P A G E 7 V O L U M E 5 I S S U E 2
OFFICER LISTING
President: Eileen Hibbler (TEK Products) Phone: 321-355-8519 Email Address: [email protected] Vice President: Todd Barham (Kimball Electronics Group) Phone: 321-474-8393 Email Address: [email protected] Secretary: Jack Reinke (Kyzen Corporation) Phone: 404-290-6744 Email Address: [email protected] Treasurer: Joan Carroll (REStronics Florida) Phone: 407-670-8765 Email Address: [email protected] VP of Technical Programs: Brad Jon Latraverse (Harris Corporation) Phone: 321-729-3086 Email Address: [email protected] VP of Membership: Robert McGlynn (Tropical Stencil, Inc.) Phone: 561-745-7769 Email Address: [email protected] VP of Publications: Ken Lawrence (Mack Technologies, FL) Phone: 321-394-4143 or 321-394-4118 Email Address: [email protected] Student Chapter Chair: Angela Pichardo (Amptech Solutions) Phone: 321-821-8590 Email Address: [email protected] Publicity Chairperson (Appointed): Mark Leyden (R.S. Hughes) Phone: 561-762-4953 Email Address: [email protected] Board Liason & Technical Advisor (Appointed): Scott Nelson (Harris Corporation) Phone: 321-757-5078 Email Address: [email protected] Technical Committee (Appointed): Michael Newman (Harris Corporation) Phone: 321-727-6163 Email Address: [email protected] Technical Committee (Appointed): Brian Wright (MC Assembly) Phone: 321-608-4232 Email Address: [email protected] Special Projects Committee Chair Jeanette deChantal (Lockheed Martin) Phone: 321-482-0973 Email Address: [email protected]
“Calling all golfers”
2014 Winter Golf Classic February 7th, 2014
Duran Golf Club 8:30am Shotgun Start Scramble Format Trivia Contest ! $ 75 Per Player $300 Per Foursome
Call Eileen Hibbler (321) 355-8519 to reserve your spot.