Soitec Products and Services - WordPress.com · Soitec is a world leader in designing and manufacturing high-performance semiconductor materials, using its unique expertise to serve

Soitec Products and ServicesSemiconductor Materials & Equipment - Solar Energy - Lighting

LED - Efficient Lighting

High-performance GaN substratesSupply lighting systems

Technologies

3,000 active patents

Smart Cut™ Smart Stacking™ Epitaxy Expertise Soitec CPV technology

High-Performance Semiconductor Materials

Solar - Clean Energy

CPV systems280 MWp / year manufacturing capacity

Green Electronics

Engineered substrates2 M wafers / year manufacturing capacity

Applications

Large IP Portfolio

The Company

Soitec is a world leader in designing and manufacturing high-performance semiconductor materials, using its unique expertise to serve the electronics, solar energy and lighting markets.

Since its creation in 1992, Soitec has continued to grow by cultivating innovation and focusing on developing differentiating technologies that add maximum value to end products.

As an industrial company, Soitec has built its reputation on developing and manufacturing its flagship material, SOI (silicon-on-insulator), which is based on the revolutionary Smart Cut™ “atomic scalpel” technology.

Green Electronics In the electronics market, Soitec’s engineered substrates and technologies toolbox enable the performance, energy efficiency and cost effectiveness to address the Internet of Everything challenges. Our substrates are used in growing markets such as mobile and consumer electronics, networking, data communications and automotive electronics.

Solar - Clean Energy In the solar market, Soitec is an industrial manufacturer of concentrator photovoltaic (CPV) systems with installations in more than 20 countries worldwide. Our innovative CPV systems are designed for utility-scale power plants as well as off-grid electrification in sunny regions. By exploiting the synergies between our proprietary semiconductor technologies and solar energy, we are committed to bringing solar cells with record efficiency into production.

LED - Efficient Lighting In the lighting market, Soitec is focused on delivering high-quality, high-performance, economically sensible light emitting diode (LED) lighting solutions for the commercial and industrial lighting markets. Leveraging our semiconductor expertise, we strive to offer high-efficiency LEDs based on breakthrough materials innovations.

350patents applications / year

~20% of staff working in R&D

Technology Innovation Rooted in our DNA

Market-changing innovation has always been the pathway to success at Soitec, beginning with our initial breakthrough – Smart Cut™ technology – and extending through Smart Stacking™, Soitec CPV technology and our full product portfolio.

Soitec has nearly 3,000 active patents and files 350 additional patent applications each year. In addition to patents for which we hold sole ownership, we also license technologies from our research and development partners.

Our research and development program focuses on four major goals: continuing to reduce the size of transistors and integrated circuits (More Moore), adding new functions to circuits (More than Moore), engineering III-V composite materials for the next generation of LED substrates, and developing high-efficiency solar cells and CPV systems for competitive electricity production.

Technology Roadmap

More Moore

Continuing transistor miniaturization

More than Moore

Integrating more RF functions into circuits

III-V materials engineering for lighting applications

Enable energy efficiency at competitive cost

High-efficiency solar cells for concentrator photovoltaic systems

Improve energy conversion rates

Double layer transfer

Single layer transfer

SOI-based substrate for CMOS process

Final bonding on new substrate: glass, sapphire,…

Buried Oxide

Base Material

Mono-Crystal Top Material

Buried Oxide

Base Silicon

Buried Oxide

Base MaterialBase Material

SOI, sSOI, GeOI or III.V-OI wafer

Si, sSi, Ge or III-V

GaN and other III-V engineered substrates

Smart Cell™Evolution of multi-junction devices

4 5 6 7 8 9 1 2

Energy (eV)

3 4 Current3 junctions

GaInP1.8 eVGaAs1.4 eV

Ge0.7 eV

GaInP1.8 eVGaAs1.4 eV

1.0 eV

0.7 eV

Soitec Smart Cell™

III-V Seed LayerIII-V

Substrate

Foreign Substrate

FD-SOI Transistor

FinFET Transistor

New Architecture Transistor

Soitec’s Five Core Technologies and the Expertise

Smart Cut™ Technology Silicon-On-Insulator Substrates

Soitec’s silicon-on-insulator (SOI) wafers cover the full range of applications for microelectronics markets. Our Smart Cut™ wafer-manufacturing technology gives us the flexibility to tailor SOI substrates to meet the most demanding specifications.

Epitaxy ExpertiseIII-V Materials GaAs epi GaN epi

For epitaxial GaAs structures, Soitec materials are tailored with atomic-layer precision to meet customer-specific design requirements. Soitec combines its expertise in III-V materials epitaxy with proven Smart Cut™ technology to prepare the next generation of engineered substrates that enables advanced device structures for lighting applications.

Altatech TechnologyEquipment Expertise Mature and advanced materials deposition Holistic defect inspection

7_Donor wafer becomes new wafer A SOI wafer

5_Splitting

6_Annealing andCMP touch polishing

1_Initial silicon

2_Oxidation

3_Implantation

4_Cleaning and bonding

GaAs substrate

GaAs buffer

InGaAs channel

AlGaAs spacer

AlGaAs:Si barrier

GaAs:Si cap

Transistor structure

Final product

Molecular Beam Epitaxy (MBE), under high vaccum, with substrate maintained at 600°C (for each step)

Soitec CPV TechnologySolar Energy Concentrator Photovoltaic

Soitec is a leading manufacturer and supplier of concentrator photovoltaic systems using highly efficient Soitec CPV technology. The company has a successful track record with CPV installations in more than 20 countries. We offer innovative CPV systems and outstanding services related to project development as well as operation and maintenance.

Soitec’s Five Core Technologies and the Expertise Smart Stacking™ TechnologyLayer-Transfer Solutions Processed wafer stacking Engineered and bonded substrates

Soitec leverages a unique portfolio of technologies — including our Smart Cut™ and Smart Stacking™ technologies — and expertise in low-temperature direct wafer bonding and mechanical-chemical thinning to offer a wide range of layer-transfer solutions that address each customer’s specific needs.

Initial processed wafer Initial bulk or processed wafer

2_Low-stress wafer bonding

3_Low-temperature thermal treatment (< 400°)

4_High-precision back thinning

5_High-quality final cleaning

Final waferafter Smart Stacking™

Optimized CPV module size

Soitec CPV systemmodule size

Fresnel lens concentrates the light ~ 500 times

High-efficiency multi-junction solar cell

Altatech develops highly efficient, cost-effective inspection and CVD technologies used for R&D and manufacturing of semiconductors, LEDs, MEMS and photovoltaic devices.

Altatech offers a unique portfolio of equipment for mature and advanced materials deposition and holistic defect inspection.

Soitec Product and Service Offerings

Soitec’s products and technologies dramatically improve energy efficiency, performance, miniaturization, reliability and the quality of daily life.

Typical Applications Typical MarketsSoitec

Products LinesSpecifications

SOI wafer diameters: 200 mm and /or 300 mm Benefits

Dig

ital

Digital CMOS: Planar Fully

Depleted (FD-SOI)

Soitec FD-2D

Ultra-thin silicon-on-insulator with:

•Top silicon: 10 nm to 30 nm

•Buried oxide layer: 10 nm to 145 nm

•Uniformity: ±5 Å min. – max. range (all points, all wafers)

•Very low power with remarkable performance

•Extremely cost-competitive to continue Moore’s Law at 28 nm and beyond for SOC

•Evolutionary path to fully depleted CMOS technology

Digital CMOS: FinFET

Soitec FD-3D

Silicon-on-insulator with:


•Buried oxide layer: 50 nm standard

Fin height and isolation built into substrate:

•Faster and easier process development and manufacturing

•Optimized cost of ownership

•Excellent electrical behavior

Digital CMOS: Partially

Depleted SOI

Soitec Premium SOI™




•Super-high performance capability

•Improved switching speed to power consumption ratio

RF

RF on SOI

Soitec Wave SOI™

(eSI™ or HR-SOI)

Silicon-on-insulator with high-resistivity base wafer:

•Top silicon: 70 nm to 1 µm

•Buried oxide layer: 145 nm to 2 µm

•Base wafer resistivity > 1 kohm.cm and a Trap Rich layer in Soitec eSI™ product

•Substrate of choice for RF front-end module

•Best cost and performance trade-off

•Low RF loss, high RF isolation, linearity, power signal and digital integration

•Simpler design and process

RF on GaAsSoitec GaAs

Epitaxial Wafers

•pHEMT, high-mobility pHEMT, MESFET, HFET, mHEMT

•Expertise in GaAs on MBE technology

•75, 100 and 150 mm wafer diameters

•Pioneer in custom GaAs pHEMT epitaxy service

•Customer support from prototypes to high-volume manufacturing

RF on Sapphire

Soitec Bonded SOS

•Combining our core technologies to provide the best silicon layer quality on top of a sapphire substrate

•Ideal substrate for RF

•State-of-the-art RF performance

•High integration

Pow

er A

nalo

g

Power Analog on SOI

Soitec Smart Power SOI™


•Top silicon: 0.2 µm to 1.5 µm

•Buried oxide layer: 145 nm to 3 µm

•Ultra-thick buried oxide option for high-voltage applications (>1000 V): buried oxide up to 10 µm

•Significant chip size reduction

•Much lower overall system costs

•Reduced standby current

•Very-high-temperature operation (up to 200 °C)

Imag

e Se

nsor

Image Sensor on SOI

Soitec Imager SOI™


•Top silicon: 1.5 µm min.


•Faster learning and ramp-up

•Higher yields in volume production

•Lower total cost of ownership

Product also available: Stacking for Imager

MEM

S MEMS on SOI

Soitec MEMS SOI


•Top silicon and buried oxide layer thickness adaptable to any customer application

•Excellent uniformity

•Intrinsic etch stop

Product also available: Stacking for MEMS

Smart Cut™ technology Smart Stacking™ technology

Epitaxy expertise Altatech technology

Soitec CPV technology

Sem

icon

duct

or M

ater

ials

WiFi

3G4G

WiFi

3G4G

Typical Applications Typical MarketsSoitec

Products LinesSpecifications

SOI wafer diameters: 200 mm and /or 300 mm Benefits

3D

3D Integration

Soitec Stacking for 3D

•Direct bonding based on dielectric or metallic layers

•Multiple stacking of processed layers

Products also available: Stacking for Imager and Stacking for MEMS

•Innovative solutions to improve performance, form factor and cost

•Customized solutions

Phot

onic

s

Photonics on SOI

Soitec Photonics SOI



•Buried oxide layer: 1 µm to 3 µm

200 mm and 300 mm wafers diameters

•Thick buried oxide for optical confinement

•Excellent top-silicon crystal quality enabling low-loss waveguide

•Good thickness uniformity for high-yield manufacturing process

LED

Mat

eria

ls &

Sys

tem

s

LED

Soitec GaN Engineered Substrate

•High-quality GaN substrates tailored to LED requirements

•Substrate diameter: 100 mm

Product in development

•High device efficiency at high current injection

•Easily removable handle substrate for vertical devices

Indoor and outdoor lighting

Soitec Lamps & Luminaires

•High efficacy LED lighting system

•Long life

•Compatible with commonly available control systems

•Power savings > 50%

•Enhanced lighting experience by end user

•Low maintenance cost

•Overall short return on investment

Sem

icon

duct

or E

quip

men

t Mature and Advanced Materials

Deposition

Altatech NanoDeposition

•Wafer sizes: 100 mm to 300 mm

•Wide spectrum of deposited materials through a broad range of vaporization and deposition temperatures

•Excellent uniformity

•Low cost of ownership

•Adapted to customer requirements

Defect Inspection

and Metrology

Altatech NanoVision

•Front-end defect inspection:

•Unpatterned and patterned wafer inspection

•Macro and edge inspection

•Back-end defect inspection

•High-sensitivity inspection

•Modular system

•Low cost of ownership

•Adapted to customer requirements

Sola

r En

ergy

Utility-Scale or Off-Grid

Electrification in Sunny Regions

Soitec CX-S530-II

CPV System

•Highly efficient conversion of solar energy to electricity with >32% module efficiency

•Precise dual-axis tracker for optimal positioning toward the sun

•Large module area to reduce the number of CPV systems per power plant

•Only 12 Soitec CPV modules to be mounted per system

•High power output in peak times when electricity is most valuable

•Low cost of installation

•Low cost of operation and maintenance



Soitec CX-S540

CPV System


•Precise dual-axis tracker for optimal positioning toward the sun

•Low height (max. 4.5 m /15 ft.) dual-axis tracker with 6 or 8 sub-units carrying 3 CPV Modules each

•High power output in peak times when electricity is most valuable

•Perfect landscape integration

•Less intrusive foundations



Soitec CX-M500 CPV Modules

•Fifth generation of Soitec CPV Modules


•Delivered with brackets and air drying unit for easy CPV system integration

•High reliability and predictability of the power output

•Partnerships with local tracker manufacturers possible

Small and Medium-Scale

Off-grid Electrification

Soitec Plug&Sun™

and Plug&Sun+

•Complete energy solution

•High-efficiency CPV modules

•Dual-axis-tracking

•Autonomous / hybrid solution

•Low ground coverage

•Easy to deploy

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Worldwide Contacts

Soitec (headquarters)Parc Technologique des Fontaines 38190 Bernin (France)T. +33 (0)4 76 92 75 00 F. +33 (0)4 38 92 71 89www.soitec.com

Offices

Fabs

R&D

Global presence

Headquarters

Semiconductor [email protected]

Altatech [email protected]

Solar [email protected]

[email protected]

Documents

Soitec Products and Services - WordPress.com · Soitec is a world leader in designing and manufacturing high-performance semiconductor materials, using its unique expertise to serve