SoC Device Trend & Introduction of ATE · PDF file · 2011-11-28T2000 HiFix simplifies High parallel DUT performance boards at x4 ease of going to at x8, x16 solution Competitor’s

All Rights Reserved - Advantest Corporation0 2011/11/16

SoC SoC SoC SoC SoC SoC SoC SoC Device Trend &Device Trend &Device Trend &Device Trend &Device Trend &Device Trend &Device Trend &Device Trend &

Introduction of ATE SolutionIntroduction of ATE SolutionIntroduction of ATE SolutionIntroduction of ATE SolutionIntroduction of ATE SolutionIntroduction of ATE SolutionIntroduction of ATE SolutionIntroduction of ATE Solution

2011/11/16 Advantest Korea Co.,Ltd.


Market Trend 1 Market Trend 1

DVD/HDD recorderDigital TV or STB

Digital Still Camera

Car navigation

& Car TV

Home Network

(Wire & Wireless)

PC

Smart phone

DVD or Digital

movie camera

Broadband modem

& RouterBroadband Network

(Fiber or Wire or WiFi)

Digital Broadcasting

Car Electronic

CATV

DTV

Digital Single Lens

Reflex Camera

The life based on Smart Phones is increasing. The life based on Smart Phones is increasing.


A Smart Phone is a lump of A Smart Phone is a lump of SoCSoC DevicesDevices

CMOS Image S.

Power Manage IC

LPDDR

IC

Appli.

Multi Band RF…

High Speed I/F

USB/ Card I/F…

BT/ WLAN Chip

GSM/ CDMA/ LTE…

Multi Chip PA…

A Smart Phone is a collection A Smart Phone is a collection

of the newest technologies.of the newest technologies.


A Demand for A Demand for SoCSoC Devices of Smart Phone Devices of Smart Phone

CMOS Image S.

Power Manage IC

LPDDR

IC

Appli.

One Chip

Multi Band RF…

High Speed I/F

USB/ Card I/F…

BT/ WLAN Chip

One Chip

GSM/ CDMA/ LTE…

One Chip PA…

The demands to The demands to SoCSoC Devices Devices

in a Smart Phone are more high in a Smart Phone are more high

performance and more cost down. performance and more cost down.

To Low Cost More! To Low Cost More!

To Performance More! To Performance More!

To Low Power To Low Power

Consumption More! Consumption More!

Cost Down by One ChipCost Down by One Chip


Example of Device Multi FictionalizeExample of Device Multi Fictionalize

20102008 2012 2014

Multi Chip on Board

POP

New Tech. MEMS

OPT

Wireless

SiP

SoCHigh Speed I/F

Add-memory Combine Multi

Function

OpticalRF-mixed

Embedded PCB

BB-mixed

More High Performance and More Cost Down

To One Chip To One Chip To One Chip To One Chip To One Chip To One Chip To One Chip To One Chip （（（（（（（（Chip Number Reduce)Chip Number Reduce)Chip Number Reduce)Chip Number Reduce)Chip Number Reduce)Chip Number Reduce)Chip Number Reduce)Chip Number Reduce)

TSV

Memory TestMemory Test

High Pin

Count Test

High Pin

Count Test

Mixed Signal Mixed Signal

High Speed

I/F Test

High Speed

I/F Test

RF (RF+BB)

Modulation

Signal Test

RF (RF+BB)

Modulation

Signal Test

More Down SizeMore Performance


� Vendor� The increase in development cost.

� The timely delivery according to market demand is difficult.

� Complication of support.

� Vendor� The increase in development cost.

� The timely delivery according to market demand is difficult.

� Complication of support.

Problem Points in Problem Points in SoCSoC Device Test 1Device Test 1

� Customer

� Complicated and various correspondences

are required of SoC Device Test.

-Investment expansion of Tester by impossible to

use the conventional Tester.

-Cost escalation of Engineer education and

Tester employment by two or more platform

possession.

� Customer

� Complicated and various correspondences

are required of SoC Device Test.

-Investment expansion of Tester by impossible to

use the conventional Tester.

-Cost escalation of Engineer education and

Tester employment by two or more platform

possession. Increase of Test Cost !Increase of Test Cost !


・・・・When functions is not enough by evolution of a device,

　　　　The change with a new system is required. (Increase of an investment cost

and an engineer resource.)

・・・・When functions is not enough by evolution of a device,

　　　　Correspondence is possible at an addition or change of Module.

　（　（　（　（investment cost small and an engineer resource is efficient.)

An old system T2000

40M, AD/DA

（「（「（「（「A」」」」System））））

100M, Mixed

（「（「（「（「B」」」」System））））

G帯帯帯帯, RF（「（「（「（「C」」」」System））））

40M, AD/DA

（（（（T2000））））

100M, Mixed

（（（（T2000））））

G帯帯帯帯, RF（（（（T2000））））

A Module addition

or change

A Module addition

or change

Time

Function

Performance

Time

Function

Performance

System change

System change

Problem Points in Problem Points in SoCSoC Device Test 2Device Test 2


T2000 T2000 SoCSoC Test SystemTest System Concept 1Concept 1

Common Architecture (H/W & S/W)Common Architecture (H/W & S/W)

Mine FrameMine Frame Test HeadTest Head Test ModulesTest Modules

Star Pro 2

Main Frame

(Max 8 site

controller)

Light Star

Main Frame

(1 site

controller)

52 slots

Test Head

DM

250M

DPS

LC DPS500

Mixed

Etc,.AA/BBWGD RF

T2000

800M 1G

LSLS

SP2SP2

26 slots

Test Head

13 slots

Test Head

…

GSGSDPS90


T2000 PlatformPower Supply

Module

RF

Module

Digital

Module

Analog

Module

Relay

Controller

Module

Sync

Module

High-Speed I/F

Module

PMU32

Module

＋＋＋＋

Power

Module

Capture

Module

Provide test solutions with appropriate modules for each area.

SoC for PC,

Game etc.

Wireless communication

(RF) IC

（W-LAN IC,

Cell Phone IC)

MCU for

Consumer,

Automotive

Digital

ModulePMU32

Module

RF

Module

RFSolution

SoC

SolutionMCU

Solution

Power IC, PMIC etc.

Power

Module

Automotive/PMIC

Solution

High-speed I/F

(DDR,HDMI,PCI)

High Speed

Solution

6GSPM

CMOS sensor IC

CIS

Solution

Capture

Module

T2000 T2000 SoCSoC Test SystemTest System Concept 2Concept 2


Seamless & Scaleable PlatformSeamless & Scaleable Platform

800MDM

Digital

Ex. Modules

DPS500mA

��The optimal composition which rinks each needs The optimal composition which rinks each needs

from development to mass production can be chosen freely. from development to mass production can be chosen freely.

Single Test in development A large number of Parallelism for

Reduce COT in mass-production.

Analog/

RF

Ex. Modules

SeamlessSeamless

ScaleableScaleable

800MDM

Digital

DPS500mA Analog/

RF


T2000 EPP SolutionT2000 EPP Solution

((6000pin6000pin SoC SoC Tester)Tester)


New T2000 New T2000 Series (6000pin Series (6000pin SoCSoC Tester)Tester)

T2000 Main Frame

LSMFLSMF

SP2MF (T2000 EPP)SP2MF (T2000 EPP)

6000pin Tester

2800pin Tester


Analog Module

Device Power Supply

Digital Module

��An indispensable function (Digital, Power Supply, Analog) is conAn indispensable function (Digital, Power Supply, Analog) is condensed densed

　　　　　　　　with high density to a generalwith high density to a general--purpose purpose SoCSoC Device Test. Device Test.

800MDM

1.1Gbps 256I/O

FTA (Functional Test Abstraction)

1GDM

800Mbps 128I/O

LCDPS

DPS500mA

DPS90A

16bit/200Ksps 32ch ISVM/VSIM

ADC/DAC Linearity test focused

4A 8ch (32A total)2A 32ch + 0.8A 32ch

BBWGD

AAWGD

24bit/190Ksps 8ch AWG

18bit/820Ksps 8ch DGT

High precision Audio focused

16bit/400Msps 8ch AWG

16bit/128Msps 8ch DGT

Not Enough THD for Audio

3G Base Band focused

GPWGD

PMU32

16bit/1Msps 16bit/50Msps

16output AWG

18bit/1Msps 16bit/50Msps 8input DGT

THD -111dB@1KHz

8output Vref (VSIM)

500mA 32ch (16A total)




550mm

480

mm

<T2000 LSMF RECT 550 PB>

��T2000 T2000 HiFixHiFix simplifies High parallel DUT performance boards simplifies High parallel DUT performance boards

at x4 ease of going to at x8, x16 solutionat x4 ease of going to at x8, x16 solution

Competitor’s User Area Size

J3001 J3006 J3011 J3016J2016 J2011 J2006 J2001

J7001 J7006J6006 J6001

J1016

B C

J4001

J5006 J5001

A D

J8006

J4011 J4016J1011 J1006 J1001

J8001

J4006

#

1

#

1

#

1

#

2

#

2

#

1

#

2

#

2

#

2

#

2

#

2

#

1

#

1

#

2

#

2

#

4

#

2

#

1

#

1

#

1

#

1

#

3

#

1

#

1

#

1

#

1

#

2

#

1

#

3

#

2

#

2

#

1

#

1

#

2

#

1

<T2000 SP2MF RECT 680 PB>

680mm

520

mm


T2000 RF SolutionT2000 RF Solution

(Low COT & High Speed (Low COT & High Speed

Test for Test for LTELTE))


12GWSGA RF Module 12GWSGA RF Module FeatureFeaturess

Support of MultiSupport of Multi--Band / High Parallelism / MultiBand / High Parallelism / Multi--Port with Low CostPort with Low Cost

•4VSG /4VSA x 4MUX: 16 ports Tx and 16 ports Rx/module

•VSG (Modulation Signal): 6GHz (CW;12GHz) , VSA: 12GHz

•High C/N mode and High speed (300us) settling mode offered

•1-100MHz Low Phase Noise REF-SG

•Independent resources for 4-DUT testing

•Expandable up to 128 ports/ system

•High speed calculation by built in FFT H/W engine


Reference SGReference SGReference SGReference SG

VSGVSGVSGVSG SP4TSP4TSP4TSP4TAWGAWGAWGAWG

SGSGSGSGUp ConverterUp ConverterUp ConverterUp Converter 4444

VNAVNAVNAVNAVSAVSAVSAVSA

DGTDGTDGTDGTSASASASA

Down ConverterDown ConverterDown ConverterDown ConverterSP4TSP4TSP4TSP4T

4444






4444






4444






4444

DIV 4DIV 4DIV 4DIV 44444







4444






4444






4444






4444






4444






4444






4444


44--resources are Installed /1resources are Installed /1--modulemodule

Advantest 12GWGSGA=1 Module

Competitor’s RF

Minimum Configuration

38% resources(TT is Slower

than T2000 RF

for 4DUT LTE Tx.)

*Note

*Note) The meaning of the figure is actually different in the calculation of theoretical by the test item, the setting parameter , and the Device.

Old System

Advantest can offer Advantest can offer

22--resources type resources type

RF module also,RF module also,

For more Low SystemFor more Low System

Price. (Module Price Price. (Module Price ½½).).


4 Parallel Testing w/o port switching4 Parallel Testing w/o port switching

Sampling

timeCalculation

in a ModuleData transfer

time

T

T

Used

FFT engineDUT 1

DUT 2

DUT 3

DUT 4

DUT 1

DUT 2

DUT 3

DUT 4

Calculation in a Site Controller

Data transfer

time

Sampling

timeCalculation

in a ModuleData transfer

time

T

T

Used

16 RF ports + 2 RF resourcesDUT 1

DUT 2

DUT 3

DUT 4

DUT 1

DUT 2

DUT 3

DUT 4

AT

Example

Competitor

Example








4444






4444






4444






4444








4444






4444






4444






4444






4444






4444






4444


12GWSGAx1

IQ

IQ

IQ

IQ

IQ

IQ

IQ

IQ

AWG1

DGT1

AWG2

DGT2

AWG3

DGT3

AWG4

DGT4

○○○○○○○○ ○○○○

S X’tal

To DUT2-4

To

DUT2

To

DUT3

To

DUT4

○○ ○○

○○ ○○○○ ○○

○○ ○○

○○ ○○○○ ○○

○○ ○○

○○ ○○○○ ○○

○○ ○○

○○ ○○

○○ ○○○○ ○○

○○ ○○

○○ ○○

○○ ○○○○ ○○

○○ ○○

○○ ○○

○○ ○○○○ ○○

○○ ○○

DPS 500x2(64ch)

800MDMx2(256ch)

RC5Vx1(192ch)Relay Cont.Relay Cont.

=16ch/DUT=16ch/DUT

DM=48ch/DUT <DM=48ch/DUT <-- 4DUT 4DUT

Mother PBMother PB

Limit.Limit.

DPS=16ch/DUTDPS=16ch/DUT

BBWGDx1

To

DUT3

To

DUT4

To

DUT2

○○ ○○

○○ ○○○○ ○○

○○ ○○

○○ ○○○○ ○○

○○ ○○

○○ ○○○○ ○○

○○ ○○

○○ ○○○○ ○○

Example of Full BandExample of Full Band--LTELTE configurationconfiguration

//X4 DUT is proposal configuration//X4 DUT is proposal configuration

--112GWSGAx1, BBWGDx1, 800MDMx2, DPS500mAx2, RC5V192x1, Analog Syncx2GWSGAx1, BBWGDx1, 800MDMx2, DPS500mAx2, RC5V192x1, Analog Syncx11


T2000 RF Parallelism ResultT2000 RF Parallelism Result

Cellular　：　　：　　：　　：　 4DUT(Results) / 8DUT(Ramp up inside)

LTE 　：　　：　　：　　：　 4DUT(Results)

WLAN 　　　　：　：　：　：　 8DUT(Results)

WiMAX　　　　：　：　：　：　 4DUT(Results for Both EDS & FT)

DTV Tuner ：：：：8DUT(Results)

GPS　：　　　　：　　　　：　　　　：　　　 4DUT(Results)

BlueTooth ：：：：4DUT(Results) / 8DUT(Ramp up inside)

Zigbee ：：：： 4DUT(Results) / 8DUT(Ramp up inside)


Support TTM by Daughter Board solutionSupport TTM by Daughter Board solution

In progressing the kind development of only daughter boardIn progressing the kind development of only daughter board

The correlation working manThe correlation working man--hour and the cost are reduced. hour and the cost are reduced.

DB4DB3

DB2

Spectrum

Analyzer

RF SGDB1

VSG

DB

VSA

DB

<Easy to PB checking> <Easy to correlation checking>

Daughter Board

For Mass Production Stage


T2000 ISS SolutionT2000 ISS Solution

((IImage mage SSensor ensor SSolution)olution)


CMOS CMOS IImage mage SSensor ensor SSolutionolution

T2000 ISST2000 ISS

[Capture Rate]

[Multi Site]

1.4Gbps

1.2Gbps

1.0Gbps

800Mbps

650Mbps

100Mbps

8 24 32 40 64164

Cell-Phone

Camcorder

DSC

DSLR

IP750EXw/ ICU-D

IP750EXw/ ICU-1GL

New T2000 New T2000 Series (T2000 ISS)Series (T2000 ISS)


Camera Interface Roadmap for Mobile ApplicationsCamera Interface Roadmap for Mobile Applications

CCP2 CPI CSI-2 CSI-3

Standard SMIA MIPI MIPI MIPI

Physical Layer

Sub-LVDS

�208Mbps (class0)

�416Mbps (class1)

�650Mbps (class2)

Parallel I/F

�66MHz

MIPI D-PHY

�800Mbps to 1Gbps

MIPI M-PHY

�A: 1.25, 2.5 & 5 Gbps

�B: 1.5, 3, 6 Gbs

Status In production In production 2010-2011 Plan in 2012

CCP2 : Compact Camera Port 2CPI : Camera Parallel InterfaceCSI-2 : Camera Serial Interface 2CSI-3 : Camera Serial Interface 3SMIA : Standard Mobile Imaging ArchitectureMIPI : Mobile Industry Processor Interface Alliance

Tester Module Module Module

T2000 ISS

1.2GICAP 1.2GICAP 1.2GICAP

IP750EX ICU-D

+ Serial Board

ICU-D

+ Parallel Board

(ICU-1GL)

T2000 ISSAdvantage


High ResolutionHigh ResolutionHigh ResolutionHigh ResolutionMoviesMoviesMoviesMoviesSeq. ShootingSeq. ShootingSeq. ShootingSeq. ShootingMIPI InterfaceMIPI InterfaceMIPI InterfaceMIPI Interface

LowerLowerLowerLowerPricePricePricePrice

�Serial Capture : 1.2Gbps x 4 Lanes x 4ch�Parallel Capture Enable�128M pixel Memory for Movies, Seq. Shooting

�Enable 800M pix./16 Flames(Legacy product : 800M pix./4 Flames)

�440φφφφ Probe card

�252x208mm, Wide User Area(x2.5 times for Legacy Product)

�160mmx150mm for 12” wafer

�High-throughput with New IP Engines

�Quad Core CPU (Legacy product : Dual Core CPU)

1.2Gbps High1.2Gbps High--speed Capturespeed Capture

64 sites Parallel Test Capability64 sites Parallel Test Capability

T2000 ISS Technical AdvantageT2000 ISS Technical Advantage


T2000 IPS SolutionT2000 IPS Solution

((IIntegrated ntegrated PPower device ower device

test test SSolution)olution)


IIntegrated ntegrated PPower device test ower device test SSolutionolution

New T2000 New T2000 Series (T2000 IPS)Series (T2000 IPS)

10

50

100

1,000

10 30 100 300 1,000

Power Supply

and

PMIC

Automotive　　　　

Home Appliance

General

Purpose

Inverter

Hybrid

and

EV Cars　　　　

(V)

(A)

Industrial

Train

and

Power Plant　　　　

3,000

10,000 T2000 IPST2000 IPS

T2000 IGBTT2000 IGBT


Integrated Power Device Integration TrendIntegrated Power Device Integration Trend

SOIC 8 / CAN Transceiver

Hi Quad 64 / System Base Chip

MQFP 128

CY2009

CY2006

CY1998

CY2012

Next Gen

Higher Integrat

ion

Increa

sing P

in Co

unt

LQFP 100 / 12 loop Airbag IC

Big pressure to reduce

Big pressure to reduce CoTCoT & &

Reduce Time

Reduce Time--toto--Market

Market


T2000 IPS Solution IntroductionT2000 IPS Solution Introduction

32 Analog (85V) &

32 Digital (24V)

LOAD

Power Matrix

High Voltage

Mixed Signal

Low Voltage

Mixed Signal

General Purpose

Generator + Digitizer Floating Power

64 Analog (18V) |

64 Digital (8V)

8/16 Generators

8 Digitizers

6 Sources 80V/12A

Stackable & Gangable

Achieve optimum cost by matching device needs Universal Instrument Unique Power Subsystem

Cost optimized power redistribution

Few multifunctional instruments cover the widest range of needs.Few multifunctional instruments cover the widest range of needs.

72 power ports

Integrated Power DUT

ADC

DAC

Power

Stages

Mixed

Signal

Mixed

Signal


��T2000 IPS doubles site count vs. competitor maximum configuratioT2000 IPS doubles site count vs. competitor maximum configurationn• Larger user area of PB than competitor PB.• Reduced number of relays on PB.• Simple PB design saves cost for development, manufacturing and maintenance

T2000 IPS Doubling ParallelismT2000 IPS Doubling Parallelism

<Competitor PB (380mm x 380mm)> <T2000 PB (550mm x 480mm)>

4 DUT or more

DUT

128pin

DUT

128pin

DUT

128pin

DUT

128pin

Huge user area

& less relays

DUT

128pin

DUT

128Pin

2 DUT

Small user area

& lots of relays


PMIC Target Device vs. IPS PMIC Target Device vs. IPS configconfig..

a) Computing & Consumer

c) Peripherals & Low-end Consumer

MPCM

DM PMU

250MDMA

PMU

MPCM

PMU Digital

AWG DGT

LMU TMU

Pattern Control

MMXH

MMXL

MFHP

DGT

PMU

AWG

GPWG

D

RC5V

DM PMU

250MDMA RC5VMFHP

MMXH

PMU Digital

AWG DGT

LMU TMU

Pattern ControlPMU

DGT

PMU

AWG

EPPMU

(T.B.D)

GPWG

D

PMU Digital

AWG DGT

LMU TMU

Pattern Control

1GDM

MMXH

250MDMA

DPS90A

PMU Digital

AWG DGT

LMU TMU

Pattern Control

MMXL

MFHP

b) Wireless Communication


d) Power Train, Safety & Control

e) IGBT Wafer

f) IGBT Chip

DM PMU

PMU

MPCM

DGT

PMU

AWG

GPWG

D

PMU Digital

AWG DGT

LMU TMU

Pattern Control

250MDMA

MMXH

MMXL

MFHP

DGT

PMU

AWG

GPWGD

Booster

SHV

Booster

SHV

MMXH

MFHPSHV2KV

MFHP

DGT

PMU

AWG

GPWG

D

Booster

SHV

Booster

SHV

AC/DC

Fixture

MMXH

SHV2KV

Booster

SHV

Booster

SHV

HC600A

IGBT Target Device vs. IGBT IGBT Target Device vs. IGBT configconfig..


Thank you very much.

Documents

SoC Device Trend & Introduction of ATE · PDF file · 2011-11-28T2000 HiFix simplifies High parallel DUT performance boards at x4 ease of going to at x8, x16 solution Competitor’s