swivel
SN75LVDS83BFlatLink Transmitter
TM
Package OptionsTSSOP: 8 x 14mm DGGBGA: 4.5 x 7mm
Applicationprocessor
(e.g. OMAP )TM
Product
Folder
Sample &Buy
Technical
Documents
Tools &
Software
Support &Community
SN75LVDS83BSLLS846C MAY 2009REVISED AUGUST 2014
SN75LVDS83B FlatLink Transmitter1 Features 2 Applications1 LVDS Display Series Interfaces Directly to LCD LCD Display Panel Driver
Display Panels With Integrated LVDS UMPC and Netbook PC Package Options: 4.5-mm x 7-mm BGA, and 8.1- Digital Picture Frame
mm x 14-mm TSSOP3 Description 1.8-V Up to 3.3-V Tolerant Data Inputs to Connect
Directly to Low-Power, Low-Voltage Application The SN75LVDS83B FlatLink transmitter containsand Graphic Processors four 7-bit parallel-load serial-out shift registers, a 7X
clock synthesizer, and five Low-Voltage Differential Transfer Rate up to 135 Mpps (Mega Pixel PerSignaling (LVDS) line drivers in a single integratedSecond); Pixel Clock Frequency Range 10 MHz tocircuit. These functions allow 28 bits of single-ended135 MHz LVTTL data to be synchronously transmitted over five
Suited for Display Resolutions Ranging From balanced-pair conductors for receipt by a compatibleHVGA up to HD With Low EMI receiver, such as the SN75LVDS82 and LCD panels
with integrated LVDS receiver. Operates From a Single 3.3-V Supply and 170mW (Typ.) at 75 MHz When transmitting, data bits D0 through D27 are
28 Data Channels Plus Clock in Low-Voltage TTL each loaded into registers upon the edge of the inputclock signal (CLKIN). The rising or falling edge of theto 4 Data Channels Plus Clock Out Low-Voltageclock can be selected via the clock select (CLKSEL)Differentialpin. The frequency of CLKIN is multiplied seven Consumes Less Than 1 mW When Disabled times, and then used to unload the data registers in
Selectable Rising or Falling Clock Edge Triggered 7-bit slices and serially. The four serial streams and aInputs phase-locked clock (CLKOUT) are then output to
LVDS output drivers. The frequency of CLKOUT is ESD: 5-kV HBMthe same as the input clock, CLKIN. Support Spread Spectrum Clocking (SSC)
Compatible with all OMAP 2x, OMAP 3x, and Device Information(1)DaVinci Application Processors PART NUMBER PACKAGE BODY SIZE (NOM)
TSSOP (56) 14.00 mm x 5.10 mmSN75LVDS83B BGA MICROSTAR 7.00 mm x 4.50 mmJUNIOR (56)
(1) For all available packages, see the orderable addendum atthe end of the datasheet.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,intellectual property matters and other important disclaimers. PRODUCTION DATA.
http://www.ti.com/product/SN75LVDS83B?dcmp=dsproject&hqs=pfhttp://www.ti.com/product/SN75LVDS83B?dcmp=dsproject&hqs=sandbuysamplebuyhttp://www.ti.com/product/SN75LVDS83B?dcmp=dsproject&hqs=tddoctype2http://www.ti.com/product/SN75LVDS83B?dcmp=dsproject&hqs=swdesKithttp://www.ti.com/product/SN75LVDS83B?dcmp=dsproject&hqs=supportcommunityhttp://www.ti.com/product/sn75lvds83b?qgpn=sn75lvds83b
SN75LVDS83BSLLS846C MAY 2009REVISED AUGUST 2014 www.ti.com
Table of Contents1 Features .................................................................. 1 9 Detailed Description ............................................ 15
9.1 Overview ................................................................. 152 Applications ........................................................... 19.2 Functional Block Diagram ....................................... 163 Description ............................................................. 19.3 Feature Description................................................. 164 Revision History..................................................... 29.4 Device Functional Modes........................................ 185 Description (Continued) ........................................ 3
10 Application and Implementation........................ 196 Pin Configuration and Functions ......................... 310.1 Application Information.......................................... 197 Specifications......................................................... 610.2 Typical Application ................................................ 197.1 Absolute Maximum Ratings ...................................... 6
11 Power Supply Recommendations ..................... 287.2 Handling Ratings....................................................... 612 Layout................................................................... 287.3 Recommended Operating Conditions....................... 6
12.1 Layout Guidelines ................................................. 287.4 Thermal Information .................................................. 712.2 Layout Example .................................................... 307.5 Dissipation Ratings ................................................... 7
13 Device and Documentation Support ................. 327.6 Electrical Characteristics........................................... 713.1 Trademarks ........................................................... 327.7 Timing Requirements ................................................ 813.2 Electrostatic Discharge Caution............................ 327.8 Switching Characteristics ........................................ 1013.3 Glossary ................................................................ 327.9 Typical Characteristics ............................................ 11
14 Mechanical, Packaging, and Orderable8 Parameter Measurement Information ................ 12Information ........................................................... 32
4 Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (September 2011) to Revision C Page
Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, DeviceFunctional Modes, Application and Implementation section, Power Supply Recommendations section, Layoutsection, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Informationsection ................................................................................................................................................................................... 1
Changes from Revision A (October 2009) to Revision B Page
Added Storage temperature, Ts to ABSOLUTE MAXIMUM RATINGS.................................................................................. 6 Added Note 3 to DISSIPATION RATINGS............................................................................................................................. 7 Deleted max values for Supply current (average) .................................................................................................................. 8 Changed Enable time units from ns to s ............................................................................................................................ 10 Added Thermal Characteristics table ................................................................................................................................... 10 Changed G7(LSB) to G7(MSB) in Figure 15........................................................................................................................ 21 Added Note C to Figure 15................................................................................................................................................... 21 Added Note D to Figure 15................................................................................................................................................... 21 Added connection between GND and D23 to Figure 19 ...................................................................................................... 25
Changes from Original (May 2009) to Revision A Page
Changed text and replaced TBDs in Note A and Note B of Figure 15................................................................................. 21 Changed Note B of Figure 16 - Replaced TBDs. ................................................................................................................. 22 Changed Note B of Figure 17 - Replaced TBDs. ................................................................................................................. 23 Changed Note C of Figure 18 - Replaced TBDs.................................................................................................................. 24 Changed Figure 19 - removed 3 GND pin locations. ........................................................................................................... 25 Changed Figure 20 - removed 3 GND pin locations. ........................................................................................................... 26
2 Submit Documentation Feedback Copyright 20092014, Texas Instruments Incorporated
Product Folder Links: SN75LVDS83B
http://www.ti.com/product/sn75lvds83b?qgpn=sn75lvds83bhttp://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLLS846C&partnum=SN75LVDS83Bhttp://www.ti.com/product/sn75lvds83b?qgpn=sn75lvds83b
