Smart Dust & Its Applications By PANKAJ SHARMA. OUTLINE OUTLINE 1. INTRODUCTION 2. ARCHITECTURE 3. MANUFACTURING 4. COMM. INTERFACE 5. SENSOR NETWORKS

Smart Dust Smart Dust &&

Its Its ApplicationsApplications

ByBy

PANKAJ SHARMAPANKAJ SHARMA

OUTLINEOUTLINE

1.1. INTRODUCTIONINTRODUCTION2.2. ARCHITECTUREARCHITECTURE3.3. MANUFACTURING MANUFACTURING 4.4. COMM. INTERFACECOMM. INTERFACE5.5. SENSOR NETWORKSSENSOR NETWORKS6.6. APPLICATIONSAPPLICATIONS7.7. THE DARK SIDE THE DARK SIDE 8.8. RESEARCH AREASRESEARCH AREAS9.9. CONCLUSIONCONCLUSION

INTRODUCTIONINTRODUCTION

Technology developed at Technology developed at UCLA Berkeley collegeUCLA Berkeley college of Engg. of Engg.

Small wireless devices designed to monitor all types of Small wireless devices designed to monitor all types of physical quantities such as:physical quantities such as:

TemperatureTemperature HumidityHumidity Motion Motion Light LevelsLight Levels Pollution etc.Pollution etc.

Commercial name coined for dust size smart sensors.Commercial name coined for dust size smart sensors.

INTRODUCTIONINTRODUCTION

Level of Integration: IntegratesLevel of Integration: Integrates Transducers Transducers ProcessorsProcessors MemoriesMemories Solar powered BatteriesSolar powered Batteries Communication Interfaces on a single micro miniscule Communication Interfaces on a single micro miniscule

silicon chip.silicon chip.

Uses MEMS technology for its fabricationUses MEMS technology for its fabrication

POWER SUPPLY

PROCESSOR

SENSORS

RECEIVER TRANSMITTER

INTRODUCTION : QuestionsINTRODUCTION : Questions

What Are SensorsWhat Are Sensors??A device that responds to a physical A device that responds to a physical

stimulus for eg. Heat Light, sound, pressure, motion, flow stimulus for eg. Heat Light, sound, pressure, motion, flow etc and produces a measurable Corresponding electrical etc and produces a measurable Corresponding electrical signal is called a sensor.signal is called a sensor.

What Are Smart Sensors?What Are Smart Sensors?Sensors which not only have the capability Sensors which not only have the capability

to respond to a physical stimulus but also the ability to to respond to a physical stimulus but also the ability to decide whether the data is useful or not.decide whether the data is useful or not.


Smart SensorsSmart Sensors ProgrammableProgrammable Decision Making CapabilityDecision Making Capability Self CalibratingSelf Calibrating Plug-n-Play OperationPlug-n-Play Operation Sophisticated & Complex Sophisticated & Complex

sensor systems are easy to sensor systems are easy to designdesign

Traditional SensorsTraditional Sensors Not Programmable Not Programmable No processing power No processing power Custom CalibrationCustom Calibration Custom designCustom design Very difficult with Very difficult with

traditional methodstraditional methods

Why Smart Sensors?


Smart SensorsSmart Sensors

Distributed MeasurementsDistributed Measurements

PossiblePossible

Low Cost & Wide AvailabilityLow Cost & Wide Availability

Less Maintenance CostLess Maintenance Cost

Traditional SensorsTraditional Sensors

Only Lumped measurementsOnly Lumped measurements

possiblepossible

Relatively High CostRelatively High Cost

Requires skilled Professionals Requires skilled Professionals

for repair jobfor repair job

Why Smart Sensors?

ARCHITECTUREARCHITECTURE

Thin Film BatteryThin Film Battery

Size = 1x1x1mm^3Size = 1x1x1mm^3 Storage = 1 JouleStorage = 1 Joule Material = Lithium ionMaterial = Lithium ion Low o/p resistance for sub milli-amp currentLow o/p resistance for sub milli-amp current

Size = 0.25x0.25x0.25mm^3Size = 0.25x0.25x0.25mm^3 Capacity = 1 micro jouleCapacity = 1 micro joule Material = CeramicMaterial = Ceramic Used to provide high current when neededUsed to provide high current when needed

for eg. For laser pulsesfor eg. For laser pulses

Power CapacitorPower Capacitor

Size = 1x1x0.1mm^3Size = 1x1x0.1mm^3 Generation Cap. = 1 joule/day/mmGeneration Cap. = 1 joule/day/mm Material = Photosensitive compoundsMaterial = Photosensitive compounds Used to power the smart dust unitUsed to power the smart dust unit

Solar CellSolar Cell

ControllerController

Size = 1x1x0.1mm^3Size = 1x1x0.1mm^3 Uses CMOS technologyUses CMOS technology Analog cum digital controllerAnalog cum digital controller Gives the dust mote the decision making Gives the dust mote the decision making

capabilitycapability

SensorsSensors

Size = 0.5x0.5x0.1mm^3Size = 0.5x0.5x0.1mm^3 Incorporates many sensors on one Incorporates many sensors on one

interfaceinterface Micromachining techniques used for Micromachining techniques used for

fabricationfabrication

Passive TransmitterPassive Transmitter

Called Corner Cube Retro-reflector (CCR)Called Corner Cube Retro-reflector (CCR) Size = 0.5x0.5x0.1mm^3Size = 0.5x0.5x0.1mm^3 Range =1KmRange =1Km Speed = 100kbpsSpeed = 100kbps Modulates interrogating laser beam with Modulates interrogating laser beam with

the help of movable mirrors & transmits itthe help of movable mirrors & transmits it

Interrogating Laser Beam

Active TransmitterActive Transmitter

Size = 1x0.5x0.1mm^3Size = 1x0.5x0.1mm^3 Range = 10KmRange = 10Km Speed = 10MbpsSpeed = 10Mbps Uses laser diode to produce carrier beam.Uses laser diode to produce carrier beam.

ReceiverReceiver

Size = 1x0.5x0.1mm^3Size = 1x0.5x0.1mm^3 Consists of photodetector and receiver Consists of photodetector and receiver

circuitrycircuitry Demodulates the incoming signal and Demodulates the incoming signal and

separates the useful information from separates the useful information from carrier & noisecarrier & noise

MANUFACTURING:MANUFACTURING: Introduction to MEMSIntroduction to MEMS

These dust size particles are fabricated These dust size particles are fabricated using MEMS technology.using MEMS technology.

MEMS devices dates way back to 1958MEMS devices dates way back to 1958

11stst application was a Strain Gauge application was a Strain Gauge

Uses silicon as base material and etching Uses silicon as base material and etching techniques to generate pattern thereintechniques to generate pattern therein

MANUFACTURINGMANUFACTURING:: Introduction to MEMSIntroduction to MEMS Combines two TechnologiesCombines two Technologies

IC fabrication TechnologyIC fabrication Technology Micromachining TechnologyMicromachining Technology

IC Fabrication :- used to etch electronic IC Fabrication :- used to etch electronic circuits on the silicon substratecircuits on the silicon substrate

Micromachining :-used to etch mechanical Micromachining :-used to etch mechanical patterns on the silicon substratepatterns on the silicon substrate

MANUFACTURINGMANUFACTURING: : FabricationFabrication ProcessProcess

MEMS Generic ProcessMEMS Generic Process

MANUFACTURINGMANUFACTURING::

Includes Two Types of Micromachining Includes Two Types of Micromachining ProcessesProcesses

1.1. BULK MICROMACHININGBULK MICROMACHINING

2.2. SURFACE MICROMACHININGSURFACE MICROMACHINING


1.1. Bulk MicromachiningBulk Micromachining Wet chemicals are used to etch the pattern Wet chemicals are used to etch the pattern

on silicon substrate.on silicon substrate. Etchants used:-Etchants used:-

Non Acidic:- Non Acidic:- Potassium hydroxide (KOH)Potassium hydroxide (KOH) Tetra methyl ammonium hydroxide (TMAH)Tetra methyl ammonium hydroxide (TMAH) Ethylene Diamene Pyrocatechol (EDP)Ethylene Diamene Pyrocatechol (EDP)

Acidic:-Acidic:- Hydroflouric AcidicHydroflouric Acidic Nitric AcidNitric Acid


1.1. Bulk MicromachiningBulk Micromachining Process involves:-Process involves:-

1.1. Depositing masking Layers of:-Depositing masking Layers of:-

1.1. Silicon nitride orSilicon nitride or

2.2. Silicon dioxide or anySilicon dioxide or any

3.3. Metal like Au, Ti, etc.Metal like Au, Ti, etc.

2.2. Patterning these using LithographyPatterning these using Lithography

1.1. Bulk MicromachiningBulk Micromachining Pressure sensors & Accelerometers are Pressure sensors & Accelerometers are

fabricated using these technologies.fabricated using these technologies.

These devices include fabrication of peizo-These devices include fabrication of peizo-resistors on one side of wafer and machining resistors on one side of wafer and machining on the other side to form diaphragm or on the other side to form diaphragm or suspended mass in the case of pressure suspended mass in the case of pressure sensor or accelerometers respectively. sensor or accelerometers respectively.



1.1. Bulk MicromachiningBulk Micromachining Pressure Sensor:Pressure Sensor:

Accelerometer:Accelerometer:

Peizo-electric material


2.2. Surface Micromachining Surface Micromachining More advanced technique to make Novel More advanced technique to make Novel

structures on surface of silicon waferstructures on surface of silicon wafer

Involves deposition of certain layers and Involves deposition of certain layers and patterning these using Lithographic And etching patterning these using Lithographic And etching techniques.techniques.


2.2. Surface Micromachining Surface Micromachining Mainly Three layers are employed:Mainly Three layers are employed:

i.i. Electrical layer: Conducts electrical signals to Electrical layer: Conducts electrical signals to and from MEMS structure.and from MEMS structure.

ii.ii. Structural layer: Forms The mechanical Body Structural layer: Forms The mechanical Body of MEMS.of MEMS.

iii.iii. Sacrificial layer: Serve the purpose of Sacrificial layer: Serve the purpose of releasing the structural layers.releasing the structural layers.

COMMUNICATION COMMUNICATION INTERFACEINTERFACE

System Design Options:System Design Options:– Must support half- or full-duplex, bi-directional Must support half- or full-duplex, bi-directional

communication between a central transceiver and up communication between a central transceiver and up to 1000 dust motes.to 1000 dust motes.

– The downlink (central transceiver to dust motes) must The downlink (central transceiver to dust motes) must broadcast to all of the dust motes at a bit rate of broadcast to all of the dust motes at a bit rate of several kbps.several kbps.

– The uplink (dust motes to central transceiver) must The uplink (dust motes to central transceiver) must

permit each of 1000 dust motes to convey about 1 kb permit each of 1000 dust motes to convey about 1 kb of data within 1 s, an aggregate throughput of 1 Mbps.of data within 1 s, an aggregate throughput of 1 Mbps.


System Design Options:System Design Options:– Options for uplink multiplexing include time-, Options for uplink multiplexing include time-,

frequency-, code- and space-division multiplexing.frequency-, code- and space-division multiplexing.

– The central transceiver must be able to resolve the The central transceiver must be able to resolve the position of each dust mote with an angular resolution position of each dust mote with an angular resolution of the order of 1/100 of the field of view. of the order of 1/100 of the field of view.

– The link should operate over a range of at least The link should operate over a range of at least

several hundred meters.several hundred meters.


System Design Options:System Design Options:

– The dust mote transceiver must occupy a volume of The dust mote transceiver must occupy a volume of the order of 1 mm^3, and consume an average power the order of 1 mm^3, and consume an average power not exceeding 1 mW. not exceeding 1 mW.

– If possible, the uplink and downlink should afford a If possible, the uplink and downlink should afford a low probability of interception low probability of interception

COMMUNICATION COMMUNICATION INTERFACE:INTERFACE:Types Types

1)1) Radio Frequency Transmission (RFT)Radio Frequency Transmission (RFT)• Time Division MUX (TDMA)Time Division MUX (TDMA)• Frequency Division MUX (FDMA)Frequency Division MUX (FDMA)• Code Division MUX (CDMA)Code Division MUX (CDMA)• Space Division MUX (SDMA)Space Division MUX (SDMA)

2)2) Free Space Optical Transmission (FSOT)Free Space Optical Transmission (FSOT)• Passive TransmissionPassive Transmission• Active TransmissionActive Transmission


Pitfalls of RFT:Pitfalls of RFT:– Problems with TDMA:Problems with TDMA:

Requires each dust mote to coordinate its Requires each dust mote to coordinate its transmission with all the other dust motes.transmission with all the other dust motes.

– Problems with FDMA:Problems with FDMA: requires accurate control of the dust-mote requires accurate control of the dust-mote

oscillator frequencyoscillator frequency

Why FSOT is preferred?


Pitfalls of RFT:Pitfalls of RFT:– Problems with CDMA:Problems with CDMA:

Requires high-speed digital circuitry to Requires high-speed digital circuitry to operate for a relatively extended time operate for a relatively extended time interval, potentially consuming excessive interval, potentially consuming excessive power. power.

In order to avoid coordination between dust In order to avoid coordination between dust motes, both FDMA and CDMA require motes, both FDMA and CDMA require individual dust motes to be preprogrammed individual dust motes to be preprogrammed with unique frequencies or codes with unique frequencies or codes



Pitfalls of RFT:Pitfalls of RFT:– Problems with SDMA:Problems with SDMA:

In SDMA, the central transceiver employs an In SDMA, the central transceiver employs an antenna array to separate transmissions from antenna array to separate transmissions from different dust motes. Given the limited size of different dust motes. Given the limited size of the central transceiver it would be difficult for the central transceiver it would be difficult for SDMA to achieve the required spatial SDMA to achieve the required spatial resolution. resolution.


COMMUNICATION COMMUNICATION INTERFACEINTERFACE Advantages of FSOTAdvantages of FSOT

– Free-space optical transmission at visible or near-infrared Free-space optical transmission at visible or near-infrared wavelengths (400-1600 nm) represents an attractive wavelengths (400-1600 nm) represents an attractive alternative for the downlink and uplink. alternative for the downlink and uplink.

– In downlinking:-In downlinking:- A single laser transmitter can broadcast an on off-keyed A single laser transmitter can broadcast an on off-keyed

signal to the collection of dust motes. signal to the collection of dust motes. Each dust mote would be equipped with a very simple Each dust mote would be equipped with a very simple

receiver consisting of a band pass optical filter, a receiver consisting of a band pass optical filter, a photodiode, a preamplifier and a slicer. photodiode, a preamplifier and a slicer.

This receiver would involve only low-speed base-band This receiver would involve only low-speed base-band electronics, making it far simpler than its RF counterpart.electronics, making it far simpler than its RF counterpart.



Advantages of FSOTAdvantages of FSOT– In uplinking:-In uplinking:-

optics offers two alternatives for transmission. optics offers two alternatives for transmission. – Active laser-diode-based transmitterActive laser-diode-based transmitter

Involves modulation of internally generated Involves modulation of internally generated laser beamlaser beam

– Optically passive transmitter consisting of a Optically passive transmitter consisting of a corner-cube retro-reflector (CCR).corner-cube retro-reflector (CCR). Involves modulation of external interrogating Involves modulation of external interrogating

beam.beam.



Active Transmitter:Active Transmitter:– Consumes a lot of power to Consumes a lot of power to

generate the laser beamgenerate the laser beam

Passive Transmitter:Passive Transmitter:– Involves a corner cube Involves a corner cube

retroreflector to modulate the retroreflector to modulate the interrogating beam from the interrogating beam from the central receiver.central receiver.

– Requires a lot less power than Requires a lot less power than its active counterpart. its active counterpart.

Which One To Prefer?Laser Diode

Lens Adjustable

Mirror

COMMUNICATION COMMUNICATION INTERFACEINTERFACESystem Realization

DISTRIBUTED SENSOR DISTRIBUTED SENSOR NETWORKSNETWORKS

Consists of a Network backbone on which Consists of a Network backbone on which many nodes reside.many nodes reside.

Nodes are classified as:Nodes are classified as: Sensor nodes:-Sensor nodes:- tend to send data to the network tend to send data to the network

Controller nodes:-Controller nodes:- tend to gather data from the tend to gather data from the networknetwork

There can be more than one controller There can be more than one controller node.node.

Virtual network via internet can also be Virtual network via internet can also be setupsetup


Networked Smart Dust Sensors


Controller Nodes:Controller Nodes:– Consists of:Consists of:

ProcessorProcessor MemoryMemory Network Interface Network Interface I/O devices to communicate with the usersI/O devices to communicate with the users

– Used to:Used to: Collect information from sensor nodesCollect information from sensor nodes Program the sensor nodesProgram the sensor nodes Provide feedback to the userProvide feedback to the user


Advantages of Sensor Networks:Advantages of Sensor Networks:– Plug-n-Play operation possiblePlug-n-Play operation possible– No new wires to be routed to accommodate No new wires to be routed to accommodate

new nodesnew nodes– Traditional sensors have varying gains, Traditional sensors have varying gains,

offsets, hysteresis, etc. which must be offsets, hysteresis, etc. which must be compensated for elsewhere in the system. A compensated for elsewhere in the system. A smart sensor node would store the physical smart sensor node would store the physical attributes of the transducer and would attributes of the transducer and would compensate for non idealities locally in the compensate for non idealities locally in the processor. processor.


It is an open standard that gives sensors makers a way It is an open standard that gives sensors makers a way

to interface to different types of field busesto interface to different types of field buses A standard transducer interface module (STIM) A standard transducer interface module (STIM)

described by the standard includes:described by the standard includes:

– sensor interfacesensor interface– signal conditioning and conversion signal conditioning and conversion – calibrationcalibration– linearization and linearization and – basic communication rules basic communication rules

THE IEEE 1451 PROTOCOL


TEDS stands for Transducer Electronic Data Sheet.TEDS stands for Transducer Electronic Data Sheet.

Contains Technical information that:Contains Technical information that:– identifies the sensor identifies the sensor – specifies the sensor’s analog interface and specifies the sensor’s analog interface and – describes the sensor’s use describes the sensor’s use

TEDS resides in the sensor in an inexpensive memory TEDS resides in the sensor in an inexpensive memory

component, typically an EEPROM,component, typically an EEPROM,

TEDS the Heart of IEEE 1451 Protocol


Consists of four fields:Consists of four fields:– Basic TEDSBasic TEDS– Standard TEDSStandard TEDS– Calibration TEDSCalibration TEDS– User areaUser area

Contents vary Contents vary according to the type of according to the type of sensorsensor

TEDS

DISTRIBUTED SENSOR DISTRIBUTED SENSOR NETWORKSNETWORKS Advantages of IEEE 1451Advantages of IEEE 1451

– Maximum CompatibilityMaximum Compatibility– Simple Adoption Simple Adoption – Quicker, more automated system setup Quicker, more automated system setup – Improved diagnostics and troubleshooting Improved diagnostics and troubleshooting – Reduced downtime for sensor repair and Reduced downtime for sensor repair and

replacement replacement – Improved sensor data management, Improved sensor data management,

bookkeeping, and inventory management bookkeeping, and inventory management – Automated use of calibration data Automated use of calibration data

APPLICATIONSAPPLICATIONS Military ApplicationsMilitary Applications

– Battlefield surveillanceBattlefield surveillance– DetectionDetection– Classification &Classification &– Tracking of enemy Tracking of enemy

vehicles.vehicles.

Eg. DARPA SensIT Eg. DARPA SensIT ProjectProject

APPLICATIONSAPPLICATIONS Dust Particles Dust Particles

can be spread by can be spread by Unmanned Air Unmanned Air Vehicles (UAVs)Vehicles (UAVs)

Data can be Data can be collected by collected by sending the same sending the same aircraft over that aircraft over that areaarea

APPLICATIONSAPPLICATIONS VIRTUAL KEYBOARDVIRTUAL KEYBOARD

– Glue some dust motes to your fingertipsGlue some dust motes to your fingertips– Accelerometers will sense the orientation and motion of each Accelerometers will sense the orientation and motion of each

of your fingertips, and talk to the computer in your watch of your fingertips, and talk to the computer in your watch Then :Then :

– Sculpt 3D shapes in virtual clay Sculpt 3D shapes in virtual clay – Play the pianoPlay the piano– Gesture in sign language and have the computer to translate Gesture in sign language and have the computer to translate – Combined with a MEMS augmented-reality heads-up Combined with a MEMS augmented-reality heads-up

display, your entire computer I/O would be invisible to the display, your entire computer I/O would be invisible to the people around you. people around you.

– Couple that with wireless access and you need never be Couple that with wireless access and you need never be bored in a meeting again! Surf the web while the boss bored in a meeting again! Surf the web while the boss rambles on and on. rambles on and on.

APPLICATIONSAPPLICATIONS INVENTORY CONTROLINVENTORY CONTROL

– The carton talks to the box The carton talks to the box – The box talks to the paletteThe box talks to the palette– The palette talks to the truck The palette talks to the truck – The truck talks to the warehouse The truck talks to the warehouse – and the truck and the warehouse talk to the and the truck and the warehouse talk to the

internet. internet.

Know where your products are and what shape Know where your products are and what shape they're in any time, anywhere.they're in any time, anywhere.

APPLICATIONSAPPLICATIONS ENVIRONMENTAL ENVIRONMENTAL

APPLICATIONSAPPLICATIONS

– Habitat MonitoringHabitat Monitoring Eg ZebraNet(Princeton)Eg ZebraNet(Princeton)

– Weather sensingWeather sensing Estuarine environmental Estuarine environmental

and observation & and observation & forecasting system forecasting system (EEOFS)(EEOFS)

APPLICATIONSAPPLICATIONS ROAD WEATHER OBSERVATIONROAD WEATHER OBSERVATION

The Overlapping Environmental Observation & Transportation Surveillance system

APPLICATIONSAPPLICATIONS HEALTH APPLICATIONSHEALTH APPLICATIONS

– Tele-monitoring human Psychological DataTele-monitoring human Psychological Data

– Tracking and monitoring of doctors and patients Tracking and monitoring of doctors and patients inside the hospitals.inside the hospitals.

– Personal health monitor application running on a PDA receives and analyzes data from a number of sensors (e.g., ECG, EMG, blood pressure, pulse oxymeter)

– Glucose level Monitors.Glucose level Monitors.

– Cancer detectors and general health monitors.Cancer detectors and general health monitors.

APPLICATIONSAPPLICATIONS BIOMEDICAL SENSORSBIOMEDICAL SENSORS

APPLICATIONSAPPLICATIONS INTERFACES FOR QUADRIPLEGIC’SINTERFACES FOR QUADRIPLEGIC’S

– Put motes "on a quadriplegic's face, to monitor Put motes "on a quadriplegic's face, to monitor blinking & facial twitches-and send them as blinking & facial twitches-and send them as commands to a wheelchair/computer/other devicecommands to a wheelchair/computer/other device

AUTOMOBILESAUTOMOBILES– Accelerometers find the biggest use in automobiles, Accelerometers find the biggest use in automobiles,

mainly in airbag safety systems to detect the collision mainly in airbag safety systems to detect the collision impact and inflate the airbags to protect the impact and inflate the airbags to protect the passengers.passengers.

– Measurement of Tyre pressure and its treading even Measurement of Tyre pressure and its treading even during motion.during motion.

THE DARK SIDETHE DARK SIDE PRIVACY GOING PUBLICPRIVACY GOING PUBLIC

– As the technology is becoming smaller & smaller As the technology is becoming smaller & smaller personal information has been under a lot of threatpersonal information has been under a lot of threat

– So some privacy laws should be implemented before So some privacy laws should be implemented before implementing this technology commercially.implementing this technology commercially.

ENVIRONMENTAL IMPACTENVIRONMENTAL IMPACT – A lot of you might be worried about inhaling a dust A lot of you might be worried about inhaling a dust

motemote– Don’t worry, even if intel stopped producing Pentium Don’t worry, even if intel stopped producing Pentium

products and produced only dust motes, we won,t products and produced only dust motes, we won,t produce too many to bother anyone.produce too many to bother anyone.

RESEARCH AREASRESEARCH AREAS Efficient data conversionEfficient data conversion within the smart within the smart

sensor node is a fundamental key to its success. sensor node is a fundamental key to its success. One may attempt to devise a small, efficient instruction set One may attempt to devise a small, efficient instruction set

with which to program nodes for a wide variety of functions.with which to program nodes for a wide variety of functions.

Plug and play functionalityPlug and play functionality requires a standard requires a standard interface that communicates a node's identity and interface that communicates a node's identity and capabilities. The upcoming IEEE 1451 standard provides capabilities. The upcoming IEEE 1451 standard provides a basic communications link for sensor nodes, but a basic communications link for sensor nodes, but provides no methods specific to programming a node's provides no methods specific to programming a node's data processing resources data processing resources

One may design a standard interface that standardizes the One may design a standard interface that standardizes the

dynamic programming of sensor nodes.dynamic programming of sensor nodes.

RESEARCH AREASRESEARCH AREAS

Other areas of researchOther areas of research Designing Tiny Operating systemsDesigning Tiny Operating systems

Designing CAD tools for developing such Designing CAD tools for developing such applicationsapplications

Design tools to monitor sensor networksDesign tools to monitor sensor networks

And many areas which are creeping in your And many areas which are creeping in your mindmind

CONCLUSIONCONCLUSION With the base technology of manufacturing ICs With the base technology of manufacturing ICs

already available in our country and just by already available in our country and just by employing a little extra on micro-fabrication employing a little extra on micro-fabrication technology the Indian firms like BEL, SCL and other technology the Indian firms like BEL, SCL and other semiconductors giants can take the initiative to semiconductors giants can take the initiative to conquer the world markets in this sector and take conquer the world markets in this sector and take India into a dominating position as in the IT sector. India into a dominating position as in the IT sector. The employment of smart dust would mean better The employment of smart dust would mean better measurement data, therefore a better control of measurement data, therefore a better control of various industrial and non industrial parameters, and various industrial and non industrial parameters, and thereby enhancing the standard of life in general.thereby enhancing the standard of life in general.

THANK YOUTHANK YOU

PANKAJ SHARMAPANKAJ SHARMA

SMART DUST: SMART DUST: A CHALLENGE A CHALLENGE

TO OUR GENERATIONTO OUR GENERATION

QUERIESQUERIES

Documents

Smart Dust & Its Applications By PANKAJ SHARMA. OUTLINE OUTLINE 1. INTRODUCTION 2. ARCHITECTURE 3. MANUFACTURING 4. COMM. INTERFACE 5. SENSOR NETWORKS