SLLS632C –DECEMBER 2005–REVISED FEBRUARY ?· SN65HVD1050 SLLS632C–DECEMBER 2005–REVISED FEBRUARY…

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  • CANH

    1

    2

    3

    4

    8

    7

    6

    5

    TXD

    GND

    VCC

    RXD

    S

    CANL

    VREF

    Mode Control

    Overtemperature

    Sensor

    Dominant

    Time-Out

    30A

    30AVCC (3)

    VREF (5)

    Driver

    Vcc (3)

    Undervoltage

    VCC/2

    Product

    Folder

    Sample &Buy

    Technical

    Documents

    Tools &

    Software

    Support &Community

    SN65HVD1050SLLS632C DECEMBER 2005REVISED FEBRUARY 2015

    SN65HVD1050 EMC Optimized CAN Bus Transceiver1 Features 3 Description

    The SN65HVD1050 meets or exceeds the1 Improved Replacement for the TJA1050

    specifications of the ISO 11898 standard for use in High Electromagnetic Immunity (EMI) applications employing a Controller Area Network Very Low Electromagnetic Emissions (EME) (CAN). Meets or Exceeds the Requirements of As a CAN transceiver, this device provides differential

    ISO 11898-2 transmit capability to the bus and differential receive CAN Bus-Fault Protection of 27 V to 40 V capability to a CAN controller at signaling rates up to

    1 megabit per second (Mbps) (1). Dominant Time-Out FunctionThe SN65HVD1050 is designed for operation in Power-Up and Power-Down Glitch-Free CAN Busespecially harsh environments. As a result, the deviceInputs and Outputsfeatures cross-wire, overvoltage and loss of ground High Input Impedance With Low VCC protection from 27 V to 40 V, overtemperature

    Monotonic Outputs During Power Cycling shutdown, a 12-V to 12-V common-mode range, andwill withstand voltage transients from 200 V to 200 V

    2 Applications according to ISO 7637. Industrial Automation Device Information(1)

    DeviceNet Data Buses (Vendor ID #806) PART NUMBER PACKAGE BODY SIZE (NOM) SAE J2284 High-Speed CAN Bus for Automotive SN65HVD1050 SOIC (8) 4.90 mm 3.91 mm

    Applications(1) For all available packages, see the orderable addendum at SAE J1939 Standard Data Bus Interface the end of the data sheet.

    ISO 11783 Standard Data Bus Interface (1) The signaling rate of a line is the number of voltagetransitions that are made per second expressed in the units NMEA 2000 Standard Data Bus Interfacebps (bits per second)

    Functional Block Diagram

    1

    An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,intellectual property matters and other important disclaimers. PRODUCTION DATA.

    http://www.ti.com/product/SN65HVD1050?dcmp=dsproject&hqs=pfhttp://www.ti.com/product/SN65HVD1050?dcmp=dsproject&hqs=sandbuysamplebuyhttp://www.ti.com/product/SN65HVD1050?dcmp=dsproject&hqs=tddoctype2http://www.ti.com/product/SN65HVD1050?dcmp=dsproject&hqs=swdesKithttp://www.ti.com/product/SN65HVD1050?dcmp=dsproject&hqs=supportcommunityhttp://www.ti.com/product/sn65hvd1050?qgpn=sn65hvd1050

  • SN65HVD1050SLLS632C DECEMBER 2005REVISED FEBRUARY 2015 www.ti.com

    Table of Contents1 Features .................................................................. 1 8 Parameter Measurement Information ................ 102 Applications ........................................................... 1 9 Detailed Description ............................................ 14

    9.1 Overview ................................................................. 143 Description ............................................................. 19.2 Functional Block Diagram ....................................... 144 Revision History..................................................... 29.3 Feature Description................................................. 145 Description (Continued) ........................................ 39.4 Device Functional Modes........................................ 156 Pin Configuration and Functions ......................... 3

    10 Application and Implementation........................ 187 Specifications......................................................... 410.1 Application Information.......................................... 187.1 Absolute Maximum Ratings ...................................... 410.2 Typical Application ................................................ 197.2 ESD Ratings.............................................................. 410.3 System Example ................................................... 227.3 Recommended Operating Conditions....................... 4

    11 Power Supply Recommendations ..................... 247.4 Thermal Information .................................................. 512 Layout................................................................... 247.5 Driver Electrical Characteristics ................................ 5

    12.1 Layout Guidelines ................................................. 247.6 Receiver Electrical Characteristics ........................... 612.2 Layout Example .................................................... 257.7 Device Switching Characteristics.............................. 6

    13 Device and Documentation Support ................. 267.8 Driver Switching Characteristics ............................... 613.1 Trademarks ........................................................... 267.9 Receiver Switching Characteristics........................... 713.2 Electrostatic Discharge Caution............................ 267.10 Supply Current ........................................................ 713.3 Glossary ................................................................ 267.11 S-Pin Characteristics............................................... 7

    7.12 VREF-Pin Characteristics ....................................... 7 14 Mechanical, Packaging, and OrderableInformation ........................................................... 267.13 Typical Characteristics ............................................ 8

    4 Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.

    Changes from Revision B (March 2010) to Revision C Page

    Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device FunctionalModes, Application and Implementation section, Power Supply Recommendations section, Layout section, Deviceand Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1

    Changes from Revision A (May 2007) to Revision B Page

    Deleted The device is also qualified for use in ISO 11898-2 automotive applications in accordance with AEC-Q100."and footnote, "The device is available with Q100 qualification as the SN65HVD1050Q."..................................................... 1

    Changed VCC min/max range from 4.75-5.25V to 4.5-5.5V.................................................................................................... 4 Changed VIH max from 5.25V to 5.5V .................................................................................................................................... 4 Added rows for various parameters showing parameters with VCC 5% and 10%.............................................................. 4 Added Signaling Rate spec, min 20kbps................................................................................................................................ 4 Changed VIH min from 2 to 2.1V............................................................................................................................................. 4 Changed Bus output voltage (Dominant) CANH 4.5V < VCC < 5.5V from 4.75 to 5.2 ........................................................... 5

    2 Submit Documentation Feedback Copyright 20052015, Texas Instruments Incorporated

    Product Folder Links: SN65HVD1050

    http://www.ti.com/product/sn65hvd1050?qgpn=sn65hvd1050http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLLS632C&partnum=SN65HVD1050http://www.ti.com/product/sn65hvd1050?qgpn=sn65hvd1050

  • 1

    2

    3

    4

    8

    7

    6

    5

    TXDGNDVCCRXD

    SCANHCANLVref

    SN65HVD1050

    SN65HVD1050www.ti.com SLLS632C DECEMBER 2005REVISED FEBRUARY 2015

    5 Description (Continued)Pin 8 provides for two different modes of operation: high-speed or silent mode. The high-speed mode ofoperation is selected by connecting S (pin 8) to ground.

    If a high logic level is applied to the S pin of the SN65HVD1050, the device enters a listen-only silent modeduring which the driver is switched off while the receiver remains fully functional.

    In silent mode, all bus activity is passed by the receiver output to the local protocol controller. When datatransmission is required, the local protocol controller reverses this low-current silent mode by placing a logic-lowon the S pin to resume full operation.

    A dominant time-out circuit in the SN65HVD1050 prevents the driver from blocking network communication witha hardware or software failure. The time-out circuit is triggered by a falling edge on TXD (pin 1). If no rising edgeis seen before the time-out constant of the circuit expires, the driver is disabled. The circuit is then reset by thenext rising edge on TXD.

    Vref (pin 5) is available as a VCC/2 voltage reference to stabilize the output common mode voltage point.

    The SN65HVD1050 is characterized for operation from 40C to 125C.

    6 Pin Configuration and Functions

    D Package8-Pin SOICTop View

    Pin FunctionsPIN

    TYPE DESCRIPTIONNAME NO.TXD 1 I CAN transmit data input (LOW for dominant and HIGH for recessive bus states)GND 2 GND Device groundVCC 3 Supply Transceiver 5-V supplyRXD 4 O CAN receive data output (LOW for dominant and HIGH for recessive bus states)VREF 5 O Reference output voltageCANL 6 I/O Low level CAN bus lineCANH 7 I/O High level CAN bus line

    Mode select pin (Logic LOW places the device in high-speed mode and logic HIGH placesS 8 I the device in a listen-only silent mode)

    Copyright 20052015, Texas Instruments Incorporated Submit Documentation Feedback 3

    Product Folder Links: SN65HVD1050

    http://www.ti.com/product/sn65hvd1050?qgpn=sn65hvd1050http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLLS632C&partnum=SN65HVD1050http://www.ti.com/product/sn65hvd1050?qgpn=sn65hvd1050

  • SN65HVD1050SLLS632C DECEMBER 2005REVISED FEBRUARY 2015 www.ti.com

    7 Specifications

    7.1 Absolute Maximum Ratings (1)MIN MAX UNIT

    VCC Supply voltage (2) 0.3 7 VVoltage range at any bus terminal (CANH, CANL, Vref) 27 40 V

    IO Receiver output current 20 mAVI Voltage input, transient pulse (3) (CANH, CANL) 200 200 VVI Voltage input range (TXD, S) 0.5 6 VTJ Junction temperature 55 170 CTstg Storage temperature 40 125 C

    (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

    (2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.(3) Tested in accordance with ISO 7637, test pulses 1, 2, 3a, 3b, 5, 6, and 7.

    7.2 ESD RatingsVALUE UNIT

    Human body model (HBM), per All pins 8000ANSI/ESDA/JEDEC JS-001 (1) Bus pins vs GND 4000

    V(ESD) Electrostatic discharge VCharged-device model (CDM), per JEDEC specification JESD22- 1500C101 (2)

    Machine Model, ANSI/ESDS5.2-1996 200

    (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

    7.3 Recommended Operating ConditionsMIN NOM MAX UNIT

    VCC Supply voltage 4.5 5.5 VVI or VIC Voltage at any bus terminal (separately or common mode) 12 12 VVIH High-level input voltage 2.1 VCC VTXD, SVIL Low-level input voltage 0 0.8 VVID Differential input voltage 7 7 V

    Driver 70IOH High-level output current mAReceiver 2

    Driver 70IOL Low-level output current mAReceiver 2

    See Absolute Maximum Ratings (1), 1-Mbps minimumTJ Junction temperature 40 150 Csignaling rate with RL = 54 Signaling Rate 20 kbps

    (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

    4 Submit Documentation Feedback Copyright 20052015, Texas Instruments Incorporated

    Product Folder Links: SN65HVD1050

    http://www.ti.com/product/sn65hvd1050?qgpn=sn65hvd1050http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLLS632C&partnum=SN65HVD1050http://www.ti.com/product/sn65hvd1050?qgpn=sn65hvd1050

  • SN65HVD1050www.ti.com SLLS632C DECEMBER 2005REVISED FEBRUARY 2015

    7.4 Thermal InformationSN65HVD1050

    THERMAL METRIC (1) D (SOIC) UNIT8 PINS

    Junction-to-air, Low-K thermal resistance (2) 211RJA Junction-to-air, High-K thermal resistance 131RJC(top) Junction-to-case (top) thermal resistance 79RJB Junction-to-board thermal resistance 53 C/WJT Junction-to-top characterization parameter 10.3JB Junction-to-board characterization parameter 56.6RJC(bot) Junction-to-case (bottom) thermal resistance 112

    Average power dissipation, VCC = 5.0V, Tj = 27C, RL = 60 , S at 0V, Input to TXD a 170500 kHz, 50% duty cycle square wave. CL at RXD = 15 pFPD mWAverage power dissipation, VCC = 5.5V, Tj = 130C, RL = 45 , S at 0V, Input to TXD a 170500 kHz, 50% duty cycle square wave. CL at RXD = 15 pFTJ_shutdown Junction temperature, thermal shutdown (3) 190 C

    (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.(2) Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface-mount packages.(3) Extended operation in thermal shutdown may affect device reliability, see APPLICATIONS INFORMATION.

    7.5 Driver Electrical Characteristicsover recommended operating conditiions (unless otherwise noted)

    PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT4.75V < VCC < 5.25V 2.9 3.4 4.5CANH VI = 0V, S at 0V, RL = 4.5V < VCC < 5.5V 2.75 5.2VO(D) Bus output voltage (Dominant) 60 , See Figure 11 V4.75V < VCC < 5.25V 0.8 1.5and Figure 12CANL4.5V < VCC < 5.5V 1.6

    VI = 3V, S at 0V, RL = 4.75V < VCC < 5.25V 2 2.3 3VO(R) Bus output voltage (Recessive) 60 , See Figure 11 V4.5V < VCC < 5.5V 1.8 3and Figure 12

    VI = 0V, RL = 60 , S 4.75V < VCC < 5.25V 1.5 3at 0V, See Figure 11,Figure 12, and 4.5V < VCC < 5.5V 1.4 3Figure 13

    VOD(D) Differential output voltage (Dominant) VVI = 0V, RL = 45 , S 4.75V < VCC < 5.25V 1.4 3at 0V, See Figure 11,Figure 12, and 4.5V < VCC < 5.5V 1.3 3Figure 13VI = 3V, S at 0V, See Figure 11 and Figure 12 0.012 0.012VOD(R) Differential output voltage (Recessive) VVI = 3V, S at 0V, No Load 0.5 0.05

    4.75V < VCC < 5.25V 2 2.3 3Steady state common-mode outputVOC(ss) Vvoltage 4.5V < VCC < 5.5V 1.9 3S at 0V, Figure 18Change in steady-state common-modeVOC(ss) 30 mVoutput voltage

    IIH High-level input current, TXD input VI at VCC 2 2IIL Low-level input current, TXD input VI at 0V 50 10 AIO(off) Power-off TXD output current VCC at 0V, TXD at 5V 1

    VCANH = -12V, CANL Open, See Figure 21...

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