With the combined requirements from datacenter operators for ever higher bandwidths, reduced footprints, increased integration and lower costs, Silicon Photonics (SiPh) is perfectly placed to play a major role in new transceiver designs for 400G and beyond.

However, it is not without its challenges, particularly with coupling the fiber to the SiPh chip in a way that facilitates high volume, low cost automated assembly.

Optoscribe has developed the most comprehensive suite of fiber coupling solutions for SiPh chips available on the market, positioning itself as the industry’s fiber coupling partner of choice. All of Optoscribe’s coupling solutions are built around its unique glass-based platform incorporating 3D waveguides and optical microstructures such as V-grooves and mirrors.

SiPh Advanced Coupling Solutions

Optoscribe’s compact, integrated spot-size converter interconnects single mode fiber (SMF) to SiPh edge couplers using a glass based platform with integrated V-grooves for precise and accurate passive alignment of the fiber, waveguides with full three dimensions of flexibility to alleviate packaging constraints, and SiON assisted spot-size converters to couple efficiently with the SiPh chip.

SiPh Edge Coupling

Feature Benefit

Glass chip Solder reflow compatible; CTE matched with silicon chip

3D waveguides Alleviate packaging constraints

Integrated V-grooves Passive alignment of fiber cable

Etched precision fiducials Automated vision alignment to SiPh chip

Spot-size converter Low loss mode coupling with SiPh chip

Integrated 3D waveguides to alleviate packaging constraints

Configuration design flexibility in all 3 dimensions

Spot-size converter from SMF to SiPh edge couplersHigh Refractive Index SiON

waveguides in top layer for SiPh coupling

Integrated V-grooves for passive fiber alignment

SiPh Adiabatic CouplingOptoscribe’s innovative, high performance adiabatic coupling solution for SiPh chips utilises the company’s glass-based platform with integrated V-grooves for precise and accurate passive alignment of the fiber and custom SiON assisted waveguides with full three dimensions of flexibility to alleviate packaging constraints.

This solution comes complete with an Optoscribe designed SiPh taper for efficient low loss coupling between the glass-based waveguides and the SiPh chip.

Integrated 3D waveguides to alleviate packaging constraints

Custom SiON assisted 3D waveguide SiPh taper

Combines benefits of grating and edge coupling

Relaxed alignment tolerances

Integrated V-grooves for passive fiber alignment

Feature Benefit

Glass chip Solder reflow compatible; CTE matched with silicon chip

3D waveguides Alleviate packaging constraints

Integrated V-grooves Passive alignment of fiber cable

Etched precision fiducials Automated vision alignment to SiPh chip

Spot-size converter Low loss mode coupling with SiPh chip

Wafer scale test compatibility

SiPh Grating Coupling Optoscribe’s SiPh grating coupling solution is a compact, low profile interface incorporating integrated V-grooves for precise and accurate passive alignment of the fiber, waveguides with full three dimensions of flexibility to alleviate packaging constraints, and total internal reflection (TIR) mirrors for directing the light to or from the SiPh grating coupler. Alignment fiducials etched on the glass chip enable automated vision-based alignment to the SiPh chip, thereby totally eliminating any need for slow and costly active alignment at either end of the glass chip. The glass chip is inherently solder reflow compatible and CTE (Coefficient of Thermal Expansion) matched to the silicon chip.

Optoscribe Limited Rosebank Technology ParkRosebank RoadLivingstonEH54 7EJUnited Kingdom

T: +44 (0) 1506 536000F: +44 (0) 1506 691280 E: sales@optoscribe.comW: www.optoscribe.com

For further information please contact us, details below

Optoscribe Limited March 2018All specifications are correct at the time of production. We reserve the right to change our specifications without notice.

Integrated V-grooves for passive fiber alignment

Etched fiducials for automated vision based alignment to SiPh

TIR mirrors for directing light to/from SiPh grating couplers

3D waveguides to alleviate packaging constraints

Feature Benefit

Glass chip Solder reflow compatible; CTE matched with silicon chip

3D waveguides Alleviate packaging constraints

Integrated V-grooves Passive alignment of fiber cable

Etched precision fiducials Automated vision alignment to SiPh chip

Integrated mirrors Precise directing of light to/from grating couplers