1FEATURESSUPPORTS DEFENSE, AEROSPACE,

DESCRIPTION/ORDERING INFORMATIONThe SN74LVC1G11 performs the Boolean function Y � A • B • C or Y � A � B � C in positive logic.

SN74LVC1G11-EP

www.ti.com ...................................................................................................................................................................................................... SCES787–JULY 2009

SINGLE 3-INPUT POSITIVE AND GATE

2• Available in the Texas Instruments NanoFree™Package AND MEDICAL APPLICATIONS

• Controlled Baseline• Supports 5-V VCC Operation• One Assembly/Test Site• Inputs Accept Voltages to 5.5 V• One Fabrication Site• Max tpd of 5.9 ns at 3.3 V• Available in Military (–55°C/125°C)• Low Power Consumption, 10-µA Max ICC Temperature Range (1)

• ±24-mA Output Drive at 3.3 V • Extended Product Life Cycle• Ioff Supports Partial-Power-Down Mode • Extended Product-Change Notification

Operation • Product Traceability• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II• ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)– 200-V Machine Model (A115-A)– 1000-V Charged-Device Model (C101) (1) Additional temperature ranges are available - contact factory

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as thepackage.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION (1)

TA PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING–55°C to 125°C SOT (SC-70) – DCK Reel of 3000 SN74LVC1G11DCKREP OBF

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date. Copyright © 2009, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.

A

CYB

Absolute Maximum Ratings (1)

SN74LVC1G11-EP

SCES787–JULY 2009 ...................................................................................................................................................................................................... www.ti.com

FUNCTION TABLEINPUTS OUTPUT

YA B CH H H HL X X LX L X LX X L L

LOGIC DIAGRAM (POSITIVE LOGIC)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNITVCC Supply voltage range –0.5 6.5 VVI Input voltage range (2) –0.5 6.5 VVO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 6.5 VVO Voltage range applied to any output in the high or low state (2) (3) –0.5 VCC + 0.5 VIIK Input clamp current VI < 0 –50 mAIOK Output clamp current VO < 0 –50 mAIO Continuous output current ±50 mA

Continuous current through VCC or GND ±100 mAθJA Package thermal impedance (4) 259 °C/WTstg Storage temperature range –65 150 °C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.(3) The value of VCC is provided in the recommended operating conditions table.(4) The package thermal impedance is calculated in accordance with JESD 51-7.

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Product Folder Link(s): SN74LVC1G11-EP

Recommended Operating Conditions (1)

SN74LVC1G11-EP

www.ti.com ...................................................................................................................................................................................................... SCES787–JULY 2009

MIN MAX UNITOperating 1.65 5.5

VCC Supply voltage VData retention only 1.5VCC = 1.65 V to 1.95 V 0.65 × VCC

VCC = 2.3 V to 2.7 V 1.7VIH High-level input voltage V

VCC = 3 V to 3.6 V 2VCC = 4.5 V to 5.5 V 0.7 × VCC

VCC = 1.65 V to 1.95 V 0.35 × VCC

VCC = 2.3 V to 2.7 V 0.7VIL Low-level input voltage V

VCC = 3 V to 3.6 V 0.8VCC = 4.5 V to 5.5 V 0.3 × VCC

VI Input voltage 0 5.5 VVO Output voltage 0 VCC V

VCC = 1.65 V –4VCC = 2.3 V –8

IOH High-level output current –16 mAVCC = 3 V

–24VCC = 4.5 V –32VCC = 1.65 V 4VCC = 2.3 V 8

IOL Low-level output current 16 mAVCC = 3 V

24VCC = 4.5 V 32VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20

Δt/Δv Input transition rise or fall rate VCC = 3.3 V ± 0.3 V 10 ns/VVCC = 5 V ± 0.5 V 10

TA Operating free-air temperature –55 125 °C

(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

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Product Folder Link(s): SN74LVC1G11-EP

Electrical Characteristics

Switching Characteristics

Operating Characteristics

SN74LVC1G11-EP

SCES787–JULY 2009 ...................................................................................................................................................................................................... www.ti.com

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS VCC MIN TYP (1) MAX UNITIOH = –100 µA 1.65 V to 5.5 V VCC – 0.1IOH = –4 mA 1.65 V 1.2IOH = –8 mA 2.3 V 1.9

VOH VIOH = –16 mA 2.4

3 VIOH = –24 mA 2.3IOH = –32 mA 4.5 V 3.8IOL = 100 µA 1.65 V to 5.5 V 0.1IOL = 4 mA 1.65 V 0.45IOL = 8 mA 2.3 V 0.3

VOL VIOL = 16 mA 0.4

3 VIOL = 24 mA 0.55IOL = 32 mA 4.5 V 0.55

II All inputs VI = 5.5 V or GND 0 to 5.5 V ±5 µAIoff VI or VO = 5.5 V 0 ±10 µAICC VI = 5.5 V or GND, IO = 0 1.65 V to 5.5 V 10 µAΔICC One input at VCC – 0.6 V, Other inputs at VCC or GND 3 V to 5.5 V 500 µACi VI = VCC or GND 3.3 V 3.5 pF

(1) All typical values are at VCC = 3.3 V, TA = 25°C.

over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 2)

VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 VFROM TO ＝ 0.15 V ＝ 0.2 V ＝ 0.3 V ＝ 0.5 VPARAMETER UNIT(INPUT) (OUTPUT)

MIN MAX MIN MAX MIN MAX MIN MAXtpd A, B, or C Y 2.9 17.2 1.4 7.5 1.3 5.9 1 5.0 ns

TA = 25°C

VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 VTESTPARAMETER UNITCONDITIONS TYP TYP TYP TYPCpd Power dissipation capacitance f = 10 MHz 18 19 20 23 pF

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Product Folder Link(s): SN74LVC1G11-EP

PARAMETER MEASUREMENT INFORMATION

thtsu

From OutputUnder Test

C

(see Note A)L

LOAD CIRCUIT

S1

VLOAD

Open

GND

RL

Data Input

Timing Input

0 V

0 V0 V

tW

Input

0 VInput

OutputWaveform 1

S1 at V

(see Note B)LOAD

OutputWaveform 2

S1 at GND(see Note B)

VOL

VOH

0 V

»0 V

Output

Output

TEST S1

t /tPLH PHL Open

OutputControl

VM

VM VM

VM

VM

1.8 V 0.15 V±

2.5 V 0.2 V±

3.3 V 0.3 V±

5 V 0.5 V±

1 kW

500 W

500 W

500 W

VCC RL

2 × VCC

2 × VCC

6 V

2 × VCC

VLOAD CL

30 pF

30 pF

50 pF

50 pF

0.15 V

0.15 V

0.3 V

0.3 V

VD

3 V

VI

VCC/2

VCC/2

1.5 V

VCC/2

VM

£2 ns

£2 ns

£2.5 ns

£2.5 ns

INPUTS

RL

t /tr f

VCC

VCC

VCC

VLOADt /tPLZ PZL

GNDt /tPHZ PZH

VOLTAGE WAVEFORMSENABLE AND DISABLE TIMES

LOW- AND HIGH-LEVEL ENABLING

VOLTAGE WAVEFORMSPROPAGATION DELAY TIMES

INVERTING AND NONINVERTING OUTPUTS

NOTES: A. C includes probe and jig capacitance.

B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.

C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .

D. The outputs are measured one at a time, with one transition per measurement.E. t and t are the same as t .

F. t and t are the same as t .

G. t and t are the same as t .

H. All parameters and waveforms are not applicable to all devices.

L

O

PLZ PHZ dis

PZL PZH en

PLH PHL pd

£ W

VOLTAGE WAVEFORMSPULSE DURATION

VOLTAGE WAVEFORMSSETUP AND HOLD TIMES

VI

VI

VI

VM

VM

V /2LOAD

tPZL tPLZ

tPHZtPZH

V – VOH D

V + VOL D

VM

VM VM

VM

VOL

VOH

VI

VI

VOH

VOL

VM

VM

VM

VM

tPLH tPHL

tPLHtPHL

SN74LVC1G11-EP

www.ti.com ...................................................................................................................................................................................................... SCES787–JULY 2009

Figure 1. Load Circuit and Voltage Waveforms

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Product Folder Link(s): SN74LVC1G11-EP

PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead/Ball Finish MSL Peak Temp(3)

Op Temp (°C) Top-Side Markings(4)

Samples

SN74LVC1G11MDCKREP ACTIVE SC70 DCK 6 3000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -55 to 125 OBF

V62/09621-01XE ACTIVE SC70 DCK 6 3000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -55 to 125 OBF

(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is acontinuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN74LVC1G11-EP :

PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

Addendum-Page 2

• Catalog: SN74LVC1G11

• Automotive: SN74LVC1G11-Q1

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

SN74LVC1G11MDCKREP SC70 DCK 6 3000 180.0 8.4 2.4 2.5 1.2 4.0 8.0 Q3

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Aug-2017

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

SN74LVC1G11MDCKREP SC70 DCK 6 3000 202.0 201.0 28.0

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Aug-2017

Pack Materials-Page 2

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