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doi:10.1016/j.m
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Materials Science in Semiconductor Processing 8 (2005) 261–266
Simultaneous optical measurement of Ge content and Borondoping in strained epitaxial films using a novel
data-analysis technique
Stephen Morrisa,�, Paul Fougeresb, Stephanie Bozzo-Escoubasc, Sylvie Bodnard,Stephane Gaillardd
aTherma-Wave Inc., 1250 Reliance Way, Fremont, CA 94539, USAbTherma-Wave Inc., Hameau du Parc Bat D16, Chem. Departmental 56C, F-13790 Rousset, France
cLaboratoire TECSEN, FST de St Jerome, F-13397 Marseille, FrancedAtmel Fab 7, Z.I. de Rousset, F-13106 Rousset, France
Available online 18 October 2004
Abstract
We present a novel technique, based on a proprietary approach to analyzing the raw optical data, which is able to
decouple the effects of Ge and B on the optical properties of a B-doped SiGe film. An example is given of the
application of this technique to measure the two material fractions, plus the thickness, simultaneously and
independently on a standard Opti-Probes film-thickness tool.
Three sets of doped epitaxial SiGe layers were grown, each with a nominally fixed Ge-content but with the Boron
levels varying from zero to �1� 1020 cm�3. Two sets consisted of single-layer films on c-Si substrates, the other
consisted of similar films capped with undoped epi-Si layers.
The Ge-fractions found were in good agreement with XRD and SIMS whilst the calculated ‘‘doping parameter’’ was
found to follow a monotonic relationship with changes in Boron concentration in each case.
r 2004 Elsevier Ltd. All rights reserved.
Keywords: Epitaxy; Composition; Doping; Measurement
1. Introduction
When growing epitaxial SiGe films it is helpful to have
a method for measuring the thickness and Germanium
fraction to facilitate process control. This can be done
optically, using a method such as spectrophotometry or
spectroscopic ellipsometry, and is a routine application
[1] where the films are either undoped or have a known
level of Boron doping. However, where the doping level
e front matter r 2004 Elsevier Ltd. All rights reserve
ssp.2004.09.040
ing author. Tel.: +44 1743 365 445; fax:
7
ess: [email protected] (S. Morris).
may be subject to change independently from the
Germanium fraction, the measurement becomes more
complex because of the effect that the Boron has on the
optical properties of the material. Changes in Boron
level, if unaccounted for, can introduce significant errors
in the measurement of Germanium fraction, or thick-
ness, or both.
Hitherto there has not been an accepted optical
method for characterizing both Germanium fraction
and Boron level simultaneously, and measurements have
of necessity been made with the assumption that one of
these is fixed and only the other must be determined. We
present here a novel technique, based on a proprietary
d.
ARTICLE IN PRESSS. Morris et al. / Materials Science in Semiconductor Processing 8 (2005) 261–266262
approach to analyzing the raw optical data, which is
able to decouple the effects of each element on the film’s
optical properties and so measure the two fractions, plus
the thickness, simultaneously and independently on a
standard Opti-Probes film-thickness tool.
Fig. 1. Plots of the �2ðEÞ curves for a set of undoped SiGe films
with varying Ge-fraction.
2. Effects of doping upon optical properties of Si and
SiGe
In order to understand how the presence of doping
affects the optical measurement of epitaxial SiGe (or
indeed Si) films, it is helpful to examine the complex
dielectric function, �ðEÞ, and in particular its imaginary
part �2ðEÞ: Together with the real part �1ðEÞ; this is
related to the more familiar nðlÞ and kðlÞ curves throughthe relations
�1 þ i�2 ¼ ðn þ ikÞ2 (1)
and
E ¼ hc=l: (2)
Fig. 1 shows a set of �2ðEÞ dielectric functions for
undoped SiGe alloys with the Germanium fraction
varying from 0% to 25%. It can be seen that the two
strong features in the visible photon range, E1 and E2,
change in height and energy as the Germanium fraction
changes. Hence, if an optical method can determine the
�2ðEÞ curve of such a material, in the absence of doping
the Germanium fraction can be deduced simply by
correlating the peak heights and positions, or else by
interpolating the curve between those obtained from
reference films with known Germanium fraction.
However, if the materials are doped (either p-type or
n-type), this also has an effect on the shape of the �2ðEÞ
curve, which consists mainly of suppressing the E1 and
E2 features [2,3]. Fig. 2 illustrates this in the case of a
Silicon sample, and Fig. 3 shows the �2ðEÞ curves for a
set of doped SiGe films with nominally the same Ge-
fraction. The modifications to the �2ðEÞ curve caused by
doping lead to errors in the calculated Ge-fraction if the
doping is not explicitly accounted for. Even so, the fact
that the effect of doping is much more localized in the
vicinity of the peaks than the effect of changes in Ge-
fraction means that the effect of doping upon the curve
is qualitatively different from the effect of changes in
Ge-fraction. This leads directly to the supposition that
the measurement of the two parameters can be
decoupled by use of an appropriate method.
Fig. 2. Measured e2 curves for a nominally undoped Silicon
substrate and an epitaxially-grown Si film doped with Boron to
�2.5� 1019 cm�3, respectively.
3. Principle of method
We have successfully decoupled the effect of doping
upon the �2ðEÞ optical properties from the effect of
changing Germanium content by introducing a ‘‘pertur-
ARTICLE IN PRESS
Fig. 3. Plots of the �2ðEÞ curves for a set of SiGe films where the
Ge-fraction is nominally the same (21%), but Boron levels vary
from zero to �1� 1020 cm�3. In practice there is also some
variation in Ge-fraction from sample to sample, which accounts
for the fact that the curves do not all appear in strict sequence.
S. Morris et al. / Materials Science in Semiconductor Processing 8 (2005) 261–266 263
bation function’’, D�2ðEÞ; to represent the effect of the
doping. This recognizes the separable form of the
Kramers–Kronig transform used to obtain �1ðEÞ from
�2ðEÞ; viz.
�1ðE0Þ ¼ 1þ
Z 1
0
E�2ðEÞ
E2 � E20
dE (3)
and hence
�1ðE0Þ þ D�1ðE0Þ ¼ 1þ
Z 1
0
Eð�2ðEÞ þ D�2ðEÞÞ
E2 � E20
dE
) D�1ðE0Þ ¼
Z 1
0
ED�2ðEÞ
E2 � E20
dE: ð4Þ
Unlike �2ðEÞ itself, which is only known within the range
of photon energies for which optical data is available,
D�2ðEÞ may be defined in such a way that it is known at
all values of E from 0 to N and can therefore be
transformed precisely. We parameterize D�2ðEÞ in such a
way that the parameters can be regressed upon and
correlated with the doping level of the material. After
transforming it, we combine the function D�1ðEÞ so
calculated with the �1ðEÞ function for the undoped
material, and so obtain the full dielectric function and
hence n and k for the doped material. Note that this
approach is proprietary and a patent application has
been filed.
A simple example of the application of this technique
to a doped Silicon film is given in Fig. 4. Here, we simply
show the measured reflectivity (at near-normal inci-
dence) of the film, normalized to that of an undoped
reference having a thin native Oxide layer. In Fig. 4(a)
the raw data is compared to the calculated reflectivity of
an undoped sample, and it can be seen that the
agreement is very poor. The strongest discrepancies are
the sharp feature at �365 nm, which corresponds to the
energy (�3.4 eV) of the E1 peak in the �2ðEÞ curve, and
the general shift in the overall reflectance level which is
positive below this wavelength and negative above it. In
Fig. 4(b) we show the calculated reflectivity obtained
when a simple D�2ðEÞ function (using two floating
parameters) is employed to suppress the E1 peak,
making no other changes. It can be seen that not only
is the strong feature at �365 nm now fitted very well, but
also the shift in reflectance in the visible part of the
spectrum is accounted for. This is because even though
the effect of doping upon �2ðEÞ is local in energy, the
Kramers–Kronig transform propagates the effect to all
energies and hence all wavelengths. Finally, we show in
Fig. 4(c) the effect of a more general D�2ðEÞ function
using eight floating parameters and affecting the vicinity
of the E2 peak as well as just E1. It can be seen that only
marginal further improvement is obtained. This is
thought to be for two reasons. Firstly, the changes in
the height of the E2 peak, though similar in magnitude
to the E1 peak, are smaller as a percentage of the peak
height because the peak itself is bigger. Secondly, as the
effect of the local peak structure upon the rest of the
curve scales as ðE2 � E20Þ
�1 (from Eq. (3)), the E2 peak
clearly has less of an effect than E1 at lower photon
energies in the visible part of the spectrum.
4. Experimental details
4.1. Analysis of samples
In the present work, three sets of doped epitaxial SiGe
layers were grown, each with a nominally fixed Ge-
content but with the Boron levels varying from zero to
�1� 1020 cm�3. Two sets consisted of single-layer
films (�300 A thick) on c-Si substrates, the other
consisted of similar films capped with undoped �600 A
epi-Si layers.
The layers were deposited in an Applied Materials Epi
Centuras 200mm RTP chamber, using SiH4 and GeH4
as gas precursors and B2H6 for doping. Thicknesses were
measured by a conventional Philips DCD Pros XRD
tool, using Vegard’s law for calculating Ge content. This
ARTICLE IN PRESS
0.98
0.99
1.00
1.01
1.02
1.03
1.04
200 400 600 800
Wavelength (nm)
No
rmal
ized
ref
lect
ance
0.98
0.99
1.00
1.01
1.02
1.03
1.04
200 400 600 800
Wavelength (nm)
No
rmal
ized
ref
lect
ance
(a) (b)
0.98
0.99
1.00
1.01
1.02
1.03
1.04
200 400 600 800
Wavelength (nm)
No
rmal
ized
ref
lect
ance
(c)
Fig. 4. (a) Raw data (represented by individual points) for the reflectance of a doped Si film, with the calculated reflectance of an
undoped film superimposed (continuous line). The reflectance is normalized to that of an undoped Si reference sample, so that a
normalized reflectance of 1.0 corresponds to the reference film reflectance. Note the prominent feature at �365 nm corresponding to
the E1 peak energy of �3.4 eV. (b) The same raw data, with a calculated curve that incorporates a first-order modification to the �2ðEÞ
curve consisting of a simple suppression of the E1 peak. (c) The same raw data, with a calculated curve that incorporates higher-order
modifications to the �2ðEÞ curve affecting both the E1 and E2 peaks.
S. Morris et al. / Materials Science in Semiconductor Processing 8 (2005) 261–266264
ARTICLE IN PRESS
15
20
25
0.00 0.80 1.00 1.50 2.00
Doping level (from SIMS) X 1E20cm-3
% G
e
Do
pin
g p
aram
eter
(ar
b. u
nit
s)
%Ge (OP) %Ge (SIMS) Doping parameter
Fig. 5. Results for Germanium fraction and ‘‘doping parameter’’ for a set of single-layer SiGe films with varying doping levels (as
separately measured using SIMS). The SIMS results for Germanium fraction are also shown for comparison.
0
5
10
15
20
25
0 50% 75% 80% 100%
Doping level (% of Max)
% G
e
Do
pin
g p
aram
eter
(ar
b. u
nit
s)
%Ge Doping parameter
Fig. 6. Results for Germanium fraction and ‘‘doping parameter’’ for a set of SiGe films with varying doping levels buried under
�600 A Si caps. As no SIMS data was taken for these samples, the x-axis shows just the expected doping levels, where the maximum
doping level is �1� 1020 cm�3.
S. Morris et al. / Materials Science in Semiconductor Processing 8 (2005) 261–266 265
technique is, however, known not to be reliable for
measuring Germanium fractions of doped films [4].
Optical data from two of the sample sets (the capped
set and one of the uncapped sets) was collected on a
standard Therma-Wave Opti-Probes 5240 production
metrology tool in Atmel Fab 7, using the tool’s beam-
profile reflectometry (BPRs), broad-band spectropho-
tometry (BB) and spectroscopic ellipsometry (SE)
technologies. The third set was measured on an Opti-
Probe 7341 tool at Therma-Wave. In each case, only the
Broad-Band data was used for the modelling, for the
reasons cited in Ref. [1]. After the results had been
obtained, the set of uncapped samples measured at
Therma-Wave was sent to an independent laboratory
for SIMS analysis.
4.2. Modelling of results
The optical data from the samples was analyzed by
combining an alloy model for the undoped SiGe
material with a parameterized representation of the
D�2ðEÞ function. The best-fit solution was found by
simultaneously optimizing the Germanium alloy frac-
tion and the parameters representing D�2ðEÞ: Followingthe principle illustrated in Fig. 4, only the suppression of
the E1 peak was modelled.
4.3. Comparison with other techniques
Figs. 5 and 6 show the results for Germanium fraction
and doping parameter for each sample set. Fig. 5
ARTICLE IN PRESS
Table 1
Comparison between XRD and Opti-Probe measurements of
thickness for the single-layer SiGe films measured at Atmel
XRD (A) Opti-Probe,
no account
of doping
(A)
Opti-Probe,
with
doping
model (A)
Undoped 310 308 308
25% max 318 305 308
50% max 325 305 307
75% max 325 301 318
Max dopinga 332 300 329
aMax doping is �1� 1020 cm�3.
S. Morris et al. / Materials Science in Semiconductor Processing 8 (2005) 261–266266
incorporates the SIMS data for comparison. In each
case the Germanium fraction found by the Opti-Probe
was in good agreement with expectation, and the E1
peak suppression was found to follow a monotonic
relationship with changes in Boron concentration. In
Fig. 5 the agreement between the Opti-Probe and SIMS
is excellent for the doped samples, but there is a puzzling
discrepancy for the undoped sample where the Opti-
Probe measurement had been calibrated to match with
XRD. Although the latter technique is not considered
reliable for %Ge of doped films, a comparison was
made between the layer thickness measurements on the
Opti-Probe and by XRD for the single-layer films
measured at Atmel, and the new model was found
greatly to improve the matching as shown in Table 1.
5. Conclusions
It has been shown that, by the application of a novel
data analysis technique which exploits a fundamental
principle of optical physics, we can decouple the effects
on the optical properties on SiGe of varying Ge-content
and B-doping level and hence determine both quantities,
together with the film thickness, simultaneously. The
method has been demonstrated both for single-layer
films and for more typical structures incorporating an
epitaxial Si cap.
Acknowledgements
We would like to express particular thanks to Heath
Pois and Jon Opsal of Therma-Wave Inc. for many
stimulating discussions, and to Laurent D’Emmanuele
of Atmel for assistance in characterizing the samples
used in this work.
References
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Proceedings, Vol. 683. College Park: AIP; 2003.
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