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SEP/2011
SHIELD CAN CLIP ENGINEERING GUIDE
2
Shield Can Clip (PTC Series)
[ Major Application ]
- CELLULAR PHONE - PMP - WIBRO USB DONGLE - GPS MODULE - NAVIGATION - HSUPA / HSDPA module - MP4 - PON - HIPASS - UMPC
[ Key Features ]
Efficient use of the PCB space To increase productivity by mounting the Clip automatically Reduction in the term and the expense for the development by removing the frame Cost reduction Efficient purchase by standardization Easy repairs
3
Product Overview
Part Name Size
H x W x L
Packing (Reel)
Shield can Thickness
Plating Mat’l Customer
PTC0703B 1.28 x 0.8 x
6.5 10,000 0.15~0.20 Sn SUS
SAMSUNG MOBILE,SAMSUNG COMPUTER, LG MOBILE,KTFT,PANTECH,KYOCERA
PTC0703C 1.28 x 0.8 x
6.5 10,000 0.3 Sn SUS SAMSUNG MOBILE,LG MOBILE
PTC0704 1.28 x 1.1 x
6.5 10,000 0.15~0.20 Sn SUS
SAMSUNG MOBILE,SAMSUNG TV, SAMSUNG LCD,LG DISPLAY
PTC0704A 1.28 x 1.1 x
6.5 10,000 0.3 Sn SUS SAMSUNG MOBILE,SAMSUNG NETWORK
PTC0801 1.28 x 1.1 x
3.9 10,000 0.2~0.3 Sn SUS SAMSUNG MOBILE
PTC0703D 1.15 x 0.8 x
6.5 10,000 0.15~0.2 Sn SUS
SAMSUNG MOBILE,SAMSUNG COMPUTER, LG MOBILE,PANTECH,SKT,FOXCONN
PTC0703E 1.15 x 0.8 x
6.5 10,000 0.3 Sn SUS SAMSUNG MOBILE
PTC0901 1.20 x 1.1 x
6.5 10,000 0.4 Sn SUS SAMSUNG MOBILE
PTC0706 (EMBOSS)
1.28 x 1.0 x 6.5
10,000 0.15~0.2 Sn SUS SAMSUNG NETWORK,ZTE
PTC3121N 0.8 x 0.8 x
4.4 10,000 0.2 Sn SUS
SAMSUNG MOBILE,QUALCOMM LG ELECTRONICS
PTC1121N 0.8 x 0.8 x
4.4 10,000 0.15 Sn SUS
SAMSUNG MOBILE LG ELECTRONICS,PANTECH
Embossing Clip is an advanced type of Clip that is designed to strengthen the retention force by adding Embossing on the joint part.
4
Application example
HOLE
Shield Can Clip
Embossing Clip
Embossing
5
Appilcation note
Big size shield can which cover whole PCB had better separate to 2 piece of shield can.
The minimum gap size between clip and clip is 0.3mm.
The clip pad keeps 0.5mm distance from PCB edge.
Clip should be separated from Magnetic strip components as far as possible.
When the gap size between shield Can and plastic cover is less than 0.2mm, it is perfect for drop test.
6
Underfill
When you artwork clip at near memory chip
1) in case of sealing with “resin”, keep 0.4mm distance from IC
2) in case of no sealing, 0.15~0.2mm distance from IC is enough
* Sealing with Resin,
they call “ underfill” for protecting memory on drop test
7
Clip placement
Case 1) when designing PCB with 4 pcs of clip
Do not place the clip at the center position.
Because it is not perfect for drop test and
inserting shield can by manual.
Recommended placement)
It is good for assembly and drop test
8
Clip placement
Case 2) artwork with 6 pcs of clip
Case 3) artwork with 10pcs of clip especially in RF part
More clip is better for EMI shielding
9
Clip application note
Case 4) With screw
When designing PCB with big shield can, you can use clip and
screw at the same time
Screw hole
10
Application example for base band
As you can see, you can use the PCB space efficiently in base band part.
11
Clip placement guide considering noise emmission
Clip should be placed within 20mm distance not to affect the wireless sensitivity
Without SHIELD CAN
SMT SHIELD CAN
CLIP
GSM850 110dBuV 93dBuV 90dBuV
PCS 105dBuV 80dBuV 82dBuV
• according to the evaluation result, both have same shield effectiveness.
- If shield can side length is less than 20mm, then clip should be placed at center. - When you consider assembly, clip should be placed within 5mm distance from corner. - Clip should be placed at shortest distance from hot spot.
Part Name Size
H x W x L A B
A’ (space size)
B’ (space size)
PTC0703 Series 1.28 x 0.8 x 6.5 0.25mm 6.5mm 0.3mm 7mm
PTC0704 Series 1.28 x 1.1 x 6.5 0.25mm 6.5mm 0.3mm 7mm
PTC0801 1.28 x 1.1 x 3.9 0.25mm 3.9mm 0.3mm 4.3mm
PTC3121,1121N PTC1001,1002
0.8 x 0.8 x 4.4 0.15mm 4.4mm 0.20mm 4.8mm
PTC0706 1.28 x 1.0 x 6.5 0.15mm 6.5mm 0.20mm 7mm
PTC2030 0.6 x 0.6 x 6.5 0.1mm 6.5mm 0.15mm 7mm
0.3mm
0.2mm
7mm
4.8mm
A’ A’
B’
B’
B
B
A
A
Remain space size of each clip
12
Part Name
Height from
ground
PCB Lay Out
Solder Mask Lay Out(%)
Part Name
Height from
ground
PCB Lay Out
Solder Mask Lay Out(%)
PTC 0703 Series
0.25 PTC0706 0.15
PTC 0704 Series
0.25
PTC3121NPTC1121N
PTC1001PTC1002
0.15
PTC 0801
0.25 PTC2030 0.1
Soldering Recommend(Mask 0.1T)
13
14
Appendix
Item Spec Method Result
Peeling strength
(Lateral force) - More than 3 kgf
- Max : 5.2 kgf - Min : 4.2 kgf - AVG : 4.6 kgf
Flexural Strength
(Twist test)
- Do not drop out
(twist 1mm) Good
Insertion/
Retention force
- Insertion force : less than 1,000g - retention force : more than 60g
- measure the force after 10 cycles(inserting and pulling out) ( Can Thickness : 0.2T )
-Insertion force : 420 g -retention force : 118 g
Contact
resistance - 100 mΩ Max - After inserting shield Can
- Max : 34 mΩ - Min : 26 mΩ - AVG : 30 mΩ
PCB
Push
GageClip