SFH 4940

1 Version 1.2 | 2018-05-22

Produktdatenblatt | Version 1.1 www.osram-os.com

SFH 4940

Array Linear Infrared Emitter Arrays (940 nm)

Applications — Industrial Automation (Machine controls, Light barriers, Vision controls)

Features: — Package: black epoxy

— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

— Wavelength 950nm — Leadframe arrays, available from 2 to 10 Emitters per array — Short switching times — Same package dimensions as BPX 80 series — Miniature package

Ordering Information

Type Radiant intensity 1) Radiant intensity 1) Ordering Codetyp.

IF = 40 mA; tp = 20 ms IF = 40 mA; tp = 20 msIe Ie

SFH 4940 16 ... 125 mW/sr 50 mW/sr Q65111A6687

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Maximum RatingsTA = 25 °C

Parameter Symbol Values

Operating temperature Top min. max.

-40 °C 80 °C

Storage temperature Tstg min. max.

-40 °C 80 °C

Reverse voltage 2) VR max. 12 V

Forward current IF max. 40 mA

Surge current tp ≤ 40 µs; D = 0 

IFSM max. 1 A

Power consumption Ptot max. 70 mW

ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

VESD max. 2 kV

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CharacteristicsIF = 40 mA; tp = 20 ms; TA = 25 °C

Parameter Symbol Values

Number of emitters n 10

Dimension “B” (see drawing) l min. max.

24.8 mm 25.2 mm

Peak wavelength λpeak typ. 950 nm

Centroid wavelength λcentroid typ. 940 nm

Spectral Bandwidth at 50% Irel,max ∆λ typ. 42 nm

Half angle φ typ. 10 °

Dimensions of active chip area L x W typ. 0.3 x 0.3 mm x mm

Distance chip surface to lens top H min. max.

1.3 mm 1.9 mm

Rise time (10% / 90%) IF = 40 mA; RL = 50 Ω

tr typ. 12 ns

Fall time (10% / 90%) IF = 40 mA; RL = 50 Ω

tf typ. 12 ns

Forward voltage VF typ. max.

1.35 V 1.7 V

Forward voltage IF = 1 A; tp = 100 µs

VF typ. max.

3.6 V 4.6 V

Reverse current 2) VR = 5 V

IR max. typ.

10 µA 0.01 µA

Total radiant flux 3) Φe typ. 30 mW

Radiant intensity 1) IF = 1 A; tp = 40 µs

Ie typ. 520 mW/sr

Temperature coefficient of brightness TCI typ. -0.3 % / K

Temperature coefficient of voltage TCV typ. -0.8 mV / K

Temperature coefficient of wavelength TCλ typ. 0.3 nm / K

Thermal resistance junction ambient real 4) RthJA max. 750 K / W

Thermal resistance junction solder point real 5) RthJS max. 650 K / W

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8000

nm

%

OHF04134

20

40

60

80

100

Irel

λ850 900 950 1025

Relative Spectral Emission 6), 7) Irel = f (λ); IF = 40 mA; tp = 20 ms

OHF05663

0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0100˚

90˚

80˚

70˚

60˚

50˚

0˚10˚20˚30˚40˚

0

0.2

0.4

0.6

0.8

1.0ϕ

Radiation Characteristics 6), 7) Irel = f (φ)

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OHF05660

310

Ιe

(40 mA)e

Ι

FI102110100 mA

10-2

10-1

100

101

210

Relative Radiant Intensity 6), 7)

Ie/Ie(40mA) = f (IF); single pulse; tp = 40 µs

0

I

OHF05642

F

VF

mA

V

102

310

010

110

1 2 3 4

Forward current 6), 7)

IF = f (VF); single pulse; tp = 40 µs

210-1-2-3-4-5 1010 1010 10tp

10 10s100

TtA

IF D = IP

T

F

PtOHF05662

10.5

0.01

0.050.10.2

0.02

0.005D =

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.1

Permissible Pulse Handling CapabilityIF = f (tp); duty cycle D = parameter; TA = 25°C

00

˚CTA

FImA

OHF05661

20 40 60 80 100

5

10

15

20

25

30

35

40

45

Max. Permissible Forward CurrentIF,max = f (TA); RthJA = 750 K / W

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Dimensional Drawing 8)

Approximate Weight: 278.0 mg

Package marking: Cathode

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Recommended Solder Pad 8)

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TTW SolderingIEC-61760-1 TTW

00

s

OHA04645

50

100

150

200

250

300

t

T

˚C

235 ˚C - 260 ˚CFirst wave

20 40 60 80 100 120 140 160 180 200 220 240

Second wave

10 s max., max. contact time 5 s per wave

Preheating

T∆

100 ˚C120 ˚C130 ˚C

Typical

Cooling

ca. 3.5 K/s typical

ca. 2 K/s

ca. 5 K/s

Continuous line: typical processDotted line: process limits

< 150 K

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NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.

For further application related informations please visit www.osram-os.com/appnotes

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Disclaimer

DisclaimerLanguage english will prevail in case of any discrepancies or deviations between the two language word-ings.

Attention please!The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version in the OSRAM OS Webside.

PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.

Product safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-nate the customer-specific request between OSRAM OS and Buyer and/or Customer.

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Glossary1) Radiant intensity: Measured at a solid angle of Ω = 0.001 sr2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-

tion is not allowed.3) Total radiant flux: Measured with integrating sphere.4) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each5) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.

metal block)6) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data

or calculated correlations of technical parameters can only reflect statistical figures. These do not nec-essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

7) Testing temperature: TA = 25°C8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and 

dimensions are specified in mm.

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