Server Memory Forum Shenzhen 2012

Contents

1. Trends

2. Markets

3. Requirements

4. Solutions

Big

Iro

nBig

Client

Evolution of IT Infra Architecture

Powerful PC The CloudMainframeServer-Client

The Web : Thin client

The Cloud : Server-Client reintroduced

Cloud with rich clients model driven by increasing power of

Internet-connected devices and the cost-utilization incentives

Context awareness

User experience

Application

responsiveness

Cost reduced byclient utilization

The Cloud : Boundaryless Society

E-mail, SNS, audio/video and collaboration services through virtualized, highly scalable servers blur boundaries

Cloud Infra: Data Center

Family

Friends

Office Connection

The Cloud is growing fast in China

0

200

400

600

800

1,000

1,200

1,400

1,600

1,800

2,000

2009 2010 2011 2012 2013 2014 2015

Total number of x86 server market shipments

Number of servers used in public cloud

China surpassed Japan after 2010 world economic crisisshowing rapid growth of x86 server used in public cloud.

Top 3 Server Markets

(Source : Gartner 2011 Q4) (Source : Gartner 2011 Nov.)

Cloud Growth in China

0

5,000

10,000

15,000

20,000

25,000

2009 2010 2011 2012 2013 2014 2015

US Japan China

revenue [m

illio

ns o

f dolla

rs]

k u

nit s

hip

ment

China > Japan

CAGR=16.9%

CAGR=36.5%

0

5,000

10,000

15,000

20,000

25,000

30,000

35,000

40,000

45,000

50,000

2008 2009 2010 2011 2012 2013 2014 2015

x86 Non x86 (RISC, IA64, others)

Mid-term Sever Market Forecast

x86 server continues proliferating for horizontal scalability. (e.g. the cloud, virtualization) But non-x86 still significant for RAS

& vertical scalability. (e.g. core infrastructure, database)

revenue [m

illio

ns o

f dolla

rs]

(Source : Gartner 2011 Q4)

CAGR=6.7%

Server Revenue by Platform Forecast on x86 Data Center

(Source : IDC 2011 Sep., Hynix)

0

2,000

4,000

6,000

8,000

10,000

12,000

14,000

2010 2014

k u

nit s

hip

ment

Total x86 Server

DC for Enterprise

DC for Cloud11%17%

Big data market can get very big

Forbes.com recently showed a groundbreaking report of forecasting astounding CAGR 58% of big data market reaching $50 billion revenue by 2017. (HW, SW, Services included)

(Source : Forbes.com/Wikibon 2012 Feb)

Requirements for Memory

Highly Parallel Workloads(HPC, Mission Critical)

Light weight workloads(Web Hosting, Contents Delivery)

Standard Workloads

High Density

Scalable PerformanceLow Power

Small Form FactorLow Power

DDR4 as Server Optimized Solution

DDR4 Feature Breakdown

Server

Common

Client

45%

CRCCA Parity

MPRMRS Readout

Fine Granul RefreshTCAR

Max Pwr Saving0.5KB Page

3DSPDA

DBIBoundary Scan

Bank GroupSelf Ref AbortGear Down

Internal VrefDQPASRTCSRCAL

VDDQ Term

Reliability

High Density

Performance

CRC (Cyclic Redundancy Check)

CA Parity (CMD/ADDR Parity)

TCAR (Temperature Compensated Auto Refresh)

MPR (Multi Purpose Register)

PDA (Per DRAM Addressability)

3DS (3 Dimensional Stack)

More than 40% of the new features were derived from server requirements.

Hynix DDR4 Development Status

30nm class 2Gb DDR4 was developed in Q1’11 with the lasted JEDEC spec at the time.

Hynix plans to mass produce JEDEC compliant 20nm class 4Gb DDR4 in 1H’13.

DDR SDRAM Supply Voltage Trend

0

0.5

1

1.5

2

2.5

200120022003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

2.5V

1.8V

1.5V1.35V

1.25V1.2V

1.0xV

DDR

DDR2

DDR3DDR3L

DDR3UDDR4

Su

pp

ly V

olta

ge

[V

]

DDR4L

Year

17%/4years?

25%/3years

17%/4years

17%/4years

DDR4L of 1.0xV anticipated in 2016 if the supply voltage trend can be maintained.

Ultra Low Voltage Operation at 1.0V

tCK vs VDD Shmoo

Passed at 1.0V 2400Mbps

VDD range for DDR4 Spec

Ultra low voltage operation of 2400Mpbs at 1.0V was verified on ATE level with 30nm class 2Gb DDR4.

40% Power Saving compared to DDR3

30nm class 2Gb DDR4 achieved 40% power saving and 35% standby current saving compared to 1.5V DDR3-2133.

40%

60%

80%

100%

IDD0 IDD2N IDD4R IDD4W IDD5 IDD6N

-40% -35%

3xnm 2Gb D3 vs D4 Power

*based on IDD measured at 2133Mbps

3xnm 2Gb D3 vs D4 IDD

*with CAL (CS to ADDR/CMD Latency) enabled

DDR3

DDR4

DDR3

DDR4

DDR4 Bank Group for Performance Scaling

0.0%

5.0%

10.0%

15.0%

20.0%

25.0%

533 667 800 933 1066 1200 1333

Ba

nd

wid

th Im

pro

ve

me

nt o

ve

rt

Data Rate [Mbps]

16 banks’ performance improvement over 8 banks

(1 Rank, Open-page)

(Source : Memory Systems, Cache/DRAM/Disk)

Bank grouping enhances performance by more than 30% providing gapless read operations with 16 banks.

> @ 2133Mbps

tCK 0.83ns(DDR2400)

Read Read Read Read Read Read

gapless read (tCCD=4nCK) @ 2400Mbps verified w/ BG

DDR4 CRC for Reliability on Data

tCRC_ALERT_PW

1.9ns

RD

MRSRDOUT_EN

MRSRDOUT_DIS

With CRC Error clear

ACTWT PRE

MRSRDOUT_EN

RD

CRC Error

tCRC_ALERT

tCRC_ALERT_PW

CRC provides error detection capability on data channel reducing BER.

CRC Alert Latency & Pulse Width Shmoo CRC Functionality Check on ATE

DDR4 CA Parity for Reliability on C/A Bus

Alert Latency & Pulse Width Shmoo Functionality Check on ATE

Active MRSREADOUTRD

MPR0

MPR1

MPR2

MPR3

RDRDRD

PARITY Error from Active command

CA Parity provides error detection on command/address bus with debug capability using MPR readout

tPAR_ON

tPAR_PW

3DS as High Density Solution

More than 1 TB of memory per CPU socket is possible with 4Hi 8Gb 3DS DDR4 based 128GB LRDIMM, which can

address SI concern on both data and c/a.

But cost challenge remains to be solved across industry.

128GB 128GB 128GB

128GB 128GB 128GB

128GB 128GB 128GB

128GB 128GB 128GB

Hynix 3DS Development

Several types of 3DS have been explored with 40nm class 2Gb DDR3 ranging from 8GB/16GB RDIMM to 16Gb PKG

Hynix has no plan for 3DS DDR3 and anticipates mass production of 3DS in DDR4

16Gb PKG (2Gb 8Hi) 8GB RDIMM (2Rx4)

3DS saves power. A lot

40nm class 2Gb 3DS 16GB DDR3 confirmed that it can drop to power a level equivalent to 8GB module.

4xnm 8GB DDR3 (2Rx4)

4xm 16GB DDR3 (4Rx4) 4xnm 16GB 3DS DDR3

(Source : IBM)

Hynix Small Form Factor Module

Hynix provides ECC-SODIMM, ULP mini UDIMM, VLP ECC UDIMM as small form factor solutions.

Network system

Small form factor

Server

Embedded system

ULP Mini-IMM

VLP ECC UDIMM

ECC SODIMM

Summary

IT infra architecture and market forces have shifted toward the Cloud, and China has become a very important part of server market.

Server optimized DDR4 will be introduced very soon capable of providing low power and scalable performance solution.

3DS will be able to answer the needs from big data market. But it may take time for cost challenge of

higher stack to be resolved.