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2007/11/16 System Arch 2007 (Fire Tom Wada) 1
SEMICONDUCTOR TECHNOLOGY-CMOS-
Fire Tom Wada
2007/11/16 System Arch 2007 (Fire Tom Wada) 2
What is semiconductor and LSIs
Huge number of transistors can be integrated in a small Si chip.The size of the chip is roughly the size of nails.Currently, 10M transistors can be integrated.1000 times integration comparing to 20 yrs ago.The cost of the chip is roughly same.All electronic equipments are powered by LSIs.PCs, Cellular phones, 3D graphics, Internet.
2007/11/16 System Arch 2007 (Fire Tom Wada) 3
PC mother board
Large Scale Integration
2007/11/16 System Arch 2007 (Fire Tom Wada) 4
SONY PLAYSTATION 2 MAINBOARD
Rendering LSI
High Speed Memory
Graphics LSI
Direct RDRAM
2007/11/16 System Arch 2007 (Fire Tom Wada) 5
Mobile Phone Mobile Phone MainboardMainboardMemory, Logic, Analog
2007/11/16 System Arch 2007 (Fire Tom Wada) 6
Key device is LSI
INTEL Pentium III module
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This is a packaged LSI-Pentium III 300MHz Cache LSI-
20 mm
15 mm
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Si chip is molded in the package.
2 million transistor Chip is connected to the pins thru
wires.
2007/11/16 System Arch 2007 (Fire Tom Wada) 9
6 inches Si wafer
2007/11/16 System Arch 2007 (Fire Tom Wada) 10
8 inches Si wafer
Hundreds of Chips
on a Si Wafer
2007/11/16 System Arch 2007 (Fire Tom Wada) 11
Several hundreds of chips are fabricated on a wafer simultaneously.
2007/11/16 System Arch 2007 (Fire Tom Wada) 12
Chip photo- Motion Estimation Chip for HDTV camera -
9.1 mm
Your small finger’s nail size.
200M transistors.
8.6 mm
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Scanning Electron Microscope photo- Cross-section of the LSI -
0.5 micron
2007/11/16 System Arch 2007 (Fire Tom Wada) 14
Structure Of CMOS LSI
IsolationPN-Isolation, Local oxidation
Si SubstrateBulk, epitaxial , SOI
Well StructureN-type well in P-type Substrate
Latch UpPNP Bipolar Transistor and NPN Bipolar Transistor
Fabrication Process Technology
2007/11/16 System Arch 2007 (Fire Tom Wada) 15
Cross-section of the LSIMetal wiring
N-type well
N+ N+ P+ P+
Poly-silicon Poly-silicon
P-type MOS transistorN-type MOS transistor
P-type Si substrate
Si wafer
2007/11/16 System Arch 2007 (Fire Tom Wada) 16
Advanced Process Development
Transistor module (FEP)
65nm
Lithography(VUV, EPL)Mask
CMPplanarization
Low Resistance Contact withHigh Aspect ratio
High κGate insulator
Fine Cu interconnect
Low κinterdielectric
SiGe/Metal gate
Multi-level MetalizationModule(BEP)
Low Resistance Ultra shallow junction
Low stress Shallow Trench Isolation
2007/11/16 System Arch 2007 (Fire Tom Wada) 17
LSI integration trend- Moore’s law -
WideWide--TV, PHS phoneTV, PHS phone
DVD player
DVD-ROM
DVD-RAM
DVD recorder
Source: SEMATEC
81
10B
1B
100M
10M
1M
100K
10K
1K
83 85 87 89 91 93 95 97 99 01 03 05 07 09
0.8 0.5 0.3 0.18CHANNEL LENGTH (MICRON)
0.13
Digital HDTV receiver
Nu
mbe
r of
tra
nsi
stor
s on
a c
hip
The number of transistors are increasing
by 58% per year.
- Moore’s Law -
2007/11/16 System Arch 2007 (Fire Tom Wada) 18
Communications and Consumer Products Drive Semiconductor
35%
30%
25%
20%
15%
10%
5%
0%0% 5% 10% 15% 20% 25% 30% 35%
CAGR % (1997-2002)
SemiconductorIndustry
Ap
pli
cati
on
Mark
et
Gro
wth
3rd Generation
2nd Generation
1st Generation
ColorTV
ColorTV
CarRadioCar
Radio
VideoCameraVideo
Camera
PortableComputingPortable
ComputingSwitching& LAN
Switching& LAN
HDTVHDTV
MultimediaPC
MultimediaPC
Advanced DesktopPC and WorkstationAdvanced Desktop
PC and Workstation
AutomotiveApplications/GPS
AutomotiveApplications/GPS
DVDPlayerDVD
Player
Set-TopBox
Set-TopBox
Internet Game Consoles
Internet Game ConsolesSmart
Cards/KiosksSmart
Cards/KiosksSmart
Appliance-PhoneSmart
Appliance-Phone
Digital CameraDigital Camera
40% 45% 50% 55%
40%
45%Cellular PhonesCellular Phones
SC Content (As % of Equipment Cost)Sources: Applied Materials Corporate Marketing estimates, Dataquest
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Fabrication Process Issues
2007/11/16 System Arch 2007 (Fire Tom Wada) 20
Ultra Clean Room
2007/11/16 System Arch 2007 (Fire Tom Wada) 21
Layer Deposition
lithography
etching
cleaning
Basic LSI process
SEM photo of Logic LSIs
M1
M2
M3
M4
M5
M6
M7
2007/11/16 System Arch 2007 (Fire Tom Wada) 22
Light Source
Lens
MaskAA A A A A A A A A A A A A A
A A A A A A A A A A A A A AA A A A A A A A A A A
Si Wafer
Y
Stage
Lens
X
Projection
2007/11/16 System Arch 2007 (Fire Tom Wada) 23
Packaging & Test
Final Test I
Burn-In
Ex.)Vcc:7V,Temp.:125℃, 24~42hrs
Shipping TestFinal Test II
Functional Test,DC/AC Test
Functional Test(at Speed),DC/AC Test
Pre Test
Wafer Test
scribing
Chips
Mounting
Bonding
Enclosing
marking
Ass
embl
y Fl
owWafer
Remove Process defect Chips
TestingFunctional Test,DC Test
Sample
2007/11/16 System Arch 2007 (Fire Tom Wada) 24
Large Scale Integration
NMOS , PMOS and WiringAll Logic Function can be madeMemory Element Can be made
Billions of Transistors and wiring make LSI!
2007/11/16 System Arch 2007 (Fire Tom Wada) 25
CMOS NOT (Inverter)
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CMOS NAND と NOR
011
101
110
100
fBA
011
001
010
100
fBA
2007/11/16 System Arch 2007 (Fire Tom Wada) 27
Classification Of LSI1. Logic LSI: Micro Processor, Digital Signal Processor (DSP), FPGA2. Memory LSI: RAM (DRAM, SRAM), ROM (Flash Memory)3. Analog LSI: ADC, DAC, Filter, Amplifier
Micro Processor (PC’s central processing Unit)Perform Digital computation according to the program in MemoryIntegration in 7000 times in 25 years, (Moor’s Law) Clock Speed : 700 times in 25 years
Memory LSI:Dynamic Random Access Memory: Main memory for Computer, 4-times density in 4 yearsStatic Random Access Memory : work memory for mobile equipmentsFlash Memory : Nonvolatile memory , Digital Camera Storage
Analog LSI: Used for interface, high speed RF interface, Analog to Digital Conversion, Digital to Analog Conversion
2007/11/16 System Arch 2007 (Fire Tom Wada) 28
Analog to Digital Conversion
ADC LSI
Analog to Digital
Sample the analog wave
Convert to Digital format in Binary
Same as f(t) to AnContinuous time
Discrete time
2007/11/16 System Arch 2007 (Fire Tom Wada) 29
Chip photoSoC Flash Memory