Semiconductor Industry Outlook & SEMICON Update

March 16, 2011

Agenda

• Semiconductor Industry Outlook• SEMICON Show Update

- Taiwan & South East Asia- Other Regions

Semiconductor Industry OutlookDaniel Tracy, Sr. Director, Industry Research & Statistics

March 16, 2011

Overall Market Outlook

Semiconductor Industry Outlook:2010 was a Record Year

150

204

139 141166

213228

248 256 249226

298319 330

$0$25$50$75

$100$125$150$175$200$225$250$275$300$325$350$375

1999

2000

2001

2002

2003

2004

2005

2006

2007

2008

2009

2010

2011

F

2012

F

-50%

-25%

0%

25%

50%

75%

100%

Semiconductor Revenue Annual Growth

Source: SIA/WSTS historical year end reports, SIA November 2010 Forecast

Glo

bal S

emic

ondu

ctor

Rev

enue

US

$B

(bar

gra

ph)

Ann

ual G

row

th %

(lin

e gr

aph)

2011 Semiconductor Revenue Forecasts

Source: SEMI

4.6%

5.1%

6.0%

6.0%

8.0%

8.1%

10.0%

11.0%

4.5%

0% 2% 4% 6% 8% 10% 12%

WSTS (Nov 10)

Gartner (Dec 10)

iSuppli (Oct 10)

SIA (Nov 10)

Future Horizons (Dec 10)

Semico Research (Jan 11)

VLSI Research (Jan 11)

IC Insights (Jan 11)

Henderson Ventures (Mar 11)

Semiconductor Investments

Worldwide Fab Capacity: Expansion Rebounds

Worldwide Installed Capacity(without Discretes)

13%

1%3%

10%

14% 15%

23%19%

8%

-4%

7%9%7%

-4-202468

1012141618

2000

2001

2002

2003

2004

2005

2006

2007

2008

2009

2010

2011

2012

Source: SEMI World Fab Database Reports (February 25, 2011)

In Millions200mm Equivalent

wafers/month

-6%-4%-2%0%2%4%6%8%10%12%14%16%18%20%22%24%26%

Change in %

Taiwan

SE Asia

S. Korea

Japan

Europe &MideastChina

Americas

Change

300 mm Fab Investments:Lead the Capacity Growth

199920

00200120

02200320

04200520

06200720

08200920

102011

S.KoreaTaiwan

JapanAmericas

ChinaSE Asia

Eur&M.East

0100200300400500600

700

800

900

1000

Thousands Wafers/month

300 mm Installed Capacity

Source: SEMI World Fab Forecast November 2010

Equipping Fabs: Top Spenders

Companies that spend over $900M/Year on equipment

p spenders (including JVs, alliances and recent mergers), based on share of known contribut

Share of total WW

2006 2007 2008 2009 2010 2011 20129 10 6 3 9 9 9

Samsung Samsung Samsung Samsung Samsung Samsung SamsungIntel Intel Intel Intel Intel Intel Intel

Hynix Hynix Hynix Hynix Hynix HynixTSMC TSMC TSMC TSMC TSMC TSMC

Powerchip Powerchip Globalfoundries Globalfoundries Globalfoundries Globalfoundries Globalfoundries

Sony Toshiba Toshiba Toshiba Toshiba Toshiba Toshiba

UMC UMC UMC Elpida Elpida

Micron Micron Micron Micron Micron Micron SMIC SMIC NanYa NanYa

65% 71% 60% 49% 73% 75% 79%

SEMI World Fab Forecast Database Reports (February 25, 2011

SEMI® Equipment Forecast (update)By Market Region

Source: SEMI, March 2011

Totals may not add due to rounding

$0$5

$10$15$20$25$30$35$40$45$50

N. America Japan Taiwan Europe S.Korea China ROW

ROW 3.05 2.61 1.44 3.85 4.31 4.89China 2.92 1.89 0.94 3.64 4.12 5.30S.Korea 7.35 4.89 2.60 8.33 8.05 9.54Europe 2.94 2.45 0.97 2.32 3.24 4.37Taiwan 10.65 5.01 4.35 11.20 11.60 10.34Japan 9.31 7.04 2.23 4.45 5.28 4.88N. America 6.55 5.63 3.39 5.75 9.21 7.82

2007 (A) 2008 (A) 2009 (A) 2010 (A) 2011 (F) 2012 (F)

US$

Bill

ions

$15.92

$39.54

$29.52

$45.81$42.77$47.14

SEMI® Equipment Forecast (update)By Segment

$0$5

$10$15$20$25$30$35$40$45$50

Wafer Process Assembly & Pack. Test Other

Other 2.92 2.00 1.11 1.99 2.03 2.30Test 5.05 3.45 1.55 4.15 3.76 4.08Assembly & Pack. 2.84 2.04 1.41 3.88 2.97 3.31Wafer Process 31.95 22.03 11.84 29.53 37.05 37.45

2007 (A) 2008 (A) 2009 (A) 2010 (A) 2011 (F) 2012 (F)

US$

Bill

ions $29.52

$15.92

$39.54$45.81

Totals may not add due to rounding

Source: SEMI, March 2011

$42.77$47.14

Regional Silicon Forecast:Asia-Pac’s share is >50%

Source: SEMI SMG through 2010; SEMI forecast

Total Silicon Area Shipments

01,0002,0003,0004,0005,0006,0007,0008,0009,000

10,00011,000

1995

1996

1997

1998

1999

2000

2001

2002

2003

2004

2005

2006

2007

2008

2009

2010

2011

F20

12F

Mill

ions

of S

quar

e In

ches

North America Japan Europe Asia Pacific

Includes polished and epi wafers. Excludes non-polish, reclaim and SOI.

LED dedicated FabsChanging LED Landscape:

4 5 7

6 15 57

1 2 5

7 10 13China

Japan

SKorea 4 9 14

SEAsia 0 0 2

Taiwan 13 22 39

664,800

35

2001

Capacity in 2-inch EQs w/m

Count Volume fabs

Year (begin operation)

1,639,200

63

2006

6,844,256

137

2011 (est)

Americas Europe/Mideast

Source: SEMI Opto/LED Fab Forecast, February 2011

Fab Investments and Activities

Taiwan Fab Capacity – Foundry to drive capacity growth

Source: SEMI World Fab Forecast, Feb. 2011

0

200

400

600

800

1,000

1,200

1,400

1,600

1,800

2,000

8" equiv wafer K

/month

2007 2008 2009 2010 2011 2012

Taiwan Fab Capacity - Foundry & DRAM

AnalogDiscreteFoundryLogicMemoryMEMSOther

Foundry Capacity Trend – Taiwan Leads the pack

Source: SEMI World Fab Forecast, Feb. 2011

0

500,000

1,000,000

1,500,000

2,000,000

2,500,000

3,000,000

3,500,000

4,000,000

4,500,000

5,000,000

2007 2008 2009 2010 2011 2012

Worldwide Foundry Capacity Trend

TaiwanSE AsiaKoreaJapanEurope & MideastChinaAmericas

Taiwan Fab Spending – Foundry & DRAM-driven

Source: SEMI World Fab Forecast, Feb. 2011

2711

8380

1576

3641

2777

1130 6237

3920

8074

2320

6930

3155

0

2000

4000

6000

8000

10000

12000

US$ M

illion

2007 2008 2009 2010 2011 2012

Taiwan Fab Spending by Product Type

OtherMEMSMemoryLogicFoundryDiscreteAnalog

Taiwan Foundry: 2011 Spending Remains Strong

• Taiwan foundries’ fab spending reached a record level of $6.7B in 2010 and we expect overall spending to exceed $8.7 billion this year.

• Aggressive capacity plan and technology roadmap continue to drive foundry’s investment.

• With 28 nm/40 nm technology investment, foundry sector is expected to outgrow overall semiconductor market.

• Market dynamics: IDM’s fab-lite strategy and the surging demand for mobile devices continue to drive foundry business.

TSMCCAPEX• 2010 capex at $5.9 billion; $5.8B for foundry business and $100M for new business

(PV and LED)• 2011 capex is planned at $7.8B (+32% YoY), while 81% of that will dedicate to

65nm/40nm/28nm technology and also 20nm/14nm development.

Production & Capacity• Demand remains certain for specialty technology and advanced nodes. • Strong capacity growth to continue in 2011, with 300mm capacity expected to

grow 35%.• LED lab & fab is almost completed. PV fab will be completed in mid 2011.

Technology development• 28 nm adoption is faster than 40nm at the similar stage. • New projects in 2011 pipeline will include development of 28 nm, 20 nm, 14 nm,

10 nm and even 7 nm nodes.• 450mm fab plan revealed with pilot line planned at Fab 12 P6 in 2013/2014 and

volume production line at Fab 15 P5 in 2015/2016.

UMC

Fab investments• Similar capex level of $1.8B in 2010 and 2011• Continue to add capacity for 65/55nm at Fab 12i• Production has started at Fab 12A P3/P4 • Fab12A investment includes 40/45 capacity and 28 nm development.

Production ,Technology & Capacity• 40/45nm revenue contribution will increase quarter by quarter to

reach 10% in second half of 2011.• 28nm pilot will start in mid 2011 and mass production scheduled in

2012.• Overall 12” capacity will grow 25% in 2011.

DRAM: 3x/4xnm Nodes Transition

• With the recent weakness of PC market and cannibalization of tablet devices, DRAM sector slows down in 2H10.

• Nodes transition plans to 40 nm class and below are somehow disturbed by fast price erosion with some accelerating their migration and others may delaying.

• Taiwan DRAM sector would only show technology buy rather than capacity buy in 2011.

• The availability of immersion tools remains the bottleneck of technology migration and capacity expansion plan.

Inotera

Production• Wafer shipments reached 275K in 4Q10 (300mm-equiv.), up 20%

quarter over quarter• Bit growth in 1Q11 is expected to be 40%-50% QoQ due to

42/50nm ramp.

Technology & Capex• Capex to come down from $1.75B in 2010 to $560M in 2011. • Majority of required immersion tools for 130K capacity (42 nm)

are installed and in production.• Plan to fully convert the vast majority of wafer starts to 42nm by

around mid-2011.• 3xnm pilot runs of 4Gb DDR3 DRAM are expected to commence

around mid-2011.

Nanya

Technology• Capex to come down from $730M in 2010 to $400M in

2011.• 42 nm mass production started in Oct. 2010.

– 42 nm will have 53% more die output per wafer than 50 nm.

• 3xnm pilot run to start in 2Q 2011.Production • Fab 3A: 50K wafer starts by the end of ’10, will reach

60K in mid 2011. • Company to focus more on Server DRAM, Consumer

DRAM and Mobile DRAM products

Rexchip

• Capacity was expanded to 85K wpm and 45 nm transition is on schedule with full conversion completed in early 2011.

• 30 nm class node is expected to start pilot production in 1H11 and mass production in second half.

• R2 fab production schedule has be postponed to 2012.

• 2011 capex shall be less than half of that for 2010.

Taiwan LED Manufacturers: Growing InvestmentsEpistar• Plans to ramp up capacity by 30% in 2011 after 30-40% capacity growth in 2010.• Two new LED JV fabs in China (Changzhou and Xiamen) shall come on line in 2011.• Capacity expansion in Pan-Epistar Group (including Huga, Tekcore and Nanya) will continue in 2011.

Lexstar• Aggressive ramp of epi capacity from 30K/M to 130K/M in Hsinchu with the adoption of 6” MOCVD

reactors. • New LED epi/chip fab in Suzhou, China is expected to come online in 1Q 2011.

TSMC• Invest $175M to build a LED lighting R&D center in Hsinchu. Facility is almost completed. Production shall

start in 2Q 2011.

Tyntek• Started to invest in LED epi capacity with two new lines in Taichung Taiwan and Fuzhou China.

Formosa Epitaxy• Taiwan fab expansion plan is still ongoing. • New fab in Yangzhou China has come on line in 4Q10 and plans to have 50 MOCVD installation by the

end of 2011.

Genesis Photonics• New fab 3 in Tainan to commence construction in October 2010. • New JV project in Kunshan, China will come online in 2H11 with 50 MOCVD installation plan.

Source: SEMI, Company announcements, and DigiTimes

Singapore/Southeast Asia FabsGlobalFoundries• 300 mm Fab 7 upgrade and expansion• 200 mm Fab3 and 5 upgrade and expansion

IM Flash• Ramping production; key driver in Southeast Asia fab capex

TECH Semiconductor• On-going upgrade to 42 nm

UMC• Capacity expansion and upgrade of UMC Fab12i

Infineon• Expansion of 200 mm fab in Kulim

Backend Investments and Activities

Taiwan Packaging: Strong growth

• High utilization rates, especially for advanced packaging

• 2010 capex: record level for some companies

• 3D packaging and copper bonding wire are key drivers in capital spending

ASEOutlook• Small unit shipment growth in 4Q• Progress/activity with customers from Japan

CAPEX• ~$820M through 3Q, 4Q= $60M to $70M• 2011= ~$700M to $850M

– Majority for flip chip, copper wirebond, and low pin count

Technology• See more European and U.S. customers “picking up pace”

with copper wirebonding in 2011• TSV: investing R&D, waiting for mainstream

PowerTechOutlook- Expect 4Q to be slightly better than Q3

CAPEX- 2010 Capex at NT$12B (approximate $400M)- 2011 plan similar as 2010 and first NT$3B (approximate $100M) would be

released in Q1 for leading technology

Technology and 3D IC activitiesPTI supports various types of 3D IC technologies, such as FC- C4, copper pillar, wirebond stacking/MCP up to 16 chips, PoP, and TSV - Equipment for TSV process development & pilot line for 3- 5K monthly

wafer capacity expect to be installed in Q1and Q2 2011- Plans to build an advanced 3D IC backend factory in 2011

SPIL

CAPEX– 2010 Capex at NT$17B,or ~$500M– 2011 plan about NT$10B or ~$320M– Added 48 wire bonders in Suzhou in 3Q – 668 wirebonders pushed out from 4Q to 2011

Technology and 3D Activities– 16-die stack for Flash– Package-over-Package, F/C CSP with wirebond– Very early stage TSV (logic + memory)– 3D SIP F/C BGA with stacked die

Southeast Asia

Packaging Materials• Largest regional market for packaging materials• Forecasting about $5.6 billion in spending for 2011

Assembly & Test Equipment• #1largest regional market• 2011 outlook

– ~$600 million in spending for A&P equipment– $850 million to $900 million for Test equipment

Regional Market Summary

SEMI® Equipment Forecast (update)By Market Region

Source: SEMI, March 2011

Totals may not add due to rounding

$0$5

$10$15$20$25$30$35$40$45$50

N. America Japan Taiwan Europe S.Korea China ROW

ROW 3.05 2.61 1.44 3.85 4.31 4.89China 2.92 1.89 0.94 3.64 4.12 5.30S.Korea 7.35 4.89 2.60 8.33 8.05 9.54Europe 2.94 2.45 0.97 2.32 3.24 4.37Taiwan 10.65 5.01 4.35 11.20 11.60 10.34Japan 9.31 7.04 2.23 4.45 5.28 4.88N. America 6.55 5.63 3.39 5.75 9.21 7.82

2007 (A) 2008 (A) 2009 (A) 2010 (A) 2011 (F) 2012 (F)

US$

Bill

ions

$15.92

$39.54

$29.52

$45.81$42.77$47.14

SEMI® 2010 Materials Forecast By Market Region

$0$5

$10$15$20$25$30$35$40$45$50

N. America Japan Taiwan Europe S.Korea China Southeast Asia

Southeast Asia 4.55 5.03 6.18 6.79 6.90 5.97 7.15 7.28 7.44China 1.28 1.64 2.38 3.31 3.57 3.24 4.03 4.53 4.94S.Korea 3.10 3.78 4.88 6.10 5.90 4.68 6.01 6.41 6.69Europe 2.80 2.88 3.39 3.68 3.32 2.51 3.11 3.19 3.24Taiwan 4.85 5.31 6.74 8.34 7.87 6.76 8.88 9.34 9.68Japan 7.61 7.58 8.57 9.19 9.96 7.60 9.22 9.36 9.41N. America 4.63 4.72 5.11 5.25 4.99 3.76 4.46 4.61 4.70

2004 2005 2006 2007 2008 2009 2010F 2011F 2012F

US$

Bill

ions

$37.25

$28.82

$42.52

$34.51$30.94

Totals may not add due to rounding.

Source: SEMI Materials Market Data Subscription November 2010

$42.67 $44.70$42.85$46.10

Summary• Semiconductor industry recovery

– Estimating 5% to 10% growth in 2011

• Taiwan market– Strong investments in foundry and packaging continue in 2011– Challenges for Taiwan’s DRAM makers.– #1 market for foundry capacity; # 2 market for 300 mm capacity– #1 region for equipment spending and currently # 2 largest market for

semiconductor materials

• Southeast Asia– # 1 region in spending for backend equipment and materials– +40% or more growth in fab equipment spending– Strong double-digit growth in 300 mm fab capacity over the next two

years

Taiwan- Where great things happen

Ana Li

March 17, 2011

The Most Effective Semiconductor Event in Taiwan & SEA!

Agenda• SEMICON Taiwan & SEMICON Singapore 2010 Overview

• SEMICON Taiwan & SEMICON Singapore 2011 Features- Technology Pavilions- Programs & Events- Marketing Promotion Opportunities

• SEMICON Taiwan & SEMICON Singapore 2011 Visitor Promotion

Taipei World Trade Center

September 7 to 9, 2011

General Information

• Date:10:00-17:00 Wed., Sept. 8 10:00-17:00 Thur., Sept. 910:00-16:00 Fri., Sept. 10

• Co-organizers:

22%+24,36519,956Visitors

13%+11501020Booths

Show Figures

7%+558520Number of Exhibiting Companies

Growth20102009

Results of Visitors• Visitors of SEMICON Taiwan 2010

- Inotera - Nanya - UMC - KYEC - ProMos - SilTerra- Maxchip - Powerchip - SPIL - MXIC - Renesas - SSMC- TSMC - AMAT, ASM, Disco, KLA,

Novellus, TEL, etc.• Influential Visitors – 47% of attendees

were management level or higher

• Highly Qualified Audience – 49% of attendees influence purchasing decisions

• High Visitor Satisfaction – 97% of visitors would like to attend future SEMICON Taiwan events

• A Supply-Chain Exhibition

• A Technology-based Promotion Platform

• A Cost Effective Solution

• The Connection to the Largest Semiconductor Community in Taiwan

Why SEMICON Taiwan 2011?

Exhibition Highlights• Technology Pavilions

– 3D IC & Advanced Packaging/Testing Pavilion – Parts OEM Pavilion – New!– LED Pavilion– Green Management Pavilion– MEMS Pavilion– Secondary Market Pavilion– Advanced Processing Gallery – New!– Principal/ Representative Program – News!– CMP Pavilion– AOI Pavilion– Compound Pavilion

• Country Pavilions– Cross Strait Pavilion (starting from USD 2,600!!)– Korea Pavilion– Singapore Pavilion– Scotland Pavilion

2011/3/1848

Technology Pavilions: All-in-One Package

• Ready Exhibit

• Innovative Technology Center

• Exclusive Promotion Programs& Networking Events

• Connect with Global and Local Business

+

+

Value more than USD 7,000

Have it all at only USD 3,300 each booth now!!

Programs & Events

• Program– Market Briefing – IC Executive Forum– MEMS Forum– 3D IC Technology Forum– Green Manufacturing Forum– LED Forum

More than 50 sessions in 2010!

• Networking Events– Gala Dinner– Golf Tournament

• Supplier Search ProgramInviting TSMC, UMC & DRAM companies in 2011!

Leadership Gala Dinner

Date: Wednesday, Sep 7, 2011Location: Grand Hyatt Taipei

More than 400 industry leaders join the biggest annual gala dinner. It is a great platform for you to mingle with decision makers and customers.

Gala Dinner Attendee (partial)

Vice PresidentThomas ChangVIS - Vanguard International

Vice Chairman & CEOJohn HsuanUMC Group

Vice ChairmanF. C. TsengTSMC

Vice Chairman of the BoardTom TsuneishiTOKYO ELECTRON LIMITED

Vice PresidentCarl ChenSPIL

Senior ManagerTakao AkiyamaRenesas Electronics

Vice President, EngineeringNicholas YuQualcomm

ChairmanFrank HuangPowerchip Technology

DirectorSteven ShihNanya Technology Corp.

PresidentChih Yuan LuMACRONIX International

President of Asia Pacific OperationsDaniel LiaoLam Research Corp.

PresidentMike LiangKYEC

PresidentNorman ChangKLA-Tencor Corporation

Walter ChenCREE Inc.

Managing DirectorTony ChaoASML

General Manager & Chief R&D OfficerHo-Min TongASE

CTO & Vice ChairmanShaulong ChinArdentec Corporation

Job TitleGuest NameCompany

Taiwan Foundry & DRAM Supplier Search Program

• International leading device makers – SSMC, SilTerra and Renesaslocate their next new strategic partners and service providers at SEMICON Taiwan

• We target to invite TSMC, UMC & DRAM companies to attend in 2011!

Over 160 guests thumbed up cheerfully to initiate the annual golf tournament with the mascot of SEMICON Taiwan-Jing Jing.

SEMICON Golf Tournament

Tournament Player List

MXICVice PresidentWen-Sen Pan4

Taiwan Semiconductor Manufacturing Company, Ltd.Senior DirectorChao Ying-Cheng14

UMCFAB DirectorT. S. Wu15

Taiwan Semiconductor Manufacturing Company, Ltd.SVPSteve Tso13

Siliconware Precision Industries Co., Ltd.Sec. ManagerJerry Chiu12

Samsung Taiwan CorporationManagerSamuel Liao11

Rexchip Electronics Corp.Technical ManagerScott Huang10

Qualcomm CDMA TechnologiesDirectorMatt Nowak9

ProMOS TECHNOLOGIESVice PresidentBen Tseng8

Powerchip Technology CorporationPresidentAlex Wang7

Nanya Technology Corp.Senior Vice PresidentPei Ing Lee6

Nan Ya Printed Circuit Board CorporationRD ManagerMax Lin5

INOTERA MEMORIES, INC.Ph.D.Jason Chu3

CHIMEI INNOLUX CORP.DirectorLorenzo Hsu2

ASE GROUP Chung-LiDirectorR.T. You1

Company NameJob TitleNameNo.

Suntec Singapore International Conventional & Exhibition Centre

11– 13 May 2011

Show Overview

Visitor Analysis - 2010• 51% of visitors are management level• 80% of visitors are involved in product selection

Visitors are global leading semiconductor companies including:3M, AMD, Amkor, Applied Materials, ASE, ASM, A-Star, Fairchild Semiconductors, Freescale Semiconductors, Globalfroundries, Infineon Technologies, Marvell, Micron Semiconductors, National Semiconductor, NEC Semiconductors, ON Semiconductor, Panasonic Semiconductor, PerkinElmer Singapore, Qualcomm, Renesas Semiconductor, Seagate, Soitec Singapore, StatsChipPAC, STMicroelectronics, SSMC, UMC, Unisem, UTAC

Why SEMICON Singapore

• Gateway to the Southeast Asian semiconductor manufacturing industry

• World largest Semiconductor back-end manufacturing

• Biggest Test, Assembly & Packaging (TAP) market

• Growing Front-end and PV manufacturing

SEMICON Singapore 2011 Features

• Theme Pavilions- Printed Electronics - LED - MEMS- SOLARCON

• Country Pavilions- France- Korea- Malaysia- Netherlands- Singapore

• Networking Events- Opening Ceremony- Exhibitor Reception- Speaker’s Luncheon

• Forum and Conference– Market Trends Briefing– MEMS – SOLARCON– Advanced Packaging – Product Test Engineering– Wafer Processing

Technology

SEMICON Singapore 2011 Technical Conference Agenda

• 11 May 2011– Market Trends Briefing– MEMS Forum

• 12 May 2011– Advanced Packaging – Copper

Wire• Invited Speakers: ASE,

STMicroelectronics, SPT, Stats Chippac

– Product Test Engineering• Invited Speakers: IME, FormFactor,

Globalfoundries, Verigy, Advantest– Wafer Processing Technology –

How to Improve Your Fab• Invited Speakers: TECH

Semiconductor, m+w Zander, KLA Tencor, AMAT

• 12 May 2011– SOLARCON – Market and

Applications• Invited speakers: Morgan

Stanley, EDB, Sustainable Energy Development Authority (SEDA), Ministry of Energy and Mineral Resouces of Republic Indonesia, Leonics, Singapore Intitute of Architects, SERIS

• 13 May 2011– Advanced Packaging –

Copper Wire• Invited Speakers: Texas

Instruments, KNS, Hitachi, Hereaus, UTAC

Media Exposure• EE Times Asia • The Star Online • Business Times.com• AsiaOne.com• Chip Scale Review• EM Asia• Advanced Packaging• Asian Solar• Compound Semiconductor• Global SMT & Packaging• Global SMT & Packaging India• US Tech• Recharge• Business Times (Print Ad)• Straits Times (Print Ad)

Marketing Promotion OpportunitiesVarious advertising opportunities to help you stand out from thecrowd!Event Sponsorship -

Marketing Promotion and Advertisement -

Visitor Promotion

WebMarketing

Makers & IC Design

Visiting

Press Conference

Media

On-site Attraction

Visitor 22%

Summary: All-in-One Package

• Turn-Key Exhibit to showcase your solution

• Promotion Channels to enhance your branding

• Networking Events to broaden your connection

• Visitor Promotion to bring you the right customers

SEMICON West 2011

July 12-14, 2011San Francisco, California, USA

SEMICON West 2011

• July 12-14, 2011• Moscone Center, San

Francisco• 600+ exhibitors• 30,000+ expected attendance

– 29,423 in 2010• Industries served:

– Semiconductor– LED– MEMS– Photovoltaic– Printed/flexible electronics– Related micro- and nano-

electronics

SEMICON West Visitor Profile:Attending Customers (sample list)

• Altera• Analog Devices• Atmel• Broadcom• Cypress Semiconductor• Fairchild• Freescale• GLOBALFOUNDRIES• HP• Hynix• IBM• Infineon

• Samsung• SanDisk• Sony• STMicroelectronics• Sun Microsytems• Texas Instruments• Toshiba• TSMC• UMC• Vishay• Xilinx

• Intel• Intersil• LSI• Marvell• Maxim• Micron• National Semiconductor• NEC• Numonyx• nVidia• NXP• Qualcomm

• 80% of visitors influence buying decisions, including 37% with final purchasing authority• 70% of visitors say that SEMICON West influences buying decisions over the next 12

months

SEMICON West 2011 Highlights• Keynotes/Executive Panels

– Tien Wu, ASE– Luc Van den hove, imec– Executive Summit– Investor Conference

• TechZONEs– Specialized exhibit areas covering:

• 3D IC• LED, MEMS, printed/flexible electronics

(Extreme Electronics)• Semiconductor design, EDA, and

manufacturing services• Secondary equipment and services• Advanced materials

• Co-located with Intersolar North America

Program Highlights

• TechXPOTs– Four stages: two South Hall, two

North Hall

• Keynotes/Executive Panels• PV Fab Manager's Forum• SEMI International Standards meetings

and workshops• Partner Events

– Gartner/SEMI Market Symposium– IMAPS/SEMI Packaging Workshops– ATE Test Vision Workshop– ITRS meetings

South Hall

North Hall

SouthOne Extreme Electronics

NorthOne NorthTwo

Special Exhibiting Opportunities

• TechZONE Pavilions– Design and Manufacturing Services

(Advanced Technology Manufacturing)

– Advanced Materials– 3D IC– Secondary Equipment and Services– "Extreme Electronics"

• LED• MEMS• Printed/Flexible Electronics

TechZONE Features/Benefits

Exclusive Features

• Dedicated pavilion exhibit area• All-inclusive exhibit display/demo

station packages available• Company recognition/visibility in

pre-show promotions• Additional company visibility

onsite (signs, advertising)• Access to exclusive sponsorships

and exhibitor opportunities

Benefits

• High-traffic exhibit location to showcase your solutions and services

• All-inclusive, low cost• Identification with critical industry

issues and technologies• Inclusion in exclusive pre-show

and at-show traffic-building promotions

SEMICON Japan 2011

December 7-9, 2011Makuhari Messe, Chiba, Japan

SEMICON Japan 2011

• December 7-9, 2011• Makuhari Messe, Halls 1-8• 1,000+ exhibitors, 2,500 booths• 70,000+ expected attendance (3 days)

SEMICON Japan 2011 Facts

• 35th Year (2011)• World's largest semiconductor equipment and materials trade show• New: "Power of Asia"

Front-end Equipment & Parts

Special Exhibits Zone

Combined

Front-end Facility & Materials

Back-end Equipment , Facility & Materials

"Power of Asia"

• Exhibits and events focused on Asian markets and cross-regional cooperation– Showcase for Asian companies, delegations– Networking, relationship-building events designed to

strengthen communications and connections between Asian and Japanese companies

– Information exchange

"Power of Asia"

• Power of Asia Event Plans– Asian Parts Suppliers Pavilion– Asian Business Development Pavilion– Asian Manufacturing Services Pavilion– Power of Asia Presentation Stage– Keynote– Seminars/business programs– "Asian Night" Networking Event

• Dynamic new exhibiting opportunity connecting Asian parts and component suppliers with Japanese equipment companies

• Benefits– Meet with senior buyers from leading Japanese equipment companies– Presentation stage time– Private meeting rooms– Networking lunch– Open discussion tables– SPECIAL BOOTH PRICING

Invited Equipment Customers include:

Asian Parts Suppliers Pavilion

• Exhibiting opportunity for regional government, trade, and business development organizations to meet Japanese companies looking to expand/build overseas operations

• Benefits– Meet with leading Japanese companies– Presentation stage time– Private meeting rooms– Networking party (Asian Night)– SPECIAL BOOTH PRICING

Asian Business Development Pavilion

• Exhibiting opportunity for semiconductor manufacturing services companies, including subcontractors, test/packaging houses, fabless, and foundries to connect with Japanese customers

• Benefits– Meet with leading Japanese companies seeking manufacturing services– Presentation stage time– Private meeting rooms– Networking party (Asian Night)– SPECIAL BOOTH PRICING

Asian Manufacturing Services Pavilion

Special Pricing for SEMICON Japan 2011"Power of Asia" Pavilions

SEMICON Russia 2011

May 31-June 2, 2011Moscow, Russia

Russian market Outlook

• Government initiatives to strengthen the semiconductor industry in Russia

• Rusnano investing into Semiconductors, PV, Plastic Electronics and LED

• Sitronics / Mikron to move to 90nm with STM and plans to go to 65/45nm

• Skolkolov to be built as the Russian “Silicon Valley” near Moscow

• LED given priority by the government. First fab (Octagon) being built now.

• Several projects for PV grade polysilicon• Build-up of a competitive PV industry in planning

Profile

• SEMICON Russia– 1500+ professional attendees– 30+ countries represented– 69% of attendees are from the Russian Federation– 72% represent Management Level– 180+ exhibiting Companies

• Programs and Events– Semiconductor Market Forum– Photovoltaic Market Forum– TechARENA

SEMICON Russia 2011 Focus

• Semiconductor Front-End• More than Moore• Packaging• LED / Solid State Lighting• SEMI-Grade Poly• PV-Grade Poly• PV-Crystalline• PV-Thin Films• PV-Modules• Flexible, Printed, Plastic, Organic electronic and PV• R&D Projects

SEMICON Europa 2011

October 11-13, 2011Dresden, Germany

SEMICON Europe 2011

• Date: 11-13 Oct 2011• Dresden, Germany

• Co-located with:Plastic Electronics 2011Conference and Exhibition

• SEMICON Europa continues to be the most important semiconductor industry event in Europe

• European market Outlook:– Investing in advanced technologies– $6 billion per year to be spent on semiconductor equipment and

materials in both 2011 and 2012– GLOBALFOUNDRIES and Infineon fabs and 240 related

semiconductor companies nearby

Profile

• SEMICON Europa is an international and pan-European event– 6000+ professional attendees– 50+ countries represented– Buying teams and engineers from all major European Fabs– 50% represent Management Level– 65% are involved in Product Selection and Purchasing Decisions

• 50+ Programs and Events scheduled– Technology and Business Conferences– Executive and Networking Events– Free Technology and Standardization Sessions– Educational Courses (CEI Europe)– Emerging Technologies:

• Plastic Electronics Conference• Fraunhofer Microelectronics Day

SEMICON Europa Programs are supported by:

•Altis

•Analog Devices

•Bosch

•Colibrys

•CSR (Cambridge Silicon Radio)

•Freescale

•GLOBALFOUNDRIES

•Infineon

•Intel

•IBM

•Lfoundry

•Micron

•Nanium

•Nokia

•Numonyx

•NXP

•Osram

•STMicroelectronics

•Texas

•Instruments

•Thales

•X-Fab

SEMICON Europa 2011 Focus

• MEMS/MST Applications / “More then Moore”• Advanced Packaging and advanced Test• LED / Solid State Lighting• Foundries Manufacturing Challenges• Fab Enhancement and Improvement• Research and Development (Science Park)• Country Pavilions (French, Saxony, Scottish and UK, US, …)

• New: Flexible, Organic and Large Area Electronics, Photovoltaic, Display and Lighting

Plastic Electronics 2011

• This is the 7th edition of the Plastic Electronics Conference, the leading International convention with focus on these new application and technologies.

• 3 days conference with 600+ attendees from all regions of the world.

• The leading global Conference and Exhibition for Flexible, Organic and Large Area Electronics, Photovoltaic, Display and Lighting.

• The co-location of the two events offer great synergies and unique opportunities for business and collaboration between this related disciplines.

• New: Dedicated Exhibition area for Plastic Electronics Suppliers

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