Seebeck Measurement Setup WrittenProposal

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    Senior Design I

    ECE 4901

    Fall 2009

    Seebeck Measurement Setup

    Written Proposal

    Group Members:

    Adam Cywar (Electrical Engineering)

    Brian Crabtree (Electrical Engineering)

    Nicholas Williams (Electrical Engineering)

    Advisor:

    Helena Silva

    University of Connecticut

    Department of Electrical and Computer Engineering

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    Induction Heating

    Induction heating is a novel heating method that works by applying a switching magnetic field

    to a ferromagnetic material. The switching of the magnetic field is achieved by the application

    of high frequency AC square waves to a coil, which causes rapid switching of the orientation of

    the magnetic dipoles in the center of the coil. When the ferromagnetic material is in thepresence of the switching magnetic field, its magnetic dipoles rapidly change their polarity,

    creating kinetic energy and thus heating the material. If the magnetic field lines intersect a non-

    ferromagnetic material, they are reflected and no heating occurs. Induction heating is the most

    optimum method of heating the sample because it can efficiently and safely provide high

    temperatures with the advantage of controlled, localized heating. Figure W illustrates the

    inductive heating process.

    Figure W: A high frequency AC squarewave is applied to a coil to create oscillating magnetic fields at the

    coil center. When a ferromagnetic material is in the presence of the magnetic field, its dipoles align

    themselves with the switching magnetic field, creating kinetic energy and thus heat.

    Solution

    Technical SpecificationsVoltage 120 V, 60 Hz

    Maximum AC Current 20 A

    Maximum Unit Size 1 m3

    Minimum Heating Requirement 750 C

    Minimum Temperature Gradient 10 C

    Maximum Wafer Size 8 in diameter

    Minimum Wafer Size 1 cm2

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    Minimum Voltage Measurement Accuracy 5 V

    Thermocouple Type K type (-180 to 1300 C)

    Cost $2000

    The Seebeck measurement setup features an induction heater and a split ferromagnetic chuck

    to create a temperature gradient on a sample of interest. The moveable chucks can be

    separated to achieve a large temperature gradient, or they can be adjacent to achieve smaller

    temperature gradients. A movable aluminum plate can be positioned under the chuck to block

    magnetic fields where heating is unwanted. A semiconductor wafer rests on the chucks and is

    probed with voltage probes and thermocouples on either side of it. Figures X and Y show side

    and top views of the preliminary design.

    Figure X: Preliminary design (side view)

    Ferromagnetic Ferromagnetic

    Aluminum

    Inductive Heater

    Raised

    Platform

    Raised

    Platform

    Semiconductor Sample

    Probe

    Positioner

    Probe

    Positioner

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    Figure Y: Preliminary design (top view)

    A National Instruments data acquisition card will be used to record voltage and temperature

    information over time. This will enable real-time data plotting and analysis in a LabVIEW

    interface. The proposed setup will allow for flexibility in the measurements.

    Project Plan

    Budget Estimate

    Our budget is $2000. We have been provided micropositioners and a metal stand. We also have access

    to the machine shop to build staging or fabricate structures. Other potential costs could include

    voltage/thermocouple probe holders, probe tips, and additional positioners.

    Item Quantity Price

    Inductive heater 1 $80.00

    Thermocouples 2 $33.65

    Voltage probes 2 Provided

    Micropositioners 5 Provided

    LabVIEW software 1 Provided

    LabVIEW hardware 1 $500.00

    Machined parts 1 Provided

    Total $647.30

    Chuck

    Probe

    Positioner

    Chuck

    Semi-

    conductor

    Wafer

    Raised

    Platform

    Raised

    Platform

    Probe

    Positioner

    Aluminum

    Plate

    Induction Heater

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    Project Phases

    September October November December January February March April May

    Research/

    Planning

    Design

    Order Parts

    Preliminary

    Testing

    Build Prototype

    Testing of

    Prototype

    Improve

    Prototype

    Finalize

    Conclusion

    The Seebeck coefficient is an important parameter in semi-conductor wafers and is in the

    interest of most people that fabricate devices on semi-conductor wafers. The Seebeck

    coefficient can only be experimentally determined since it is too difficult to calculate solely

    from the process variables. Hence, it is useful to have a measurement setup that can quickly

    and easily determine Seebeck coefficient.