Section 4: Technical Summary and Application Guidelines · Section 4: Technical Summary and Application Guidelines INTRODUCTION ... 2.4 x 10-9 m/V Dielectric thickness (d) = 21 x

254

Section 4 Technical Summary and Application GuidelinesINTRODUCTION

Tantalum capacitors are manufactured from a powder of puretantalum metal OxiCapreg - niobium oxide capacitor is madefrom niobium oxide NbO powder The typical particle size isbetween 2 and 10 μm

Figure below shows typical powders Note the very great difference in particle size between the powder CVsg

4000μFV 20000μFV 50000μFVFigure 1a Tantalum powder

Figure 1b Niobium Oxide powder

The powder is compressed under high pressure around aTantalum or Niobium wire (known as the Riser Wire) to form aldquopelletrdquo The riser wire is the anode connection to the capaci-tor

This is subsequently vacuum sintered at high temperature (typically 1200 - 1800degC) which produces a mechanicallystrong pellet and drives off any impurities within the powder

During sintering the powder becomes a sponge like structure with all the particles interconnected in a huge lattice

This structure is of high mechanical strength and density butis also highly porous giving a large internal surface area (seeFigure 2)

The larger the surface area the larger the capacitance Thushigh CVg (capacitance voltage product per gram) powderswhich have a low average particle size are used for low voltage high capacitance parts

By choosing which powder and sinter temperature is used toproduce each capacitancevoltage rating the surface areacan be controlled

The following example uses a 220μF 6V capacitor to illustratethe point

C =or A

d

where o is the dielectric constant of free space

(8855 x 10-12 Faradsm)

r is the relative dielectric constant

= 27 for Tantalum Pentoxide

= 41 for Niobium Pentoxided is the dielectric thickness in meters C is the capacitance in Farads

and A is the surface area in meters

Rearranging this equation gives

A =C dor

thus for a 220μF6V capacitor the surface area is 346 squarecentimeters or nearly a half times the size of this page

The dielectric is then formed over all the Tantalum or niobiumoxide surfaces by the electrochemical process of anodizationTo activate this the ldquopelletrdquo is dipped into a very weak solutionof phosphoric acid

The dielectric thickness is controlled by the voltage appliedduring the forming process Initially the power supply is kept in a constant current mode until the correct thickness ofdielectric has been reached (that is the voltage reaches thelsquoforming voltagersquo) it then switches to constant voltage modeand the current decays to close to zero

Figure 2 Sintered Anode

255

The chemical equations describing the process are asfollows

Tantalum Anode 2 Ta rarr 2 Ta5+ + 10 e- 2 Ta5+ + 10 OH-rarr Ta2O5 + 5 H2O

Niobium Oxide Anode

2 NbO rarr 2 NbO3+ + 6 e-2 NbO3+ + 6 OH-rarr Nb2O5 + 3 H2O

Cathode

Tantalum 10 H2O ndash 10 e rarr 5H2 + 10 OH-

Niobium Oxide 6 H2O ndash 6 e- rarr 3H2 + 6 OH-

The oxide forms on the surface of the Tantalum or NiobiumOxide but it also grows into the material For each unit ofoxide two thirds grows out and one third grows in It is forthis reason that there is a limit on the maximum voltage rat-ing of Tantalum amp Niobium Oxide capacitors with presenttechnology powders (see Figure 3)

The dielectric operates under high electrical stress Considera 220μF 6V part

Formation voltage = Formation Ratio x Working Voltage = 35 x 6 = 21 VoltsTantalumThe pentoxide (Ta2O5) dielectric grows at a rate of 17 x 10-9 mV

Dielectric thickness (d) = 21 x 17 x 10-9

= 0036 μm

Electric Field strength = Working Voltage d= 167 KVmm

Niobium OxideThe niobium oxide (Nb2O5) dielectric grows at a rate of 24 x 10-9 mV


= 0050 μm


Figure 3 Dielectric layer

The next stage is the production of the cathode plate This is achieved by pyrolysis of Manganese Nitrate intoManganese Dioxide

The ldquopelletrdquo is dipped into an aqueous solution of nitrate andthen baked in an oven at approximately 250degC to producethe dioxide coat The chemical equation is

Mn (NO3)2 rarr MnO2 + 2NO2 ndash

This process is repeated several times through varyingspecific densities of nitrate to build up a thick coat over all internal and external surfaces of the ldquopelletrdquo as shown inFigure 4

Figure 4 Manganese Dioxide Layer

The ldquopelletrdquo is then dipped into graphite and silver to provide a good connection to the Manganese Dioxide cathode plate Electrical contact is established by depositionof carbon onto the surface of the cathode The carbon is then coated with a conductive material to facilitate connectionto the cathode termination (see Figure 5) Packaging is carriedout to meet individual specifications and customer require-ments This manufacturing technique is adhered to for thewhole range of AVX Tantalum capacitors which can be subdi-vided into four basic groups Chip Resin dipped Rectangular boxed Axial

Further information on production of Tantalum Capacitorscan be obtained from the technical paper ldquoBasic TantalumTechnologyrdquo by John Gill available from your local AVX representative

Figure 5 Cathode Termination

Anode Manganese Graphite Outer Silver Cathode

Dioxide Silver Layer Epoxy Connection

Technical Summary and Application Guidelines

11 CAPACITANCE

111 Rated capacitance (CR)This is the nominal rated capacitance For tantalum andOxiCapreg capacitors it is measured as the capacitance of theequivalent series circuit at 25degC using a measuring bridgesupplied by a 05V rms 120Hz sinusoidal signal free of har-monics with a bias of 22Vdc

112 Capacitance toleranceThis is the permissible variation of the actual value of thecapacitance from the rated value For additional readingplease consult the AVX technical publication ldquoCapacitanceTolerances for Solid Tantalum Capacitorsrdquo

113 Temperature dependence of capacitanceThe capacitance of a tantalum capacitor varies with temper-ature This variation itself is dependent to a small extent onthe rated voltage and capacitor size

114 Frequency dependence of the capacitance The effective capacitance decreases as frequency increasesBeyond 100kHz the capacitance continues to drop until res-onance is reached (typically between 05 - 5MHz dependingon the rating) Beyond the resonant frequency the devicebecomes inductive

12 VOLTAGE

121 Rated dc voltage (VR)

This is the rated dc voltage for continuous operation up to85degC (up to 40degC for TLJ TLN NLJ series)

Operating voltage consists of the sum of DC bias voltage andripple peak voltage The peak voltage should not exceed thecategory voltage For recommended voltage (application) der-ating refer to figure 2c of the SECTION 3

122 Category voltage (VC)

This is the maximum voltage that may be applied continu-ously to a capacitor It is equal to the rated voltage up to+85degC (up to 40degC for TLJ TLN NLJ series) beyond whichit is subject to a linear derating to 23 VR at 125degC for tanta-lum and 23 VR at 105degC for OxiCapreg

123 Surge voltage (VS)

This is the highest voltage that may be applied to a capacitor forshort periods of time in circuits with minimum series resistance of33Ohms (CECC states 1kΩ) The surge voltage may be appliedup to 10 times in an hour for periods of up to 30 seconds at atime The surge voltage must not be used as a parameter in thedesign of circuits in which in the normal course of operation thecapacitor is periodically charged and discharged

SECTION 1ELECTRICAL CHARACTERISTICS AND EXPLANATION OF TERMS

TAJE227K010

85degC Tantalum 125degC Tantalum

Rated Voltage Surge Voltage Category Voltage Surge Voltage VR VS VC VS

2 27 13 17 25 33 17 22 3 39 2 26 4 52 27 34 5 65 33 4 63 8 4 5 10 13 7 8 16 20 10 13 20 26 13 16 25 32 17 20 35 46 23 28 50 65 33 40

85degC OxiCapreg 105degC OxiCapreg


18 23 12 16 25 33 17 22 4 52 27 34 63 8 4 5 10 13 7 8


For THJ 175degC Category amp Surge voltage see THJ section on pages 131-136For individual part number please refer to SpiTan Software for frequencyand temperature behavior found on AVX Corporation website

256 112917

112917 257

124 Effect of surgesThe solid Tantalum and OxiCapreg capacitors have a limitedability to withstand voltage and current surges This is incommon with all other electrolytic capacitors and is due tothe fact that they operate under very high electrical stressacross the dielectric For example a 6 volt tantalum capacitorhas an Electrical Field of 167 kVmm when operated at ratedvoltage OxiCapreg capacitors operate at electrical field signifi-cantly less than 167 kVmm

It is important to ensure that the voltage across the terminalsof the capacitor never exceeds the specified surge voltagerating

Solid tantalum capacitors and OxiCapreg have a self healingability provided by the Manganese Dioxide semiconductinglayer used as the negative plate However this is limited inlow impedance applications In the case of low impedancecircuits the capacitor is likely to be stressed by current surges

Derating the capacitor increases the reliability of the com-ponent (See Figure 2b page 264) The ldquoAVX RecommendedDerating Tablerdquo (page 266) summarizes voltage rating for use on common voltage rails in low impedance applica-tions for both Tantalum and OxiCapreg capacitors

In circuits which undergo rapid charge or discharge a protective resistor of 1ΩV is recommended If this isimpossible a derating factor of up to 70 should be usedon tantalum capacitors OxiCapreg capacitors can be usedwith derating of 20 minimum

In such situations a higher voltage may be needed than is available as a single capacitor A series combination should be used to increase the working voltage of the equivalentcapacitor For example two 22μF 25V parts in series is equiv-alent to one 11μF 50V part For further details refer to JA Gillrsquospaper ldquoInvestigation into the Effects of Connecting TantalumCapacitors in Seriesrdquo available from AVX offices worldwide

NOTEWhile testing a circuit (eg at ICT or functional) it is likely thatthe capacitors will be subjected to large voltage and currenttransients which will not be seen in normal use These conditions should be borne in mind when considering thecapacitorrsquos rated voltage for use These can be controlled byensuring a correct test resistance is used

125 Reverse voltage and Non-Polar operationThe values quoted are the maximum levels of reverse voltagewhich should appear on the capacitors at any time Theselimits are based on the assumption that the capacitors arepolarized in the correct direction for the majority of theirworking life They are intended to cover short term reversalsof polarity such as those occurring during switching tran-sients of during a minor portion of an impressed waveformContinuous application of reverse voltage without normalpolarization will result in a degradation of leakage current Inconditions under which continuous application of a reverse

voltage could occur two similar capacitors should be used ina back-to-back configuration with the negative terminationsconnected together Under most conditions this combinationwill have a capacitance one half of the nominal capacitanceof either capacitor Under conditions of isolated pulses orduring the first few cycles the capacitance may approachthe full nominal value The reverse voltage ratings are designedto cover exceptional conditions of small level excursions intoincorrect polarity The values quoted are not intended tocover continuous reverse operation

The peak reverse voltage applied to the capacitor must notexceed

10 of the rated dc working voltage to a maximum of 10v at 25degC


1 of the rated dc working voltage to a maximum of 01v at 125degC (01v at 150degC THJ Series)

Note Capacitance and DF values of OxiCapreg may exceedspecification limits under these conditions

126 Superimposed AC Voltage (Vrms) - Ripple Voltage

This is the maximum rms alternating voltage superim-posed on a dc voltage that may be applied to a capacitorThe sum of the dc voltage and peak value of the superimposed ac voltage must not exceed the categoryvoltage vc

Full details are given in Section 2

127 Forming voltageThis is the voltage at which the anode oxide is formed Thethickness of this oxide layer is proportional to the formation volt-age for a capacitor and is a factor in setting the rated voltage


13 DISSIPATION FACTOR ANDTANGENT OF LOSS ANGLE (TAN D)

131 Dissipation factor (DF)Dissipation factor is the measurement of the tangent of theloss angle (tan ) expressed as a percentage The measure-ment of DF is carried out using a measuring bridge that supplies a 05V rms 120Hz sinusoidal signal free of harmonics with a bias of 22Vdc The value of DF is temperatureand frequency dependent

Note For surface mounted products the maximum allowedDF values are indicated in the ratings table and it is importantto note that these are the limits met by the componentAFTER soldering onto the substrate

132 Tangent of Loss Angle (tan )This is a measurement of the energy loss in the capacitor Itis expressed as tan and is the power loss of the capacitordivided by its reactive power at a sinusoidal voltage of spec-ified frequency Terms also used are power factor loss factorand dielectric loss Cos (90 - ) is the true power factor Themeasurement of tan is carried out using a measuringbridge that supplies a 05V rms 120Hz sinusoidal signal freeof harmonics with a bias of 22Vdc

133 Frequency dependence of Dissipation FactorDissipation Factor increases with frequency as shown in thetypical curves that are for tantalum and OxiCapreg capacitorsidentical

Typical DF vs Frequency

134 Temperature dependence of DissipationFactor

Dissipation factor varies with temperature as the typical curvesshow These plots are identical for both Tantalum and OxiCapreg

capacitors For maximum limits please refer to ratings tables

Typical DF vs Temperature

14 IMPEDANCE (Z) AND EQUIVALENTSERIES RESISTANCE (ESR)

141 Impedance ZThis is the ratio of voltage to current at a specified frequencyThree factors contribute to the impedance of a Tantalum capac-itor the resistance of the semiconductor layer the capacitancevalue and the inductance of the electrodes and leads

At high frequencies the inductance of the leads becomes a limiting factor The temperature and frequency behavior of these three factors of impedance determine the behaviorof the impedance Z The impedance is measured at 25degCand 100kHz

142 Equivalent Series Resistance ESRResistance losses occur in all practical forms of capacitorsThese are made up from several different mechanismsincluding resistance in components and contacts viscousforces within the dielectric and defects producing bypasscurrent paths To express the effect of these losses they areconsidered as the ESR of the capacitor The ESR is frequencydependent and can be found by using the relationship

ESR =

tan δ 2πfC

Where f is the frequency in Hz and C is the capacitance infarads

The ESR is measured at 25degC and 100kHz

ESR is one of the contributing factors to impedance and at high frequencies (100kHz and above) it becomes thedominant factor Thus ESR and impedance become almostidentical impedance being only marginally higher

143 Frequency dependence of Impedance and ESRESR and Impedance both increase with decreasing frequen-cy At lower frequencies the values diverge as the extra con-tributions to impedance (due to the reactance of the capac-itor) become more significant Beyond 1MHz (and beyondthe resonant point of the capacitor) impedance againincreases due to the inductance of the capacitor TypicalESR and Impedance values are similar for both tantalum andniobium oxide materials and thus the same charts are validfor both for Tantalum and OxiCapreg capacitors

Typical ESR vs Frequency

5

45

4

35

325

2

151

05001 1 10

ES

R M

ultip

lier

Frequency (kHz)

Tantalum

OxiCapreg

100 1000

18

17

1615

14

1312

111

0908

-55 -5 45 95

Temperature (Celsius)

TantalumOxiCapreg

DF

Mu

ltip

lier

50

5

1

0101 1 10 100

Frequency (kHz)

Tantalum OxiCapreg

DF

Mu

ltip

lier


258 112917


Typical Impedance vs Frequency

144 Temperature dependence of the Impedanceand ESR

At 100kHz impedance and ESR behave identically anddecrease with increasing temperature as the typical curvesshow

Typical 100kHz ESR vs Temperature

15 DC LEAKAGE CURRENT

151 Leakage currentThe leakage current is dependent on the voltage applied the elapsed time since the voltage was applied and the component temperature It is measured at +20degC with therated voltage applied A protective resistance of 1000Ω is connected in series with the capacitor in the measuring circuit Three to five minutes after application of the ratedvoltage the leakage current must not exceed the maximumvalues indicated in the ratings table Leakage current is referenced as DCL (for Direct Current Leakage) The defaultmaximum limit for DCL Current is given by DCL = 001CVwhere DCL is in microamperes and C is the capacitance rating in microfarads and V is the voltage rating in volts DCLof tantalum capacitors vary within arrange of 001 - 01CV or05μA (whichever is the greater) And 002 - 01CV or 10μA(whichever is the greater) for OxiCapreg capacitors

Reforming of Tantalum or OxiCapreg capacitors is unnecessaryeven after prolonged storage periods without the applicationof voltage

152 Temperature dependence of the leakage current

The leakage current increases with higher temperaturestypical values are shown in the graph For operation between85degC and 125degC the maximum working voltage must bederated and can be found from the following formula

Vmax = 1- (T - 85) x VR

125 where T is the required operating temperature

LEAKAGE CURRENT vs TEMPERATURE

153 Voltage dependence of the leakage currentThe leakage current drops rapidly below the value correspon-ding to the rated voltage VR when reduced voltages are appliedThe effect of voltage derating on the leakage current is shown inthe graph This will also give a significant increase in the reliabilityfor any application See Section 31 (page 264) for details

For input condition of fixed application voltage and includingmedian curve of the Leakage current vs Rated voltagegraph displayed above we can evaluate following curve

100

10

1

0101 1 10

Frequency (kHz)

Tantalum

OxiCapreg

Imp

ed

an

ce M

ultip

lier

100 1000

0 20 40Temperature (Celsius)

Tantalum

OxiCapreg

Ch

an

ge in

ES

R

60 80 100 125 150-20-40-55

18

1716

15

14

13

1211

109

08

10

100

1

01

Temperature (degC)Le

akag

e cu

rrent

ratio

IIR

20

20 40 60 80 1000-20-40 175150125

1

01

0010 20 40 60 80 100

Rated Voltage (VR)

Leakage Currentratio IIVR

TypicalRange

LEAKAGE CURRENT vs RATED VOLTAGE

112917 259


154 Ripple currentThe maximum ripple current allowed is derived from the powerdissipation limits for a given temperature rise above ambienttemperature (please refer to Section 2 pages 261-262)

16 SELF INDUCTANCE (ESL)

The self-inductance value (ESL) can be important for resonance frequency evaluation See figure below typical ESLvalues per case size

TAJTMJTPSTRJTHJTLJTCJTCQTCRNLJNOJNOS

Typical Self Typical Self Typical Self Case Inductance Case Inductance Case Inductance Size value (nH) Size value (nH) Size value (nH)

A 18 H 18 U 24 B 18 K 18 V 24 C 22 N 14 W 22 D 24 P 14 X 24 E 25 R 14 Y 24 F 22 S 18 5 24 G 18 T 18

Typical Self- Case Inductance Size value (nH)

A 15 B 16 D 14 E 10 H 14 I 13 J 12 K 11 L 12 M 13 R 14 T 16 U 13 V 15 Z 11


K 10 L 10 M 13 N 13 O 10 S 10 T 10 X 18 3 20 4 22 6 25


D 10 E 25 U 24 V 24 Y 10

TCMTPMTRMNOM

TACTLCTPC TLNTCNJ-CAPTM

LEAKAGE CURRENT MULTIPLIER vs VOLTAGE DERATING

for FIXED APPLICATION VOLTAGE VA

We can identify the range of VAVR (derating) values with min-imum actual DCL as the ldquooptimalrdquo range Therefore the min-imum DCL is obtained when capacitor is used at 25 to 40 of rated voltage - when the rated voltage of the capacitor is25 to 4 times higher than actual application voltage

For additional information on Leakage Current please con-sult the AVX technical publication ldquoAnalysis of Solid TantalumCapacitor Leakage Currentrdquo by R W Franklin

0

02

04

06

08

1

12

14

0 10 20 30 40 50 60 70 80 90 100

Application voltage VA to rated voltage VR ratio ()

Optimalrange

Leak

age

curr

ent m

ultip

lier

260 112917


21 RIPPLE RATINGS (AC)

In an ac application heat is generated within the capacitorby both the ac component of the signal (which will dependupon the signal form amplitude and frequency) and by thedc leakage For practical purposes the second factor isinsignificant The actual power dissipated in the capacitor iscalculated using the formula

P = I 2 R

and rearranged to I = SQRT (PfraslR) (Eq 1)

where I = rms ripple current amperes R = equivalent series resistance ohms U = rms ripple voltage volts P = power dissipated watts Z = impedance ohms at frequency under consideration

Maximum ac ripple voltage (Umax)

From the Ohmsrsquo law equation

Umax = IR (Eq 2)

Where P is the maximum permissible power dissipated aslisted for the product under consideration (see tables)

However care must be taken to ensure that

1 The dc working voltage of the capacitor must not beexceeded by the sum of the positive peak of the appliedac voltage and the dc bias voltage

2 The sum of the applied dc bias voltage and the negativepeak of the ac voltage must not allow a voltage reversalin excess of the ldquoReverse Voltagerdquo

Historical ripple calculationsPrevious ripple current and voltage values were calculatedusing an empirically derived power dissipation required togive a 10degC (30degC for polymer) rise of the capacitors bodytemperature from room temperature usually in free air Thesevalues are shown in Table I Equation 1 then allows the max-imum ripple current to be established and Equation 2 themaximum ripple voltage But as has been shown in the AVXarticle on thermal management by I Salisbury the thermalconductivity of a Tantalum chip capacitor varies considerablydepending upon how it is mounted

SECTION 2AC OPERATION RIPPLE VOLTAGE AND RIPPLE CURRENT

Max power dissipation (W)

Tantalum Polymer OxiCapreg

TCJ Case

TAJTMJTPS TPM

TCN NLJ Size

TRJTHJ TLN TRM

J-CAPTM TCM NOJ NOM TLJ TCQ NOS TCR

A 0075 mdash mdash 0100 mdash 0090 mdash

B 0085 mdash mdash 0125 mdash 0102 mdash

C 0110 mdash mdash 0175 mdash 0132 mdash

D 0150 mdash 0255 0225 ndash 0180 mdash

E 0165 mdash 0270 0250 0410 0198 0324

F 0100 mdash mdash 0150 mdash 0120 mdash

G 0070 0060 mdash 0100 mdash 0084 mdash

H 0080 0070 mdash 0100 mdash 0096 mdash

K 0065 0055 mdash 0090 mdash 0078 mdash

L 0070 0060 mdash 0095 mdash 0084 mdash

M mdash 0040 mdash 0080 mdash mdash mdash

N 0050 0040 mdash 0080 mdash mdash mdash

O ndash ndash mdash 0065 mdash mdash mdash

P 0060 mdash mdash 0090 mdash 0072 mdash

R 0055 mdash mdash 0085 mdash 0066 mdash

S 0065 0055 mdash 0095 mdash 0078 mdash

T 0080 0070 mdash 0100 mdash 0096 mdash

U 0165 mdash 0295 0380 mdash mdash mdash

V 0250 mdash 0285 0360 0420 0300 mdash

W 0090 mdash mdash 0130 mdash 0108 mdash

X 0100 mdash mdash 0175 mdash 0120 mdash

Y 0125 0115 0210 0185 ndash 0150 mdash

3 mdash mdash mdash 0145 mdash mdash mdash

4 mdash 0165 mdash 0190 mdash mdash mdash


6 mdash 0230 mdash mdash mdash mdash mdash

Case Max power

Size dissipation (W) A 0040 B 0040 D 0035 E 0010 H 0040 I 0035 J 0020 K 0015 L 0025 M 0030 Q 0040 R 0045 T 0040 U 0035 V 0035 X 0040 Z 0020

Temp ordmC

Correction Factor Correction Factor Max Temperature for ripple current for Power Dissipation rise ordmC

up to 25degC 100 100 10

+55 095 090 9

+85 090 081 81

+105 065 042 42

+115 049 024 24

+125 040 016 16

+175 (THJ) 020 004 04

+200 (THJ) 010 001 01

Temperature correction factor

for ripple current

Temp degC Factor+25 100+55 095+85 090+105 040+125

040(NOSNOM)

TACmicrochipreg Series NLJNOJNOSNOMTAJTMJTPSTPMTRJTRMTHJTLJTLNTCJTCMTCNJ-CAPTMTCQTCRNLJNOJNOSNOM Series Molded Chip

TAJTPSTPMTRJTRMTHJTLJTLN

Table I Power Dissipation Ratings (In Free Air)

Temp ordmC


up to 45degC 100 100 30

+85 070 049 15

+105 045 020 6

+125 025 006 18

TCJTCMTCNJ-CAPTMTCQTCR

052418 261

Technical Summary and Application GuidelinesA piece of equipment was designed which would pass sineand square wave currents of varying amplitudes through abiased capacitor The temperature rise seen on the body forthe capacitor was then measured using an infra-red probeThis ensured that there was no heat loss through any thermo-couple attached to the capacitorrsquos surface

Results for the C D and E case sizes

Several capacitors were tested and the combined results areshown above All these capacitors were measured on FR4board with no other heat sinking The ripple was supplied atvarious frequencies from 1kHz to 1MHz

As can be seen in the figure above the average Pmax valuefor the C case capacitors was 011 Watts This is the sameas that quoted in Table I

The D case capacitors gave an average Pmax value 0125Watts This is lower than the value quoted in the Table I by0025 Watts The E case capacitors gave an average Pmax of0200 Watts that was much higher than the 0165 Wattsfrom Table I

If a typical capacitorrsquos ESR with frequency is considered egfigure below it can be seen that there is variation Thus for aset ripple current the amount of power to be dissipated bythe capacitor will vary with frequency This is clearly shownin figure in top of next column which shows that the surfacetemperature of the unit raises less for a given value of ripplecurrent at 1MHz than at 100kHz

The graph below shows a typical ESR variation with frequencyTypical ripple current versus temperature rise for 100kHzand 1MHz sine wave inputs

If I2R is then plotted it can be seen that the two lines are infact coincident as shown in figure below

ExampleA Tantalum capacitor is being used in a filtering applicationwhere it will be required to handle a 2 Amp peak-to-peak200kHz square wave current

A square wave is the sum of an infinite series of sine wavesat all the odd harmonics of the square waves fundamentalfrequency The equation which relates is

ISquare = Ipksin (2πƒ) + Ipksin (6πƒ) + Ipksin (10πƒ) + Ipksin (14πƒ) +

Thus the special components are

Let us assume the capacitor is a TAJD686M006Typical ESR measurements would yield

Thus the total power dissipation would be 0069 Watts

From the D case results shown in figure top of previous column it can be seen that this power would cause thecapacitors surface temperature to rise by about 5degC For additional information please refer to the AVX technicalpublication ldquoRipple Rating of Tantalum Chip Capacitorsrdquo byRW Franklin

7000

6000

5000

4000

3000

2000

1000

000

000 005 045010 015 020 025 030 035 040 050FR

Tem

per

atur

e R

ise

(C)

100KHz

1 MHz

70

60

50

40

30

20

10

0000 020 040 060 080 100 120

RMS current (Amps)

Tem

per

atur

e ri

se (C

)

100KHz

1 MHz

100

90

8070

6050

4030

201000 01 02 03 04 05

Power (Watts)

Tem

per

atur

e ri

se (

oC

)

C case

D case

E case

Frequency Typical ESR Power (Watts) (Ohms) Irms2 x ESR

200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001

Frequency Peak-to-peak current RMS current (Amps) (Amps)

200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101

ESR vs FREQUENCY(TPSE107M016R0100)

ES

R (

Oh

ms)

1

01

001100 1000 10000 100000 1000000

Frequency (Hz)

262 052418

The heat generated inside a tantalum capacitor in ac operation comes from the power dissipation due to ripplecurrent It is equal to I2R where I is the rms value of the current at a given frequency and R is the ESR at the samefrequency with an additional contribution due to the leakagecurrent The heat will be transferred from the outer surfaceby conduction How efficiently it is transferred from this pointis dependent on the thermal management of the board

The power dissipation ratings given in Section 21 (page 231)are based on free-air calculations These ratings can beapproached if efficient heat sinking andor forced cooling is used

In practice in a high density assembly with no specificthermal management the power dissipation required to givea 10degC (30degC for polymer) rise above ambient may be up toa factor of 10 less In these cases the actual capacitor tem-perature should be established (either by thermocoupleprobe or infra-red scanner) and if it is seen to be above thislimit it may be necessary to specify a lower ESR part or ahigher voltage rating

Please contact application engineering for details or contactthe AVX technical publication entitled ldquoThermal Managementof Surface Mounted Tantalum Capacitorsrdquo by Ian Salisbury

OxiCapreg capacitors showing 20 higher power dissipationallowed compared to tantalum capacitors as a result of twicehigher specific heat of niobium oxide compared to Tantalum

powders (Specific heat is related to energy necessary to heata defined volume of material to a specified temperature)


23 THERMAL MANAGEMENT

LEAD FRAME

SOLDER

ENCAPSULANT

COPPER

PRINTED CIRCUIT BOARD

TANTALUMANODE

121 CWATT

73 CWATT

236 CWATT

X - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY

XX

X

TEMPERATURE DEG C

THERMAL IMPEDANCE GRAPHC CASE SIZE CAPACITOR BODY

140

120

100

80

60

40

20

00 01 02 03 04 05 06 07 08 09 10 11 12 13 14

POWER IN UNIT CASE DC WATTS

= PCB MAX Cu THERMAL = PCB MIN Cu AIR GAP = CAP IN FREE AIR

Thermal Dissipation from the Mounted Chip

Thermal Impedance Graph with Ripple Current

22 OxiCapreg RIPPLE RATING

052418 263


SECTION 3RELIABILITY AND CALCULATION OF FAILURE RATE

31 STEADY-STATE

Both Tantalum and Niobium Oxide dielectric have essentially

no wear out mechanism and in certain circumstances is

capable of limited self healing However random failures can

occur in operation The failure rate of Tantalum capacitors

will decrease with time and not increase as with other

electrolytic capacitors and other electronic components

Figure 1 Tantalum and OxiCapreg Reliability Curve

The useful life reliability of the Tantalum and OxiCapreg capacitors

in steady-state is affected by three factors The equation from

which the failure rate can be calculated is

F = FV x FT x FR x FBwhere FV is a correction factor due to operating

voltagevoltage derating

FT is a correction factor due to operating

temperature

FR is a correction factor due to circuit series

resistance

FB is the basic failure rate level

Base failure rate

Standard Tantalum conforms to Level M reliability (ie

11000 hrs) or better at rated voltage 85degC and 01Ωvolt

circuit impedance

FB = 10 1000 hours for TAJ TPS TPM TCJ TCQ

TCM TCN J-CAPTM TAC

05 1000 hours for TCR TMJ TRJ TRM THJ amp NOJ

02 1000 hours for NOS and NOM

TLJ TLN TLC and NLJ series of tantalum capacitors are defined

at 05 x rated voltage at 85degC due to the temperature derating

FB = 021000 hours at 85degC and 05xVR with 01ΩV

series impedance with 60 confidence level

Operating voltagevoltage derating

If a capacitor with a higher voltage rating than the maximum

line voltage is used then the operating reliability will be

improved This is known as voltage derating

The graph Figure 2a shows the relationship between

voltage derating (the ratio between applied and rated

voltage) and the failure rate The graph gives the correction

factor FU for any operating voltage

Figure 2a Correction factor to failure rate FV for voltage derating of a typical component (60 con level)

Figure 2b Gives our recommendation for voltage derating

for tantalum capacitors to be used in typical applications

Figure 2c Gives voltage derating recommendations for

tantalum capacitors as a function of circuit impedance

Infinite Useful Life

Useful life reliability can be altered by voltagederating temperature or series resistance

InfantMortalities

Recommended Range Tantalum

100908070605

040302

010001 01 10 10

Circuit Resistance (OhmV)

Wor

king

Vol

tage

Rat

ed V

olta

ge

100 1000 10000

OxiCapreg Tantalum Polymer TCJ TCN J-CAPTM

Specified Range inLow Impedance Circuit

Specified Rangein General Circuit

40

30

20

10

04 63 10 16 20 25

Rated Voltage (V)

Op

era

tin

g V

oltag

e (V

)

35 50

100

10

01

001

0001

000010 01 02 03 04 05 06

Applied VoltageRated Voltage

Co

rrectio

n F

acto

r

07 08 09 10 11 12

TantalumOxiCap

reg

FV

264 101216

Technical Summary and Application GuidelinesOperating Temperature

If the operating temperature is below the rated temperature

for the capacitor then the operating reliability will be

improved as shown in Figure 3 This graph gives a correction

factor FT for any temperature of operation

Figure 3 Correction factor to failure rate FR for ambient

temperature T for typical component

(60 con level)

Circuit Impedance

All solid Tantalum andor niobium oxide capacitors require

current limiting resistance to protect the dielectric from surges

A series resistor is recommended for this purpose A lower

circuit impedance may cause an increase in failure rate

especially at temperatures higher than 20degC An inductive low

impedance circuit may apply voltage surges to the capacitor

and similarly a non-inductive circuit may apply current surges

to the capacitor causing localized over-heating and failure

The recommended impedance is 1 Ω per volt Where this is

not feasible equivalent voltage derating should be used

(See MIL HANDBOOK 217E) The graph Figure 4 shows

the correction factor FR for increasing series resistance

Figure 4 Correction factor to failure rate FR for series

resistance R on basic failure rate FB for a typical component

(60 con level)

For circuit impedances below 01 ohms per volt or for any

mission critical application circuit protection should be

considered An ideal solution would be to employ an AVX

SMT thin-film fuse in series

Example calculation

Consider a 12 volt power line The designer needs about

10μF of capacitance to act as a decoupling capacitor near a

video bandwidth amplifier Thus the circuit impedance will be

limited only by the output impedance of the boardrsquos power

unit and the track resistance Let us assume it to be about

2 Ohms minimum ie 0167 OhmsVolt The operating

temperature range is -25degC to +85degC

If a 10μF 16 Volt capacitor was designed in the operating

failure rate would be as follows

a) FT = 10 85degC

b) FR = 085 0167 OhmsVolt

c) FV = 008 applied voltagerated

voltage = 75

d) FB = 11000 hours basic failure rate level

Thus F = 10 x 085 x 008 x 1 = 00681000 Hours

If the capacitor was changed for a 20 volt capacitor the

operating failure rate will change as shown

FV = 0018 applied voltagerated voltage = 60

F = 10 x 085 x 0018 x 1 = 001531000 Hours

32 Dynamic

As stated in Section 124 (page 257) the solid capacitor has

a limited ability to withstand voltage and current surges

Such current surges can cause a capacitor to fail The

expected failure rate cannot be calculated by a simple

formula as in the case of steady-state reliability The two

parameters under the control of the circuit design engineer

known to reduce the incidence of failures are derating and

series resistance

The table below summarizes the results of trials carried out

at AVX with a piece of equipment which has very low series

resistance with no voltage derating applied That is if the

capacitor was tested at its rated voltage It has been tested

on tantalum capacitors however the conclusions are valid

for both tantalum and OxiCapreg capacitors

Results of production scale derating experiment

As can clearly be seen from the results of this experiment

the more derating applied by the user the less likely the

probability of a surge failure occurring

It must be remembered that these results were derived from

a highly accelerated surge test machine and failure rates in

the low ppm are more likely with the end customer

A commonly held misconception is that the leakage current

of a Tantalum capacitor can predict the number of failures

which will be seen on a surge screen This can be disproved

by the results of an experiment carried out at AVX on 47μF

Capacitance Number of 50 derating No derating and Voltage units tested applied applied

47μF 16V 1547587 003 11

100μF 10V 632876 001 05

22μF 25V 2256258 005 03

0

1000

10000

100

10

01

0014020 60 80 100 120 140 160 180 200

100000

Temperature (ordmC)

TantalumNOJ

NOS

Cor

rect

ion

Fact

orF T

Circuit resistance FR ohmsvolt

30 007

20 01

10 02

08 03

06 04

04 06

02 08

01 10

101216 265

Technical Summary and Application Guidelines10V surface mount capacitors with different leakage

currents The results are summarized in the table below

Leakage current vs number of surge failures

Again it must be remembered that these results were

derived from a highly accelerated surge test machine

and failure rates in the low ppm are more likely with the end

customer

OxiCapreg capacitor is less sensitive to an overloading stress

compared to Tantalum and so a 20 minimum derating is

recommended It may be necessary in extreme low impedance

circuits of high transient or lsquoswitch-onrsquo currents to derate the

voltage further Hence in general a lower voltage OxiCapreg part

number can be placed on a higher rail voltage compared to the

tantalum capacitor ndash see table below

AVX recommended derating table

For further details on surge in Tantalum capacitors refer

to JA Gillrsquos paper ldquoSurge in Solid Tantalum Capacitorsrdquo

available from AVX offices worldwide

An added bonus of increasing the derating applied in a

circuit to improve the ability of the capacitor to withstand

surge conditions is that the steady-state reliability is

improved by up to an order Consider the example of a

63 volt capacitor being used on a 5 volt rail

The steady-state reliability of a Tantalum capacitor is affected by

three parameters temperature series resistance and voltage

derating Assume 40degC operation and 01 OhmsVolt series

resistance

The capacitors reliability will therefore be

Failure rate = FU x FT x FR x 11000 hours

= 015 x 01 x 1 x 11000 hours

= 00151000 hours

If a 10 volt capacitor was used instead the new scaling factor

would be 0006 thus the steady-state reliability would be


= 0006 x 01 x 1 x 11000 hours

= 6 x 10-4 1000 hours

So there is an order improvement in the capacitors steady-

state reliability

Number tested Number failed surge

Standard leakage range 10000 25 01 μA to 1μA

Over Catalog limit 10000 26 5μA to 50μA

Classified Short Circuit 10000 25 50μA to 500μA

Voltage Rail Rated Voltage of Cap (V)

(V) Tantalum OxiCapreg

33 63 4

5 10 63

8 16 10

10 20 ndash

12 25 ndash

15 35 ndash

gt24 Series Combination ndash

266 101216


Both Tantalum and OxiCapreg are lead-free system compatiblecomponents meeting requirements of J-STD-020 standardThe maximum conditions with care Max Peak Temperature260ordmC for maximum 10s 3 reflow cycles 2 cycles areallowed for F-series capacitors

Small parametric shifts may be noted immediately afterreflow components should be allowed to stabilize at roomtemperature prior to electrical testing

RECOMMENDED REFLOW PROFILE

Lead-free soldering

Pre-heating 150plusmn15ordmC60ndash120sec Max Peak Temperature 245plusmn5ordmCMax Peak Temperature Gradient 25ordmCsec Max Time above 230ordmC 40sec max

SnPb soldering

Pre-heating 150plusmn15ordmC60ndash90secMax Peak Temperature 220plusmn5ordmCMax Peak Temperature Gradient 2ordmCsecMax Time above solder melting point 60sec

RECOMMENDED WAVE SOLDERING

Lead-free soldering

Pre-heating 50-165ordmC90-120sec Max Peak Temperature 250-260ordmCTime of wave 3-5sec(max 10sec)

SnPb soldering

Pre-heating 50-165ordmC90ndash120sec Max Peak Temperature 240-250ordmCTime of wave 3-5sec(max10sec)

The upper side temperature of the board should notexceed +150ordmC

GENERAL LEAD-FREE NOTES

The following should be noted by customers changing fromlead based systems to the new lead free pastes

a) The visual standards used for evaluation of solder joints willneed to be modified as lead-free joints are not as bright aswith tin-lead pastes and the fillet may not be as large

b) Resin color may darken slightly due to the increase in tem-perature required for the new pastes

c) Lead-free solder pastes do not allow the same self align-ment as lead containing systems Standard mountingpads are acceptable but machine set up may need to bemodified

Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to wave soldering

RECOMMENDED HAND SOLDERING

Recommended hand soldering condition

Note TCJ TCM TCN J-CAPTM TCQ TCR F38 TLN andF98 series are not dedicated to hand soldering

SECTION 4RECOMMENDED SOLDERING CONDITIONS

Tip Diameter Selected to fit Application

Max Tip Temperature +370degC

Max Exposure Time 3s

Anti-static Protection Non required

101216 267

51 Basic Materials

Two basic materials are used for termination leads Nilo42 (Fe58Ni42) and copper Copper lead frame is mainlyused for products requiring low ESR performance whileNilo 42 is used for other products The actual status ofbasic material per individual part type can be checkedwith AVX

52 Termination Finishes ndash Coatings

Three terminations plating are available Standard platingmaterial is pure matte tin (Sn) Gold or tin-lead (SnPb) areavailable upon request with different part number suffixdesignations

521 Pure matte tin is used as the standard coatingmaterial meeting lead-free and RoHS require-ments AVX carefully monitors the latest findingson prevention of whisker formation Currentlyused techniques include use of matte tin elec-trodeposition nickel barrier underplating andrecrystallization of surface by reflow Terminationsare tested for whiskers according to NEMI recom-mendations and JEDEC standard requirementsData is available upon request

522 Gold Plating is available as a special option main-ly for hybrid assembly using conductive glue

523 Tin-lead (90Sn 10Pb) electroplated termina-tion finish is available as a special option uponrequest

Some plating options can be limited to specific part typesPlease check availability of special options with AVX

SECTION 5TERMINATIONS


268 101216

61 Acceleration981ms2 (10g)

62 Vibration Severity10 to 2000Hz 075mm of 981ms2 (10g)

63 ShockTrapezoidal Pulse 981ms2 for 6ms

64 Adhesion to SubstrateIEC 384-3 minimum of 5N

65 Resistance to Substrate Bending The component has compliant leads which reduces the risk of

stress on the capacitor due to substrate bending

66 Soldering ConditionsDip soldering is permissible provided the solder bath tempera-ture is 270degC the solder time 3 seconds and the circuitboard thickness 10mm

67 Installation InstructionsThe upper temperature limit (maximum capacitor surface tem-perature) must not be exceeded even under the most unfavor-able conditions when the capacitor is installed This must be con-sidered particularly when it is positioned near components whichradiate heat strongly (eg valves and power transistors)Furthermore care must be taken when bending the wires thatthe bending forces do not strain the capacitor housing

68 Installation PositionNo restriction

69 Soldering InstructionsFluxes containing acids must not be used

691 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVX capacitors

The component footprint is defined as the maximum board areataken up by the terminators The footprint dimensions are given byA B C and D in the diagram which corresponds to W1 max A max S min and L max for the component The footprint is symmetric about the center lines

The dimensions x y and z should be kept to a minimum to reducerotational tendencies while allowing for visual inspection of the com-ponent and its solder fillet

Dimensions PS (c for F-series) (Pad Separation) and PW (a for F-series) (Pad Width) are calculated using dimensions x and zDimension y may vary depending on whether reflow or wave soldering is to be performed

For reflow soldering dimensions PL (b for positive terminal of F-series b for negative terminal of F-series) (Pad Length) PW (a)(Pad Width) and PSL (Pad Set Length) have been calculated Forwave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up whileensuring that a good joint can be produced In the case of mount-ing conformal coated capacitors excentering (Δc) is needed toexcept anode tab [ ]

PW

PLP PLNPSPSL

SECTION 6MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS


Case Size PSL PL PS PW PWw A 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) B 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) C 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) D 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) E 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) F 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) G 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) H 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) K 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) L 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) N 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) P 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) R 270 (0106) 095 (0037) 080 (0031) 160 (0063) 080 (0031) S 400 (0157) 140 (0055) 120 (0047) 180 (0071) 090 (0035) T 400 (0157) 140 (0055) 120 (0047) 280 (0110) 160 (0063) U 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) V 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) W 650 (0256) 200 (0079) 250 (0098) 280 (0110) 160 (0063) X 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Y 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) Z 800 (0315) 200 (0079) 400 (0157) 370 (0145) 180 (0071) 5 800 (0315) 200 (0079) 400 (0157) 300 (0118) 170 (0067) A 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) B 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) C 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) D 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) E 090 (0035) 030 (0012) 030 (0012) 030 (0012) NA H 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) I 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) J 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) K 220 (0087) 090 (0035) 040 (0016) 070 (0028) 035 (0014) L 280 (0110) 110 (0043) 060 (0024) 100 (0039) 050 (0019) M 320 (0126) 130 (0051) 060 (0024) 100 (0039) 050 (0019) Q 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) R 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) S 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) T 470 (0185) 170 (0067) 130 (0051) 300 (0118) 150 (0059) U 320 (0126) 130 (0051) 060 (0024) 150 (0059) 0075 (0003) V 440 (0173) 160 (0063) 120 (0047) 180 (0071) 090 (0035) Z 280 (0110) 110 (0043) 060 (0024) 070 (0028) 035 (0014)

SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series

Note SMD lsquoJrsquo Lead = TAJ TMJ TPS TPM TRJ TRM THJ TLJ TCJ TCM TCQ TCR

NOTE

These recommendations (also in compliancewith EIA) are guidelines only With care andcontrol smaller footprints may be consideredfor reflow soldering

Nominal footprint and pad dimensions for each case size are givenin the following tables

PAD DIMENSIONS millimeters (inches)

Case Size a b b c Δc U 035 (0014) 040 (0016) 040 (0016) 040 (0016) 000 M 065 (0026) 070 (0028) 070 (0028) 060 (0024) 000 S 090 (0035) 070 (0028) 070 (0028) 080 (0032) 000 P 100 (0039) 110 (0043) 110 (0043) 040 (0016) 000 A 130 (0051) 140 (0055) 140 (0055) 100 (0039) 000 B 230 (0091) 140 (0055) 140 (0055) 130 (0051) 000 C 230 (0091) 200 (0079) 200 (0079) 270 (0106) 000 N 250 (0098) 200 (0079) 200 (0079) 400 (0157) 000 RP 140 (0055) 060 (0024) 050 (0020) 070 (0028) 020 (0008) QS 170 (0067) 070 (0028) 060 (0024) 110 (0043) 020 (0008) A 180 (0071) 070 (0028) 060 (0024) 110 (0043) 020 (0008) T 260 (0102) 070 (0028) 060 (0024) 120 (0047) 020 (0008) B 260 (0102) 080 (0032) 070 (0028) 110 (0043) 020 (0008)

RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series

In the case of mounting conformal coated capacitors excentering (Δc) is needed to except anode tab [ ]

Case Size PSL PLP PS PLN PW+ PW- M 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle

PAD DIMENSIONS F-SERIES millimeters (inches)

041118 269

610 PCB CleaningTa chip capacitors are compatible with most PCBboard cleaning systems

If aqueous cleaning is performed parts must be allowed to dry prior to test In the event ultrasonics are used powerlevels should be less than 10 watts perlitre and care mustbe taken to avoid vibrational nodes in the cleaning bath

SECTION 7 EPOXY FLAMMABILITY

SECTION 8 QUALIFICATION APPROVAL STATUS


EPOXY UL RATING OXYGEN INDEX

TAJTMJTPSTPMTRJTRMTHJ TLJTLNTCJTCMTCNJ-CAPTM UL94 V-0 35 TCQTCRNLJNOJNOSNOM

DESCRIPTION STYLE SPECIFICATION

Surface mount TAJ CECC 30801 - 005 Issue 2 capacitors CECC 30801 - 011 Issue 1

PW

PLP PSPSL

Case Size PSL PL PS PW PWW

9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA

TCH amp THHJ-lead only

THHJ-lead only

THHUndertab only

SERIES

Case Size PSL PL PS PKW PW PK 9 1100(0433) 170(0067) 760(0300) 1060(0417) 300(0118) 460(0181)TCH amp THHUndertab only

SERIES

PAD DIMENSIONS SMD HERMETICmillimeters (inches)

PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118

255

The chemical equations describing the process are asfollows

Tantalum Anode 2 Ta rarr 2 Ta5+ + 10 e- 2 Ta5+ + 10 OH-rarr Ta2O5 + 5 H2O

Niobium Oxide Anode

2 NbO rarr 2 NbO3+ + 6 e-2 NbO3+ + 6 OH-rarr Nb2O5 + 3 H2O

Cathode

Tantalum 10 H2O ndash 10 e rarr 5H2 + 10 OH-

Niobium Oxide 6 H2O ndash 6 e- rarr 3H2 + 6 OH-

The oxide forms on the surface of the Tantalum or NiobiumOxide but it also grows into the material For each unit ofoxide two thirds grows out and one third grows in It is forthis reason that there is a limit on the maximum voltage rat-ing of Tantalum amp Niobium Oxide capacitors with presenttechnology powders (see Figure 3)

The dielectric operates under high electrical stress Considera 220μF 6V part

Formation voltage = Formation Ratio x Working Voltage = 35 x 6 = 21 VoltsTantalumThe pentoxide (Ta2O5) dielectric grows at a rate of 17 x 10-9 mV


= 0036 μm


Niobium OxideThe niobium oxide (Nb2O5) dielectric grows at a rate of 24 x 10-9 mV


= 0050 μm


Figure 3 Dielectric layer

The next stage is the production of the cathode plate This is achieved by pyrolysis of Manganese Nitrate intoManganese Dioxide

The ldquopelletrdquo is dipped into an aqueous solution of nitrate andthen baked in an oven at approximately 250degC to producethe dioxide coat The chemical equation is

Mn (NO3)2 rarr MnO2 + 2NO2 ndash

This process is repeated several times through varyingspecific densities of nitrate to build up a thick coat over all internal and external surfaces of the ldquopelletrdquo as shown inFigure 4

Figure 4 Manganese Dioxide Layer

The ldquopelletrdquo is then dipped into graphite and silver to provide a good connection to the Manganese Dioxide cathode plate Electrical contact is established by depositionof carbon onto the surface of the cathode The carbon is then coated with a conductive material to facilitate connectionto the cathode termination (see Figure 5) Packaging is carriedout to meet individual specifications and customer require-ments This manufacturing technique is adhered to for thewhole range of AVX Tantalum capacitors which can be subdi-vided into four basic groups Chip Resin dipped Rectangular boxed Axial

Further information on production of Tantalum Capacitorscan be obtained from the technical paper ldquoBasic TantalumTechnologyrdquo by John Gill available from your local AVX representative

Figure 5 Cathode Termination

Anode Manganese Graphite Outer Silver Cathode

Dioxide Silver Layer Epoxy Connection


11 CAPACITANCE





12 VOLTAGE









TAJE227K010



2 27 13 17 25 33 17 22 3 39 2 26 4 52 27 34 5 65 33 4 63 8 4 5 10 13 7 8 16 20 10 13 20 26 13 16 25 32 17 20 35 46 23 28 50 65 33 40



18 23 12 16 25 33 17 22 4 52 27 34 63 8 4 5 10 13 7 8



256 112917

112917 257


































ESR =

tan δ 2πfC






5

45

4

35

325

2

151

05001 1 10

ES

R M

ultip

lier

Frequency (kHz)

Tantalum

OxiCapreg

100 1000

18

17

1615

14

1312

111

0908

-55 -5 45 95


TantalumOxiCapreg

DF

Mu

ltip

lier

50

5

1

0101 1 10 100

Frequency (kHz)

Tantalum OxiCapreg

DF

Mu

ltip

lier


258 112917











Vmax = 1- (T - 85) x VR





100

10

1

0101 1 10

Frequency (kHz)

Tantalum

OxiCapreg

Imp

ed

an

ce M

ultip

lier

100 1000


Tantalum

OxiCapreg

Ch

an

ge in

ES

R

60 80 100 125 150-20-40-55

18

1716

15

14

13

1211

109

08

10

100

1

01


akag

e cu

rrent

ratio

IIR

20

20 40 60 80 1000-20-40 175150125

1

01

0010 20 40 60 80 100

Rated Voltage (VR)


TypicalRange


112917 259











K 10 L 10 M 13 N 13 O 10 S 10 T 10 X 18 3 20 4 22 6 25


D 10 E 25 U 24 V 24 Y 10

TCMTPMTRMNOM






0

02

04

06

08

1

12

14

0 10 20 30 40 50 60 70 80 90 100


Optimalrange

Leak

age

curr

ent m

ultip

lier

260 112917




P = I 2 R





Umax = IR (Eq 2)









TCJ Case

TAJTMJTPS TPM

TCN NLJ Size

TRJTHJ TLN TRM






E 0165 mdash 0270 0250 0410 0198 0324














V 0250 mdash 0285 0360 0420 0300 mdash



Y 0125 0115 0210 0185 ndash 0150 mdash





Case Max power


Temp ordmC


up to 25degC 100 100 10

+55 095 090 9

+85 090 081 81

+105 065 042 42

+115 049 024 24

+125 040 016 16

+175 (THJ) 020 004 04

+200 (THJ) 010 001 01


for ripple current

Temp degC Factor+25 100+55 095+85 090+105 040+125

040(NOSNOM)




Temp ordmC


up to 45degC 100 100 30

+85 070 049 15

+105 045 020 6

+125 025 006 18


052418 261
















7000

6000

5000

4000

3000

2000

1000

000

000 005 045010 015 020 025 030 035 040 050FR

Tem

per

atur

e R

ise

(C)

100KHz

1 MHz

70

60

50

40

30

20

10

0000 020 040 060 080 100 120

RMS current (Amps)

Tem

per

atur

e ri

se (C

)

100KHz

1 MHz

100

90

8070

6050

4030

201000 01 02 03 04 05

Power (Watts)

Tem

per

atur

e ri

se (

oC

)

C case

D case

E case


200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001


200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101


ES

R (

Oh

ms)

1

01

001100 1000 10000 100000 1000000

Frequency (Hz)

262 052418









LEAD FRAME

SOLDER

ENCAPSULANT

COPPER


TANTALUMANODE

121 CWATT

73 CWATT

236 CWATT


XX

X

TEMPERATURE DEG C


140

120

100

80

60

40

20

00 01 02 03 04 05 06 07 08 09 10 11 12 13 14






052418 263



31 STEADY-STATE














temperature


resistance


Base failure rate



circuit impedance


TCM TCN J-CAPTM TAC






















InfantMortalities


100908070605

040302

010001 01 10 10


Wor

king

Vol

tage

Rat

ed V

olta

ge

100 1000 10000




40

30

20

10

04 63 10 16 20 25

Rated Voltage (V)

Op

era

tin

g V

oltag

e (V

)

35 50

100

10

01

001

0001

000010 01 02 03 04 05 06


Co

rrectio

n F

acto

r

07 08 09 10 11 12

TantalumOxiCap

reg

FV

264 101216








(60 con level)

Circuit Impedance















(60 con level)





Example calculation










a) FT = 10 85degC



voltage = 75


Thus F = 10 x 085 x 008 x 1 = 00681000 Hours




F = 10 x 085 x 0018 x 1 = 001531000 Hours

32 Dynamic








series resistance



















47μF 16V 1547587 003 11

100μF 10V 632876 001 05

22μF 25V 2256258 005 03

0

1000

10000

100

10

01

0014020 60 80 100 120 140 160 180 200

100000

Temperature (ordmC)

TantalumNOJ

NOS

Cor

rect

ion

Fact

orF T


30 007

20 01

10 02

08 03

06 04

04 06

02 08

01 10

101216 265







customer




















resistance



= 015 x 01 x 1 x 11000 hours

= 00151000 hours




= 0006 x 01 x 1 x 11000 hours

= 6 x 10-4 1000 hours


state reliability







33 63 4

5 10 63

8 16 10

10 20 ndash

12 25 ndash

15 35 ndash


266 101216





Lead-free soldering


SnPb soldering



Lead-free soldering


SnPb soldering

















101216 267

51 Basic Materials










268 101216
















PW

PLP PLNPSPSL




SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series


NOTE





RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series



N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle


041118 269










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118

11 CAPACITANCE





12 VOLTAGE









TAJE227K010



2 27 13 17 25 33 17 22 3 39 2 26 4 52 27 34 5 65 33 4 63 8 4 5 10 13 7 8 16 20 10 13 20 26 13 16 25 32 17 20 35 46 23 28 50 65 33 40



18 23 12 16 25 33 17 22 4 52 27 34 63 8 4 5 10 13 7 8



256 112917

112917 257


































ESR =

tan δ 2πfC






5

45

4

35

325

2

151

05001 1 10

ES

R M

ultip

lier

Frequency (kHz)

Tantalum

OxiCapreg

100 1000

18

17

1615

14

1312

111

0908

-55 -5 45 95


TantalumOxiCapreg

DF

Mu

ltip

lier

50

5

1

0101 1 10 100

Frequency (kHz)

Tantalum OxiCapreg

DF

Mu

ltip

lier


258 112917











Vmax = 1- (T - 85) x VR





100

10

1

0101 1 10

Frequency (kHz)

Tantalum

OxiCapreg

Imp

ed

an

ce M

ultip

lier

100 1000


Tantalum

OxiCapreg

Ch

an

ge in

ES

R

60 80 100 125 150-20-40-55

18

1716

15

14

13

1211

109

08

10

100

1

01


akag

e cu

rrent

ratio

IIR

20

20 40 60 80 1000-20-40 175150125

1

01

0010 20 40 60 80 100

Rated Voltage (VR)


TypicalRange


112917 259











K 10 L 10 M 13 N 13 O 10 S 10 T 10 X 18 3 20 4 22 6 25


D 10 E 25 U 24 V 24 Y 10

TCMTPMTRMNOM






0

02

04

06

08

1

12

14

0 10 20 30 40 50 60 70 80 90 100


Optimalrange

Leak

age

curr

ent m

ultip

lier

260 112917




P = I 2 R





Umax = IR (Eq 2)









TCJ Case

TAJTMJTPS TPM

TCN NLJ Size

TRJTHJ TLN TRM






E 0165 mdash 0270 0250 0410 0198 0324














V 0250 mdash 0285 0360 0420 0300 mdash



Y 0125 0115 0210 0185 ndash 0150 mdash





Case Max power


Temp ordmC


up to 25degC 100 100 10

+55 095 090 9

+85 090 081 81

+105 065 042 42

+115 049 024 24

+125 040 016 16

+175 (THJ) 020 004 04

+200 (THJ) 010 001 01


for ripple current

Temp degC Factor+25 100+55 095+85 090+105 040+125

040(NOSNOM)




Temp ordmC


up to 45degC 100 100 30

+85 070 049 15

+105 045 020 6

+125 025 006 18


052418 261
















7000

6000

5000

4000

3000

2000

1000

000

000 005 045010 015 020 025 030 035 040 050FR

Tem

per

atur

e R

ise

(C)

100KHz

1 MHz

70

60

50

40

30

20

10

0000 020 040 060 080 100 120

RMS current (Amps)

Tem

per

atur

e ri

se (C

)

100KHz

1 MHz

100

90

8070

6050

4030

201000 01 02 03 04 05

Power (Watts)

Tem

per

atur

e ri

se (

oC

)

C case

D case

E case


200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001


200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101


ES

R (

Oh

ms)

1

01

001100 1000 10000 100000 1000000

Frequency (Hz)

262 052418









LEAD FRAME

SOLDER

ENCAPSULANT

COPPER


TANTALUMANODE

121 CWATT

73 CWATT

236 CWATT


XX

X

TEMPERATURE DEG C


140

120

100

80

60

40

20

00 01 02 03 04 05 06 07 08 09 10 11 12 13 14






052418 263



31 STEADY-STATE














temperature


resistance


Base failure rate



circuit impedance


TCM TCN J-CAPTM TAC






















InfantMortalities


100908070605

040302

010001 01 10 10


Wor

king

Vol

tage

Rat

ed V

olta

ge

100 1000 10000




40

30

20

10

04 63 10 16 20 25

Rated Voltage (V)

Op

era

tin

g V

oltag

e (V

)

35 50

100

10

01

001

0001

000010 01 02 03 04 05 06


Co

rrectio

n F

acto

r

07 08 09 10 11 12

TantalumOxiCap

reg

FV

264 101216








(60 con level)

Circuit Impedance















(60 con level)





Example calculation










a) FT = 10 85degC



voltage = 75


Thus F = 10 x 085 x 008 x 1 = 00681000 Hours




F = 10 x 085 x 0018 x 1 = 001531000 Hours

32 Dynamic








series resistance



















47μF 16V 1547587 003 11

100μF 10V 632876 001 05

22μF 25V 2256258 005 03

0

1000

10000

100

10

01

0014020 60 80 100 120 140 160 180 200

100000

Temperature (ordmC)

TantalumNOJ

NOS

Cor

rect

ion

Fact

orF T


30 007

20 01

10 02

08 03

06 04

04 06

02 08

01 10

101216 265







customer




















resistance



= 015 x 01 x 1 x 11000 hours

= 00151000 hours




= 0006 x 01 x 1 x 11000 hours

= 6 x 10-4 1000 hours


state reliability







33 63 4

5 10 63

8 16 10

10 20 ndash

12 25 ndash

15 35 ndash


266 101216





Lead-free soldering


SnPb soldering



Lead-free soldering


SnPb soldering

















101216 267

51 Basic Materials










268 101216
















PW

PLP PLNPSPSL




SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series


NOTE





RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series



N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle


041118 269










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118

112917 257


































ESR =

tan δ 2πfC






5

45

4

35

325

2

151

05001 1 10

ES

R M

ultip

lier

Frequency (kHz)

Tantalum

OxiCapreg

100 1000

18

17

1615

14

1312

111

0908

-55 -5 45 95


TantalumOxiCapreg

DF

Mu

ltip

lier

50

5

1

0101 1 10 100

Frequency (kHz)

Tantalum OxiCapreg

DF

Mu

ltip

lier


258 112917











Vmax = 1- (T - 85) x VR





100

10

1

0101 1 10

Frequency (kHz)

Tantalum

OxiCapreg

Imp

ed

an

ce M

ultip

lier

100 1000


Tantalum

OxiCapreg

Ch

an

ge in

ES

R

60 80 100 125 150-20-40-55

18

1716

15

14

13

1211

109

08

10

100

1

01


akag

e cu

rrent

ratio

IIR

20

20 40 60 80 1000-20-40 175150125

1

01

0010 20 40 60 80 100

Rated Voltage (VR)


TypicalRange


112917 259











K 10 L 10 M 13 N 13 O 10 S 10 T 10 X 18 3 20 4 22 6 25


D 10 E 25 U 24 V 24 Y 10

TCMTPMTRMNOM






0

02

04

06

08

1

12

14

0 10 20 30 40 50 60 70 80 90 100


Optimalrange

Leak

age

curr

ent m

ultip

lier

260 112917




P = I 2 R





Umax = IR (Eq 2)









TCJ Case

TAJTMJTPS TPM

TCN NLJ Size

TRJTHJ TLN TRM






E 0165 mdash 0270 0250 0410 0198 0324














V 0250 mdash 0285 0360 0420 0300 mdash



Y 0125 0115 0210 0185 ndash 0150 mdash





Case Max power


Temp ordmC


up to 25degC 100 100 10

+55 095 090 9

+85 090 081 81

+105 065 042 42

+115 049 024 24

+125 040 016 16

+175 (THJ) 020 004 04

+200 (THJ) 010 001 01


for ripple current

Temp degC Factor+25 100+55 095+85 090+105 040+125

040(NOSNOM)




Temp ordmC


up to 45degC 100 100 30

+85 070 049 15

+105 045 020 6

+125 025 006 18


052418 261
















7000

6000

5000

4000

3000

2000

1000

000

000 005 045010 015 020 025 030 035 040 050FR

Tem

per

atur

e R

ise

(C)

100KHz

1 MHz

70

60

50

40

30

20

10

0000 020 040 060 080 100 120

RMS current (Amps)

Tem

per

atur

e ri

se (C

)

100KHz

1 MHz

100

90

8070

6050

4030

201000 01 02 03 04 05

Power (Watts)

Tem

per

atur

e ri

se (

oC

)

C case

D case

E case


200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001


200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101


ES

R (

Oh

ms)

1

01

001100 1000 10000 100000 1000000

Frequency (Hz)

262 052418









LEAD FRAME

SOLDER

ENCAPSULANT

COPPER


TANTALUMANODE

121 CWATT

73 CWATT

236 CWATT


XX

X

TEMPERATURE DEG C


140

120

100

80

60

40

20

00 01 02 03 04 05 06 07 08 09 10 11 12 13 14






052418 263



31 STEADY-STATE














temperature


resistance


Base failure rate



circuit impedance


TCM TCN J-CAPTM TAC






















InfantMortalities


100908070605

040302

010001 01 10 10


Wor

king

Vol

tage

Rat

ed V

olta

ge

100 1000 10000




40

30

20

10

04 63 10 16 20 25

Rated Voltage (V)

Op

era

tin

g V

oltag

e (V

)

35 50

100

10

01

001

0001

000010 01 02 03 04 05 06


Co

rrectio

n F

acto

r

07 08 09 10 11 12

TantalumOxiCap

reg

FV

264 101216








(60 con level)

Circuit Impedance















(60 con level)





Example calculation










a) FT = 10 85degC



voltage = 75


Thus F = 10 x 085 x 008 x 1 = 00681000 Hours




F = 10 x 085 x 0018 x 1 = 001531000 Hours

32 Dynamic








series resistance



















47μF 16V 1547587 003 11

100μF 10V 632876 001 05

22μF 25V 2256258 005 03

0

1000

10000

100

10

01

0014020 60 80 100 120 140 160 180 200

100000

Temperature (ordmC)

TantalumNOJ

NOS

Cor

rect

ion

Fact

orF T


30 007

20 01

10 02

08 03

06 04

04 06

02 08

01 10

101216 265







customer




















resistance



= 015 x 01 x 1 x 11000 hours

= 00151000 hours




= 0006 x 01 x 1 x 11000 hours

= 6 x 10-4 1000 hours


state reliability







33 63 4

5 10 63

8 16 10

10 20 ndash

12 25 ndash

15 35 ndash


266 101216





Lead-free soldering


SnPb soldering



Lead-free soldering


SnPb soldering

















101216 267

51 Basic Materials










268 101216
















PW

PLP PLNPSPSL




SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series


NOTE





RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series



N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle


041118 269










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118















ESR =

tan δ 2πfC






5

45

4

35

325

2

151

05001 1 10

ES

R M

ultip

lier

Frequency (kHz)

Tantalum

OxiCapreg

100 1000

18

17

1615

14

1312

111

0908

-55 -5 45 95


TantalumOxiCapreg

DF

Mu

ltip

lier

50

5

1

0101 1 10 100

Frequency (kHz)

Tantalum OxiCapreg

DF

Mu

ltip

lier


258 112917











Vmax = 1- (T - 85) x VR





100

10

1

0101 1 10

Frequency (kHz)

Tantalum

OxiCapreg

Imp

ed

an

ce M

ultip

lier

100 1000


Tantalum

OxiCapreg

Ch

an

ge in

ES

R

60 80 100 125 150-20-40-55

18

1716

15

14

13

1211

109

08

10

100

1

01


akag

e cu

rrent

ratio

IIR

20

20 40 60 80 1000-20-40 175150125

1

01

0010 20 40 60 80 100

Rated Voltage (VR)


TypicalRange


112917 259











K 10 L 10 M 13 N 13 O 10 S 10 T 10 X 18 3 20 4 22 6 25


D 10 E 25 U 24 V 24 Y 10

TCMTPMTRMNOM






0

02

04

06

08

1

12

14

0 10 20 30 40 50 60 70 80 90 100


Optimalrange

Leak

age

curr

ent m

ultip

lier

260 112917




P = I 2 R





Umax = IR (Eq 2)









TCJ Case

TAJTMJTPS TPM

TCN NLJ Size

TRJTHJ TLN TRM






E 0165 mdash 0270 0250 0410 0198 0324














V 0250 mdash 0285 0360 0420 0300 mdash



Y 0125 0115 0210 0185 ndash 0150 mdash





Case Max power


Temp ordmC


up to 25degC 100 100 10

+55 095 090 9

+85 090 081 81

+105 065 042 42

+115 049 024 24

+125 040 016 16

+175 (THJ) 020 004 04

+200 (THJ) 010 001 01


for ripple current

Temp degC Factor+25 100+55 095+85 090+105 040+125

040(NOSNOM)




Temp ordmC


up to 45degC 100 100 30

+85 070 049 15

+105 045 020 6

+125 025 006 18


052418 261
















7000

6000

5000

4000

3000

2000

1000

000

000 005 045010 015 020 025 030 035 040 050FR

Tem

per

atur

e R

ise

(C)

100KHz

1 MHz

70

60

50

40

30

20

10

0000 020 040 060 080 100 120

RMS current (Amps)

Tem

per

atur

e ri

se (C

)

100KHz

1 MHz

100

90

8070

6050

4030

201000 01 02 03 04 05

Power (Watts)

Tem

per

atur

e ri

se (

oC

)

C case

D case

E case


200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001


200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101


ES

R (

Oh

ms)

1

01

001100 1000 10000 100000 1000000

Frequency (Hz)

262 052418









LEAD FRAME

SOLDER

ENCAPSULANT

COPPER


TANTALUMANODE

121 CWATT

73 CWATT

236 CWATT


XX

X

TEMPERATURE DEG C


140

120

100

80

60

40

20

00 01 02 03 04 05 06 07 08 09 10 11 12 13 14






052418 263



31 STEADY-STATE














temperature


resistance


Base failure rate



circuit impedance


TCM TCN J-CAPTM TAC






















InfantMortalities


100908070605

040302

010001 01 10 10


Wor

king

Vol

tage

Rat

ed V

olta

ge

100 1000 10000




40

30

20

10

04 63 10 16 20 25

Rated Voltage (V)

Op

era

tin

g V

oltag

e (V

)

35 50

100

10

01

001

0001

000010 01 02 03 04 05 06


Co

rrectio

n F

acto

r

07 08 09 10 11 12

TantalumOxiCap

reg

FV

264 101216








(60 con level)

Circuit Impedance















(60 con level)





Example calculation










a) FT = 10 85degC



voltage = 75


Thus F = 10 x 085 x 008 x 1 = 00681000 Hours




F = 10 x 085 x 0018 x 1 = 001531000 Hours

32 Dynamic








series resistance



















47μF 16V 1547587 003 11

100μF 10V 632876 001 05

22μF 25V 2256258 005 03

0

1000

10000

100

10

01

0014020 60 80 100 120 140 160 180 200

100000

Temperature (ordmC)

TantalumNOJ

NOS

Cor

rect

ion

Fact

orF T


30 007

20 01

10 02

08 03

06 04

04 06

02 08

01 10

101216 265







customer




















resistance



= 015 x 01 x 1 x 11000 hours

= 00151000 hours




= 0006 x 01 x 1 x 11000 hours

= 6 x 10-4 1000 hours


state reliability







33 63 4

5 10 63

8 16 10

10 20 ndash

12 25 ndash

15 35 ndash


266 101216





Lead-free soldering


SnPb soldering



Lead-free soldering


SnPb soldering

















101216 267

51 Basic Materials










268 101216
















PW

PLP PLNPSPSL




SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series


NOTE





RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series



N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle


041118 269










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118











Vmax = 1- (T - 85) x VR





100

10

1

0101 1 10

Frequency (kHz)

Tantalum

OxiCapreg

Imp

ed

an

ce M

ultip

lier

100 1000


Tantalum

OxiCapreg

Ch

an

ge in

ES

R

60 80 100 125 150-20-40-55

18

1716

15

14

13

1211

109

08

10

100

1

01


akag

e cu

rrent

ratio

IIR

20

20 40 60 80 1000-20-40 175150125

1

01

0010 20 40 60 80 100

Rated Voltage (VR)


TypicalRange


112917 259











K 10 L 10 M 13 N 13 O 10 S 10 T 10 X 18 3 20 4 22 6 25


D 10 E 25 U 24 V 24 Y 10

TCMTPMTRMNOM






0

02

04

06

08

1

12

14

0 10 20 30 40 50 60 70 80 90 100


Optimalrange

Leak

age

curr

ent m

ultip

lier

260 112917




P = I 2 R





Umax = IR (Eq 2)









TCJ Case

TAJTMJTPS TPM

TCN NLJ Size

TRJTHJ TLN TRM






E 0165 mdash 0270 0250 0410 0198 0324














V 0250 mdash 0285 0360 0420 0300 mdash



Y 0125 0115 0210 0185 ndash 0150 mdash





Case Max power


Temp ordmC


up to 25degC 100 100 10

+55 095 090 9

+85 090 081 81

+105 065 042 42

+115 049 024 24

+125 040 016 16

+175 (THJ) 020 004 04

+200 (THJ) 010 001 01


for ripple current

Temp degC Factor+25 100+55 095+85 090+105 040+125

040(NOSNOM)




Temp ordmC


up to 45degC 100 100 30

+85 070 049 15

+105 045 020 6

+125 025 006 18


052418 261
















7000

6000

5000

4000

3000

2000

1000

000

000 005 045010 015 020 025 030 035 040 050FR

Tem

per

atur

e R

ise

(C)

100KHz

1 MHz

70

60

50

40

30

20

10

0000 020 040 060 080 100 120

RMS current (Amps)

Tem

per

atur

e ri

se (C

)

100KHz

1 MHz

100

90

8070

6050

4030

201000 01 02 03 04 05

Power (Watts)

Tem

per

atur

e ri

se (

oC

)

C case

D case

E case


200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001


200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101


ES

R (

Oh

ms)

1

01

001100 1000 10000 100000 1000000

Frequency (Hz)

262 052418









LEAD FRAME

SOLDER

ENCAPSULANT

COPPER


TANTALUMANODE

121 CWATT

73 CWATT

236 CWATT


XX

X

TEMPERATURE DEG C


140

120

100

80

60

40

20

00 01 02 03 04 05 06 07 08 09 10 11 12 13 14






052418 263



31 STEADY-STATE














temperature


resistance


Base failure rate



circuit impedance


TCM TCN J-CAPTM TAC






















InfantMortalities


100908070605

040302

010001 01 10 10


Wor

king

Vol

tage

Rat

ed V

olta

ge

100 1000 10000




40

30

20

10

04 63 10 16 20 25

Rated Voltage (V)

Op

era

tin

g V

oltag

e (V

)

35 50

100

10

01

001

0001

000010 01 02 03 04 05 06


Co

rrectio

n F

acto

r

07 08 09 10 11 12

TantalumOxiCap

reg

FV

264 101216








(60 con level)

Circuit Impedance















(60 con level)





Example calculation










a) FT = 10 85degC



voltage = 75


Thus F = 10 x 085 x 008 x 1 = 00681000 Hours




F = 10 x 085 x 0018 x 1 = 001531000 Hours

32 Dynamic








series resistance



















47μF 16V 1547587 003 11

100μF 10V 632876 001 05

22μF 25V 2256258 005 03

0

1000

10000

100

10

01

0014020 60 80 100 120 140 160 180 200

100000

Temperature (ordmC)

TantalumNOJ

NOS

Cor

rect

ion

Fact

orF T


30 007

20 01

10 02

08 03

06 04

04 06

02 08

01 10

101216 265







customer




















resistance



= 015 x 01 x 1 x 11000 hours

= 00151000 hours




= 0006 x 01 x 1 x 11000 hours

= 6 x 10-4 1000 hours


state reliability







33 63 4

5 10 63

8 16 10

10 20 ndash

12 25 ndash

15 35 ndash


266 101216





Lead-free soldering


SnPb soldering



Lead-free soldering


SnPb soldering

















101216 267

51 Basic Materials










268 101216
















PW

PLP PLNPSPSL




SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series


NOTE





RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series



N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle


041118 269










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118











K 10 L 10 M 13 N 13 O 10 S 10 T 10 X 18 3 20 4 22 6 25


D 10 E 25 U 24 V 24 Y 10

TCMTPMTRMNOM






0

02

04

06

08

1

12

14

0 10 20 30 40 50 60 70 80 90 100


Optimalrange

Leak

age

curr

ent m

ultip

lier

260 112917




P = I 2 R





Umax = IR (Eq 2)









TCJ Case

TAJTMJTPS TPM

TCN NLJ Size

TRJTHJ TLN TRM






E 0165 mdash 0270 0250 0410 0198 0324














V 0250 mdash 0285 0360 0420 0300 mdash



Y 0125 0115 0210 0185 ndash 0150 mdash





Case Max power


Temp ordmC


up to 25degC 100 100 10

+55 095 090 9

+85 090 081 81

+105 065 042 42

+115 049 024 24

+125 040 016 16

+175 (THJ) 020 004 04

+200 (THJ) 010 001 01


for ripple current

Temp degC Factor+25 100+55 095+85 090+105 040+125

040(NOSNOM)




Temp ordmC


up to 45degC 100 100 30

+85 070 049 15

+105 045 020 6

+125 025 006 18


052418 261
















7000

6000

5000

4000

3000

2000

1000

000

000 005 045010 015 020 025 030 035 040 050FR

Tem

per

atur

e R

ise

(C)

100KHz

1 MHz

70

60

50

40

30

20

10

0000 020 040 060 080 100 120

RMS current (Amps)

Tem

per

atur

e ri

se (C

)

100KHz

1 MHz

100

90

8070

6050

4030

201000 01 02 03 04 05

Power (Watts)

Tem

per

atur

e ri

se (

oC

)

C case

D case

E case


200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001


200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101


ES

R (

Oh

ms)

1

01

001100 1000 10000 100000 1000000

Frequency (Hz)

262 052418









LEAD FRAME

SOLDER

ENCAPSULANT

COPPER


TANTALUMANODE

121 CWATT

73 CWATT

236 CWATT


XX

X

TEMPERATURE DEG C


140

120

100

80

60

40

20

00 01 02 03 04 05 06 07 08 09 10 11 12 13 14






052418 263



31 STEADY-STATE














temperature


resistance


Base failure rate



circuit impedance


TCM TCN J-CAPTM TAC






















InfantMortalities


100908070605

040302

010001 01 10 10


Wor

king

Vol

tage

Rat

ed V

olta

ge

100 1000 10000




40

30

20

10

04 63 10 16 20 25

Rated Voltage (V)

Op

era

tin

g V

oltag

e (V

)

35 50

100

10

01

001

0001

000010 01 02 03 04 05 06


Co

rrectio

n F

acto

r

07 08 09 10 11 12

TantalumOxiCap

reg

FV

264 101216








(60 con level)

Circuit Impedance















(60 con level)





Example calculation










a) FT = 10 85degC



voltage = 75


Thus F = 10 x 085 x 008 x 1 = 00681000 Hours




F = 10 x 085 x 0018 x 1 = 001531000 Hours

32 Dynamic








series resistance



















47μF 16V 1547587 003 11

100μF 10V 632876 001 05

22μF 25V 2256258 005 03

0

1000

10000

100

10

01

0014020 60 80 100 120 140 160 180 200

100000

Temperature (ordmC)

TantalumNOJ

NOS

Cor

rect

ion

Fact

orF T


30 007

20 01

10 02

08 03

06 04

04 06

02 08

01 10

101216 265







customer




















resistance



= 015 x 01 x 1 x 11000 hours

= 00151000 hours




= 0006 x 01 x 1 x 11000 hours

= 6 x 10-4 1000 hours


state reliability







33 63 4

5 10 63

8 16 10

10 20 ndash

12 25 ndash

15 35 ndash


266 101216





Lead-free soldering


SnPb soldering



Lead-free soldering


SnPb soldering

















101216 267

51 Basic Materials










268 101216
















PW

PLP PLNPSPSL




SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series


NOTE





RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series



N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle


041118 269










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118




P = I 2 R





Umax = IR (Eq 2)









TCJ Case

TAJTMJTPS TPM

TCN NLJ Size

TRJTHJ TLN TRM






E 0165 mdash 0270 0250 0410 0198 0324














V 0250 mdash 0285 0360 0420 0300 mdash



Y 0125 0115 0210 0185 ndash 0150 mdash





Case Max power


Temp ordmC


up to 25degC 100 100 10

+55 095 090 9

+85 090 081 81

+105 065 042 42

+115 049 024 24

+125 040 016 16

+175 (THJ) 020 004 04

+200 (THJ) 010 001 01


for ripple current

Temp degC Factor+25 100+55 095+85 090+105 040+125

040(NOSNOM)




Temp ordmC


up to 45degC 100 100 30

+85 070 049 15

+105 045 020 6

+125 025 006 18


052418 261
















7000

6000

5000

4000

3000

2000

1000

000

000 005 045010 015 020 025 030 035 040 050FR

Tem

per

atur

e R

ise

(C)

100KHz

1 MHz

70

60

50

40

30

20

10

0000 020 040 060 080 100 120

RMS current (Amps)

Tem

per

atur

e ri

se (C

)

100KHz

1 MHz

100

90

8070

6050

4030

201000 01 02 03 04 05

Power (Watts)

Tem

per

atur

e ri

se (

oC

)

C case

D case

E case


200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001


200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101


ES

R (

Oh

ms)

1

01

001100 1000 10000 100000 1000000

Frequency (Hz)

262 052418









LEAD FRAME

SOLDER

ENCAPSULANT

COPPER


TANTALUMANODE

121 CWATT

73 CWATT

236 CWATT


XX

X

TEMPERATURE DEG C


140

120

100

80

60

40

20

00 01 02 03 04 05 06 07 08 09 10 11 12 13 14






052418 263



31 STEADY-STATE














temperature


resistance


Base failure rate



circuit impedance


TCM TCN J-CAPTM TAC






















InfantMortalities


100908070605

040302

010001 01 10 10


Wor

king

Vol

tage

Rat

ed V

olta

ge

100 1000 10000




40

30

20

10

04 63 10 16 20 25

Rated Voltage (V)

Op

era

tin

g V

oltag

e (V

)

35 50

100

10

01

001

0001

000010 01 02 03 04 05 06


Co

rrectio

n F

acto

r

07 08 09 10 11 12

TantalumOxiCap

reg

FV

264 101216








(60 con level)

Circuit Impedance















(60 con level)





Example calculation










a) FT = 10 85degC



voltage = 75


Thus F = 10 x 085 x 008 x 1 = 00681000 Hours




F = 10 x 085 x 0018 x 1 = 001531000 Hours

32 Dynamic








series resistance



















47μF 16V 1547587 003 11

100μF 10V 632876 001 05

22μF 25V 2256258 005 03

0

1000

10000

100

10

01

0014020 60 80 100 120 140 160 180 200

100000

Temperature (ordmC)

TantalumNOJ

NOS

Cor

rect

ion

Fact

orF T


30 007

20 01

10 02

08 03

06 04

04 06

02 08

01 10

101216 265







customer




















resistance



= 015 x 01 x 1 x 11000 hours

= 00151000 hours




= 0006 x 01 x 1 x 11000 hours

= 6 x 10-4 1000 hours


state reliability







33 63 4

5 10 63

8 16 10

10 20 ndash

12 25 ndash

15 35 ndash


266 101216





Lead-free soldering


SnPb soldering



Lead-free soldering


SnPb soldering

















101216 267

51 Basic Materials










268 101216
















PW

PLP PLNPSPSL




SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series


NOTE





RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series



N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle


041118 269










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118
















7000

6000

5000

4000

3000

2000

1000

000

000 005 045010 015 020 025 030 035 040 050FR

Tem

per

atur

e R

ise

(C)

100KHz

1 MHz

70

60

50

40

30

20

10

0000 020 040 060 080 100 120

RMS current (Amps)

Tem

per

atur

e ri

se (C

)

100KHz

1 MHz

100

90

8070

6050

4030

201000 01 02 03 04 05

Power (Watts)

Tem

per

atur

e ri

se (

oC

)

C case

D case

E case


200 KHz 0120 0060 600 KHz 0115 0006 1 MHz 0090 0002 14 MHz 0100 0001


200 KHz 2000 0707 600 KHz 0667 0236 1 MHz 0400 0141 14 MHz 0286 0101


ES

R (

Oh

ms)

1

01

001100 1000 10000 100000 1000000

Frequency (Hz)

262 052418









LEAD FRAME

SOLDER

ENCAPSULANT

COPPER


TANTALUMANODE

121 CWATT

73 CWATT

236 CWATT


XX

X

TEMPERATURE DEG C


140

120

100

80

60

40

20

00 01 02 03 04 05 06 07 08 09 10 11 12 13 14






052418 263



31 STEADY-STATE














temperature


resistance


Base failure rate



circuit impedance


TCM TCN J-CAPTM TAC






















InfantMortalities


100908070605

040302

010001 01 10 10


Wor

king

Vol

tage

Rat

ed V

olta

ge

100 1000 10000




40

30

20

10

04 63 10 16 20 25

Rated Voltage (V)

Op

era

tin

g V

oltag

e (V

)

35 50

100

10

01

001

0001

000010 01 02 03 04 05 06


Co

rrectio

n F

acto

r

07 08 09 10 11 12

TantalumOxiCap

reg

FV

264 101216








(60 con level)

Circuit Impedance















(60 con level)





Example calculation










a) FT = 10 85degC



voltage = 75


Thus F = 10 x 085 x 008 x 1 = 00681000 Hours




F = 10 x 085 x 0018 x 1 = 001531000 Hours

32 Dynamic








series resistance



















47μF 16V 1547587 003 11

100μF 10V 632876 001 05

22μF 25V 2256258 005 03

0

1000

10000

100

10

01

0014020 60 80 100 120 140 160 180 200

100000

Temperature (ordmC)

TantalumNOJ

NOS

Cor

rect

ion

Fact

orF T


30 007

20 01

10 02

08 03

06 04

04 06

02 08

01 10

101216 265







customer




















resistance



= 015 x 01 x 1 x 11000 hours

= 00151000 hours




= 0006 x 01 x 1 x 11000 hours

= 6 x 10-4 1000 hours


state reliability







33 63 4

5 10 63

8 16 10

10 20 ndash

12 25 ndash

15 35 ndash


266 101216





Lead-free soldering


SnPb soldering



Lead-free soldering


SnPb soldering

















101216 267

51 Basic Materials










268 101216
















PW

PLP PLNPSPSL




SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series


NOTE





RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series



N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle


041118 269










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118









LEAD FRAME

SOLDER

ENCAPSULANT

COPPER


TANTALUMANODE

121 CWATT

73 CWATT

236 CWATT


XX

X

TEMPERATURE DEG C


140

120

100

80

60

40

20

00 01 02 03 04 05 06 07 08 09 10 11 12 13 14






052418 263



31 STEADY-STATE














temperature


resistance


Base failure rate



circuit impedance


TCM TCN J-CAPTM TAC






















InfantMortalities


100908070605

040302

010001 01 10 10


Wor

king

Vol

tage

Rat

ed V

olta

ge

100 1000 10000




40

30

20

10

04 63 10 16 20 25

Rated Voltage (V)

Op

era

tin

g V

oltag

e (V

)

35 50

100

10

01

001

0001

000010 01 02 03 04 05 06


Co

rrectio

n F

acto

r

07 08 09 10 11 12

TantalumOxiCap

reg

FV

264 101216








(60 con level)

Circuit Impedance















(60 con level)





Example calculation










a) FT = 10 85degC



voltage = 75


Thus F = 10 x 085 x 008 x 1 = 00681000 Hours




F = 10 x 085 x 0018 x 1 = 001531000 Hours

32 Dynamic








series resistance



















47μF 16V 1547587 003 11

100μF 10V 632876 001 05

22μF 25V 2256258 005 03

0

1000

10000

100

10

01

0014020 60 80 100 120 140 160 180 200

100000

Temperature (ordmC)

TantalumNOJ

NOS

Cor

rect

ion

Fact

orF T


30 007

20 01

10 02

08 03

06 04

04 06

02 08

01 10

101216 265







customer




















resistance



= 015 x 01 x 1 x 11000 hours

= 00151000 hours




= 0006 x 01 x 1 x 11000 hours

= 6 x 10-4 1000 hours


state reliability







33 63 4

5 10 63

8 16 10

10 20 ndash

12 25 ndash

15 35 ndash


266 101216





Lead-free soldering


SnPb soldering



Lead-free soldering


SnPb soldering

















101216 267

51 Basic Materials










268 101216
















PW

PLP PLNPSPSL




SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series


NOTE





RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series



N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle


041118 269










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118



31 STEADY-STATE














temperature


resistance


Base failure rate



circuit impedance


TCM TCN J-CAPTM TAC






















InfantMortalities


100908070605

040302

010001 01 10 10


Wor

king

Vol

tage

Rat

ed V

olta

ge

100 1000 10000




40

30

20

10

04 63 10 16 20 25

Rated Voltage (V)

Op

era

tin

g V

oltag

e (V

)

35 50

100

10

01

001

0001

000010 01 02 03 04 05 06


Co

rrectio

n F

acto

r

07 08 09 10 11 12

TantalumOxiCap

reg

FV

264 101216








(60 con level)

Circuit Impedance















(60 con level)





Example calculation










a) FT = 10 85degC



voltage = 75


Thus F = 10 x 085 x 008 x 1 = 00681000 Hours




F = 10 x 085 x 0018 x 1 = 001531000 Hours

32 Dynamic








series resistance



















47μF 16V 1547587 003 11

100μF 10V 632876 001 05

22μF 25V 2256258 005 03

0

1000

10000

100

10

01

0014020 60 80 100 120 140 160 180 200

100000

Temperature (ordmC)

TantalumNOJ

NOS

Cor

rect

ion

Fact

orF T


30 007

20 01

10 02

08 03

06 04

04 06

02 08

01 10

101216 265







customer




















resistance



= 015 x 01 x 1 x 11000 hours

= 00151000 hours




= 0006 x 01 x 1 x 11000 hours

= 6 x 10-4 1000 hours


state reliability







33 63 4

5 10 63

8 16 10

10 20 ndash

12 25 ndash

15 35 ndash


266 101216





Lead-free soldering


SnPb soldering



Lead-free soldering


SnPb soldering

















101216 267

51 Basic Materials










268 101216
















PW

PLP PLNPSPSL




SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series


NOTE





RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series



N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle


041118 269










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118








(60 con level)

Circuit Impedance















(60 con level)





Example calculation










a) FT = 10 85degC



voltage = 75


Thus F = 10 x 085 x 008 x 1 = 00681000 Hours




F = 10 x 085 x 0018 x 1 = 001531000 Hours

32 Dynamic








series resistance



















47μF 16V 1547587 003 11

100μF 10V 632876 001 05

22μF 25V 2256258 005 03

0

1000

10000

100

10

01

0014020 60 80 100 120 140 160 180 200

100000

Temperature (ordmC)

TantalumNOJ

NOS

Cor

rect

ion

Fact

orF T


30 007

20 01

10 02

08 03

06 04

04 06

02 08

01 10

101216 265







customer




















resistance



= 015 x 01 x 1 x 11000 hours

= 00151000 hours




= 0006 x 01 x 1 x 11000 hours

= 6 x 10-4 1000 hours


state reliability







33 63 4

5 10 63

8 16 10

10 20 ndash

12 25 ndash

15 35 ndash


266 101216





Lead-free soldering


SnPb soldering



Lead-free soldering


SnPb soldering

















101216 267

51 Basic Materials










268 101216
















PW

PLP PLNPSPSL




SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series


NOTE





RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series



N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle


041118 269










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118







customer




















resistance



= 015 x 01 x 1 x 11000 hours

= 00151000 hours




= 0006 x 01 x 1 x 11000 hours

= 6 x 10-4 1000 hours


state reliability







33 63 4

5 10 63

8 16 10

10 20 ndash

12 25 ndash

15 35 ndash


266 101216





Lead-free soldering


SnPb soldering



Lead-free soldering


SnPb soldering

















101216 267

51 Basic Materials










268 101216
















PW

PLP PLNPSPSL




SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series


NOTE





RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series



N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle


041118 269










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118





Lead-free soldering


SnPb soldering



Lead-free soldering


SnPb soldering

















101216 267

51 Basic Materials










268 101216
















PW

PLP PLNPSPSL




SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series


NOTE





RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series



N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle


041118 269










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118

51 Basic Materials










268 101216
















PW

PLP PLNPSPSL




SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series


NOTE





RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series



N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle


041118 269










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118
















PW

PLP PLNPSPSL




SMD lsquoJrsquo

Lead amp

OxiCapreg

(excluding

F-series)

TACmicro-

chipreg

Series

Series


NOTE





RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

UC 300 (0118) 120 (0047) 120 (0047) 330 (0130) 050 (0020) D 410 (0161) 120 (0047) 120 (0047) 390 (0154) 050 (0020) RM 580 (0228) 120 (0047) 120 (0047) 390 (0154) 050 (0020)

F38 F91

F92 F93

F97 F9H

F98

F95

AUDIO F95

Conformal

F72

Conformal

F75

Conformal

Series



N 250 (0098) 105 (0041) 040 (0016) 105 (0041) 100 (0039) 100 (0039)

O 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

K 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

S 360 (0142) 135 (0053) 090 (0035) 135 (0053) 130 (0051) 130 (0051)

L 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

T 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

H 390 (0154) 135 (0053) 100 (0039) 155 (0061) 250 (0098) 210 (0083)

X 770 (0303) 220 (0087) 210 (0083) 340 (0134) 325 (0128) 325 (0128)

3 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

4 770 (0303) 220 (0087) 210 (0083) 340 (0134) 475 (0187) 475 (0187)

6 1520 (0598) 265 (0104) 990 (0390) 265 (0104) 550 (0217) 550 (0217)


TLN TCN

amp J-CAPTM

Undertab

Series

+-

bacute c

a

b

c

Center of nozzle


041118 269










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118










PW

PLP PSPSL


9 1320 (0520) 240 (0094) 840 (0331) 1180 (0465) NA

I 1300 (0512) 380 (0150) 540 (0213) 530 (0210) NA

I 1060 (0417) 300 (0118) 460 (0181) 400 (0157) NA


THHJ-lead only

THHUndertab only

SERIES


SERIES


PW PK PW

PKW

PL PS PL

PSL

-

-

+

+

270 041118

Documents

Section 4: Technical Summary and Application Guidelines · Section 4: Technical Summary and Application Guidelines INTRODUCTION ... 2.4 x 10-9 m/V Dielectric thickness (d) = 21 x