Supply Network ConferenceSupply Network ConferenceSecond AnnualSecond Annual

September 2003The Fairmont HotelSan Jose, California

September 2003The Fairmont HotelSan Jose, California

Mastering the Three A’s of Supply NetworkExcellence: Agility, Adaptability, and Alignment

Mastering the Three A’s of Supply NetworkExcellence: Agility, Adaptability, and Alignment

Pb-Free Electronics:Pb-Free Electronics:Drivers, R&D, andDrivers, R&D, and

TransitionTransition

Dr. Robert PfahlNEMI

Second Annual Supply Network Conference – San Jose, California – September 2003 Slide 2

Outline

Drivers of Change

Overview of R&D

Status of Implementation

Second Annual Supply Network Conference – San Jose, California – September 2003 Slide 3

Drivers for Elimination of Pb

Increasing Environmental Legislative Activityß Pb-Bans in Products

– All electronics-RoHS in Europe (July 2006)– Cables (100 PPM) Proposition 65, California (2002)

ß End-of-Life Disposal Legislation– Electric Home Appliances Recycling Law in Japan (1998)– WEEE in Europe (July 2005)– Automotive legislation in Europe– EOL legislation pending in 20 states

Commercial Customer Requirementsß Multiple motivations at work

– Corporate stewardship/image– Product marketing advantage

Second Annual Supply Network Conference – San Jose, California – September 2003 Slide 4

RoHs bansPb, Hg, Cd,Cr VI, PBB,

PBDE

Take-backsystem

by country

Recyclingtargets

(50-75%) met

RoHS and WEEE Timeline

Dec 02 July 04 July 05 July 06July 06

Enactmentby EU

Enactment by member

states

Productmarking

Document-ation to

recyclers

4kg / personcollectiontarget met

ExternalActions

IndustryActions

CompanyAction

Product Design

EHS

Undefined

Product Design, Sourcing, & Manufacturing

Second Annual Supply Network Conference – San Jose, California – September 2003 Slide 5

Situation Analysis: Technology

NCMS Pb-free Program 1994 To 1998

NEMI Pb-free Projects 1999 To Present

ß Lead-Free Assembly Project– Alloy, Process, Components, Reliability

ß Lead-Free Assembly and Rework Project– Assembly Process Development, Components & Materials,

Rework Process Development, Reliability

ß Tin Whisker Modeling Project

ß Tin Whisker Accelerated Test Project

ß Tin Whisker Users Group

Second Annual Supply Network Conference – San Jose, California – September 2003 Slide 6

Summary of NEMI Pb-Free Projects

Pb-Free AlloySelection

Process Development

SMTWave Rework

Joint Reliability ModelsPWB SelectionLand Finishes

Project CompleteProjects Underway

KnowledgeBase

Components – Lead finishes• Moisture Sensitivity• Temperature sensitivityÿ CrystalsÿOptoelectronicsÿÿ

Second Annual Supply Network Conference – San Jose, California – September 2003 Slide 7

Pb-Free Project Results

Solder Alloy

ß Recommended Sn-3.9Ag-0.6Cu for reflow and Sn-0.7Cu for waveComponents

ß 240C max achievable for large ICs, 250C max for small ICs on boards£ 0.92” thick

ß JEDEC revised J-STD-020B standard 250°C –5/+0Process

ß Manufactured with existing assembly process equipment

ß Performance of Pb-free pastes and fluxes are adequateReliabilityß Demonstrated Pb-free joints are more reliable than tin-lead

Second Annual Supply Network Conference – San Jose, California – September 2003 Slide 8

On-Going Technology Development

Work still needed to implement/understand SnAgCusolders. Projects underway on:

ß Board laminates & ability to withstand higher temp

ß Board finishes for SnAgCu soldering

ß Component lead finishes– Tin whisker accelerated stress testing– Fundamental understanding of tin whisker formation

ß Component replacement & rework– Thin (0.060”) and thick (0.130”) boards

ß Wave solder for pin-in-hole components

Second Annual Supply Network Conference – San Jose, California – September 2003 Slide 9

Situation Analysis: Implementation

Widespread introduction of Pb-free solders in Japan

Limited introduction of Pb-free solders in North Americaand Europe

The most pressing implementation issue for Pb-free solder isthe availability of components specified to meet highersoldering temperatures

Pb-free components are becoming available; however, leadfinishes are still under debate for high reliabilityapplications

Need effort on eliminating Pb in cables

NEMI evaluating how to facilitate the conversion of thesupply chain

Second Annual Supply Network Conference – San Jose, California – September 2003 Slide 10

Key Action Item

OEMs and EMS firms must workwith their supply chain to develop acoordinated transition plan