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www.pactech.de
SB² Laser Solder Jetting Systems
Product Features• Single-step solder ball placement and reflow• Flux-free reflow with laser• No special tooling required• No additional reflow required• Solder-ball diameter from 40µm to 760µm• High solder alloy flexibility · Eutectic SnPb · High-lead SnPb · Lead-free SnAg, SnAgCu, etc. · AuSn · InSn · SnBi• In-line capability• High throughput• High accuracy axis system• Automated fiducial alignment• Ball rework and repair capability• Option configurations · 2D bump-inspection systems · Integrated laser power sensor · Solder rework & reballing station · Automatic handling/robot system · Reel-to-reel (300-400mm or 35-70mm)
Applications• HDD (HGA, HSA, Hook-Up)• Flip-chip, BGAs, cLCC’s, CSPs• 3D packaging• 4- to 12-inch wafers• Repair/rework of BGA-like packages• Optoelectronics/Microoptics• MEMS• Camera modules• Wafer bumping
Solder ball placement systems within the semiconductor industry have reached a new standard for advanced and reliable solder ball placement, reflow and rework. The high-speed SB² systems can achieve a ball placement rate up to 10 balls per second. They provide an exceptional solution for economical solder ball, reflow and repair. SB² systems provide reproducible solder bumping technology for packaging optoelectronic devices, hard disk drives (HGA, HSA), MEMS, sensors, camera modules, BGA’s, chip-scale packaging and flip-chips. They are available in three configurations: fully automatic (SB²-Jet), semiautomatic (SB²-SM) and small foot print (SB²-M). SB² systems have the ability to singulate, to position and to reflow solder balls with diameters of 40µm to 760µm. They are designed for water bumping, single-chip bumping and selective solder deposition on substrates (FR4, ceramic, flex materials). They are suitable for wafer or substrates sizes up to 300mm. They also allow a flexible method of solder ball placement on chip-scale packages (CSP) and ball-grid arrays (BGA). One of the major applications is for 3D interconnections such as chip-on-flex, stacked 3D modules and HGA’s. Solder ball reflow is performed by a laser system using an infrared wavelength. All components of the system are integrated into a single cabinet.
Ball Placement Solder Balling foroptoelectronics/MEMS
3D Laser Vertical ChipBonding
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SB²-JetThe SB²-Jet is the most advanced, automated high-speed sequential solder-ball attach system available today. It can operate in either an automatic mode or semiautomatic mode. In automatic mode, the SB2-Jet uses pre-pro-grammed coordinates. In semiautomati mode, an operator employs "eyes-on" control. The solder jetting process has a ball placement rate of up to 10 balls per second, with ball diameters ranging from 40μm to 760μm. A single cycle consists of solder ball singula-tion, solder ball placement (or solder jetting) and laser reflow.
The SB²-Jet axis uses a gantry system for bond head movement suitable for wafer or substrate sizes up to 12 inches. In a fully loaded version, the SB²-Jet is delivered with a vision and pattern-recognition system, an after-bump 2D inspection and an additional repair unit. The system is fully in line capable and can be equipped with an automated substrate or wafer handling solution such as conveyor, robot or reel-to-reel systems.
SB²-SM
The axis system of the SB²-SM is driven by piezo linear motors, as opposed to the gantry system used in the SB²-Jet. In a fully loaded version, the system can be equipped wih a vision and pattern-recognition system, and an additional solder ball rework unit. In the basic configuration, the system is delivered with solder ball placement only, automated substrate or waferhandling is not available for this system.
The SB²-SM has a smaller footprint than the SB²-Jet and a maximum working area of 8-inches. In areas with limited floor space, or costly environmental aspects, using the SB²-SM has distinct Advantages. The SB²-SM product line is a fully automated high-speed Sequential solder ball attach system that can operate either in a fully automatic mode or in a semiautomatic mode. In automatic mode, the SB²-SM operates. Using programmed coordinates. The ball placement rate is up to 5 balls per second, when using PacTech's solder jetting process. Ball diameters range from 60μm to 760μm.
SB²-M
high-resolution five-step-zoom stereo microscope. In the basic configura-tion, the system is delivered with solder jetting process only. The solder ball rework unit is available as an optional feature. Automated substrate or wafer handling is not available for this system.
The SB²-M is the smallest available equipment in the SB²-series. It is a semiautomatic solder ball placement reflow/rework machine designed for small volume manufacturing, prototyping, and research and development. Maximum throughput is 5 balls per second if the solder jetting option is installed. The ball diameters range from 150μm to 760μm. Equipped with the optional solder ball remov-al unit, it is ideal for BGA and CSP rework. The axis of the system are driven by piezo linear motors for either 4-inch substrate capability. In manual mode, a joystick controls the axis. Visual inspection is accomplished using a
System ConfigurationAll SB² systems are self-contained into a compact chassis. The systems cansingulate, position and reflow solder balls that have diameters ranging from40μm to 760μm. The solder-ball bumper base is constructed of highly stablegranite with isolation. SB² systems consist of the following elements:
• Bond head (mounted on a Z stage)• Axis and drives with 4-inch for the SB²-M or 8-inch chuck for the system control unit• Class 1 laser system
Bond HeadFor different solder ball diameters, a specific bond head is required. For theSB²-Jet and the SB²-SM bond heads for ball diameters ranging from 40μm to760μm are available The minimum ball size for the SB²-M is 150μm. A bondhead consists of the following elements:
• Solder ball loading station• Singulation unit• Capillary holding for ball positioning• Fiber-coupling unit• Optical sensor• Rotation motor stage• Pressure sensor
System Control UnitThe SB² system-control unit fulfills all requirements for industrial PCstandards. The system-control computer can be linked to a host computer,via Ethernet, to administer all data. The integration of a SECS GEM protocolis optional. The basic system-control unit configuration consists of thefollowing:
Processor: IntelCore, Duo 2.6 GHzMemory: 1-GB minimumHard Drive: 120-GB minimumAdditional Drive: DVD ROMMonitor: 17-inch TFTInput Devices: Keyboard and joystickVGA Card: 256NB PCI Express
Laser Class 1 SystemPacTech uses a fibre laser that is incorporated into a standard 19-inch rack configuration. The entire system includes the laser power supply and cooling unit. A red pilot laser light is used as a target light to precisely locate the high-power laser spot.The laser system, when combined into the SB²-Jet, SB²-SM or SB²-M systems safety housing, is specified as a class 1 laser product . The entire system is manufactured in accordance with IEC825 (European Standards E DIN VDE 0750, 871, 835 and 837). When the system is exported to the United States, the laser system complies with the U.S. Federal Performance Standards for class lV laser products (21 CFR 1040.10 and 1040.11)
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Technical Data and Facility Requirements
Notes:1. All systems can be delivered with a transformer in order to meet the specific needs of the customer.2. An optional vacuum ejector can be used to create the vacuum. This will require compressed air.3. Maximum laser energy for fiber laser is 400mJ / 40W module.
Note 1
Note 2
Note 3
Ball Placement Rate and Reflow Specified Depending on Layout
Up to 10 balls/sec. Up to 5 balls/sec. 3 balls/sec.
Mechanical Data Dimensions (L x W x H) mm Inches
Total weight (Approx.) kg/Pounds (lb)
1230 x 1200 x 170048.43 x 47.24 x 66.93
800 / 1765
1300 x 1000 x 185051.18 x 33.46 x 70.87
300 / 660
700 x 600 x 160027.56 x 23.62 x 62.99
150 / 330
Ancillary Supply Vacuum-Pressure Vacuum-Tube Diameter Air-Pressure (bar/PSI) Air-Flow Rate Air-Tube Diameter Nitrogen-Pressure (bar/PSI) Nitrogen-Flow Rate (l/min.) Nitrogen-Tube Diameter
Approx... 0.03 bar6mm/8mm ID/OD7 bar. max.126 l/min. max.6mm/8mm ID/OD3 bar min., 12 bar max.0.75 l/min. max.6mm/8mm ID/OD
Approx... 0.03 bar6mm/8mm ID/OD7 bar. max.126 l/min. max.6mm/8mm ID/OD3 bar min., 12 bar max.0.75 l/min. max.6mm/8mm ID/OD
Approx... 0.03 bar6mm/8mm ID/OD7 bar. max.126 l/min. max.6mm/8mm ID/OD3 bar min., 12 bar max.0.75 l/min. max.6mm/8mm ID/OD
Environmental Conditions Temperature Relative Humidity (non-condensing) Climatization Time Cleanroom Recommendations
20°C ±2°30% - 60%12 hoursClass 10.000 or better
20°C ±5°30% - 80%12 hoursClass 10.000 or better
20°C ±5°30% - 80%12 hoursClass 10.000 or better
Optional Features Pattern Recognition Vision System (2D Inspection) Automatic Wafer Substrate Handling ESD Protection
IncludedOptionalOptionalOptional
OptionalN/AN/AOptional
OptionalN/AN/AN/A
Laser Specifications Wavelength Laser Energy (max.) Pulse Widths (Cont. adjustable) Pilot Diode Laser Stability
1064nm0,4J in 10ms1ms - 20ms40W (1085nm)±5%
1064nm0,4J in 10ms1ms - 20ms40W (1085nm)±5%
1064nm0,4J in 10ms1ms - 20ms40W (1085nm)±5%
Electrical Data Line voltage Maximum Current/Frequency
230VAC\25 Amp, Single Phase16(230V)/50/60Hz
230VAC\25 Amp, Single Phase16(230V)/50/60Hz
230VAC\25 Amp, Single Phase16(230V)/50/60Hz
SB²-Jet
Axis (travel range) X, Y Axis Work area Z Axis
Gantry500mm x 500mm320mm x 320mm
50mm
Piezo linear motors (BLDC)Max. 300mm x 250mm200mm x 200mm
50mm
Piezo linear motors100mm x 100mm (4-inch)150mm x 100mm
50mm
SB²-SM SB²-M
SB²-Jet Machine Headfor Wafer Bumping
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PacTech USA Inc.328 Martin Avenue, Santa Clara, CA 95050, USA
PacTech Asia Sdn. Bhd.No.14, Medan Bayan Lepas, Technoplex, Phase 4Bayan Lepas Industrial Zone, 11900 Bayan Lepas,Penang, Malaysia
PacTech - Packaging Technologies GmbHAm Schlangenhorst 15-17, 14641 Nauen, Germany
Contact us at [email protected]
Specifications for Pattern Recognition and2D Ball Inspection Software used with SB²Solder Ball Placement Equipment
Machine Details
SB²-Jet Machine Headfor BGA Ball Attach
Schematic of the SB²-Jet Process
SB² solder ball placement
Process Principles
System OS Windows-based OS
Optics Integrated lighting and optics
Communications I/O Serial and digital I/O (TTL)
Accuracy andReapeatability
Up to 5µm
Device Types Flip-chip, CSP, BGA, HGA, HSA, cLLC,Camera module, Microoptics
Results Reporting Overall device dataIndividual ball data
Calibration Calibration not necessaryFocus optimization
User I/F Standard Windows-based GUI
Substrate/WaferHandling
Manual (optional automatic handlingsystem available)
Ball PatternsSupported
All patterns, including non-symmetricaland arbitrary
Video Input/Output CCIR video inputStrobed camera supportNear real-time video display over PC bus
Speed 5-inch 6-inch 8-inch12-inch
Macrolens 2X 2 min. 3 min. 5 min.11 min.
ToleranceMeasurements
Ball sizeBall positionBall pitchBall absenceBall shapeExtra or misplaced ballSolder bridges
Ball Diameter RangeSB²-JetSB²-SMSB²-M
50µm up to 760µm60µm up to 760µm150µm up to 760µm
Macrolens 1X0.50 min.0.75 min.1.25 min.2.75 min.